WO2019148934A1

WO2019148934A1 - Lighting fixture, in-line led bead, and manufacturing method

Info

Publication number: WO2019148934A1
Application number: PCT/CN2018/115115
Authority: WO
Inventors: 吴相勇
Original assignee: 吴相勇
Priority date: 2018-01-31
Filing date: 2018-11-13
Publication date: 2019-08-08
Also published as: CN108172679A

Abstract

An in-line light-emitting diode (LED) bead (10), comprising a patch LED (11); the patch LED (11) comprises an LED chip (110), a first flat support (111), a second flat support (113), and a first packaging structure (115) used for coating the LED chip (110) and fixing the first flat support (111) and the second flat support (113); the LED bead (10) further comprises a first pin (15) that is electrically connected to the first flat support (111), a second pin (17) that is electrically connected to the second flat support (113), and a second packaging structure (13) used for coating the first packaging structure (115) and fixing the first pin (15) and the second pin (17). The in-line LED bead (10) uses the sorted patch LED (11) as a light source, and the obtained in-line LED bead (10) has good consistency, and the loss of resins as well as the first pin (15) and the second pin (17) during production is low. By directly connecting the patch LED (11) to the first pin (15) and the second pin (17), the first pin (15) and the second pin (17) achieve an effect of enhanced heat dissipation such that the obtained in-line LED bead (10) has a longer service life and light decay is reduced.

Description

Lamp, in-line LED lamp bead and manufacturing method

Technical field

The invention relates to the field of illumination, in particular to lamps, in-line LED lamp beads and a manufacturing method thereof.

Background technique

Light-emitting diodes in English, called LightEmittingDiode (LED for short), is a new type of solid-state light source. Born in the 1960s, in 1923, Lossen.ow studied light emission in a PN junction with impurities in semiconductor SiC, and developed a light-emitting diode (LED: Light Emitting Diode), which has been ignored. The rapid development of the electronics industry, in the 1960s, the rapid development of display technology LED has gradually received people's attention. The advantages of LED are long life (>100,000Hrs), low driving voltage (1.8~4.5V), low power consumption (40~1000mW), relatively cold light source (small radiation), fast lighting speed (time constant is 10) -7～10-9S), avoid suspected lighting effect, small size, multiple colors, excellent shock resistance (all solid packaging, not easy to break), good monochromaticity (stable wavelength of light emission), green pollution-free.

Please refer to Figure 1, the Chinese invention patent of the publication No. CN1883057 (applicant: Nichia Chemical Industry Co., Ltd., inventor: Takashima Yu; Kameji Masahiro; Yuji Kuanren; Wushi Shunsi; Murakami Jiadian; Muxia Jinping) A light-emitting device (in-line LED lamp bead) has a light-emitting element 10 (LED wafer) in an ultraviolet region, and a cathode-side lead frame 13a (first pin) having a cup in which the light-emitting element 10 is placed, and is disposed in An anode side lead frame 13b (second pin) away from the position of the lead frame 13a, and a coating member 12 (first package structure) including the phosphor 11 provided in the cup of the lead frame 13a, and a transparent mold covering the whole The member 15 (second package structure), and a plurality of direct migration type phosphors are used as the phosphor 11.

Further, the positive electrode 3 of the light-emitting element 10 is connected to the lead frame 13b via a wire 14, the negative electrode 4 of the light-emitting element 10 is connected to the lead frame 13a via a wire 14, and the light-emitting element 10, the wire 14, the cup of the lead frame 13a, and The front end portion of the lead frame 13b is covered by the transparent mold member 15.

The illuminating device is manufactured as follows:

First, the chip component 13 is soldered (bonded) to the light-emitting component 10 by chip soldering on the surface of the lead frame 13a: after the chip is soldered, the lead frame 13 is transferred to the wire bonding machine, and the negative electrode 4 of the light-emitting element is golded. a wire (conductive wire) is wire-bonded to the upper end portion of the cup of the lead frame 13a, and the positive electrode 3 is wire-bonded to the other lead frame 13b; secondly, it is transferred to the molding device, and the dispenser of the molding device is used The phosphor 11 and the coating member 12 are injected into the cup of the lead frame 13a. The phosphor 11 and the coating member 12 are uniformly mixed in a desired ratio before the injection. The illuminating color of the illuminating device is mainly determined by the illuminating colors of the plurality of phosphors; after the phosphor 11 and the coating member 12 are injected, the lead frame 13 is immersed in a mold box in which the mold member 15 is previously injected, and the detachable type is removed. The box hardens the resin to produce a bullet-type illuminating device as shown in FIG.

