CN210110833U

CN210110833U - High-power LED light-emitting device packaging structure

Info

Publication number: CN210110833U
Application number: CN201921361053.0U
Authority: CN
Inventors: 杨恩茂; 陈亚勇
Original assignee: Fujian Xinda Photoelectric Technology Co Ltd
Current assignee: XIAMEN XINDECO OPTOELECTRONICS Co.,Ltd.
Priority date: 2019-08-21
Filing date: 2019-08-21
Publication date: 2020-02-21
Anticipated expiration: 2029-08-21

Abstract

The utility model relates to a high-power LED luminescent device packaging structure, including the base plate, encapsulate LED chip on the base plate, be fixed in the anti-light cup on the base plate and be located the lens on the base plate, anti-light cup is the big, little toper structure in lower part in upper portion, anti-light cup's middle part has the space that is used for holding LED chip, lens pass through the mode of mould pressing and are formed on the surface of base plate to all cover whole anti-light cup, and closely laminate with base plate and LED chip, with the problem of solving current mould pressing lens and easily separating with the base plate when the drawing of patterns.

Description

High-power LED light-emitting device packaging structure

Technical Field

The utility model relates to a LED encapsulates technical field, specifically relates to a high-power LED luminescent device packaging structure.

Background

With the continuous maturity of LED semiconductor light emitting technology, LEDs have been widely used in various fields, such as lighting applications, display backlights, signal lights, disinfection and sterilization, ink photocuring, medical physiotherapy, and the like. In some special applications, such as street lamps, deep ultraviolet sterilization, etc., the LED is required to have the characteristics of small volume, high power and high heat dissipation.

For such small and powerful LED light emitting devices, the prior art generally uses a ceramic substrate and a molded lens for packaging. The ceramic substrate has the advantages of insulation and high thermal conductivity, and the requirement of high-power heat dissipation can be met by using the ceramic substrate; and no cavity is formed between the molded lens and the LED chip, so that the total reflection phenomenon can be avoided, and the light-emitting efficiency is high. However, this method has a disadvantage that the molded lens is easily separated from the ceramic during the mold release. For example, in the process of packaging a high-power white light LED, a layer of high-concentration fluorescent powder needs to be sprayed on the surface of a ceramic substrate, which causes the adhesive force of the organic silicon lens on the surface of the ceramic substrate to be poor; for another example, a fluororesin material is required for a molded lens of a deep ultraviolet LED, and the adhesion of the fluororesin material itself to the surface of a ceramic substrate is poor.

Some manufacturers adopt a design of forming grooves in the side surface or the back surface of the substrate to improve the adhesive force between the molded lens and the ceramic substrate, and the whole substrate needs to be cut into single pieces and then molded in such a way, which easily causes the glue of the molded lens to permeate into the back surface of the substrate from the groove in the side surface of the substrate, thereby polluting the electrode on the back surface of the substrate and causing the problem that the circuit cannot be conducted.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a high-power LED luminescent device packaging structure to solve the problem that current mould pressing lens easily separated with the base plate when the drawing of patterns.

The specific scheme is as follows:

the utility model provides a high-power LED luminescent device packaging structure, includes the base plate, encapsulates the LED chip on the base plate, is fixed in the anti-light cup on the base plate and is located the lens on the base plate, anti-light cup is the big toper structure of upper portion, the little cone structure in lower part, the middle part of anti-light cup has the space that is used for holding the LED chip, lens pass through the mode of mould pressing and are formed on the surface of base plate to cover whole anti-light cup, and closely laminate with base plate and LED chip.

Furthermore, the upper edge of the reflecting cup is provided with an annular wing part extending outwards, the lens is provided with a side wing part positioned on the edge, and the annular wing part can transversely extend into the side wing part of the lens.

Further, the LED chip is an ultraviolet LED chip, and the lens is made of a fluororesin material.

Further, the reflector is made of magnesium-aluminum alloy materials.

Furthermore, the reflection cup is fixed on the substrate in a mode of eutectic soldering, reflow soldering or metal sealing.

Further, the LED chip is a blue LED chip, and a fluorescent powder layer is covered on the blue LED chip.

