CN106764561A - A kind of integrated lamp and preparation method based on flip LED chips Vacuum Package - Google Patents
A kind of integrated lamp and preparation method based on flip LED chips Vacuum Package Download PDFInfo
- Publication number
- CN106764561A CN106764561A CN201611227709.0A CN201611227709A CN106764561A CN 106764561 A CN106764561 A CN 106764561A CN 201611227709 A CN201611227709 A CN 201611227709A CN 106764561 A CN106764561 A CN 106764561A
- Authority
- CN
- China
- Prior art keywords
- led
- flip
- substrate
- light source
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000013078 crystal Substances 0.000 claims abstract description 22
- 239000000084 colloidal system Substances 0.000 claims description 15
- 238000009461 vacuum packaging Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000004806 packaging method and process Methods 0.000 claims description 12
- 230000005496 eutectics Effects 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000005253 cladding Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of integrated lamp based on flip LED chips Vacuum Package, including LED packaged light sources, radiator, constant current driving source, lamp holder and lampshade；The LED packaged light sources include flip LED chips, substrate and crystallofluorescence piece；LED packaged light sources are fixed on a heat sink, LED packaged light sources, constant current driving source, lamp holder are linked in sequence successively, and lampshade is arranged in LED packaged light sources, and flip LED chips are welded on substrate, white colloidal is coated with around flip LED chips, crystallofluorescence piece is covered on white colloidal.The invention also discloses a kind of preparation method of the integrated lamp based on flip LED chips Vacuum Package, the present invention solves crystal bonding area and cures, problem of oxidation, longer life still can be also maintained under the conditions of Tj higher.
Description
Technical Field
The invention relates to the technical field of LED (light emitting diode) upstream, middle and downstream industrial chains, in particular to an integrated lamp based on flip LED chip vacuum packaging and a manufacturing method thereof.
Background
With the continuous updating and breakthrough of the LED industrial technology, the light efficiency requirement and the quality requirement are improved year by year, but the cost is reduced. Packaging plants in midstream of LEDs therefore have been tried with great success in reducing costs, whether using smaller sized chips or thinner plating, for the sole purpose of reducing costs. A series of low-cost materials use LED packages of increasingly poor quality to meet the requirements of LED downstream applications, such as sulfuration resistance, thermal shock resistance, and higher Tj. The previous and now well-established industry including the current well-established LED up (chip), in (package), downstream (application) industry has been unable to accommodate the market demand for low-cost high-quality LED
Therefore, an integrated lamp light source with a flip LED chip packaged in vacuum is necessary, and the existing problems can be completely solved.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide an integrated lamp based on flip-chip LED chip vacuum packaging and a manufacturing method thereof.
The invention adopts the following technical scheme for solving the technical problems:
the invention provides an integrated lamp based on flip LED chip vacuum packaging, which comprises an LED packaging light source, a radiator, a constant current driving source, a lamp cap and a lampshade; the LED packaging light source comprises a flip LED chip, a substrate, a white colloid and a crystal fluorescent sheet; wherein,
LED encapsulation light source fixes on the radiator, and radiator, constant current drive source, lamp holder connect gradually in proper order, and the lamp shade setting is on LED encapsulation light source, and flip-chip LED chip welds on the base plate, and the cladding of white colloid is around flip-chip LED chip, and the crystal fluorescence piece covers on white colloid.
The manufacturing method of the integrated lamp based on the vacuum packaging of the flip LED chip comprises the following steps:
eutectic welding a flip LED chip on a substrate;
step two, coating the periphery of the flip LED chip with a white colloid to form a white rubber ring;
covering the crystal fluorescent sheet on the white rubber ring, and vacuumizing and curing among the substrate, the crystal fluorescent sheet and the white rubber ring to form the LED packaging light source in a vacuum state;
fixing the LED packaging light source on the radiator;
and step five, sequentially connecting the radiator, the constant-current driving source and the lamp cap, and arranging the lampshade on the LED packaging light source to form the vacuum-packaged integrated lamp.
As a further optimized scheme of the manufacturing method of the integrated lamp based on the vacuum packaging of the flip LED chip, the substrate is in a connected piece type.
As a further optimized scheme of the manufacturing method of the integrated lamp based on the vacuum packaging of the flip LED chip, the substrate is a copper substrate.
