CN210429881U

CN210429881U - LED support packaging structure

Info

Publication number: CN210429881U
Application number: CN201920984303.XU
Authority: CN
Inventors: 宋文洲
Original assignee: Shenzhen Guang Tai Industrial Co ltd
Current assignee: Shenzhen Guang Tai Industrial Co ltd
Priority date: 2019-06-27
Filing date: 2019-06-27
Publication date: 2020-04-28
Anticipated expiration: 2029-06-27

Abstract

The utility model discloses a LED support packaging structure relates to LED encapsulation field. The LED support packaging structure comprises an LED support and a light-emitting wafer. The utility model discloses a set up the first side of LED support into the positive terminal of LED support, set up the third side of LED support into the negative pole end of LED support, set up the luminous wafer of third in the position that is close to the third side and be connected with the negative pole end. Compared with the prior art, the distance between the third light-emitting wafer and the cathode end of the LED support is shortened, so that the length of a bonding wire is shortened, the problem that the conductive metal wire is broken due to the fact that the light-transmittance colloid is greatly shaken under the change of expansion with heat and contraction with cold due to the overlong conductive metal wire in the prior art is solved, the cost is saved, the stability of the conductive metal wire is improved, and the quality of an LED product is improved.

Description

LED support packaging structure

Technical Field

The utility model belongs to the technical field of the LED encapsulation and specifically relates to a LED support packaging structure is related to.

Background

In the conventional LED support packaging, circuit connection is completed by adopting a die bonding and wire bonding mode on a circuit board in a support bowl. As shown in fig. 1, the manufacturing method comprises: (1) firstly, fixing a wafer 2 on an electrode of a circuit board in an LED bracket 1; (2) connecting a wafer electrode (called a first welding point) to an LED bracket 1 (called a second welding point) through a conductive metal wire 3 by a welding wire, and connecting the wafer electrode with a pin of the LED bracket 1 to form a through circuit; (3) the LED support 1 is sealed with a light-transmitting colloid 4 to form a light-emitting source.

Referring to fig. 1, in the conventional die bonding method, a die 21, a die 22, and a die 23 are placed on a straight line for fixing, when a conductive metal wire 3 is soldered, the length of the conductive metal wire 3 is too long due to the fact that the middle die 22 is far away from the LED support 1, and the light-transmissive colloid 4 has a large shaking amplitude of the conductive metal wire 3 under the change of expansion with heat and contraction with cold at the use environment temperature, which may cause poor phenomena such as poor lighting of an LED due to disconnection of the conductive metal wire 3, and poor product reliability.

SUMMERY OF THE UTILITY MODEL

The present invention aims at solving at least one of the technical problems in the related art to a certain extent. Therefore, an object of the present invention is to provide a LED support packaging structure, which is beneficial to shortening the bonding wire, increasing the bonding wire stability and reducing the cost.

The utility model adopts the technical proposal that:

the utility model provides a LED support packaging structure, include:

the LED support comprises a first side face, a second side face, a third side face and a fourth side face, wherein the first side face is arranged as a positive end of the LED support, and the third side face is arranged as a negative end of the LED support;

and the light-emitting wafer comprises a first light-emitting wafer, a second light-emitting wafer and a third light-emitting wafer, and the third light-emitting wafer is arranged at a position close to the third side surface and is connected with the negative electrode end.

Further, the first light emitting wafer is arranged at a position close to the second side surface and connected with the LED bracket, the second light emitting wafer is arranged at a position close to the fourth side surface and connected with the LED bracket, and the connection positions of the first light emitting wafer, the second light emitting wafer and the LED bracket are all bracket electrodes of the LED bracket.

Further, the third light emitting chip is connected with the negative electrode end through a conductive metal wire, and the length of the conductive metal wire is less than 1.4 mm.

Furthermore, the length of the conductive metal wire is between 0.6 mm and 1.0 mm.

Further, the LED support package structure further includes a package colloid for packaging the LED support and the light emitting chip.

Further, the packaging colloid is a light-transmitting colloid.