Referring to Figures 2 and 3, the Chinese invention patent of the publication No. CN106449937A (Applicant: Nichia Chemical Industry Co., Ltd., inventor: Wakaki Takahiro) discloses a light-emitting device 100 (patch LED) having a substrate 101, It is provided with a recess S including a bottom surface and a side wall; and a pair of conductive members 102 whose upper surface is exposed at the bottom surface of the recess S. The conductive member 102 is formed such that its lower surface is formed as an outer surface of the light-emitting device 100, and together with the base 101 constitutes a part of the lower surface of the light-emitting device 100. In the concave portion S, a light-emitting element 102 electrically connected to the conductive wire 105 or the like by the conductive member 102 is placed using a bonding member (not shown). Further, a light-transmitting sealing member 104 (first package structure) is provided in the concave portion S so as to cover the light-emitting element 103 (LED wafer) or the like.

The illuminating device is manufactured as follows:

First, a support substrate made of a metal plate or the like is prepared; then, a base body that reflects light from the light-emitting element is formed between the conductive members; and then, the light-emitting element is bonded to the bottom surface of the base concave portion using the joint member, and the conductive wire can be used. The conductive member is electrically connected; thereafter, the recessed portion is filled with a sealing member containing a light-transmitting resin; by curing the sealing member, an assembly of the light-emitting device is obtained, and the support substrate is peeled off from the assembly; finally, the recess and the recess are cut The side walls are singulated so that a light-emitting device having one recess as shown in Fig. 1A can be obtained.

Usually, the pins of the in-line LED lamp bead are thin and long, and the molding precision of the lead is high. In the automatic production, the color and brightness of the in-line LED obtained by the pin, especially the cup forming progress of 13a, are consistent. Poor sex. The stent used for the patch LED is a wide and short plate-like structure, and the cup type structure is not required on the bracket, and the precision of the bracket used for the patch LED is low, and the produced patch LED has good consistency.

However, in the prior art, in-line products, differences (color, brightness) are inevitably generated in the manufacturing process of the in-line LED lamp bead. The defective product causes the producer to lose the resin of the second package structure portion and the first pin and the second pin.

Summary of the invention

The object of the present invention is to provide a direct insertion type LED lamp bead, which has the consistency of the in-line type LED lamp bead obtained in the production of the in-line type LED lamp bead, and the loss of the resin and the first pin and the second pin are produced. less.

Another object of the present invention is to provide a luminaire that uses a direct-inserted LED lamp bead as a light source to produce a loss of resin and a small number of first pins and second pins.

Another object of the present invention is to provide a method for manufacturing an in-line LED lamp bead. The obtained in-line LED lamp bead has good consistency, and the loss of the resin and the first pin and the second pin are small.

In order to achieve the above advantages, the present invention provides an in-line LED lamp bead, comprising a patch LED, the patch LED comprising an LED chip, a first flat bracket, a second flat bracket, and a cover for the LED chip and fixing the LED chip a first mounting structure of the first flat bracket and the second flat bracket, wherein the LED lamp bead further includes a first pin electrically connected to the first flat bracket, and is electrically connected to the second flat bracket a second pin and a second package structure for covering the first package structure and fixing the first pin and the second pin.

In an embodiment of the invention, the first flat bracket is in contact with the upper end surface of the first pin, and the second flat bracket is in contact with the upper end surface of the second pin.

In an embodiment of the invention, the first flat bracket is attached to the upper end side of the first pin, and the second flat bracket is attached to the upper end side of the second pin.

In an embodiment of the invention, the in-line LED lamp bead of the luminaire includes the following steps:

E. connecting the first flat bracket and the second flat bracket of the sorted LEDs to the first lead rod and the second lead rod on the LED bracket board;

F. covering the second encapsulant outside the first package structure to form an uncured second package structure;

G, heating to cure the surface of the uncured second package structure;

H. Trim the first lead rod and the second lead connecting rod of the LED bracket board to form a first pin and a second pin to form an in-line LED lamp bead.

