WO2019148934A1 - Lighting fixture, in-line led bead, and manufacturing method - Google Patents

Lighting fixture, in-line led bead, and manufacturing method Download PDF

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Publication number
WO2019148934A1
WO2019148934A1 PCT/CN2018/115115 CN2018115115W WO2019148934A1 WO 2019148934 A1 WO2019148934 A1 WO 2019148934A1 CN 2018115115 W CN2018115115 W CN 2018115115W WO 2019148934 A1 WO2019148934 A1 WO 2019148934A1
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Prior art keywords
pin
led
flat bracket
lamp bead
package
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PCT/CN2018/115115
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French (fr)
Chinese (zh)
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吴相勇
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吴相勇
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Priority to CN201810097285.3 priority Critical
Priority to CN201810097285.3A priority patent/CN108172679A/en
Application filed by 吴相勇 filed Critical 吴相勇
Publication of WO2019148934A1 publication Critical patent/WO2019148934A1/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0066Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Abstract

An in-line light-emitting diode (LED) bead (10), comprising a patch LED (11); the patch LED (11) comprises an LED chip (110), a first flat support (111), a second flat support (113), and a first packaging structure (115) used for coating the LED chip (110) and fixing the first flat support (111) and the second flat support (113); the LED bead (10) further comprises a first pin (15) that is electrically connected to the first flat support (111), a second pin (17) that is electrically connected to the second flat support (113), and a second packaging structure (13) used for coating the first packaging structure (115) and fixing the first pin (15) and the second pin (17). The in-line LED bead (10) uses the sorted patch LED (11) as a light source, and the obtained in-line LED bead (10) has good consistency, and the loss of resins as well as the first pin (15) and the second pin (17) during production is low. By directly connecting the patch LED (11) to the first pin (15) and the second pin (17), the first pin (15) and the second pin (17) achieve an effect of enhanced heat dissipation such that the obtained in-line LED bead (10) has a longer service life and light decay is reduced.

Description

灯具、直插式LED灯珠及制造方法Lamp, in-line LED lamp bead and manufacturing method 技术领域Technical field
本发明涉及照明领域,尤其是灯具、直插式LED灯珠及制造方法。The invention relates to the field of illumination, in particular to lamps, in-line LED lamp beads and a manufacturing method thereof.
背景技术Background technique
发光二极管英文全称为LightEmittingDiode(简称LED),是一种新型的固态光源。诞生于20世纪60年代,1923年罗塞夫(Lossen.o.w)在研究半导体SiC时有杂质的P-N结中有光发射,研究出了发光二极管(LED:LightEmittingDiode),一直不受重视.随着电子工业的快速发展,在60年代,显示技术得到迅速发展LED才逐步受到人们的重视。LED的优点为寿命长(>100,000Hrs)、驱动电压低(1.8~4.5V)、耗电量少(40~1000mW)、相对冷光源(辐射小)、点亮速度快(时间常数为10-7~10-9S)、避免疑似点灯效应、体积小、多种色彩、耐震性特佳(全固体封装,不易破损)、单色性佳(发光波长稳定)、绿色无污染。Light-emitting diodes in English, called LightEmittingDiode (LED for short), is a new type of solid-state light source. Born in the 1960s, in 1923, Lossen.ow studied light emission in a PN junction with impurities in semiconductor SiC, and developed a light-emitting diode (LED: Light Emitting Diode), which has been ignored. The rapid development of the electronics industry, in the 1960s, the rapid development of display technology LED has gradually received people's attention. The advantages of LED are long life (>100,000Hrs), low driving voltage (1.8~4.5V), low power consumption (40~1000mW), relatively cold light source (small radiation), fast lighting speed (time constant is 10) -7~10-9S), avoid suspected lighting effect, small size, multiple colors, excellent shock resistance (all solid packaging, not easy to break), good monochromaticity (stable wavelength of light emission), green pollution-free.
请参见图1,公布号CN1883057的中国发明专利(申请人:日亚化学工业株式会社,发明人:高岛优;龟岛正敏;玉置宽人;武市顺司;村崎嘉典;木下晋平)公开了一种发光装置(直插式LED灯珠)具有,紫外区域的发光元件10(LED晶片)和、具有放置发光元件10的杯的阴极侧引线框13a(第一引脚)和、设置在离开引线框13a位置的阳极侧引线框13b(第二引脚)和、包含设置在引线框13a杯内的荧光体11的涂覆部件12(第一封装结构)和、覆盖整体的透明塑模部件15(第二封装结构),并且作为荧光体11使用多个直接迁移型荧光体。Please refer to Figure 1, the Chinese invention patent of the publication No. CN1883057 (applicant: Nichia Chemical Industry Co., Ltd., inventor: Takashima Yu; Kameji Masahiro; Yuji Kuanren; Wushi Shunsi; Murakami Jiadian; Muxia Jinping) A light-emitting device (in-line LED lamp bead) has a light-emitting element 10 (LED wafer) in an ultraviolet region, and a cathode-side lead frame 13a (first pin) having a cup in which the light-emitting element 10 is placed, and is disposed in An anode side lead frame 13b (second pin) away from the position of the lead frame 13a, and a coating member 12 (first package structure) including the phosphor 11 provided in the cup of the lead frame 13a, and a transparent mold covering the whole The member 15 (second package structure), and a plurality of direct migration type phosphors are used as the phosphor 11.
而且,发光元件10的正电极3,通过导线14连接在引线框13b,发光元件10的负电极4,通过导线14连接在引线框13a,且发光元件10、导线14、引线框13a的杯以及引线框13b的前端部分被透明塑模部 件15所覆盖。Further, the positive electrode 3 of the light-emitting element 10 is connected to the lead frame 13b via a wire 14, the negative electrode 4 of the light-emitting element 10 is connected to the lead frame 13a via a wire 14, and the light-emitting element 10, the wire 14, the cup of the lead frame 13a, and The front end portion of the lead frame 13b is covered by the transparent mold member 15.