As a further optimized scheme of the manufacturing method of the integrated lamp based on the vacuum packaging of the flip LED chip, the substrate is an aluminum substrate.
Compared with the prior art, the invention adopting the technical scheme has the following technical effects:
(1) the substrate with the circuit which can be directly eutectic-welded with the flip LED chip is adopted, compared with the prior art, the process of solder paste piece making is reduced, and the LED is directly eutectic-welded on the module to form an integrated light source module;
(2) the eutectic welding process of the flip LED chip is adopted, so that the thermal resistance is reduced, and the high-current operation can be realized;
(3) according to the invention, a vacuum sealed space is adopted among the substrate, the LED chip, the white colloid and the crystal fluorescent sheet, so that the solid crystal region cannot be oxidized and vulcanized;
(4) the invention adopts the crystal fluorescent sheet, and the heat resistance reaches more than 600 ℃. The heat generated by the LED is not sufficient at all to affect other materials.
Drawings
Fig. 1 shows a flip-chip LED eutectic on a heat sink die, with a white encapsulant covering the periphery of the flip-chip LED die.
Fig. 2 is a schematic diagram of a flip-chip LED bottom pad.
Fig. 3 is an LED packaged light source.
Fig. 4 is a schematic view of the entire lamp assembly.
The reference signs are interpreted as: 1 is the radiating substrate, 2 is flip-chip LED, 3 is the base plate pad, 4 is white colloid, 5 is flip-chip LED bottom pad,6 is the crystal fluorescence piece, 7 is the lamp holder, 8 is the constant current driving source, 9 is the radiator, 10 is LED encapsulation light source, 11 is the lamp shade.
Detailed Description
The technical scheme of the invention is further explained in detail by combining the attached drawings:
the invention discloses an integrated lamp packaged by a flip LED chip in vacuum and a manufacturing method thereof, which solve the problem of light attenuation of LED vulcanization and realize the technical breakthrough that Tj can be higher than 150 ℃ and the heat dissipation condition that the Tj is lower than 125 ℃ is only maintained. The technology adopts the eutectic welding of the flip chip directly on a heat dissipation (metal, ceramic, aluminum nitride and the like) substrate with a series-parallel circuit, uses chips with different quantities according to different wattages as required, then uses a white rubber ring which can be directly solidified at normal temperature to enclose the flip chip in the center, then covers a crystal fluorescent sheet with high light transmittance on the rubber ring, and vacuumizes in the solidification process. And finally forming the LED module light source in a vacuum state by the substrate, the chip, the white glue and the crystal fluorescent sheet. And finally, fixing the packaged LED module light source with the lamp cap, the constant-current driving source, the radiator and the lampshade. The design can reduce the thermal resistance, and the substrate with the same size can be used as a whole lamp with larger wattage; furthermore, the package body is in a vacuum state and does not penetrate moisture and penetrate oxygen, and the eutectic region is not vulcanized to cause serious light attenuation after long-term use.
Fig. 1 is a flip-chip LED eutectic crystal on a heat dissipation die, a white colloid is coated around a flip-chip LED chip, and fig. 2 is a schematic diagram of a bottom pad of the flip-chip LED. Fig. 3 is a schematic diagram of a crystal phosphor plate covering a white colloid region on a heat dissipation substrate, the LED, the white colloid, and the phosphor plate forming an LED package light source, and fig. 4 is a schematic diagram of the whole lamp assembly. The invention has more advantages in the assembly of LED upstream chip factories, and can fully utilize the advantages of the product: and an LED light source is inverted. The reference numerals in fig. 1-4 are interpreted as: 1 is the radiating substrate, 2 is flip-chip LED, 3 is the base plate pad, 4 is white colloid, 5 is flip-chip LED bottom pad,6 is the crystal fluorescence piece, 7 is the lamp holder, 8 is the constant current driving source, 9 is the radiator, 10 is LED encapsulation light source, 11 is the lamp shade.
The substrate capable of eutectic band printing circuit is designed and developed, and can be copper substrate, aluminum substrate, etc.
The flip LED eutectic is welded on the substrate, the substrate can be directly connected with a chip, and each hole is used as a light source of the whole lamp.
The LED was used as the optical center and surrounded with a white room temperature curing glue.
And covering the crystal fluorescent sheet on the white colloid, vacuumizing and curing to form the LED packaging light source in a vacuum state.
And the LED light source is fixed on the radiator and is connected with a constant current driving source.