In an embodiment of the invention, the step E includes: A1, the first flat bracket and/or the first lead rod, the second flat bracket and/or the second pin The rod is coated with solder paste; A2, the first flat bracket and the first lead rod are attached, the second flat bracket and the second lead rod are attached; A3, the solder paste is heated and melted; A4, adding the first The pressure between the flat bracket and the first lead rod, the second flat bracket and the second lead rod; A5, the cooled molten solder makes the first flat bracket and the first lead rod, the second flat bracket and the second lead The foot rods are fixed.

In one embodiment of the invention, the second encapsulant is one or more of an epoxy, a silicone, and a silicone modified epoxy.

In an embodiment of the invention, the sorted patch LEDs in step A are obtained by the following steps:

S101, electrically connecting the two electrodes of the LED chip to the first flat bracket and the second flat bracket;

S102, covering the first encapsulant outside the LED chip to form an uncured first package structure;

S103, heating the fully cured uncured first package structure, the first package structure is fixed to the first flat bracket, the second flat bracket to form a patch LED;

S104, sorting patch LED;

In an embodiment of the invention, the first encapsulant is formed by uniformly mixing phosphor and encapsulating glue.

In an embodiment of the present invention, the step S104 includes: classifying a plurality of patch LEDs according to color temperature and/or brightness to obtain a multi-component selected patch LED.

In the lamp, the in-line LED lamp bead and the manufacturing method of the invention, the in-line LED lamp bead uses the sorted patch LED as a light source, and the obtained in-line LED lamp bead has good consistency and production loss. The resin has fewer first pins and second pins. In the present invention, the chip LED is directly connected to the first pin and the second pin, and the first pin and the second pin have the effect of increasing heat dissipation, so that the in-line LED lamp bead improves life and reduces Light decay.

DRAWINGS

FIG. 1 is a schematic structural view of a conventional in-line LED lamp bead.

FIG. 2 is a schematic view showing the structure of a conventional patch LED.

Figure 3 is a cross-sectional view of the patch LED of Figure 2.

FIG. 4 is a schematic structural view of an in-line LED lamp bead according to a first embodiment of the present invention.

FIG. 5 is a schematic structural view of a patch LED of the in-line LED lamp bead of FIG. 4.

FIG. 6 is a schematic structural view of the first flat bracket and the second flat bracket of the patch LED of FIG. 5.

FIG. 7 is a schematic structural view of the first pin and the second pin of the in-line LED lamp bead of FIG. 4.

Fig. 8 is a view showing the state of the patch LED of the method for manufacturing the in-line LED lamp bead according to the first embodiment of the present invention before being connected to the first and second pins.

FIG. 9 is a schematic view showing a state in which the patch LED of the method for manufacturing the in-line LED lamp bead of FIG. 6 is connected to the first and second pins.

FIG. 10 is a schematic view showing a state in which the patch LED of the method for manufacturing the in-line LED lamp bead of FIG. 9 is covered with the second package structure.

FIG. 11 is a schematic view showing the state after the first and second pin rods are removed from the method for manufacturing the in-line LED lamp bead of FIG. 10.

FIG. 12 is a schematic view showing a state before the first flat holder of the patch LED of FIG. 1 is connected to the LED chip.

FIG. 13 is a schematic view showing a state in which the first flat holder of the patch LED of FIG. 12 is connected to the LED chip.

FIG. 14 is a schematic view showing the state of the package LED of FIG. 13 after the first package structure is packaged.

Fig. 15 is a view showing a state in which a patch LED of a method for manufacturing an in-line LED lamp bead according to a second embodiment of the present invention is connected to first and second pins.

Fig. 16 is a view showing a state in which a patch LED of a method for manufacturing an in-line type LED lamp bead according to a third embodiment of the present invention is connected to first and second pins.

Fig. 17 is a view showing a state in which a patch LED of a method for manufacturing an in-line type LED lamp bead according to a fourth embodiment of the present invention is connected to first and second pins.

Fig. 18 is a partial enlarged view of Fig. 8.

Fig. 19 is a partial enlarged view of Fig. 15.

Fig. 20 is a partial enlarged view of Fig. 16.

Detailed ways

The detailed description of the specific embodiments, structures, features and functions of the present invention in accordance with the present invention are set forth in the accompanying drawings and claims.