该发光装置的制造如下:The illuminating device is manufactured as follows:
首先,用芯片焊接机,在引线框13a的杯面朝上地芯片焊接(粘结)发光元件10:芯片焊接之后,将引线框13移送到焊线机,将发光元件的负电极4以金线(导电性电线)引线接合在引线框13a的杯的上端部分,并将正电极3丝焊在另一方的引线框13b上;其次,移送到塑模装置,用塑模装置的分配器将荧光体11以及涂覆部件12注入到引线框13a的杯内。注入前以所需比例均匀混合荧光体11以及涂覆部件12。发光装置的发光颜色主要由多个荧光体的发光颜色而决定;注入荧光体11以及涂覆部件12之后,将引线框13浸渍在预先注入有塑模部件15的塑模型箱之后,卸下型箱使树脂硬化,就能制造出如图1所示的炮弹型发光装置。First, the chip component 13 is soldered (bonded) to the light-emitting component 10 by chip soldering on the surface of the lead frame 13a: after the chip is soldered, the lead frame 13 is transferred to the wire bonding machine, and the negative electrode 4 of the light-emitting element is golded. a wire (conductive wire) is wire-bonded to the upper end portion of the cup of the lead frame 13a, and the positive electrode 3 is wire-bonded to the other lead frame 13b; secondly, it is transferred to the molding device, and the dispenser of the molding device is used The phosphor 11 and the coating member 12 are injected into the cup of the lead frame 13a. The phosphor 11 and the coating member 12 are uniformly mixed in a desired ratio before the injection. The illuminating color of the illuminating device is mainly determined by the illuminating colors of the plurality of phosphors; after the phosphor 11 and the coating member 12 are injected, the lead frame 13 is immersed in a mold box in which the mold member 15 is previously injected, and the detachable type is removed. The box hardens the resin to produce a bullet-type illuminating device as shown in FIG.
请参见图2、3,公布号CN106449937A的中国发明专利(申请人:日亚化学工业株式会社,发明人:若木贵功)公开了一种发光装置100(贴片LED)其具备:基体101,其设置有包括底面及侧壁的凹部S;以及一对导电构件102,其上表面在凹部S的底面露出。导电构件102使其下表面形成为发光装置100的外表面而设置,并与基体101一起构成发光装置100的下表面的一部分。在凹部S内,使用接合构件(未图示)而载置着通过导电构件102与导电性导线105等进行电连接的发光元件102。再者,在凹部S内以覆盖该发光元件103(LED晶片)等的方式,设置着透光性的密封构件104(第一封装结构)。Referring to Figures 2 and 3, the Chinese invention patent of the publication No. CN106449937A (Applicant: Nichia Chemical Industry Co., Ltd., inventor: Wakaki Takahiro) discloses a light-emitting device 100 (patch LED) having a substrate 101, It is provided with a recess S including a bottom surface and a side wall; and a pair of conductive members 102 whose upper surface is exposed at the bottom surface of the recess S. The conductive member 102 is formed such that its lower surface is formed as an outer surface of the light-emitting device 100, and together with the base 101 constitutes a part of the lower surface of the light-emitting device 100. In the concave portion S, a light-emitting element 102 electrically connected to the conductive wire 105 or the like by the conductive member 102 is placed using a bonding member (not shown). Further, a light-transmitting sealing member 104 (first package structure) is provided in the concave portion S so as to cover the light-emitting element 103 (LED wafer) or the like.
该发光装置的制造如下:The illuminating device is manufactured as follows:
首先,准备由金属板等构成的支持基板;接着,于导电构件间形成可反射来自发光元件的光线的基体;接着,使用接合构件将发光元件接合于基体凹部的底面,使用导电性导线可与导电构件电连接;之后,于 凹部内填充含有透光性树脂的密封构件;通过固化密封构件,可得到发光装置的集合体,从该集合体上剥离除去支持基板;最后,切断凹部与凹部间的侧壁而使其单片化,从而可以得到如图1A所示的具有1个凹部的发光装置。First, a support substrate made of a metal plate or the like is prepared; then, a base body that reflects light from the light-emitting element is formed between the conductive members; and then, the light-emitting element is bonded to the bottom surface of the base concave portion using the joint member, and the conductive wire can be used. The conductive member is electrically connected; thereafter, the recessed portion is filled with a sealing member containing a light-transmitting resin; by curing the sealing member, an assembly of the light-emitting device is obtained, and the support substrate is peeled off from the assembly; finally, the recess and the recess are cut The side walls are singulated so that a light-emitting device having one recess as shown in Fig. 1A can be obtained.
通常由于直插式LED灯珠的引脚细而长、引脚的成型精度要求高,在自动化生产中受引脚尤其是13a的杯成形进度影响得到的直插式LED的颜色、亮度的一致性差。而贴片LED采用的支架为宽而短的板状结构,支架上不需要设置杯型构造,贴片LED采用的支架的精度要求低,生产得到的贴片LED一致性好。Usually, the pins of the in-line LED lamp bead are thin and long, and the molding precision of the lead is high. In the automatic production, the color and brightness of the in-line LED obtained by the pin, especially the cup forming progress of 13a, are consistent. Poor sex. The stent used for the patch LED is a wide and short plate-like structure, and the cup type structure is not required on the bracket, and the precision of the bracket used for the patch LED is low, and the produced patch LED has good consistency.
但是现有技术中,直插式LED灯珠制造过程中不可避免的会产生次品、差异(颜色、亮度)。次品会导致生产者损失第二封装结构部分的树脂和第一引脚、第二引脚。However, in the prior art, in-line products, differences (color, brightness) are inevitably generated in the manufacturing process of the in-line LED lamp bead. The defective product causes the producer to lose the resin of the second package structure portion and the first pin and the second pin.
发明内容Summary of the invention
本发明目的在于提供一种直插式LED灯珠,使直插式LED灯珠生产中得到的直插式LED灯珠的一致性好,生产损失的树脂和第一引脚、第二引脚少。The object of the present invention is to provide a direct insertion type LED lamp bead, which has the consistency of the in-line type LED lamp bead obtained in the production of the in-line type LED lamp bead, and the loss of the resin and the first pin and the second pin are produced. less.
本发明目的还在于提供一种灯具,利用直插式LED灯珠作为光源,生产损失的树脂和第一引脚、第二引脚少。Another object of the present invention is to provide a luminaire that uses a direct-inserted LED lamp bead as a light source to produce a loss of resin and a small number of first pins and second pins.
本发明目的还在于提供直插式LED灯珠的制造方法,得到的直插式LED灯珠的一致性好,生产损失的树脂和第一引脚、第二引脚少。Another object of the present invention is to provide a method for manufacturing an in-line LED lamp bead. The obtained in-line LED lamp bead has good consistency, and the loss of the resin and the first pin and the second pin are small.