Further, the fluorescent powder layer covers the blue LED chip in a spraying mode.

Further, the lens is made of a silicone resin material.

Further, the substrate is an aluminum nitride ceramic substrate.

The utility model provides a high-power LED luminescent device packaging structure compares with prior art and has following advantage: the utility model provides a high-power LED luminescent device packaging structure fixes the anti-light cup of the big, little toper structure in lower part in upper portion on the base plate, should reflect light the cup can be to compression molding's lens fastening on the fixed base plate, can prevent effectively that the adhesive force between because of lens and the base plate is low and lead to lens to drop at the drawing of patterns in-process. And because the substrate is not provided with the groove, when the lens is molded, the substrate of the plurality of high-power LED light-emitting devices is an undivided whole, the molding lens glue cannot penetrate from the side surface of the substrate to the back surface of the substrate, the pollution to the back surface electrode of the substrate is avoided, and the molding lens is cut into single bodies after being demolded, so that the manufacturing efficiency of the molding lens can be improved. In addition, the light-emitting efficiency of the LED chip can be improved due to the existence of the reflecting cup.

Drawings

Fig. 1 shows a schematic diagram of a single high-power ultraviolet LED light emitting device package structure in embodiment 1.

Fig. 2 shows a schematic diagram of a package structure of a plurality of high-power ultraviolet LED light emitting devices in embodiment 1.

Fig. 3 shows a schematic diagram of a single high-power white-light LED light emitting device package structure in embodiment 2.

Detailed Description

To further illustrate the embodiments, the present invention provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the embodiments. With these references, one of ordinary skill in the art will appreciate other possible embodiments and advantages of the present invention. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.

The present invention will now be further described with reference to the accompanying drawings and detailed description.

Example 1

As shown in fig. 1 and fig. 2, the present embodiment provides a high power ultraviolet LED light emitting device package structure, which includes a substrate 11, an ultraviolet LED chip 12 packaged on the substrate 11, and a lens 13 covering over the ultraviolet LED chip 12. The ultraviolet LED chip in the present embodiment is described by taking a UVC ultraviolet LED chip as an example, but the present invention is not limited thereto, and may be applied to a package of UVA and UVB ultraviolet LED chips.

Specifically, the substrate 11 has a first electrode 111 and a second electrode 112 on the upper surface and the lower surface, respectively, and the first electrode 111 and the second electrode 112 are electrically connected through a via hole 113. The substrate 11 is made of insulating material resistant to deep ultraviolet, such as alumina ceramic, aluminum nitride ceramic, etc., and in this embodiment, aluminum nitride ceramic material with high thermal conductivity is preferred. The first electrode 111 and the second electrode 112 may be formed on the substrate 11 by electroplating, silk-screening, or the like, and the communication between the first electrode 111 and the second electrode 112 may be achieved by depositing copper in the via hole 113.

The ultraviolet LED chip 12 in this embodiment is a flip chip structure, but is not limited thereto, and may be other chip structures, such as a normal chip structure and a vertical chip structure. The ultraviolet LED chip 12 that flips in this embodiment can be fixed in on the base plate 11 through tin cream welding or eutectic bonding's mode to switch on with the first electrode 111 on the base plate 11 surface, adopt tin cream welding or eutectic bonding's mode can avoid adopting organic solid crystal glue fixed, can prevent in the use organic solid crystal glue degradation and influence its life.

A reflective cup 14 is further fixedly disposed on the surface of the substrate 11, the reflective cup 14 is a cone-shaped structure or a substantially cone-shaped structure with a large upper portion and a small lower portion, and a space for accommodating the ultraviolet LED chip 12 is disposed in the middle of the reflective cup 14. The reflection cup 14 is preferably made of magnesium-aluminum alloy, the reflectivity of the reflection cup 14 made of magnesium-aluminum alloy to UVC can reach more than 90%, the reflection cup can be fixed on the surface of the substrate 11 in the modes of eutectic soldering, reflow soldering, metal sealing, sealant bonding and the like, the reflection cup is preferably fixed on the substrate 11 in the modes of eutectic soldering, reflow soldering and metal sealing, the fixation of organic solid crystal glue can be avoided, and the bonding force between the reflection cup 14 and the substrate 11 is prevented from being influenced by the deterioration of the organic solid crystal glue in the using process.

