CN210519046U - PCB packaging structure - Google Patents
PCB packaging structure Download PDFInfo
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- CN210519046U CN210519046U CN201921086161.1U CN201921086161U CN210519046U CN 210519046 U CN210519046 U CN 210519046U CN 201921086161 U CN201921086161 U CN 201921086161U CN 210519046 U CN210519046 U CN 210519046U
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Abstract
The utility model discloses a PCB packaging structure, include: the PCB substrate is provided with a first electrode and a second electrode; the wafer is arranged at the first electrode, the wafer electrode is arranged on the wafer, and the wafer electrode is connected with the second electrode; coating the part; the PCB substrate is provided with an extended conductive circuit; the coating part is connected with the first electrode or the second electrode through the extension conducting circuit. The utility model discloses a conducting wire on the PCB base plate designs into the tortuous form of turning round for reflow soldering cladding position tin position prolongs as far as possible to the conducting wire of first electrode or second electrode, lead to the not bright quality problems of emitting diode because of the first electrode functional area of the solid brilliant region of the direct infiltration of soldering tin and the regional second electrode functional area of bonding wire when effectively solving reflow soldering, realize solid brilliant regional first electrode of brilliant and the regional second electrode of bonding wire and soldering tin isolation, thereby effectively promote the product quality in the product production process.
Description
Technical Field
The utility model relates to a PCB encapsulates technical field, especially relates to a PCB packaging structure.
Background
In a conventional PCB packaging method, for example, in the PCB packaging of a light emitting diode, two different electrodes, namely a first electrode and a second electrode, are designed on a PCB circuit board, and then a die is bonded to the first electrode by die bonding adhesive, which is called die bonding; then the electrode on the wafer is welded to a second electrode by a conductive metal wire, which is called a welding wire; and connecting the wafer electrode with a second electrode on the PCB to form a power-on loop, and then sealing the light-transmitting colloid on the PCB to form a light-emitting source.
The conventional PCB is short in electrified circuit length and straight in circuit, and during reflow soldering, tin permeates into functional regions of the first electrode and the second electrode along the circuit, so that the light-transmitting colloid is peeled off from the PCB substrate, a chip on the PCB is peeled off from the first electrode, a conductive metal wire is peeled off from the second electrode, and the quality problem that the light-emitting diode is not bright is caused.
SUMMERY OF THE UTILITY MODEL
The present invention aims at solving at least one of the technical problems in the related art to a certain extent. Therefore, the utility model aims at providing a PCB packaging structure can effectively improve the product quality of product in process of production.
The utility model adopts the technical proposal that:
in a first aspect, the present invention provides a PCB encapsulation structure, including:
the PCB substrate is provided with a first electrode and a second electrode; a wafer disposed at the first electrode, the wafer having a wafer electrode disposed thereon, the wafer electrode being connected to the second electrode; coating the part; the PCB substrate is provided with the extending conductive circuit; the cladding portion and the first electrode or the second electrode are connected through the extended conductive trace.
Furthermore, the wafer electrode is connected with the second electrode through the conductive metal wire.
Further, the structure of the extending conductive circuit on the PCB substrate is a zigzag structure or an S-shaped arc bending structure.
Further, the coating part comprises a first coating part and a second coating part, the extension conductive circuit comprises a first conductive circuit and a second conductive circuit, the first coating part is connected with the first electrode through the first extension conductive circuit, and the second coating part is connected with the second electrode through the second extension conductive circuit.
Furthermore, the extension conductive circuit between the first coating part and the first electrode is divided into a first conductive wire section, a second conductive wire section and a third conductive wire section, an included angle between the first conductive wire section and the second conductive wire section is 90 degrees, an included angle between the second conductive wire section and the third conductive wire section is 90 degrees, the extension conductive circuit between the second coating part and the second electrode is divided into a fourth conductive wire section and a fifth conductive wire section, and an included angle between the fourth conductive wire section and the fifth conductive wire section is 90 degrees.
Furthermore, a light-transmitting packaging body is attached to the upper surface of the PCB substrate.
Further, the light-transmitting packaging body is a light-transmitting glue or a glue body consisting of the light-transmitting glue and fluorescent powder.
Further, the light-transmitting glue comprises resin glue or silica gel.
Further, the wafer is a light emitting diode chip.