为达上述优点,本发明提供一种直插式LED灯珠,包括贴片LED,该贴片LED包括LED晶片、第一平支架、第二平支架以及用于包覆该LED晶片并固定该第一平支架、该第二平支架的第一封装结构,其特征在于,所述LED灯珠还包括与该第一平支架电连接的第一引脚、与该第二平支架电连接的第二引脚以及用于包覆该第一封装结构并固定该第一引脚、该第二引脚的第二封装结构。In order to achieve the above advantages, the present invention provides an in-line LED lamp bead, comprising a patch LED, the patch LED comprising an LED chip, a first flat bracket, a second flat bracket, and a cover for the LED chip and fixing the LED chip a first mounting structure of the first flat bracket and the second flat bracket, wherein the LED lamp bead further includes a first pin electrically connected to the first flat bracket, and is electrically connected to the second flat bracket a second pin and a second package structure for covering the first package structure and fixing the first pin and the second pin.
在本发明的一个实施例中,所述第一平支架与所述第一引脚的上端端面贴合,所述第二平支架与所述第二引脚的上端端面贴合。In an embodiment of the invention, the first flat bracket is in contact with the upper end surface of the first pin, and the second flat bracket is in contact with the upper end surface of the second pin.
在本发明的一个实施例中,所述第一平支架与所述第一引脚的上端侧面贴合,所述第二平支架与所述第二引脚的上端侧面贴合。In an embodiment of the invention, the first flat bracket is attached to the upper end side of the first pin, and the second flat bracket is attached to the upper end side of the second pin.
在本发明的一个实施例中,一种灯具所述的直插式LED灯珠包括以下的步骤:In an embodiment of the invention, the in-line LED lamp bead of the luminaire includes the following steps:
E、将分选后的贴片LED的第一平支架、第二平支架分别与LED支架板上的第一引脚杆、第二引脚杆连接;E. connecting the first flat bracket and the second flat bracket of the sorted LEDs to the first lead rod and the second lead rod on the LED bracket board;
F、在第一封装结构外覆盖第二封装胶形成未固化的第二封装结构;F. covering the second encapsulant outside the first package structure to form an uncured second package structure;
G、加热使未固化的第二封装结构的表面固化;G, heating to cure the surface of the uncured second package structure;
H、修剪LED支架板的第一引脚杆、第二引脚连接杆形成第一引脚、第二引脚,形成直插式LED灯珠。H. Trim the first lead rod and the second lead connecting rod of the LED bracket board to form a first pin and a second pin to form an in-line LED lamp bead.
在本发明的一个实施例中,所述步骤E包括:A1、在所述第一平支架和/或所述第一引脚杆,所述第二平支架和/或所述第二引脚杆上涂覆锡膏;A2、将第一平支架和第一引脚杆贴合,第二平支架和第二引脚杆贴合;A3、将该锡膏加热融化;A4、增加第一平支架和第一引脚杆、第二平支架和第二引脚杆间的压力;A5、冷却融化的锡膏使第一平支架和第一引脚杆、第二平支架和第二引脚杆连接固定。In an embodiment of the invention, the step E includes: A1, the first flat bracket and/or the first lead rod, the second flat bracket and/or the second pin The rod is coated with solder paste; A2, the first flat bracket and the first lead rod are attached, the second flat bracket and the second lead rod are attached; A3, the solder paste is heated and melted; A4, adding the first The pressure between the flat bracket and the first lead rod, the second flat bracket and the second lead rod; A5, the cooled molten solder makes the first flat bracket and the first lead rod, the second flat bracket and the second lead The foot rods are fixed.
在本发明的一个实施例中,所述第二封装胶为环氧、有机硅和有机硅改性环氧树脂中的一种或多种。In one embodiment of the invention, the second encapsulant is one or more of an epoxy, a silicone, and a silicone modified epoxy.
在本发明的一个实施例中,所述步骤A中的分选后的贴片LED由以下步骤获得:In an embodiment of the invention, the sorted patch LEDs in step A are obtained by the following steps:
S101、将LED晶片的两个电极分别与第一平支架、与第二平支架电连接;S101, electrically connecting the two electrodes of the LED chip to the first flat bracket and the second flat bracket;
S102、在LED晶片外覆盖第一封装胶形成未固化的第一封装结构;S102, covering the first encapsulant outside the LED chip to form an uncured first package structure;
S103、加热完全固化未固化的第一封装结构,使该第一封装结构固定该 第一平支架、该第二平支架,形成贴片LED;S103, heating the fully cured uncured first package structure, the first package structure is fixed to the first flat bracket, the second flat bracket to form a patch LED;
S104、分选贴片LED;S104, sorting patch LED;
在本发明的一个实施例中,所述第一封装胶由荧光粉与封装胶水均匀混合而成。In an embodiment of the invention, the first encapsulant is formed by uniformly mixing phosphor and encapsulating glue.
在本发明的一个实施例中,所述的步骤S104包括:将多个贴片LED按照色温和/或亮度分类,得到多组分选后的贴片LED。In an embodiment of the present invention, the step S104 includes: classifying a plurality of patch LEDs according to color temperature and/or brightness to obtain a multi-component selected patch LED.
在本发明中的灯具、直插式LED灯珠及制造方法中,直插式LED灯珠利用分选后的贴片LED作为光源,得到的直插式LED灯珠的一致性好,生产损失的树脂和第一引脚、第二引脚少。在本发明中,将贴片LED与第一引脚,第二引脚直接连接,第一引脚,第二引脚具有增加散热的效果,使得到的直插式LED灯珠提高寿命,减少光衰。In the lamp, the in-line LED lamp bead and the manufacturing method of the invention, the in-line LED lamp bead uses the sorted patch LED as a light source, and the obtained in-line LED lamp bead has good consistency and production loss. The resin has fewer first pins and second pins. In the present invention, the chip LED is directly connected to the first pin and the second pin, and the first pin and the second pin have the effect of increasing heat dissipation, so that the in-line LED lamp bead improves life and reduces Light decay.
附图说明DRAWINGS
图1所示为现有的一种直插式LED灯珠的结构示意图。FIG. 1 is a schematic structural view of a conventional in-line LED lamp bead.
图2所示为现有的贴片LED的结构示意图。FIG. 2 is a schematic view showing the structure of a conventional patch LED.
图3所示为图2贴片LED的截面图。Figure 3 is a cross-sectional view of the patch LED of Figure 2.
图4所示为本发明第一实施例的直插式LED灯珠的结构示意图。FIG. 4 is a schematic structural view of an in-line LED lamp bead according to a first embodiment of the present invention.
