CN204303808U - A kind of LED area light source - Google Patents

A kind of LED area light source Download PDF

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Publication number
CN204303808U
CN204303808U CN201420834312.8U CN201420834312U CN204303808U CN 204303808 U CN204303808 U CN 204303808U CN 201420834312 U CN201420834312 U CN 201420834312U CN 204303808 U CN204303808 U CN 204303808U
Authority
CN
China
Prior art keywords
led chip
circuit board
circuit
led
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420834312.8U
Other languages
Chinese (zh)
Inventor
杨仁扣
王春
Original Assignee
杨仁扣
王春
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 杨仁扣, 王春 filed Critical 杨仁扣
Priority to CN201420834312.8U priority Critical patent/CN204303808U/en
Application granted granted Critical
Publication of CN204303808U publication Critical patent/CN204303808U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Abstract

This practical a kind of LED area light source, comprise circuit board 1, LED chip 2, aluminum steel 3, gold thread 4, glue, fluorescent material 5, it is characterized in that: circuit board 1 is provided with can the circuit of conducting electrical signals, described circuit is provided with pad, does not have the place of circuit to be provided with LED chip 2 on the circuit card 1, the rectangular array distribution of described LED chip 2, aluminum steel 3 is welded with between LED chip 2 and chip, be welded with gold thread 4 between LED chip 2 and circuit board 1, LED chip 2 is provided with glue, fluorescent material 5, and LED chip 2 inspires white light through glue, fluorescent material 5.

Description

A kind of LED area light source
Technical field
The utility model relates to field of LED illumination, specifically refers to a kind of LED area light source.
Background technology
LED area light source is by being encapsulated on one piece of heat-conducting substrate by multiple small-power integrated chip, thus the luminous intensity required by realizing.Current chip is electrically connected to two kinds of modes with circuit board, chip with chip: a kind of is connected for gold thread, and one is aluminum steel connection, and wherein gold thread link cost is higher, and aluminum steel link cost is lower.Gold thread reliably connects base material for gold or silver-colored, and the base material that aluminum steel reliably connects is gold.Pad on LED chip is golden material.
For improving luminous efficiency, silver-plated or application ceramic circuit board can improve the reflecting rate of chip on circuit boards, but this mode is because the pad on circuit board is silver-plated, LED chip is connected with the reliable electric connection gold thread of circuit board, and LED area light source is because being multiple chips integration packaging needs a lot of connecting lines, multiple chips effectively could be electrically connected, if all will be higher with gold thread link cost, and this condition of contact be used aluminum steel instead and can not reliably be connected.
Utility model content
It is high that the purpose of this utility model is to solve this LED area light source gold thread used price, and provide a kind of gold thread, aluminum steel to mix a kind of LED area light source of welding.
A kind of LED area light source, comprises circuit board, LED chip, aluminum steel, gold thread, glue, fluorescent material, it is characterized in that: circuit board is provided with can the circuit of conducting electrical signals, described circuit is provided with pad, does not have the place of circuit to be provided with LED chip on circuit boards, the rectangular array distribution of described LED chip, aluminum steel is welded with between LED chip and chip, be welded with gold thread between LED chip and circuit board, LED chip is provided with glue, fluorescent material, and LED chip inspires white light through fluorescent material.
As further improvement of the utility model, described circuit board is silver plating ceramic circuit board, silver coated aluminum base circuit board or silver-plated copper base circuit board.
The beneficial effects of the utility model are: by such scheme, and under the prerequisite ensureing product quality, not only reduce cost, also suit large area to popularize use.
Accompanying drawing explanation
Fig. 1 is the total structural representation of the utility model.
Fig. 2 is the schematic diagram of the utility model LED chip weldering aluminum steel part.
Fig. 3 is the schematic diagram of the utility model LED chip weldering gold thread part.
Embodiment
For making the purpose of this utility model, technical scheme and advantage more clear, below in conjunction with drawings and Examples, the utility model is described in further detail.Be to be understood that specific embodiment described herein only for explaining the utility model, and be not used in restriction the utility model.
With reference to accompanying drawing 1, shown in 2 and 3, this practical a kind of LED area light source, comprise circuit board 1, LED chip 2, aluminum steel 3, gold thread 4, glue, fluorescent material 5, it is characterized in that: circuit board 1 is provided with can the circuit of conducting electrical signals, described circuit is provided with pad, the place of circuit is not had to be provided with LED chip 2 on the circuit card 1, the rectangular array distribution of described LED chip 2, aluminum steel 3 is welded with between LED chip 2 and chip, gold thread 4 is welded with between LED chip 2 and circuit board 1, LED chip 2 is provided with glue, fluorescent material 5, LED chip 2 is through glue, fluorescent material 5 inspires white light.
Described circuit board is silver plating ceramic circuit board, silver coated aluminum base circuit board or silver-plated copper base circuit board.
The foregoing is only a kind of implementation method of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.

Claims (2)

1. a LED area light source, comprises circuit board, LED chip, aluminum steel, gold thread, glue, fluorescent material, is characterized in that: circuit board is provided with can the circuit of conducting electrical signals, described circuit is provided with pad, do not have the place of circuit to be provided with LED chip on circuit boards, the rectangular array distribution of described LED chip, is welded with aluminum steel between LED chip and chip, be welded with gold thread between LED chip and circuit board, LED chip is provided with glue, fluorescent material.
2. a kind of LED area light source according to claim 1, is characterized in that: described circuit board is silver plating ceramic circuit board, silver coated aluminum base circuit board or silver-plated copper base circuit board.
CN201420834312.8U 2014-12-25 2014-12-25 A kind of LED area light source Expired - Fee Related CN204303808U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420834312.8U CN204303808U (en) 2014-12-25 2014-12-25 A kind of LED area light source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420834312.8U CN204303808U (en) 2014-12-25 2014-12-25 A kind of LED area light source

Publications (1)

Publication Number Publication Date
CN204303808U true CN204303808U (en) 2015-04-29

Family

ID=53109326

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420834312.8U Expired - Fee Related CN204303808U (en) 2014-12-25 2014-12-25 A kind of LED area light source

Country Status (1)

Country Link
CN (1) CN204303808U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110596951A (en) * 2018-05-23 2019-12-20 青岛海信电器股份有限公司 Mini LED lamp panel, preparation method and display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110596951A (en) * 2018-05-23 2019-12-20 青岛海信电器股份有限公司 Mini LED lamp panel, preparation method and display device

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Legal Events

Date Code Title Description
GR01 Patent grant
C14 Grant of patent or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150429

Termination date: 20161225

CF01 Termination of patent right due to non-payment of annual fee