The utility model has the advantages that:
the utility model discloses a conducting wire on the PCB base plate designs into the tortuous form of turning round, make reflow soldering cladding position eat the conducting wire of tin position to first electrode or second electrode and prolong as far as possible, because of the direct infiltration of soldering tin is solid brilliant regional first electrode functional area and the regional second electrode functional area of bonding wire when effectively solving reflow soldering, cause light transmissivity colloid and PCB base plate to peel off, lead to on the PCB base plate wafer and first electrode to peel off and conductive metal line and second electrode peel off, and then lead to the not bright quality problems of emitting diode, realize solid brilliant regional first electrode and the regional second electrode of bonding wire and soldering tin isolation, thereby effectively promote the product quality in the product production process.
Drawings
FIG. 1 is a schematic diagram of one embodiment of a prior art package structure;
fig. 2 is a schematic diagram of a package structure according to a first embodiment of the present invention;
fig. 3 is a schematic diagram of a package structure according to a second embodiment of the present invention;
FIG. 4 is a front line schematic of one embodiment of the conductive trace design of the present invention;
fig. 5 is a schematic back side circuit diagram of one embodiment of the conductive circuit design of the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
The present embodiment takes the package structure of the surface mount light emitting diode as an example, and can also be applied to other PCB package structures.
Referring to fig. 1, a conventional package structure of a surface mount light emitting diode (led) includes: the first coating portion 20 is connected to the first electrode 40 through a conductive line, and the second coating portion 30 is connected to the second electrode 50 through a conductive line. The length of a conductive circuit on the existing PCB is short and the route is straight, and during reflow soldering, tin permeates into functional areas of a first electrode and a second electrode along the route, so that a light-transmitting colloid is peeled off from a PCB substrate, a wafer on the PCB is peeled off from the first electrode, a conductive metal wire is peeled off from the second electrode, and the quality problem of the LED is poor.
The basic idea of the utility model is that: the length of a conducting circuit between the coating part and the electrode is prolonged as much as possible, and particularly, the length of the conducting circuit between the first coating part and the first electrode is prolonged as much as possible; or the length of the conducting circuit between the second coating part and the second electrode is long. Such as: the conducting circuit is designed into a zigzag turning structure, so that soldering tin is prevented from permeating into a functional area of the electrode along the circuit during reflow soldering.
Example one
The present embodiment provides a structure diagram of a PCB package structure, referring to fig. 2, the PCB package structure includes: the PCB comprises a PCB substrate 10, a wafer 60 and a conductive metal wire 80, wherein the PCB substrate 10 is provided with a first coating part 20, a second coating part 30, a first electrode 40 and a second electrode 50. The wafer 60 is disposed at the first electrode 40, the wafer 60 is disposed with a wafer electrode 70, the wafer electrode 70 and the second electrode 50 are connected by a conductive metal wire 80, the PCB substrate 10 is further disposed with an extension conductive trace 90, and the extension conductive trace 90 is designed to be a curved shape. The first coating portion 20 is connected to the first electrode 40 through an extension conductive trace 90, and the second coating portion 30 is connected to the second electrode 50 through an extension conductive trace 90. The extended conductive traces 90 between the first cladding portion 20 and the first electrode 40 are divided into a first trace segment, a second trace segment, and a third trace segment. The included angle between the first wire section and the second wire section is 90 degrees, and the included angle between the second wire section and the third wire section is 90 degrees. The extended conductive traces 90 between the second coating portion 30 and the second electrode 50 are divided into a fourth trace segment and a fifth trace segment. The included angle between the fourth wire segment and the fifth wire segment is 90 degrees.
The included angle is designed to be 90 degrees, so that the soldering tin is further prevented from permeating into the first electrode functional area and the second electrode functional area. The conducting circuit is designed into a zigzag turning structure, so that the conducting circuit between the coating part and the electrode is greatly prolonged, and 90 degrees is set between each section of circuit, and the quality problem that the light-transmitting colloid is peeled off from the PCB substrate due to the fact that soldering tin directly permeates into a first electrode function area of a solid crystal area and a second electrode function area of a welding line area during reflow soldering, a wafer on the PCB substrate is peeled off from the first electrode and a conducting metal wire is peeled off from the second electrode, and then the light-emitting diode is not bright is caused is effectively solved.
Alternatively, the number of constituent line segments of the extended conductive line may vary according to the production process and the distance between the electrode and the clad portion.