图5所示为图4的直插式LED灯珠的贴片LED的结构示意图。FIG. 5 is a schematic structural view of a patch LED of the in-line LED lamp bead of FIG. 4.
图6所示为图5的贴片LED的第一平支架和第二平支架的结构示意图。FIG. 6 is a schematic structural view of the first flat bracket and the second flat bracket of the patch LED of FIG. 5.
图7所示为图4的直插式LED灯珠的第一引脚和第二引脚的结构示意图。FIG. 7 is a schematic structural view of the first pin and the second pin of the in-line LED lamp bead of FIG. 4.
图8所示为本发明第一实施例的直插式LED灯珠的制造方法的贴片LED与第一、二引脚连接前的状态示意图。Fig. 8 is a view showing the state of the patch LED of the method for manufacturing the in-line LED lamp bead according to the first embodiment of the present invention before being connected to the first and second pins.
图9所示为图6的直插式LED灯珠的制造方法的贴片LED与第一、二引脚连接后的状态示意图。FIG. 9 is a schematic view showing a state in which the patch LED of the method for manufacturing the in-line LED lamp bead of FIG. 6 is connected to the first and second pins.
图10所示为图9的直插式LED灯珠的制造方法的贴片LED包覆第二封装结构后的状态示意图。FIG. 10 is a schematic view showing a state in which the patch LED of the method for manufacturing the in-line LED lamp bead of FIG. 9 is covered with the second package structure.
图11所示为图10的直插式LED灯珠的制造方法的第一、二引脚杆切除后的状态示意图。FIG. 11 is a schematic view showing the state after the first and second pin rods are removed from the method for manufacturing the in-line LED lamp bead of FIG. 10.
图12所示为图1的贴片LED的第一平支架与LED晶片连接前的状态示意图。FIG. 12 is a schematic view showing a state before the first flat holder of the patch LED of FIG. 1 is connected to the LED chip.
图13所示为图12的贴片LED的第一平支架与LED晶片连接后的状态示意图。FIG. 13 is a schematic view showing a state in which the first flat holder of the patch LED of FIG. 12 is connected to the LED chip.
图14所示为图13的贴片LED的封装第一封装结构后的状态示意图。FIG. 14 is a schematic view showing the state of the package LED of FIG. 13 after the first package structure is packaged.
图15所示为本发明第二实施例的直插式LED灯珠的制造方法的贴片LED与第一、二引脚连接后的状态示意图。Fig. 15 is a view showing a state in which a patch LED of a method for manufacturing an in-line LED lamp bead according to a second embodiment of the present invention is connected to first and second pins.
图16所示为本发明第三实施例的直插式LED灯珠的制造方法的贴片LED与第一、二引脚连接后的状态示意图。Fig. 16 is a view showing a state in which a patch LED of a method for manufacturing an in-line type LED lamp bead according to a third embodiment of the present invention is connected to first and second pins.
图17所示为本发明第四实施例的直插式LED灯珠的制造方法的贴片LED与第一、二引脚连接后的状态示意图。Fig. 17 is a view showing a state in which a patch LED of a method for manufacturing an in-line type LED lamp bead according to a fourth embodiment of the present invention is connected to first and second pins.
图18所示为图8的局部放大图。Fig. 18 is a partial enlarged view of Fig. 8.
图19所示为图15的局部放大图。Fig. 19 is a partial enlarged view of Fig. 15.
图20所示为图16的局部放大图。Fig. 20 is a partial enlarged view of Fig. 16.
具体实施方式Detailed ways
为更进一步阐述本发明为达成预定发明目的所采取的技术手段及功效,以下结合附图及较佳实施例,对依据本发明提出具体实施方式、结构、特征及其功效,详细说明如后。The detailed description of the specific embodiments, structures, features and functions of the present invention in accordance with the present invention are set forth in the accompanying drawings and claims.
图4所示为本发明第一实施例的直插式LED灯珠的结构示意图。请参见图4,本发明第一实施例的直插式LED灯珠10,包括贴片LED11、第二封装结构13、第一引脚15、第二引脚17。贴片LED11完全容纳在第二封装结构13内;第一引脚15和第二引脚17上端容纳在在第二封装结构13内;第一 引脚15和第二引脚17之间具有间隙;第一引脚15和第二引脚17的上端端面分别和贴片LED11的第一平支架111、第二平支架113贴合。FIG. 4 is a schematic structural view of an in-line LED lamp bead according to a first embodiment of the present invention. Referring to FIG. 4 , the in-line LED lamp bead 10 of the first embodiment of the present invention includes a patch LED 11 , a second package structure 13 , a first pin 15 , and a second pin 17 . The chip LED 11 is completely housed in the second package structure 13; the upper ends of the first pin 15 and the second pin 17 are accommodated in the second package structure 13; there is a gap between the first pin 15 and the second pin 17 The upper end faces of the first pin 15 and the second pin 17 are respectively attached to the first flat bracket 111 and the second flat bracket 113 of the patch LED 11.
图5所示为图4的直插式LED灯珠的贴片LED的结构示意图。请参见图5,贴片LED11(B.SMD,表面贴装二极管)选用0603型贴片LED,该贴片LED包(Surface mount diode)括LED晶片110、导线110a、第一平支架111、第二平支架113以及用于包覆LED晶片110并固定第一平支架111、第二平支架113的第一封装结构115。FIG. 5 is a schematic structural view of a patch LED of the in-line LED lamp bead of FIG. 4. Referring to FIG. 5, the SMD LED 11 (B.SMD, surface mount diode) selects a 0603 type SMD LED, and the SMD LED package includes an LED chip 110, a wire 110a, and a first flat support 111. The second flat bracket 113 and the first package structure 115 for covering the LED wafer 110 and fixing the first flat bracket 111 and the second flat bracket 113.
在其他实施例中,贴片LED还可以选用其他规格的贴片LED,如1206、2810、3020、3528、5050型贴片LED,贴片LED颜色可以选用单色、双色、全彩中的一种。In other embodiments, the SMD LED can also be used with other sizes of SMD LEDs, such as 1206, 2810, 3020, 3528, 5050 SMD LEDs, and the SMD LED color can be selected from monochrome, two-color, and full-color. Kind.
LED晶片110为贴片LED11的主要原材料,LED贴片主要依靠LED晶片110来发光。LED晶片110的上表面设有正、负极。LED晶片110通过银胶110b固定在第一平支架111上,银胶110b为一种不导电的银胶。The LED chip 110 is the main raw material of the patch LED 11, and the LED patch mainly relies on the LED wafer 110 to emit light. The upper surface of the LED wafer 110 is provided with positive and negative electrodes. The LED chip 110 is fixed on the first flat bracket 111 by the silver glue 110b, which is a non-conductive silver paste.