FIG. 4 is a schematic structural view of an in-line LED lamp bead according to a first embodiment of the present invention. Referring to FIG. 4 , the in-line LED lamp bead 10 of the first embodiment of the present invention includes a patch LED 11 , a second package structure 13 , a first pin 15 , and a second pin 17 . The chip LED 11 is completely housed in the second package structure 13; the upper ends of the first pin 15 and the second pin 17 are accommodated in the second package structure 13; there is a gap between the first pin 15 and the second pin 17 The upper end faces of the first pin 15 and the second pin 17 are respectively attached to the first flat bracket 111 and the second flat bracket 113 of the patch LED 11.

FIG. 5 is a schematic structural view of a patch LED of the in-line LED lamp bead of FIG. 4. Referring to FIG. 5, the SMD LED 11 (B.SMD, surface mount diode) selects a 0603 type SMD LED, and the SMD LED package includes an LED chip 110, a wire 110a, and a first flat support 111. The second flat bracket 113 and the first package structure 115 for covering the LED wafer 110 and fixing the first flat bracket 111 and the second flat bracket 113.

In other embodiments, the SMD LED can also be used with other sizes of SMD LEDs, such as 1206, 2810, 3020, 3528, 5050 SMD LEDs, and the SMD LED color can be selected from monochrome, two-color, and full-color. Kind.

The LED chip 110 is the main raw material of the patch LED 11, and the LED patch mainly relies on the LED wafer 110 to emit light. The upper surface of the LED wafer 110 is provided with positive and negative electrodes. The LED chip 110 is fixed on the first flat bracket 111 by the silver glue 110b, which is a non-conductive silver paste.

The wire 110a is used to electrically connect the positive and negative electrodes of the LED wafer 110 to the first flat bracket 111 and the second flat bracket 113, respectively.

FIG. 6 is a schematic structural view of the first flat bracket and the second flat bracket of the patch LED of FIG. 5. Referring to FIG. 6, the first flat bracket 111 includes a first upper substrate 111a, a first lower substrate 111b, and a first connecting plate 111c for connecting the first upper substrate 111a and the first lower substrate 111b. The second flat bracket 113 includes a second upper substrate 113a, a second lower substrate 113b, and a second connecting plate 113c for connecting the second upper substrate 113a and the second lower substrate 113b.

The second package structure 13 is used to cover the first package structure 115 and fix the first pin 15 and the second pin 17 . The second package structure 13 may be made of a light transmissive material such as epoxy, silicone, and silicone-modified epoxy.

FIG. 7 is a schematic structural view of the first pin and the second pin of the in-line LED lamp bead of FIG. 4. FIG. 5 is a schematic view showing the structure of the holder board 20 for processing the first lead and the second lead. Referring to Figures 4 and 5, the first pin 15 is formed by stamping the metal plate after the support plate 20 is formed by cutting the foot.

The bracket plate 20 includes a middle connecting rod 21 that is laterally arranged, a lower connecting plate 23, a plurality of first lead rods 25 that are vertically spaced apart, and a second lead rod 27. The middle connecting rod 21 and the lower connecting plate 23 are used to maintain the relative positions of the first lead rod 25 and the second lead rod 27 to prevent the first lead rod 25 and the second lead rod 27 from being deformed.

The first pin 15 and the second pin 17 are similar in structure, and the first pin 15 includes a rod-shaped first leg portion 151, a first connecting portion 153, and a first upper end portion 155. The cross section of the first upper end portion 155 and the first connecting portion 153 is larger than the cross section of the first leg portion 151, and the upper end surface of the first upper end portion 155 is a plane that fits the first flat bracket. In this way, when the LED chip emits light, the heat is transmitted to the first leg portion 151 in the atmosphere through the first flat bracket or the first package structure of the metal, the first upper end portion 155, and the heat is dissipated in the atmosphere to prevent heat. The temperature of the LED chip is too high.

A similar second pin 17 includes a rod-shaped second leg portion 151, a second connecting portion 153, and a second upper end portion 155.