Alternatively, the degree of bending of the elongated conductive trace may be variable.
Alternatively, the included angle between constituent segments of the elongated conductive traces may vary between 0 ° and 90 °, such as 70 °, 75 °, 80 °.
Alternatively, the shape of the elongated conductive traces may be an S-shaped curve or the like.
Example two
The present embodiment provides a structure diagram of a PCB package structure, referring to fig. 3, the PCB package structure includes: the PCB comprises a PCB substrate 10, a wafer 60 and a conductive metal wire 80, wherein the PCB substrate 10 is provided with a first coating part 20, a second coating part 30, a first electrode 40 and a second electrode 50. The upper surface of the PCB substrate 10 is attached with a light transmissive encapsulant 100. The wafer 60 is disposed at the first electrode 40, the wafer 60 is disposed with a wafer electrode 70, the wafer electrode 70 and the second electrode 50 are connected by a conductive metal wire 80, the PCB substrate 10 is further disposed with an extension conductive trace 90, and the extension conductive trace 90 is designed to be a curved shape. The first coating portion 20 is connected to the first electrode 40 through an extension conductive trace 90, and the second coating portion 30 is connected to the second electrode 50 through an extension conductive trace 90. The extended conductive traces 90 between the first cladding portion 20 and the first electrode 40 are divided into a first trace segment, a second trace segment, and a third trace segment. The included angle between the first wire section and the second wire section is 90 degrees, and the included angle between the second wire section and the third wire section is 90 degrees. The extension conductive traces 90 between the second cladding 30 and the second electrode 50 are divided into a fourth trace segment and a fifth trace segment. The included angle between the fourth wire segment and the fifth wire segment is 90 degrees.
The included angle is designed to be 90 degrees, so that the soldering tin is further prevented from permeating into the first electrode functional area and the second electrode functional area. The conducting circuit is designed into a zigzag turning structure, so that the conducting circuit between the coating part and the electrode is greatly prolonged, and 90 degrees is set between each section of circuit, and the quality problem that the light-transmitting colloid is peeled off from the PCB substrate due to the fact that soldering tin directly permeates into a first electrode function area of a solid crystal area and a second electrode function area of a welding line area during reflow soldering, a wafer on the PCB substrate is peeled off from the first electrode and a conducting metal wire is peeled off from the second electrode, and then the light-emitting diode is not bright is caused is effectively solved.
Alternatively, the number of constituent line segments of the extended conductive line may vary according to the production process and the distance between the electrode and the clad portion.
Alternatively, the degree of bending of the elongated conductive trace may be variable.
Alternatively, the included angle between constituent segments of the elongated conductive traces may vary between 0 ° and 90 °, such as 70 °, 75 °, 80 °.
Alternatively, the shape of the elongated conductive traces may be an S-shaped curve or the like.
Alternatively, the light transmissive colloid 100 may be a colloidal body of silica gel, or a colloidal body of silica gel and phosphor, or a colloidal body of resin, and phosphor. The silica gel is selected as the light-transmitting colloid material, so that the cost can be reduced; resin is selected as a light-transmitting material, so that a better light-transmitting effect can be realized; the composition of the fluorescent powder and the light-transmitting glue is selected, so that the light-emitting diode can display various colors.
EXAMPLE III
The present embodiment provides an embodiment of a conductive circuit design on a PCB substrate, and referring to fig. 4 and 5, the conductive circuit structure includes: a front side circuit structure and a back side circuit structure. Referring to fig. 4, the front surface circuit structure is divided into a first cladding portion 20, a second cladding portion 30, a first electrode 40, a second electrode 50 and an extended conductive circuit structure 90. The extended conductive trace structure 90 between the first cladding portion 20 and the first electrode 40 is divided into a first trace segment 910, a second trace segment 920 and a third trace portion 930; an included angle between the first wire portion 910 and the second wire portion 920 is 90 °, and an included angle between the second wire portion 920 and the third wire portion 930 is 90 °. The elongated conductive trace structure 90 between the second cladding portion 30 and the second electrode 50 is divided into a fourth trace portion 940 and a fifth trace portion 950; the angle between the fourth wire portion 940 and the fifth wire portion 950 is 90 °. Referring to fig. 5, the back side structure is divided into a first covering portion 20, a second covering portion 30, a sixth wire portion 960, and a seventh wire portion 970.
