CN109192837A - A kind of direct insertion LED lamp bead of built-in patch formula LED - Google Patents
A kind of direct insertion LED lamp bead of built-in patch formula LED Download PDFInfo
- Publication number
- CN109192837A CN109192837A CN201810893100.XA CN201810893100A CN109192837A CN 109192837 A CN109192837 A CN 109192837A CN 201810893100 A CN201810893100 A CN 201810893100A CN 109192837 A CN109192837 A CN 109192837A
- Authority
- CN
- China
- Prior art keywords
- led
- pin
- built
- direct insertion
- lamp bead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011324 bead Substances 0.000 title claims abstract description 14
- 238000003780 insertion Methods 0.000 title claims abstract description 14
- 230000037431 insertion Effects 0.000 title claims abstract description 14
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims abstract description 5
- 239000000843 powder Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000000084 colloidal system Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 8
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses the direct insertion LED lamp beads of built-in patch formula LED a kind of, including pedestal, setting LED illuminator on the base and two pins, pin bracket is equipped with below the pedestal, the LED illuminator is correspondingly connected with pin bracket, the pin bracket welding corresponding with pin, the outside of the pedestal is equipped with packaging body.The present invention is intended to provide a kind of direct insertion LED lamp bead for the built-in patch formula LED for reducing pin material cost, improving product reliability.
Description
Technical field
The invention belongs to LED field more particularly to a kind of direct insertion LED lamp beads of built-in patch formula LED.
Background technique
Currently, LED on the market is usually that LED illuminator is encapsulated in a small transparent epoxy resin, wafer electric
Pole is connect by gold thread, alloy wire or silver wire with pin, it is desirable that the outer surface material of pin is noble silver, increase material at
This；In order to guarantee chip and pin connection reliability, it is desirable that pin and lead joint face surface smoothness are high, could reliably with
Lead connection, this provides for improved the processing costs of pin, while to improve die bond, routing precision, can all draw on pin
Foot lateral incision trace, pin substrate is exposed, so that pin is easy to be corroded, serious can thoroughly disconnect causes LED failure.
Summary of the invention
The present invention is to provide a kind of reduction pin material cost in order to overcome above-mentioned deficiency in the prior art, improve
The direct insertion LED lamp bead of the built-in patch formula LED of product reliability.
To achieve the goals above, the invention adopts the following technical scheme:
A kind of direct insertion LED lamp bead of built-in patch formula LED is drawn including pedestal, setting LED illuminator on the base and two
Foot is equipped with pin bracket below the pedestal, and the LED illuminator is correspondingly connected with pin bracket, the pin bracket with draw
The corresponding welding of foot, the outside of the pedestal are equipped with packaging body.In this way, LED illuminator is welded and fixed by pin bracket with pin,
Therefore lower for the surface smoothness requirements of pin, shape and precision are more convenient for manufacturing, meanwhile, pin bracket and pin weld
It is fixed, noble silver is not needed in the material of pin, electroplating technology is eliminated, further reduced the cost of raw material.It drops significantly
The low production cost of LED.Since welding process does not need high position precision for pin, there is pin lateral incision in avoidable pin
Trace also reduces the risk of pin corrosion in use process, improves the reliability of product.
Preferably, the pedestal is base of ceramic or pcb board or FPC plate or aluminum substrate.Pedestal there are many material for
Selection, adaptation range are wider.
Preferably, the LED illuminator is the mixture for having cured fluorescent powder and colloid.In the prior art, it has
The LED of fluorescent powder will design the cup body that can contain fluorescent powder and colloid admixture on pin, and production technology is more
It is complicated.And LED illuminator connect the finished product LED completed with pedestal, it is no longer necessary to process cup body on pin, further reduced
Processing technology cost.
Preferably, the packaging body is made of epoxy resin.
Preferably, the top of the packaging body is equipped with scattering part.The light that LED illuminator can be issued by scattering part
Line is scattered, and improves illumination zone and angle.
Preferably, the scattering part is in the conical surface of indent.LED illuminator cooperation has the packaging body of the indent conical surface,
The display effect that can produce double luminous points, improves illuminating effect.
Preferably, the LED illuminator (4) is polarity illuminator and/or nonpolarity illuminator.For LED illuminator
Selection it is more free, plurality of LEDs illuminator can also be set on the base, and production design flexibility is preferable.
The beneficial effects of the present invention are: (1) reduces positioning and processing request, raw material and process costs have been saved；(2)
It avoids pin from pin cut mark occur, the risk of pin corrosion is reduced in use process；(3) display effect of double luminous points is generated,
Improve illuminating effect.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of the invention；
Fig. 2 is cross-sectional view of the invention.
In figure: packaging body 1, scattering part 1a, pin 2, base of ceramic 3, LED illuminator 4, pin bracket 5.
Specific embodiment
The present invention will be further described with reference to the accompanying drawings and detailed description.
In embodiment as shown in Figure 1, including pedestal 3, the LED illuminator being arranged on pedestal 34 and two pins 2, base
3 lower section of seat is equipped with pin bracket 5, and LED illuminator 4 is correspondingly connected with pin bracket 5, the welding corresponding with pin 2 of pin bracket 5,
The outside of pedestal 3 is equipped with packaging body 1.LED illuminator is the mixture for having cured fluorescent powder and colloid, what LED illuminator issued
Light excitated fluorescent powder, can be improved the luminous efficiency of corresponding wave band, while make light more uniformly soft.LED illuminator with
After the completion of pedestal connection, without processing cup body on pin 2, the scattering for light can be realized, reduce processing cost.