The utility model has the advantages that:

the utility model discloses a set up the first side of LED support into the positive terminal of LED support, set up the third side of LED support into the negative pole end of LED support, set up the luminous wafer of third in the position that is close to the third side and be connected with the negative pole end. Compared with the prior art, the distance between the third light-emitting wafer and the cathode end of the LED support is shortened, so that the length of a bonding wire is shortened, the problem that the conductive metal wire is broken due to the fact that the light-transmittance colloid is greatly shaken under the change of expansion with heat and contraction with cold due to the overlong conductive metal wire in the prior art is solved, the cost is saved, the stability of the conductive metal wire is improved, and the quality of an LED product is improved.

Drawings

FIG. 1 is a schematic flow diagram of a prior art LED support packaging process;

fig. 2 is a schematic structural diagram of an embodiment of an LED support package structure according to the present invention;

fig. 3 is a schematic flow chart of an embodiment of the LED frame packaging process of the present invention.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

Example one

The present embodiment provides an LED support package structure, as shown in fig. 2, the package structure includes:

LED support 6, LED support 6 includes first side 61, second side 62, third side 63 and fourth side 64. The first side surface 61 is set as a positive end of the LED support 6, and the third side surface 63 is set as a negative end of the LED support 6;

a light emitting chip 7, wherein the light emitting chip 7 comprises a first light emitting chip 71, a second light emitting chip 72 and a third light emitting chip 73. The third light emitting chip 73 is disposed near the third side 63 and connected to the negative terminal of the LED support 6.

Further, a first light emitting chip 71 is disposed adjacent to the second side 62 and connected to the LED support, and a second light emitting chip 72 is disposed adjacent to the fourth side 64 and connected to the LED support. The connection positions of the first light emitting chip 71, the second light emitting chip 72 and the LED support 6 are support electrodes of the LED support 6.

In this embodiment, the third light emitting chip 73 is connected to the negative terminal of the LED support 6 through the conductive metal wire 8, and the length of the conductive metal wire 8 is less than 1.4 mm. Preferably, the length of the conductive metal wire 8 is between 0.6 mm and 1.0 mm. In the conventional LED frame packaging structure, the length of the bonding wire between the third light emitting chip 73 and the cathode end of the LED frame 6 is generally 1.4-1.9 mm, and the bonding wire is too long and is easily pulled and broken due to the deformation of the encapsulant, which affects the reliability of the LED product. In the embodiment, the fixing position of the third light emitting chip 73 is changed, so that the bonding wire is shortened to be less than 1.4mm, the cost is reduced, and the reliability of the LED product is improved. Preferably between 0.6-1.0 mm, the conductive metal wire 8 between 0.6-1.0 mm can ensure that the bonding wire is shortened and the cost is reduced, and can ensure that the third light-emitting chip 73 is not in contact with the LED support 6, thereby avoiding damaging the chip electrode.

In this embodiment, the LED frame package structure further includes a molding compound (not shown) for encapsulating the LED frame 6 and the light emitting chip 7.

Preferably, since the package structure is used for packaging a light emitting diode, and the light emitting chip 7 is an RGB light emitting chip, the package colloid should adopt a light-transmitting colloid, such as a resin colloid or a silicon colloid, to ensure light-transmitting property.

The packaging process of the LED bracket, as shown in FIG. 3, comprises the following steps:

s1, die bonding: the light emitting chip 7 includes a first light emitting chip 71, a second light emitting chip 72 and a third light emitting chip 73, the third light emitting chip 73 is fixed at a position close to the third side 63, the first light emitting chip 71 is fixed at a position close to the second side 62, and the second light emitting chip 72 is fixed at a position close to the fourth side 64;

s2, wire welding: connecting the third light-emitting chip 73 with the negative electrode end of the LED support 6, connecting the first light-emitting chip 71 with the LED support 6, and connecting the second light-emitting chip 72 with the LED support 6;

s3, packaging: the LED support 6 and the light emitting chip 7 are encapsulated by the encapsulant 9 to form a light emitting source.

The connection positions of the first light emitting chip 71, the second light emitting chip 72, the third light emitting chip 73 and the LED support 6 are all support electrodes of the LED support 6.