The included angle is designed to be 90 degrees, so that the soldering tin is further prevented from permeating into the first electrode functional area and the second electrode functional area. The conducting circuit is designed into a zigzag turning structure, so that the conducting circuit between the coating part and the electrode is greatly prolonged, and 90 degrees is set between each section of circuit, and the quality problem that the light-transmitting colloid is peeled off from the PCB substrate due to the fact that soldering tin directly permeates into a first electrode function area of a solid crystal area and a second electrode function area of a welding line area during reflow soldering, a wafer on the PCB substrate is peeled off from the first electrode and a conducting metal wire is peeled off from the second electrode, and then the light-emitting diode is not bright is caused is effectively solved.
Alternatively, the number of constituent line segments of the extended conductive line may vary according to the production process and the distance between the electrode and the clad portion.
Alternatively, the degree of bending of the elongated conductive trace may be variable.
Alternatively, the included angle between constituent segments of the elongated conductive traces may vary between 0 ° and 90 °, such as 70 °, 75 °, 80 °.
Alternatively, the shape of the elongated conductive traces may be an S-shaped curve or the like.
While the preferred embodiments of the present invention have been described, the present invention is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are intended to be included within the scope of the present invention as defined by the appended claims.
Claims (9)
1. A PCB package structure, comprising:
the PCB substrate is provided with a first electrode and a second electrode;
a wafer disposed at the first electrode, the wafer having a wafer electrode disposed thereon, the wafer electrode being connected to the second electrode;
coating the part;
the PCB substrate is provided with the extending conductive circuit;
the cladding portion and the first electrode or the second electrode are connected through the extended conductive trace.
2. The PCB package structure of claim 1, further comprising a conductive metal line, wherein the die electrode is connected to the second electrode with a conductive metal line.
3. The PCB package structure of claim 1, wherein the structure of the elongated conductive traces on the PCB substrate is a meander turn structure or an S-shaped arc bend structure.
4. The PCB packaging structure of claim 1, wherein the covering part comprises a first covering part and a second covering part, the extension conductive traces comprise a first conductive trace and a second conductive trace, the first covering part is connected with the first electrode through the first extension conductive trace, and the second covering part is connected with the second electrode through the second extension conductive trace.
5. The PCB packaging structure of claim 4, wherein the extension conductive trace between the first covering portion and the first electrode is divided into a first conductive trace segment, a second conductive trace segment and a third conductive trace segment, an included angle between the first conductive trace segment and the second conductive trace segment is 90 degrees, an included angle between the second conductive trace segment and the third conductive trace segment is 90 degrees, the extension conductive trace between the second covering portion and the second electrode is divided into a fourth conductive trace segment and a fifth conductive trace segment, and an included angle between the fourth conductive trace segment and the fifth conductive trace segment is 90 degrees.
6. The PCB packaging structure of claim 5, wherein a light transmissive packaging body is attached to the upper surface of the PCB substrate.
7. The PCB packaging structure of claim 6, wherein the light transmissive packaging body is a light transmissive glue or a glue body composed of a light transmissive glue and phosphor.
8. The PCB packaging structure of claim 7, wherein the light transmissive glue comprises a resin glue or a silicon glue.
9. The PCB assembly structure of claim 1, wherein the die is a light emitting diode die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921086161.1U CN210519046U (en) | 2019-07-11 | 2019-07-11 | PCB packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921086161.1U CN210519046U (en) | 2019-07-11 | 2019-07-11 | PCB packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210519046U true CN210519046U (en) | 2020-05-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921086161.1U Active CN210519046U (en) | 2019-07-11 | 2019-07-11 | PCB packaging structure |
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| CN (1) | CN210519046U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110366316A (en) * | 2019-07-11 | 2019-10-22 | 深圳光台实业有限公司 | A kind of PCB encapsulating structure |
| WO2023213481A1 (en) * | 2022-05-04 | 2023-11-09 | Ams-Osram International Gmbh | Optoelectronic semiconductor component |
-
2019
- 2019-07-11 CN CN201921086161.1U patent/CN210519046U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110366316A (en) * | 2019-07-11 | 2019-10-22 | 深圳光台实业有限公司 | A kind of PCB encapsulating structure |
| WO2023213481A1 (en) * | 2022-05-04 | 2023-11-09 | Ams-Osram International Gmbh | Optoelectronic semiconductor component |
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