导线110a用于将LED晶片110的正、负极分别与第一平支架111、与第二平支架113电连接。The wire 110a is used to electrically connect the positive and negative electrodes of the LED wafer 110 to the first flat bracket 111 and the second flat bracket 113, respectively.
图6所示为图5的贴片LED的第一平支架和第二平支架的结构示意图。请参见图6,第一平支架111包括第一上基板111a、第一下基板111b以及用于连接第一上基板111a和第一下基板111b的第一连接板111c。第二平支架113包括第二上基板113a、第二下基板113b以及用于连接第二上基板113a和第二下基板113b的第二连接板113c。FIG. 6 is a schematic structural view of the first flat bracket and the second flat bracket of the patch LED of FIG. 5. Referring to FIG. 6, the first flat bracket 111 includes a first upper substrate 111a, a first lower substrate 111b, and a first connecting plate 111c for connecting the first upper substrate 111a and the first lower substrate 111b. The second flat bracket 113 includes a second upper substrate 113a, a second lower substrate 113b, and a second connecting plate 113c for connecting the second upper substrate 113a and the second lower substrate 113b.
第二封装结构13用于包覆第一封装结构115并固定第一引脚15、第二引脚17。第二封装结构13可以由环氧、有机硅和有机硅改性环氧树脂等透 光材料制成。The second package structure 13 is used to cover the first package structure 115 and fix the first pin 15 and the second pin 17 . The second package structure 13 may be made of a light transmissive material such as epoxy, silicone, and silicone-modified epoxy.
图7所示为图4的直插式LED灯珠的第一引脚和第二引脚的结构示意图。图5所示为用于加工第一引脚和第二引脚的支架板20的结构示意图。请参见图4,5,第一引脚15,第二引脚17是由金属板冲压后形成的支架板20再通过切脚后形成的。FIG. 7 is a schematic structural view of the first pin and the second pin of the in-line LED lamp bead of FIG. 4. FIG. 5 is a schematic view showing the structure of the holder board 20 for processing the first lead and the second lead. Referring to Figures 4 and 5, the first pin 15 is formed by stamping the metal plate after the support plate 20 is formed by cutting the foot.
支架板20包括横向排列的中部连接杆21、下部连接板23、竖向间隔排列的多根第一引脚杆25、第二引脚杆27。中部连接杆21、下部连接板23用于保持第一引脚杆25、第二引脚杆27的相对位置,防止第一引脚杆25、第二引脚杆27变形。The bracket plate 20 includes a middle connecting rod 21 that is laterally arranged, a lower connecting plate 23, a plurality of first lead rods 25 that are vertically spaced apart, and a second lead rod 27. The middle connecting rod 21 and the lower connecting plate 23 are used to maintain the relative positions of the first lead rod 25 and the second lead rod 27 to prevent the first lead rod 25 and the second lead rod 27 from being deformed.
第一引脚15,第二引脚17包括的结构相似,第一引脚15包括杆状的第一腿部151、第一连接部153以及第一上端端部155。第一上端端部155和第一连接部153的截面大于第一腿部151的截面,第一上端端部155的上端面为与第一平支架贴合的平面。这样,在LED晶片发光时,热量经金属的第一平支架或第一封装结构、第一上端端部155,第一连接部153高效率传递到第一腿部151在大气中散热,以防止LED晶片的温度过高。The first pin 15 and the second pin 17 are similar in structure, and the first pin 15 includes a rod-shaped first leg portion 151, a first connecting portion 153, and a first upper end portion 155. The cross section of the first upper end portion 155 and the first connecting portion 153 is larger than the cross section of the first leg portion 151, and the upper end surface of the first upper end portion 155 is a plane that fits the first flat bracket. In this way, when the LED chip emits light, the heat is transmitted to the first leg portion 151 in the atmosphere through the first flat bracket or the first package structure of the metal, the first upper end portion 155, and the heat is dissipated in the atmosphere to prevent heat. The temperature of the LED chip is too high.
类似的第二引脚17包括杆状的第二腿部151、第二连接部153以及第二上端端部155。A similar second pin 17 includes a rod-shaped second leg portion 151, a second connecting portion 153, and a second upper end portion 155.
图8所示为本发明第一实施例的直插式LED灯珠的制造方法的贴片LED与第一、二引脚连接前的状态示意图。图9所示为图6的直插式LED灯珠的制造方法的贴片LED与第一、二引脚连接后的状态示意图。图10所示为图9的直插式LED灯珠的制造方法的贴片LED包覆第二封装结构后的状态示意图。图11所示为图10的直插式LED灯珠的制造方法的第一、二引脚杆切除后的 状态示意图。请参见图8、9、10、11、18,在本实施例中,直插式LED灯珠的制造方法包括以下的步骤:Fig. 8 is a view showing the state of the patch LED of the method for manufacturing the in-line LED lamp bead according to the first embodiment of the present invention before being connected to the first and second pins. FIG. 9 is a schematic view showing a state in which the patch LED of the method for manufacturing the in-line LED lamp bead of FIG. 6 is connected to the first and second pins. FIG. 10 is a schematic view showing a state in which the patch LED of the method for manufacturing the in-line LED lamp bead of FIG. 9 is covered with the second package structure. Fig. 11 is a view showing the state after the first and second pin rods are removed from the method of manufacturing the in-line LED lamp bead of Fig. 10. Referring to FIG. 8, 9, 10, 11, and 18. In the embodiment, the method for manufacturing the in-line LED lamp bead includes the following steps:
I、将分选后的贴片LED11的第一平支架111、第二平支架113分别与支架板20上的第一引脚杆25、第二引脚杆27连接;I. The first flat bracket 111 and the second flat bracket 113 of the sorted LED 11 are respectively connected to the first lead rod 25 and the second lead rod 27 on the bracket board 20;
J、在第一封装结构115外覆盖第二封装胶形成未固化的第二封装结构13;J, covering the second encapsulation structure 115 outside the first package structure 115 to form an uncured second package structure 13;
K、加热使未固化的第二封装结构13的表面固化;K, heating to cure the surface of the uncured second package structure 13;
D、修剪支架板20的第一引脚杆25、第二引脚杆27、第一连接杆、第二连接杆形成第一引脚15、第二引脚17,形成直插式LED灯珠10。D. The first lead rod 25, the second lead rod 27, the first connecting rod and the second connecting rod of the trim bracket plate 20 form a first pin 15 and a second pin 17 to form a direct-insertion LED lamp bead. 10.