The lens 13 is a fluororesin lens, is formed on the surface of the substrate 11 by means of mold pressing, covers the whole reflection cup 14, is tightly attached to the substrate 11 and the deep ultraviolet LED chip 12, and has no bubbles in the middle. The refractive index of the fluororesin lens is greater than or equal to 1.35, the fluororesin is heated to a plasticizing temperature, flows into a cavity of a mold under certain pressure, and is solidified and molded after being cooled to form the lens 13, and the optical characteristics of the formed lens 13 are determined according to actual requirements, for example, the lens 13 can be in a hemispherical shape, a semi-ellipsoidal shape or a flat plate shape, so that ultraviolet rays can be emitted out of the device at different angles.

Compared with the existing high-power LED light-emitting device package structure, in this embodiment 1, the substrate 11 is fixed with the reflective cup 14 having a conical structure, and the reflective cup 14 can tightly fix the lens 13 formed by compression molding on the substrate 11, so as to effectively prevent the lens 13 from falling off during the demolding process due to low adhesion between the lens 13 and the substrate 11. In addition, referring to fig. 2, since the substrate 11 is not grooved, when the lens is molded, the substrate 11 of the plurality of high-power ultraviolet LED light-emitting devices is an undivided whole, the molding lens glue does not penetrate from the side surface of the substrate to the back surface of the substrate, and the substrate back surface electrode is not polluted.

Preferably, in this embodiment, the upper peripheral edge of the reflector cup 14 has an annular wing 141 extending outward, the lens 13 also has a wing 131 located at the peripheral edge, and the annular wing 141 extends laterally into the wing 131 of the lens 13 to enhance the fixing force of the reflector cup 14 to the lens 13, thereby further preventing the lens 13 from falling off the substrate 11.

Example 2

As shown in fig. 3, the present embodiment provides a high power white LED light emitting device package structure, which includes a substrate 21, a blue LED chip 22 packaged on the substrate 21, and a lens 23 covering over the blue LED chip 22.

Specifically, the substrate 21 has a first electrode 211 and a second electrode 212 on the upper surface and the lower surface, respectively, and the first electrode 211 and the second electrode 212 are electrically connected through a via hole 213. The substrate 21 is made of an insulating material, such as alumina ceramic, aluminum nitride ceramic, and the like, and in this embodiment, an aluminum nitride ceramic material with high thermal conductivity is preferred. The first electrode 211 and the second electrode 212 may be formed on the substrate 21 by electroplating, silk-screening, or the like, and the communication between the first electrode 211 and the second electrode 212 may be achieved by depositing copper in the via hole 213.

The blue LED chip 22 in this embodiment is a flip chip structure, but is not limited thereto, and may be other chip structures, such as a normal chip structure and a vertical chip structure. The blue LED chip 22 that is flipped in this embodiment can be fixed on the substrate 21 in a solder paste soldering or eutectic soldering manner, and conducted with the first electrode 211 on the surface of the substrate 21, and the solder paste soldering or eutectic soldering manner is adopted for the die attach adhesive fixing manner, so that a better bonding force is obtained.

The surface of the substrate 21 is further fixedly provided with a reflective cup 24, the reflective cup 24 is a cone-shaped structure with a large upper part and a small lower part, and the middle part of the reflective cup has a space for accommodating the blue LED chip 22. The inner wall of the reflective cup 24 has a reflective layer to improve the light extraction efficiency of the blue LED chip 22. The reflective cup 24 may be fixed on the surface of the substrate 21 by eutectic soldering, reflow soldering, metal sealing, or adhesive bonding, wherein eutectic soldering, reflow soldering, or metal sealing is preferably adopted to be fixed on the substrate 21, so that the reflective cup 24 and the substrate 21 have better bonding force.

