CN205609565U

CN205609565U - Heat dissipation, integrated circuit ization LED face down chip light source ceramics base

Info

Publication number: CN205609565U
Application number: CN201620311851.2U
Authority: CN
Inventors: 荆允昌; 赵晓斌; 刘传伟; 于增梁
Original assignee: HEBEI DAQI OPTOELECTRONICS TECHNOLOGY Co Ltd
Current assignee: HEBEI DAQI OPTOELECTRONICS TECHNOLOGY Co Ltd
Priority date: 2016-04-14
Filing date: 2016-04-14
Publication date: 2016-09-28
Anticipated expiration: 2026-04-14

Abstract

The utility model provides a heat dissipation, integrated circuit ization LED face down chip light source ceramics base, includes that the copper plate that spatters on aluminium oxide or aluminium nitride ceramic base body and the up end corrodes the printed circuit who makes. When such LED face down chip light source ceramics base uses, on the direct solid brilliant printed circuit who makes on ceramics base body up end of LED face down chip, and link to each other with the drive circuit who installs in ceramics base body cavity through the lead wire, because solid brilliant LED face down chip's printed circuit adopts sputter technique direct sputter bronze medal layer on the up end of ceramics base body, then form through corroding, the heat that makes the LED face down chip during operation produce can be given the ceramics base body and gived off by the direct conduction of printed circuit that the sputter is fixed in on the ceramics base body up end, thereby shorten LED face down chip heat dissipation path, reduce thermal resistance, improve the heat conductivility, prolonged service life, and still make the LED face down chip lighting products structure simplify, technological process of production shortens, the productive efficiency is enhanced.

Description

Heat radiation, circuit integration LED flip chip light source base of ceramic

Technical field

This utility model relates to a kind of LED flip chip light source base of ceramic, particularly a kind of heat radiation, Circuit integration LED flip chip light source base of ceramic.

Background technology

LED is a kind of using solid-state semiconductor chip as light-emitting component, converts electrical energy into the half of luminous energy Conductor device, as photoelectric device, in its work process, the electric energy of only about 30% is converted into luminous energy, Remaining electric energy nearly all can be converted into heat energy, during LED operation produce heat as can not in time via Radiator structure is derived rapidly and dissipates, it will greatly affect its quality, can be greatly shortened time serious Its life-span, therefore LED illumination product radiator structure, heat-sinking capability quality particularly important.At present, LED illumination product is divided into LED flip chip illuminating product and the big class of LED positive cartridge chip illuminating product two, And in terms of conduction, heat conductivility, LED flip chip illuminating product is substantially better than the positive cartridge chip of LED Illuminating product.As shown in Figure 1, existing LED flip chip illuminating product: LED flip chip Being fixed on surface to be shaped with on the aluminium base of printed circuit, as light source, its aluminium base passes through thermal conductive silicon again Fat is fixing on a heat sink, such LED flip chip encapsulation technology scheme two heat conduction bottlenecks of existence: A. the Bonded Ring epoxy resins between aluminium base and printed circuit Copper Foil；B. between aluminium base and radiator Heat-conducting silicone grease, such infrastructure product, not only heat dissipation path length, thermal resistance is big, heat radiation is slow, largely effect on The service life of LED chip, and the technological process of production is loaded down with trivial details, has an effect on production efficiency.

Summary of the invention

The purpose of this utility model is to overcome above-mentioned existing LED flip chip encapsulation technology to exist not Foot, and the heat radiation of LED illumination product one, circuit integration LED flip chip light source ceramic base are provided Seat, to simplify LED flip chip illuminating product structure, to shorten LED flip chip heat dissipation path, fall Low thermal resistance, improve heat conductivility, extend its service life, and shorten the technological process of production, improve raw Produce efficiency.

The purpose of this utility model can be realized by such technical scheme: this heat radiation, circuit Integrated LED flip chip light source base of ceramic, it includes aluminium oxide or aluminium nitride ceramics base body And on upper surface sputtered Cu layer corrosion prepare printed circuit, described base of ceramic body by The cylinder that empty upper round platform and its lower end connect is constituted, the upper surface of round platform, i.e. ceramic base in hollow Also offer the fairlead communicated with its inner chamber on the upper surface of seat body, and in hollow, round platform lower end connects Cylinder outer wall on be shaped with screw thread.When such LED flip chip light source base of ceramic uses, will On the printed circuit that the direct die bond of LED flip chip prepares on base of ceramic body upper surface, and lead to Cross lead-in wire to be connected with the drive circuit being installed in base of ceramic Body Lumen.Use such base of ceramic LED illumination product: LED flip chip work time produce heat directly will be fixed on pottery by sputter Printed circuit on porcelain base body upper surface is conducted to base of ceramic body, owing to forming printed circuit Copper material be good conductor, and base of ceramic body uses aluminium oxide or aluminium nitride ceramics manufacture, has High conduction of heat and the physical characteristic of high radiation, thus the heat produced when LED flip chip can be worked Quickly derive and dissipate.