In conjunction with fig. 2 through 3, specifically,

s1, a crystal fixing step: determining die bonding positions in the LED bracket 6, wherein the die bonding positions are close to the side surface of the LED bracket 6, so that the wafer electrodes of the light-emitting wafer 7 are welded to the LED bracket 6 by short bonding wires; dripping colloid on the die bonding position; clamping by using tweezers or respectively sucking the light-emitting wafers 71-73 by using a suction nozzle and placing at a die bonding position; heating and baking to solidify the colloid, so that the light-emitting chips 71-73 are fixed in the LED bracket 6. Specifically, referring to fig. 2 and 3, the third light emitting chip 73 is fixed at a position close to the third side 63, the first light emitting chip 71 is fixed at a position close to the second side 62, and the second light emitting chip 72 is fixed at a position close to the fourth side 64. Here, the light emitting chip 7 is divided into a single electrode chip and a double electrode chip, the single electrode chip is bonded with a conductive adhesive, and the double electrode chip is bonded with an insulating adhesive.

S2, wire welding: welding spots are arranged on the wafer electrodes of the light-emitting wafers 71-73 respectively, welding spots are arranged on the support electrode of the LED support 6, and the wafer electrodes of the light-emitting wafers 71-73 and the support electrode of the LED support 6 are welded through the conductive metal wire 8 by using an LED wire welding machine to form a conductive loop. Specifically, referring to fig. 2 and 3, the third light emitting chip 73 is soldered to the mount electrode on the third side 63 (i.e., the negative terminal) of the LED mount 6 through the conductive wire 8, the first light emitting chip 71 is soldered to the mount electrode on the second side 62 of the LED mount 6 through the conductive wire, and the second light emitting chip 72 is soldered to the mount electrode on the fourth side 64 of the LED mount 6 through the conductive wire.

The length of the conductive metal wire 8 between the third light emitting chip 73 and the negative electrode of the LED support 6 is required to be less than 1.4mm, preferably, between 0.6 mm and 1.0 mm.

Preferably, since the packaging process is used for packaging a light emitting diode, and the light emitting chip 7 is an RGB light emitting chip, the packaging colloid 9 should be a transparent colloid, such as a resin adhesive or a silicon adhesive, to ensure light transparency.

Among the current LED support packaging technology, solid brilliant mode is put the wafer and fixes in the LED support on a straight line, and middle wafer leads to conductive wire length overlength far away with the LED support during welding conductive wire, the utility model discloses a fix the side department near the LED support with the wafer, utilize conductive wire to be connected the wafer electrode with the support electrode of LED support, compare with prior art and shortened the length of conductive wire between middle wafer and the LED support, thereby solved among the prior art conductive wire overlength and lead to the problem that conductive wire shakes the range greatly and appears conductive wire broken string under the change of expend with heat and contract with cold of light transmissivity colloid, not only practiced thrift the cost, increased conductive wire's steadiness moreover, improved LED product quality.

While the preferred embodiments of the present invention have been described, the present invention is not limited to the embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are intended to be included within the scope of the present invention as defined by the appended claims.

Claims

1. An LED support packaging structure, comprising:

the light-emitting chip comprises a first light-emitting chip, a second light-emitting chip and a third light-emitting chip, and the third light-emitting chip is arranged at a position close to the third side surface and is connected with the negative electrode end;

the third light-emitting wafer is connected with the negative end through a conductive metal wire, and the length of the conductive metal wire is less than 1.4 mm.

2. The LED support packaging structure of claim 1, wherein the first light emitting chip is disposed near the second side and connected to the LED support, the second light emitting chip is disposed near the fourth side and connected to the LED support, and the connection points of the first light emitting chip, the second light emitting chip and the LED support are all support electrodes of the LED support.

3. The LED package structure of claim 2, wherein the length of the conductive metal line is between 0.6 mm and 1.0 mm.

4. The LED support package structure according to any one of claims 1 to 3, further comprising an encapsulant for encapsulating the LED support and the light emitting die.

5. The LED package structure of claim 4, wherein the encapsulant is a light transmissive encapsulant.