A fluorescent powder layer 25 is sprayed in the area in the middle of the reflective cup 24, the fluorescent powder layer 25 covers the blue LED chip 22 and the surface of the surrounding substrate 21, a part of light emitted from the blue LED chip 22 excites the fluorescent powder in the fluorescent powder layer 25 to emit light with different wavelengths, and the light emitted from the fluorescent powder layer 25 is mixed with another part of blue light emitted from the blue LED chip 22 to make the light emitted from the LED light-emitting device package structure form white light. The combination and proportion of the phosphors in the phosphor layer 25 in this embodiment can be prepared according to the requirements of the actual color temperature, display index, and the like.

The lens 23 is made of silicone resin material, is formed on the surface of the substrate 21 by means of mold pressing, covers the whole reflection cup 24, and is closely attached to the substrate 21 and the blue LED chip 22 without air bubbles in the middle. The refractive index of the lens 23 is preferably 1.45 or more to improve the light extraction capability. The organic silicon resin material can flow at normal temperature, flows into a die cavity of a die under certain pressure, is heated, crosslinked, cured and molded, and forms the lens 23 after cooling, and the optical characteristics of the formed lens 23 are determined according to actual requirements, for example, the lens 23 can be in a hemispherical shape, a semi-ellipsoidal shape or a flat plate shape, so that light rays can be emitted out of the device at different angles.

Compared with the existing high-power LED light-emitting device package structure, in this embodiment 2, the substrate 21 is fixed with the reflective cup 24 having a conical structure, and the reflective cup 24 can tightly fix the lens 23 formed by compression molding on the substrate 21, so as to effectively prevent the lens 23 from falling off during the demolding process due to the low adhesion between the lens 23 and the substrate 21. In addition, because the substrate 21 is not provided with the groove, when the lens is molded, the substrate 21 of the plurality of high-power white light LED light-emitting devices is an undivided whole, the molded lens glue cannot penetrate from the side surface of the substrate to the back surface of the substrate, the pollution to the back surface electrode of the substrate is avoided, and the molded lens is cut into single bodies after being demolded, so that the manufacturing efficiency of the molded lens can be improved.

In the present embodiment, the white LED light emitting device is taken as an example for description, but the present invention is not limited thereto, and the present invention may also be applied to a package of a single color LED light emitting device or a multi-color LED light emitting device, and the difference from the white LED light emitting device in the present embodiment is that the phosphor layer is not provided and the blue LED chip in the present embodiment is replaced by an LED chip of a corresponding color.

While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A high-power LED light-emitting device packaging structure is characterized in that: the LED light-reflecting cup comprises a substrate, an LED chip packaged on the substrate, a light-reflecting cup fixed on the substrate and a lens positioned on the substrate, wherein the light-reflecting cup is of a conical structure with a large upper part and a small lower part, the middle part of the light-reflecting cup is provided with a space for accommodating the LED chip, and the lens is formed on the surface of the substrate in a mould pressing mode, covers the whole light-reflecting cup and is tightly attached to the substrate and the LED chip.

2. The high power LED light emitting device package structure of claim 1, wherein: the upper edge of the reflecting cup is provided with an annular wing part extending outwards, the lens is provided with a side wing part positioned on the edge, and the annular wing part can transversely extend into the side wing part of the lens.

3. The high power LED light emitting device package structure of claim 1, wherein: the LED chip is an ultraviolet LED chip, and the lens is made of fluororesin materials.

4. The high power LED light emitting device package structure of claim 3, wherein: the reflection cup is made of magnesium-aluminum alloy materials.

5. The high power LED light emitting device package structure of claim 4, wherein: the reflection cup is fixed on the substrate in a mode of eutectic soldering, reflow soldering or metal sealing.

6. The high power LED light emitting device package structure of claim 1, wherein: the LED chip is a blue LED chip, and a fluorescent powder layer covers the blue LED chip.

7. The high power LED light emitting device package structure of claim 6, wherein: the fluorescent powder layer covers the blue LED chip in a spraying mode.

8. The high power LED light emitting device package structure of claim 6, wherein: the lens is made of a silicone resin material.

9. The high power LED light emitting device package structure of claim 1, wherein: the substrate is an aluminum nitride ceramic substrate.