进一步的,步骤A中第一平支架111与第一引脚15的上端端面贴合,第二平支架113与第二引脚17的上端端面贴合。将贴片LED11与第一引脚15,第二引脚17直接连接,第一引脚15,第二引脚17具有增加散热的效果,使得到的直插式LED灯珠10提高寿命,减少光衰。Further, in the step A, the first flat bracket 111 is in contact with the upper end surface of the first lead 15, and the second flat bracket 113 is in contact with the upper end surface of the second lead 17. The SMD LED 11 is directly connected to the first pin 15 and the second pin 17, and the first pin 15 and the second pin 17 have the effect of increasing heat dissipation, so that the incoming in-line LED lamp bead 10 improves the life and reduces the life. Light decay.
进一步的,步骤A包括:Further, step A includes:
A1、在第一平支架111和/或第一引脚杆25,第二平支架113和/或第二引脚杆27上涂覆锡膏116;A1, the first flat bracket 111 and / or the first lead rod 25, the second flat bracket 113 and / or the second lead rod 27 is coated with solder paste 116;
A2、将第一平支架111和第一引脚杆25贴合,第二平支架113和第二引脚杆27贴合;A2, the first flat bracket 111 and the first lead rod 25 are attached, and the second flat bracket 113 and the second lead rod 27 are attached;
A3、将锡膏116加热融化;A4、增加第一平支架111和第一引脚杆25、第二平支架113和第二引脚杆27间的压力;A3, the solder paste 116 is heated and melted; A4, the pressure between the first flat bracket 111 and the first lead rod 25, the second flat bracket 113 and the second lead rod 27 is increased;
A5、冷却融化的锡膏116使第一平支架111和第一引脚杆25、第二平支架113和第二引脚杆27连接固定。A5. Cooling and melting the solder paste 116 connects the first flat bracket 111 and the first lead rod 25, the second flat bracket 113 and the second lead rod 27 to each other.
其中,步骤B的第二封装胶为环氧、有机硅和有机硅改性环氧树脂中的一种或多种。Wherein, the second encapsulant of step B is one or more of epoxy, silicone and silicone modified epoxy resins.
图12所示为图1的贴片LED的第一平支架与LED晶片连接前的状态示意图,图13所示为图12的贴片LED的第一平支架与LED晶片连接后的状态示意图,图14所示为图13的贴片LED的封装第一封装结构后的状态示意图。请参见图12、13、14,步骤A中的分选后的贴片LED11由以下步骤获得:12 is a schematic view showing a state before the first flat bracket of the patch LED of FIG. 1 is connected to the LED chip, and FIG. 13 is a schematic view showing a state after the first flat bracket of the patch LED of FIG. 12 is connected to the LED chip. FIG. 14 is a schematic view showing the state of the package LED of FIG. 13 after the first package structure is packaged. Referring to Figures 12, 13, and 14, the sorted patch LEDs 11 in step A are obtained by the following steps:
S101、将LED晶片110的两个电极分别与第一平支架111、与第二平支架113电连接;S101, electrically connecting the two electrodes of the LED chip 110 to the first flat bracket 111 and the second flat bracket 113;
S102、在LED晶片110外覆盖第一封装胶形成未固化的第一封装结构115;S102, covering the first encapsulant outside the LED chip 110 to form an uncured first package structure 115;
S103、加热完全固化未固化的第一封装结构115,使第一封装结构115固定第一平支架111、第二平支架113,形成贴片LED11;S103, heating fully cured uncured first package structure 115, the first package structure 115 fixed first flat bracket 111, second flat bracket 113, forming patch LED 11;
S104、将多个贴片LED11按照色温和/或亮度分类,得到多组分选后的贴片LED11;S104, the plurality of patch LEDs 11 are classified according to color temperature and/or brightness to obtain a multi-component selected patch LED 11;
其中,步骤S102中的第一封装胶由荧光粉与封装胶水均匀混合而成。The first encapsulant in the step S102 is formed by uniformly mixing the phosphor and the encapsulating glue.
图15所示为本发明第二实施例的直插式LED灯珠的制造方法的贴片LED与第一、二引脚连接后的状态示意图。请参见图15、19,在本实施例中,两个贴片LED分别位于第一引脚、第二引脚的两侧,第一平支架111与第一引脚15的上端的侧面贴合,第二平支架113与第二引脚17的上端的侧面贴合。Fig. 15 is a view showing a state in which a patch LED of a method for manufacturing an in-line LED lamp bead according to a second embodiment of the present invention is connected to first and second pins. Referring to FIG. 15 and FIG. 19, in the embodiment, two patch LEDs are respectively located on two sides of the first pin and the second pin, and the first flat bracket 111 is attached to the side of the upper end of the first pin 15. The second flat bracket 113 is attached to the side of the upper end of the second lead 17.
图16所示为本发明第三实施例的直插式LED灯珠的制造方法的贴片LED与第一、二引脚连接后的状态示意图。请参见图16、20,在本实施例中,两个贴片LED分别位于第一引脚、第二引脚的两侧。其中一个贴片LED的第一平支架111与第一引脚15的上端侧面贴合,第二平支架113与第二引脚17 的上端侧面贴合,另一个贴片LED的第一平支架111与第二引脚17的上端侧面贴合,第二平支架113与第一引脚15的上端侧面贴合。Fig. 16 is a view showing a state in which a patch LED of a method for manufacturing an in-line type LED lamp bead according to a third embodiment of the present invention is connected to first and second pins. Referring to FIGS. 16 and 20, in the embodiment, two patch LEDs are respectively located on both sides of the first pin and the second pin. The first flat bracket 111 of one of the patch LEDs is in contact with the upper end side of the first lead 15, the second flat bracket 113 is attached to the upper end side of the second lead 17, and the first flat bracket of the other patch LED 111 is attached to the upper end side of the second lead 17, and the second flat bracket 113 is attached to the upper end side of the first lead 15.