Fig. 8 is a view showing the state of the patch LED of the method for manufacturing the in-line LED lamp bead according to the first embodiment of the present invention before being connected to the first and second pins. FIG. 9 is a schematic view showing a state in which the patch LED of the method for manufacturing the in-line LED lamp bead of FIG. 6 is connected to the first and second pins. FIG. 10 is a schematic view showing a state in which the patch LED of the method for manufacturing the in-line LED lamp bead of FIG. 9 is covered with the second package structure. Fig. 11 is a view showing the state after the first and second pin rods are removed from the method of manufacturing the in-line LED lamp bead of Fig. 10. Referring to FIG. 8, 9, 10, 11, and 18. In the embodiment, the method for manufacturing the in-line LED lamp bead includes the following steps:

I. The first flat bracket 111 and the second flat bracket 113 of the sorted LED 11 are respectively connected to the first lead rod 25 and the second lead rod 27 on the bracket board 20;

J, covering the second encapsulation structure 115 outside the first package structure 115 to form an uncured second package structure 13;

K, heating to cure the surface of the uncured second package structure 13;

D. The first lead rod 25, the second lead rod 27, the first connecting rod and the second connecting rod of the trim bracket plate 20 form a first pin 15 and a second pin 17 to form a direct-insertion LED lamp bead. 10.

Further, in the step A, the first flat bracket 111 is in contact with the upper end surface of the first lead 15, and the second flat bracket 113 is in contact with the upper end surface of the second lead 17. The SMD LED 11 is directly connected to the first pin 15 and the second pin 17, and the first pin 15 and the second pin 17 have the effect of increasing heat dissipation, so that the incoming in-line LED lamp bead 10 improves the life and reduces the life. Light decay.

Further, step A includes:

A1, the first flat bracket 111 and / or the first lead rod 25, the second flat bracket 113 and / or the second lead rod 27 is coated with solder paste 116;

A2, the first flat bracket 111 and the first lead rod 25 are attached, and the second flat bracket 113 and the second lead rod 27 are attached;

A3, the solder paste 116 is heated and melted; A4, the pressure between the first flat bracket 111 and the first lead rod 25, the second flat bracket 113 and the second lead rod 27 is increased;

A5. Cooling and melting the solder paste 116 connects the first flat bracket 111 and the first lead rod 25, the second flat bracket 113 and the second lead rod 27 to each other.

Wherein, the second encapsulant of step B is one or more of epoxy, silicone and silicone modified epoxy resins.

12 is a schematic view showing a state before the first flat bracket of the patch LED of FIG. 1 is connected to the LED chip, and FIG. 13 is a schematic view showing a state after the first flat bracket of the patch LED of FIG. 12 is connected to the LED chip. FIG. 14 is a schematic view showing the state of the package LED of FIG. 13 after the first package structure is packaged. Referring to Figures 12, 13, and 14, the sorted patch LEDs 11 in step A are obtained by the following steps:

S101, electrically connecting the two electrodes of the LED chip 110 to the first flat bracket 111 and the second flat bracket 113;

S102, covering the first encapsulant outside the LED chip 110 to form an uncured first package structure 115;

S103, heating fully cured uncured first package structure 115, the first package structure 115 fixed first flat bracket 111, second flat bracket 113, forming patch LED 11;

S104, the plurality of patch LEDs 11 are classified according to color temperature and/or brightness to obtain a multi-component selected patch LED 11;

The first encapsulant in the step S102 is formed by uniformly mixing the phosphor and the encapsulating glue.

Fig. 15 is a view showing a state in which a patch LED of a method for manufacturing an in-line LED lamp bead according to a second embodiment of the present invention is connected to first and second pins. Referring to FIG. 15 and FIG. 19, in the embodiment, two patch LEDs are respectively located on two sides of the first pin and the second pin, and the first flat bracket 111 is attached to the side of the upper end of the first pin 15. The second flat bracket 113 is attached to the side of the upper end of the second lead 17.

Fig. 16 is a view showing a state in which a patch LED of a method for manufacturing an in-line type LED lamp bead according to a third embodiment of the present invention is connected to first and second pins. Referring to FIGS. 16 and 20, in the embodiment, two patch LEDs are respectively located on both sides of the first pin and the second pin. The first flat bracket 111 of one of the patch LEDs is in contact with the upper end side of the first lead 15, the second flat bracket 113 is attached to the upper end side of the second lead 17, and the first flat bracket of the other patch LED 111 is attached to the upper end side of the second lead 17, and the second flat bracket 113 is attached to the upper end side of the first lead 15.

Fig. 17 is a view showing a state in which a patch LED of a method for manufacturing an in-line type LED lamp bead according to a fourth embodiment of the present invention is connected to first and second pins. Referring to FIG. 17, in the embodiment, two patch LEDs are respectively located at upper end faces of the first pin and the second pin. The first flat bracket 111 of one of the patch LEDs is attached to the upper end surface of the first lead 15, the second flat bracket 113 is attached to the upper end surface of the second lead 17, and the first flat bracket of the other patch LED is attached. 111 is bonded to the upper end surface of the second lead 17, and the second flat holder 113 is fitted to the upper end surface of the first lead 15.