LED illuminator is fixed at the top of pedestal, and pedestal is equipped with the pin being correspondingly connected with two connecting pins of LED illuminator
Bracket, pin are located at below base of ceramic, and pin includes the substrate being sequentially arranged from inside to outside, internal copper layer, nickel layer and outside
Layers of copper, substrate can be made of conductive materials such as iron, aluminium, copper.Pin is elongated, and two pins are arranged symmetrically, between the two
With gap, pin is corresponding with pin to be welded and fixed.Two connecting pins of LED illuminator and pin are fixed by soldering, pin
Material in do not need noble silver, pin than in the prior art reduces silver coating, eliminates electroplating technology, reduces original
Material and process costs.Pedestal can the single or more all directions for being placed in pin bracket and any position, form plane and 3D
Illumination effect.
The outside of pedestal be equipped with packaging body 1, packaging body is made of epoxy resin, packaging body by pedestal, LED illuminator with
And in being wrapped at the top of pin.The top of packaging body be equipped with scattering part 1a, scattering part be in indent the conical surface, the center of the conical surface with
The center of LED illuminator is aligned in the vertical direction, when LED illuminator is lighted, generates the display effect of double luminous points.
Claims (7)
1. a kind of direct insertion LED lamp bead of built-in patch formula LED, characterized in that including pedestal (3), be arranged on pedestal (3)
LED illuminator (4) and two pins (2) are equipped with pin bracket (5) below the pedestal (3), the LED illuminator (4) with draw
Foot support (5) is correspondingly connected with, and pin bracket (5) welding corresponding with pin (2), the outside of the pedestal (3) is equipped with encapsulation
Body (1).
2. the direct insertion LED lamp bead of built-in patch formula LED according to claim 1 a kind of, characterized in that the pedestal
It (3) is base of ceramic or pcb board or FPC plate or aluminum substrate.
3. the direct insertion LED lamp bead of built-in patch formula LED according to claim 1 or 2 a kind of, characterized in that described
LED illuminator (4) is the mixture for having cured fluorescent powder and colloid.
4. the direct insertion LED lamp bead of built-in patch formula LED according to claim 1 or 2 a kind of, characterized in that described
Packaging body (1) is made of epoxy resin.
5. the direct insertion LED lamp bead of built-in patch formula LED according to claim 1 or 2 a kind of, characterized in that described
The top of packaging body (1) is equipped with scattering part (1a).
6. the direct insertion LED lamp bead of built-in patch formula LED according to claim 5 a kind of, characterized in that the scattering
Portion is in the conical surface of indent.
7. the direct insertion LED lamp bead of built-in patch formula LED according to claim 1 or 2 a kind of, characterized in that the LED
Illuminator (4) is polarity illuminator and/or nonpolarity illuminator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810893100.XA CN109192837A (en) | 2018-08-07 | 2018-08-07 | A kind of direct insertion LED lamp bead of built-in patch formula LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810893100.XA CN109192837A (en) | 2018-08-07 | 2018-08-07 | A kind of direct insertion LED lamp bead of built-in patch formula LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109192837A true CN109192837A (en) | 2019-01-11 |
Family
ID=64921030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810893100.XA Pending CN109192837A (en) | 2018-08-07 | 2018-08-07 | A kind of direct insertion LED lamp bead of built-in patch formula LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109192837A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050121736A1 (en) * | 2003-12-05 | 2005-06-09 | Chiung-Hun Wang | Receiver optical subassembly |
| CN101886749A (en) * | 2009-05-12 | 2010-11-17 | 扬州银凤车业有限公司 | LED light source component |
| CN201936914U (en) * | 2010-11-30 | 2011-08-17 | 浙江彩虹光电有限公司 | LED (light-emitting diode) lamp bead |
| CN206907789U (en) * | 2017-06-16 | 2018-01-19 | 王超 | A kind of direct insertion LED lamp bead |
| CN108172679A (en) * | 2018-01-31 | 2018-06-15 | 吴相勇 | Lamps and lanterns, direct insertion LED lamp bead and manufacturing method |
-
2018
- 2018-08-07 CN CN201810893100.XA patent/CN109192837A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050121736A1 (en) * | 2003-12-05 | 2005-06-09 | Chiung-Hun Wang | Receiver optical subassembly |
| CN101886749A (en) * | 2009-05-12 | 2010-11-17 | 扬州银凤车业有限公司 | LED light source component |
| CN201936914U (en) * | 2010-11-30 | 2011-08-17 | 浙江彩虹光电有限公司 | LED (light-emitting diode) lamp bead |
| CN206907789U (en) * | 2017-06-16 | 2018-01-19 | 王超 | A kind of direct insertion LED lamp bead |
| CN108172679A (en) * | 2018-01-31 | 2018-06-15 | 吴相勇 | Lamps and lanterns, direct insertion LED lamp bead and manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190111 |
|
| RJ01 | Rejection of invention patent application after publication |