And finally, fixing the lamp cap, the constant-current driving source, the radiator and the lampshade to form the integrated lamp in vacuum packaging.
The technology adopts the eutectic welding of the flip chip directly on a heat dissipation (metal, ceramic, aluminum nitride and the like) substrate with a series-parallel circuit, uses chips with different quantities according to different wattages as required, then uses a white rubber ring which can be directly solidified at normal temperature to enclose the flip chip in the center, then covers a crystal fluorescent sheet with high light transmittance on the rubber ring, and vacuumizes in the solidification process. And finally forming the LED module light source in a vacuum state by the substrate, the chip, the white glue and the crystal fluorescent sheet. And finally, fixing the packaged LED module light source with the lamp cap, the constant-current driving source, the radiator and the lampshade. The design can reduce the thermal resistance, and the substrate with the same size can be used as a whole lamp with larger wattage; furthermore, the package body is in a vacuum state and does not penetrate moisture and penetrate oxygen, and the eutectic region is not vulcanized to cause serious light attenuation after long-term use.
The structure of the final product is shown in fig. 4, and specifically comprises a lamp cap, a constant current driving source, a radiator, an LED light source module and a lampshade.
Manufacturing an LED light source module, namely eutectic-crystallizing a flip LED chip on a heat dissipation substrate as shown in figures 1 to 4; then, the white rubber ring is enclosed in the LED flip chip as an optical center to form the structure shown in figure 3; then covering the crystal fluorescent sheet on the white rubber ring, and vacuumizing the middle closed space; and finally, fixing the lamp cap, the constant-current driving source, the radiator, the LED light source module and the lampshade into a finished lamp.
In addition to the above embodiments, the present invention may have other embodiments, and any technical solutions formed by equivalent substitutions or equivalent transformations fall within the scope of the claims of the present invention.
Claims (5)
1. An integrated lamp based on flip LED chip vacuum packaging is characterized by comprising an LED packaging light source, a radiator, a constant current driving source, a lamp cap and a lampshade; the LED packaging light source comprises a flip LED chip, a substrate, a white colloid and a crystal fluorescent sheet; wherein,
LED encapsulation light source fixes on the radiator, and radiator, constant current drive source, lamp holder connect gradually in proper order, and the lamp shade setting is on LED encapsulation light source, and flip-chip LED chip welds on the base plate, and the cladding of white colloid is around flip-chip LED chip, and the crystal fluorescence piece covers on white colloid.
2. A manufacturing method of an integrated lamp based on vacuum packaging of a flip LED chip is characterized by comprising the following steps:
eutectic welding a flip LED chip on a substrate;
step two, coating the periphery of the flip LED chip with a white colloid to form a white rubber ring;
covering the crystal fluorescent sheet on the white rubber ring, and vacuumizing and curing among the substrate, the crystal fluorescent sheet and the white rubber ring to form the LED packaging light source in a vacuum state;
fixing the LED packaging light source on the radiator;
and step five, sequentially connecting the radiator, the constant-current driving source and the lamp cap, and arranging the lampshade on the LED packaging light source to form the vacuum-packaged integrated lamp.
3. The method for manufacturing the integrated lamp based on the vacuum packaging of the flip LED chip as claimed in claim 2, wherein the substrate is a connecting piece.
4. The method for manufacturing the integrated lamp based on the vacuum packaging of the flip LED chip as claimed in claim 2, wherein the substrate is a copper substrate.