图17所示为本发明第四实施例的直插式LED灯珠的制造方法的贴片LED与第一、二引脚连接后的状态示意图。请参见图17,在本实施例中,两个贴片LED分别位于第一引脚、第二引脚的上端端面。其中一个贴片LED的第一平支架111与第一引脚15的上端端面贴合,第二平支架113与第二引脚17的上端端面贴合,另一个贴片LED的第一平支架111与第二引脚17的上端端面贴合,第二平支架113与第一引脚15的上端端面贴合。Fig. 17 is a view showing a state in which a patch LED of a method for manufacturing an in-line type LED lamp bead according to a fourth embodiment of the present invention is connected to first and second pins. Referring to FIG. 17, in the embodiment, two patch LEDs are respectively located at upper end faces of the first pin and the second pin. The first flat bracket 111 of one of the patch LEDs is attached to the upper end surface of the first lead 15, the second flat bracket 113 is attached to the upper end surface of the second lead 17, and the first flat bracket of the other patch LED is attached. 111 is bonded to the upper end surface of the second lead 17, and the second flat holder 113 is fitted to the upper end surface of the first lead 15.
在本发明的第三、四实施例中,直插式LED灯珠的包括两个反向并联的LED贴片,即LED晶片的工作不受到电流方向的限制。In the third and fourth embodiments of the present invention, the in-line LED lamp bead includes two anti-parallel LED patches, that is, the operation of the LED wafer is not limited by the direction of current flow.
本发明还提供一种灯具包括任意一种直插式LED灯珠。The invention also provides a luminaire comprising any of the in-line LED lamp beads.
在本发明中的灯具、直插式LED灯珠及制造方法中,直插式LED灯珠利用分选后的贴片LED作为光源,得到的直插式LED灯珠的一致性好,生产损失的树脂和第一引脚、第二引脚少。在本发明中,将贴片LED与第一引脚,第二引脚直接连接,第一引脚,第二引脚具有增加散热的效果,使得到的直插式LED灯珠提高寿命,减少光衰。In the lamp, the in-line LED lamp bead and the manufacturing method of the invention, the in-line LED lamp bead uses the sorted patch LED as a light source, and the obtained in-line LED lamp bead has good consistency and production loss. The resin has fewer first pins and second pins. In the present invention, the chip LED is directly connected to the first pin and the second pin, and the first pin and the second pin have the effect of increasing heat dissipation, so that the in-line LED lamp bead improves life and reduces Light decay.
如下表,本发明的贴片LED采用的两平支架加工方便、刚性好、精度高,得到的贴片LED均一性好,良品率高。再通过对贴片LED的筛选,得到的贴片LED的色温、亮度一致性更好,节约了树脂和支架,并且因为不需要等待第一封装完全固化从而缩短了总体固化时间。此外将贴片LED与第一引脚,第二引脚直接连接,第一引脚,第二引脚具有散热的功能,使得到的直插式LED灯珠提高寿命,减少光衰。As shown in the following table, the two flat brackets of the patch LED of the invention are convenient to process, have good rigidity and high precision, and the obtained patch LED has good uniformity and high yield. Through the screening of the SMD LEDs, the obtained SMD LEDs have better color temperature and brightness consistency, saving the resin and the support, and shortening the overall curing time because there is no need to wait for the first package to be completely cured. In addition, the SMD LED is directly connected to the first pin and the second pin, and the first pin and the second pin have a heat dissipating function, so that the in-line LED lamp bead improves the life and reduces the light decay.
经过申请人测算,本申请的方案的直插式LED灯珠较相同质量等级的直插式LED灯珠的成本更低,生产效率更高,具有良好的市场前景。According to the estimation of the applicant, the in-line LED lamp bead of the solution of the present application has lower cost, higher production efficiency and good market prospect than the in-line LED lamp bead of the same quality grade.
Figure PCTCN2018115115-appb-000001
Figure PCTCN2018115115-appb-000001
以上,仅是本发明的较佳实施例而已,并非对本发明作任何形式上的限制,虽然本发明已以较佳实施例揭露如上,然而并非用以限定本发明,任何熟悉本专业的技术人员,在不脱离本发明技术方案范围内,当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例,但凡是未脱离本发明技术方案内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化和修饰,均仍属于本发明技术方案的范围内。The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. The present invention has been described above by way of preferred embodiments, but is not intended to limit the invention, and any skilled person skilled in the art. The equivalents of the technical solutions disclosed above may be modified or modified to equivalent variations without departing from the technical scope of the present invention, without departing from the technical scope of the present invention. Any simple modifications, equivalent changes and modifications made to the above embodiments are still within the scope of the technical solutions of the present invention.

Claims (10)

  1. 一种直插式LED灯珠,包括贴片LED,该贴片LED包括LED晶片、第一平支架、第二平支架以及用于包覆该LED晶片并固定该第一平支架、该第二平支架的第一封装结构,其特征在于,所述LED灯珠还包括与该第一平支架电连接的第一引脚、与该第二平支架电连接的第二引脚以及用于包覆该第一封装结构并固定该第一引脚、该第二引脚的第二封装结构。An in-line LED lamp bead comprising a patch LED, the patch LED comprising an LED chip, a first flat bracket, a second flat bracket, and a cover for the LED chip and fixing the first flat bracket, the second The first package structure of the flat bracket is characterized in that the LED lamp bead further includes a first pin electrically connected to the first flat bracket, a second pin electrically connected to the second flat bracket, and a package And covering the first package structure and fixing the first pin and the second package structure of the second pin.
  2. 根据权利要求1所述的直插式LED灯珠,其特征在于,所述第一平支架与所述第一引脚的上端端面贴合,所述第二平支架与所述第二引脚的上端端面贴合。The in-line LED lamp bead according to claim 1, wherein the first flat bracket is attached to an upper end surface of the first pin, and the second flat bracket and the second pin are The upper end face fits.
  3. 根据权利要求1所述的直插式LED灯珠,其特征在于,所述第一平支架与所述第一引脚的上端侧面贴合,所述第二平支架与所述第二引脚的上端侧面贴合。The in-line LED lamp bead according to claim 1, wherein the first flat bracket is attached to an upper end side of the first pin, and the second flat bracket and the second pin are The upper end side fits.
  4. 一种灯具,其特征在于,包括权利要求1至3中任意一项所述的直插式LED灯珠。A luminaire characterized by comprising the in-line LED lamp bead according to any one of claims 1 to 3.