This heat radiation provided by the utility model, circuit integration LED flip chip light source ceramic base Seat, owing to the printed circuit of die bond LED flip chip is to use sputtering process at aluminium oxide or aluminium nitride On the upper surface of base of ceramic body, direct sputter one layers of copper, is then formed by etching, not only makes LED The heat produced during flip-chip work can be fixed on the printing on base of ceramic body upper surface by sputter Circuit is directly conducted to base of ceramic body and dissipates, thus shorten LED flip chip heat dissipation path, Reduce thermal resistance, raising heat conductivility, extend its service life, but also make LED flip chip illuminate Product structure simplifies, the technological process of production shortens, production efficiency improves.

Accompanying drawing explanation

Fig. 1 is existing LED flip chip illuminating product structural representation；

Heat radiation that Fig. 2 is provided by this utility model embodiment, circuit integration LED flip chip light The front view of source base of ceramic；

Heat radiation that Fig. 3 is provided by this utility model embodiment, circuit integration LED flip chip light The top view of source base of ceramic；

Heat radiation that Fig. 4 is provided by this utility model embodiment, circuit integration LED flip chip light The use state reference map of source base of ceramic；

Labelling in figure: 1, LED flip chip, 2, printed circuit, 3, epoxy resin, 4, aluminum base Plate, 5, heat-conducting silicone grease, 6, radiator, 7, Circular shape lampshade groove is installed, 8, the upper round platform of hollow, 9, the cylinder that in hollow, round platform lower end connects, 10, fairlead, 11, lampshade, 12, socket.

Detailed description of the invention

Below in conjunction with embodiment, the utility model is described in further detail, but is not limiting as this utility model Protection domain.

Referring to the drawings 2,3, this utility model embodiment provides one heat radiation, circuit integration LED to fall Cartridge chip light source base of ceramic, it includes on aluminium oxide or aluminium nitride ceramics base body and upper surface thereof Sputtered Cu layer corrosion prepare printed circuit 2, described base of ceramic body is by the upper round platform 8 of hollow The cylinder 9 connected with its lower end is constituted, the upper surface of round platform 8 in hollow, i.e. base of ceramic body Upper surface on also offer the fairlead 10 communicated with its inner chamber, and pacify near edge Circular shape lampshade Dress groove 7, and it is shaped with screw thread on cylinder 9 outer wall that in hollow, round platform 8 lower end connects.

Referring to the drawings 4, this heat radiation that this utility model embodiment is provided, circuit integration LED When flip-chip light source base of ceramic uses, by direct for LED flip chip 1 die bond at base of ceramic originally On the printed circuit 2 prepared on body upper surface, and by going between and being installed on base of ceramic Body Lumen Interior drive circuit (not shown) is connected, and then offers by base of ceramic body upper surface Circular shape lampshade install groove install lampshade 11, then by lead-in wire will be installed on base of ceramic Body Lumen Interior drive circuit is connected with spinning socket 12 on cylinder under base of ceramic body, i.e. completes The production of LED flip chip illuminating product, the technological process of production shortens, and production efficiency is carried significantly High.

Claims

1. a heat radiation, circuit integration LED flip chip light source base of ceramic, it is characterised in that: It includes what the sputtered Cu layer corrosion on aluminium oxide or aluminium nitride ceramics base body and upper surface thereof prepared Printed circuit (2), described base of ceramic body is connected by the upper round platform (8) of hollow and its lower end Cylinder (9) is constituted, the upper surface of round platform (8), the i.e. upper surface of base of ceramic body in hollow On also offer the fairlead (10) communicated with its inner chamber, and the circle that in hollow, round platform (8) lower end connects It is shaped with screw thread on cylinder (9) outer wall.

Heat radiation the most according to claim 1, circuit integration LED flip chip light source pottery Pedestal, it is characterised in that: the upper surface of round platform (8) in described hollow, i.e. base of ceramic body is upper End face installs groove (7) near edge Circular shape lampshade.