In the third and fourth embodiments of the present invention, the in-line LED lamp bead includes two anti-parallel LED patches, that is, the operation of the LED wafer is not limited by the direction of current flow.

The invention also provides a luminaire comprising any of the in-line LED lamp beads.

As shown in the following table, the two flat brackets of the patch LED of the invention are convenient to process, have good rigidity and high precision, and the obtained patch LED has good uniformity and high yield. Through the screening of the SMD LEDs, the obtained SMD LEDs have better color temperature and brightness consistency, saving the resin and the support, and shortening the overall curing time because there is no need to wait for the first package to be completely cured. In addition, the SMD LED is directly connected to the first pin and the second pin, and the first pin and the second pin have a heat dissipating function, so that the in-line LED lamp bead improves the life and reduces the light decay.

According to the estimation of the applicant, the in-line LED lamp bead of the solution of the present application has lower cost, higher production efficiency and good market prospect than the in-line LED lamp bead of the same quality grade.

The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. The present invention has been described above by way of preferred embodiments, but is not intended to limit the invention, and any skilled person skilled in the art. The equivalents of the technical solutions disclosed above may be modified or modified to equivalent variations without departing from the technical scope of the present invention, without departing from the technical scope of the present invention. Any simple modifications, equivalent changes and modifications made to the above embodiments are still within the scope of the technical solutions of the present invention.

Claims

An in-line LED lamp bead comprising a patch LED, the patch LED comprising an LED chip, a first flat bracket, a second flat bracket, and a cover for the LED chip and fixing the first flat bracket, the second The first package structure of the flat bracket is characterized in that the LED lamp bead further includes a first pin electrically connected to the first flat bracket, a second pin electrically connected to the second flat bracket, and a package And covering the first package structure and fixing the first pin and the second package structure of the second pin.
The in-line LED lamp bead according to claim 1, wherein the first flat bracket is attached to an upper end surface of the first pin, and the second flat bracket and the second pin are The upper end face fits.
The in-line LED lamp bead according to claim 1, wherein the first flat bracket is attached to an upper end side of the first pin, and the second flat bracket and the second pin are The upper end side fits.
A luminaire characterized by comprising the in-line LED lamp bead according to any one of claims 1 to 3.
A method for manufacturing an in-line LED lamp bead, comprising the steps of:

A. The first flat bracket and the second flat bracket of the sorted LED are respectively connected to the first lead rod and the second lead rod on the LED bracket board;

B, covering the second encapsulant outside the first package structure to form an uncured second package structure;

C. heating causes the surface of the uncured second package structure to be cured;

D. Trim the first lead rod and the second lead connecting rod of the LED bracket board to form a first pin and a second pin to form an in-line LED lamp bead.
The method of manufacturing the in-line LED lamp bead according to claim 5, wherein the step E comprises: A1, the first flat bracket and/or the first lead rod, the first Applying a solder paste to the second flat bracket and/or the second lead rod; A2, bonding the first flat bracket and the first lead rod, and fitting the second flat bracket and the second lead rod; A3, The solder paste is heated and melted; A4, increasing the pressure between the first flat bracket and the first lead rod, the second flat bracket and the second lead rod; A5, cooling the molten solder paste to make the first flat bracket and the first The pin rod, the second flat bracket and the second lead rod are fixedly connected.
The in-line LED lamp bead according to claim 7, wherein the second encapsulant is one or more of an epoxy, a silicone, and a silicone modified epoxy.
The in-line LED lamp bead according to claim 7, wherein the sorted patch LED in the step A is obtained by the following steps:

S101, electrically connecting the two electrodes of the LED chip to the first flat bracket and the second flat bracket;

S102, covering the first encapsulant outside the LED chip to form an uncured first package structure;

S103, heating the fully cured uncured first package structure, the first package structure is fixed to the first flat bracket, the second flat bracket to form a patch LED;

S104, sorting patch LED;
The in-line LED lamp bead according to claim 8, wherein the first encapsulant is uniformly mixed with a phosphor and a package glue.
The in-line LED lamp bead according to claim 8, wherein the step S104 comprises: classifying the plurality of patch LEDs according to color temperature and/or brightness to obtain a multi-component selected patch LED.