  5. 一种直插式LED灯珠的制造方法,其特征在于,包括以下的步骤:A method for manufacturing an in-line LED lamp bead, comprising the steps of:
    A、将分选后的贴片LED的第一平支架、第二平支架分别与LED支架板上的第一引脚杆、第二引脚杆连接;A. The first flat bracket and the second flat bracket of the sorted LED are respectively connected to the first lead rod and the second lead rod on the LED bracket board;
    B、在第一封装结构外覆盖第二封装胶形成未固化的第二封装结构;B, covering the second encapsulant outside the first package structure to form an uncured second package structure;
    C、加热使未固化的第二封装结构的表面固化;C. heating causes the surface of the uncured second package structure to be cured;
    D、修剪LED支架板的第一引脚杆、第二引脚连接杆形成第一引脚、第二引脚,形成直插式LED灯珠。D. Trim the first lead rod and the second lead connecting rod of the LED bracket board to form a first pin and a second pin to form an in-line LED lamp bead.
  6. 根据权利要求5所述的直插式LED灯珠的制造方法,其特征在于,所述步骤E包括:A1、在所述第一平支架和/或所述第一引脚杆,所述第二平支架和/或所述第二引脚杆上涂覆锡膏;A2、将第一平支架和第一引脚杆贴合,第二平支架和第二引脚杆贴合;A3、将该锡膏加热融化;A4、增加第一平支架和第一引脚杆、第二平支架和第二引脚杆间的压力;A5、冷却融化的锡膏 使第一平支架和第一引脚杆、第二平支架和第二引脚杆连接固定。The method of manufacturing the in-line LED lamp bead according to claim 5, wherein the step E comprises: A1, the first flat bracket and/or the first lead rod, the first Applying a solder paste to the second flat bracket and/or the second lead rod; A2, bonding the first flat bracket and the first lead rod, and fitting the second flat bracket and the second lead rod; A3, The solder paste is heated and melted; A4, increasing the pressure between the first flat bracket and the first lead rod, the second flat bracket and the second lead rod; A5, cooling the molten solder paste to make the first flat bracket and the first The pin rod, the second flat bracket and the second lead rod are fixedly connected.
  7. 根据权利要求7所述的直插式LED灯珠,其特征在于,所述第二封装胶为环氧、有机硅和有机硅改性环氧树脂中的一种或多种。The in-line LED lamp bead according to claim 7, wherein the second encapsulant is one or more of an epoxy, a silicone, and a silicone modified epoxy.
  8. 根据权利要求7所述的直插式LED灯珠,其特征在于,所述步骤A中的分选后的贴片LED由以下步骤获得:The in-line LED lamp bead according to claim 7, wherein the sorted patch LED in the step A is obtained by the following steps:
    S101、将LED晶片的两个电极分别与第一平支架、与第二平支架电连接;S101, electrically connecting the two electrodes of the LED chip to the first flat bracket and the second flat bracket;
    S102、在LED晶片外覆盖第一封装胶形成未固化的第一封装结构;S102, covering the first encapsulant outside the LED chip to form an uncured first package structure;
    S103、加热完全固化未固化的第一封装结构,使该第一封装结构固定该第一平支架、该第二平支架,形成贴片LED;S103, heating the fully cured uncured first package structure, the first package structure is fixed to the first flat bracket, the second flat bracket to form a patch LED;
    S104、分选贴片LED;S104, sorting patch LED;
  9. 根据权利要求8所述的直插式LED灯珠,其特征在于,所述第一封装胶由荧光粉与封装胶水均匀混合而成。The in-line LED lamp bead according to claim 8, wherein the first encapsulant is uniformly mixed with a phosphor and a package glue.
  10. 根据权利要求8所述的直插式LED灯珠,其特征在于,所述的步骤S104包括:将多个贴片LED按照色温和/或亮度分类,得到多组分选后的贴片LED。The in-line LED lamp bead according to claim 8, wherein the step S104 comprises: classifying the plurality of patch LEDs according to color temperature and/or brightness to obtain a multi-component selected patch LED.
PCT/CN2018/115115 2018-01-31 2018-11-13 Lighting fixture, in-line led bead, and manufacturing method WO2019148934A1 (en)

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Publication number Priority date Publication date Assignee Title
CN108172679A (en) * 2018-01-31 2018-06-15 吴相勇 Lamps and lanterns, direct insertion LED lamp bead and manufacturing method
CN109192837A (en) * 2018-08-07 2019-01-11 天台天宇光电股份有限公司 A kind of direct insertion LED lamp bead of built-in patch formula LED
CN109713111A (en) * 2019-01-16 2019-05-03 浙江鸿大光电科技有限公司 A kind of direct insertion LED lamp bead and its packaging technology

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6562643B2 (en) * 2000-10-06 2003-05-13 Solidlite Corporation Packaging types of light-emitting diode
CN202695546U (en) * 2012-05-21 2013-01-23 王定锋 Light emitting diode (LED) support with surface mount device resistors and LED device with same
CN203932055U (en) * 2014-06-26 2014-11-05 深圳市阿里山电子集团有限公司 The square color LED lamp that has three rims of a cup on a pin support
CN203963576U (en) * 2014-06-19 2014-11-26 深圳市阿里山电子集团有限公司 The compound color LED of a kind of paster straight cutting
CN204885211U (en) * 2015-08-25 2015-12-16 广东金鉴检测科技有限公司 LED support and LED packaging structure
CN205985069U (en) * 2016-08-29 2017-02-22 厦门华联电子有限公司 Pasterization cut straightly LED
CN108172679A (en) * 2018-01-31 2018-06-15 吴相勇 Lamps and lanterns, direct insertion LED lamp bead and manufacturing method
CN207977348U (en) * 2018-01-31 2018-10-16 吴相勇 Lamps and lanterns and direct insertion LED lamp bead

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6562643B2 (en) * 2000-10-06 2003-05-13 Solidlite Corporation Packaging types of light-emitting diode
CN202695546U (en) * 2012-05-21 2013-01-23 王定锋 Light emitting diode (LED) support with surface mount device resistors and LED device with same
CN203963576U (en) * 2014-06-19 2014-11-26 深圳市阿里山电子集团有限公司 The compound color LED of a kind of paster straight cutting
CN203932055U (en) * 2014-06-26 2014-11-05 深圳市阿里山电子集团有限公司 The square color LED lamp that has three rims of a cup on a pin support
CN204885211U (en) * 2015-08-25 2015-12-16 广东金鉴检测科技有限公司 LED support and LED packaging structure
CN205985069U (en) * 2016-08-29 2017-02-22 厦门华联电子有限公司 Pasterization cut straightly LED
CN108172679A (en) * 2018-01-31 2018-06-15 吴相勇 Lamps and lanterns, direct insertion LED lamp bead and manufacturing method
CN207977348U (en) * 2018-01-31 2018-10-16 吴相勇 Lamps and lanterns and direct insertion LED lamp bead

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