5. The method of claim 2, wherein the substrate is an aluminum substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611227709.0A CN106764561A (en) | 2016-12-27 | 2016-12-27 | A kind of integrated lamp and preparation method based on flip LED chips Vacuum Package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611227709.0A CN106764561A (en) | 2016-12-27 | 2016-12-27 | A kind of integrated lamp and preparation method based on flip LED chips Vacuum Package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106764561A true CN106764561A (en) | 2017-05-31 |
Family
ID=58922682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611227709.0A Pending CN106764561A (en) | 2016-12-27 | 2016-12-27 | A kind of integrated lamp and preparation method based on flip LED chips Vacuum Package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106764561A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200717857A (en) * | 2005-10-28 | 2007-05-01 | Iled Photoelectronics Inc | Packaging structure for a white light LED |
| CN202423286U (en) * | 2011-12-27 | 2012-09-05 | 杭州丽晶照明电器有限公司 | Integrated LED point light source |
| CN204497230U (en) * | 2015-03-23 | 2015-07-22 | 深圳职业技术学院 | A kind of LED encapsulation structure |
| CN105826454A (en) * | 2016-05-17 | 2016-08-03 | 中国人民大学 | Discrete transparent ceramic flip chip integrated LED light source and packaging method thereof |
| CN205609565U (en) * | 2016-04-14 | 2016-09-28 | 河北大旗光电科技有限公司 | Heat dissipation, integrated circuit ization LED face down chip light source ceramics base |
| CN106122804A (en) * | 2015-10-22 | 2016-11-16 | 亚浦耳照明股份有限公司 | A kind of LEDbulb lamp and preparation method thereof |
-
2016
- 2016-12-27 CN CN201611227709.0A patent/CN106764561A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200717857A (en) * | 2005-10-28 | 2007-05-01 | Iled Photoelectronics Inc | Packaging structure for a white light LED |
| CN202423286U (en) * | 2011-12-27 | 2012-09-05 | 杭州丽晶照明电器有限公司 | Integrated LED point light source |
| CN204497230U (en) * | 2015-03-23 | 2015-07-22 | 深圳职业技术学院 | A kind of LED encapsulation structure |
| CN106122804A (en) * | 2015-10-22 | 2016-11-16 | 亚浦耳照明股份有限公司 | A kind of LEDbulb lamp and preparation method thereof |
| CN205609565U (en) * | 2016-04-14 | 2016-09-28 | 河北大旗光电科技有限公司 | Heat dissipation, integrated circuit ization LED face down chip light source ceramics base |
| CN105826454A (en) * | 2016-05-17 | 2016-08-03 | 中国人民大学 | Discrete transparent ceramic flip chip integrated LED light source and packaging method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203857313U (en) | LED bulb lamp with high lighting effect | |
| CN100435361C (en) | Semiconductor luminous element packing structure | |
| CN204130585U (en) | A kind of uv-LED device | |
| CN101350321A (en) | Method for manufacturing LED directly mounted on a support upside-down | |
| CN201868429U (en) | Embedded-type encapsulating structure of luminous diode | |
| CN102064247A (en) | Packaging method and packaging structure for embedded light emitting diode | |
| CN103400833A (en) | Led module and manufacturing method thereof | |
| CN104393145A (en) | Ceramic-substrate-contained white-light LED with low thermal resistance and high brightness | |
| CN201708188U (en) | Ceramic high-power light emitting diode | |
| CN103972377A (en) | Method for packaging omni-directional lighting LED lamp filament by means of flip bonding | |
| CN201590435U (en) | LED encapsulation structure | |
| CN202013881U (en) | Integrated packaging structure with vertically structured LED chips | |
| CN107819065B (en) | Flip LED light-emitting device and preparation method thereof | |
| CN203941950U (en) | A kind of LED package assembling | |
| CN206490057U (en) | One kind is with drive, panchromatic temperature, with brightness upside-down mounting COB light source | |
| CN106764561A (en) | A kind of integrated lamp and preparation method based on flip LED chips Vacuum Package | |
| CN102364709A (en) | High-power LED packaging structure | |
| CN206480621U (en) | A kind of LED chip inverted structure | |
| CN206490059U (en) | A kind of adjustable color temperature upside-down mounting COB encapsulating structures | |
| CN207367968U (en) | A kind of LED encapsulation structure of directly chip on board | |
| CN202018990U (en) | High-power white-light LED light source encapsulating structure | |
| CN102148319A (en) | High-power white light emitting diode (LED) light source packaging structure | |
| CN207753042U (en) | A kind of inorganic encapsulated LED | |
| CN204088362U (en) | A kind of chip upside-down mounting type LED silk | |
| CN202259296U (en) | High-power straw-hat-shaped integrated packaging LED light source structure for automobile headlamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180814 Address after: 212009 88 Wei Yi Road, Ding Mao Development Area, Zhenjiang, Jiangsu Applicant after: Wenrui Photoelectric Co., Ltd., Jiangsu Address before: 212009 88 Wei Yi Road, Ding Mao Development Area, Zhenjiang, Jiangsu Applicant before: Jiangsu Wenrun Optoelectronic Technology Co., Ltd. |
|
| TA01 | Transfer of patent application right | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170531 |
|
| WD01 | Invention patent application deemed withdrawn after publication |