CN203218331U - LED device for indoor display screen - Google Patents
LED device for indoor display screen Download PDFInfo
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- CN203218331U CN203218331U CN 201320212739 CN201320212739U CN203218331U CN 203218331 U CN203218331 U CN 203218331U CN 201320212739 CN201320212739 CN 201320212739 CN 201320212739 U CN201320212739 U CN 201320212739U CN 203218331 U CN203218331 U CN 203218331U
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- insulated substrate
- display screen
- led device
- chip
- indoor display
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Abstract
The utility model discloses an LED device for an indoor display screen. The LED device comprises an insulated substrate, at least one LED chip arranged on the insulated substrate, at least two electrodes arranged on the insulated substrate, and a packaged body which is packaged on the upper surface of the insulated substrate. The LED device is characterized in that at least one LED chip is directly installed on the insulated substrate, the LED chip is a bipolar chip, and the insulated substrate is black. Due to the adoption of the bipolar chip, the bottom conduction of the bipolar chip is not needed, the LED chip is directly mounted on the black insulated substrate, the use of a metal foil as a welding pad is not needed, and the black area of the black insulated substrate is enlarged, which means that the contrast of a chip LED device used in the indoor display screen is raised; since the black surface can absorb light, the brightness is decreased at the same time, and the display effect of the chip LED device used in the indoor display screen is raised.
Description
Technical field
The utility model relates to the LED encapsulation field, relates in particular to a kind of indoor display screen LED device.
Background technology
At present, the used device of the indoor display screen of LED mainly is TOP LED.As everyone knows, TOP LED develops to the high density direction thereby restricted the indoor display screen of LED because the restriction of product design itself and the restriction of producting process difficulty can not be accomplished reduced size, has limited the definition of the indoor display screen of LED then.
Existing sheet-shaped LED is used for display screen, because its device size is little, and whole screen density height, needed number of devices is many, each device can be luminous, and the place of placing chip is the pad of metallic copper base material, gold-platedly on metallic copper base material pad then causes brightness very high, so the brightness that integrates is very high, brightness is too high, when watching display screen, can produce dazzling light, do not meet display screen and be beneficial to the requirement of viewing and admiring, need to reduce its brightness.And reduce the copper material area and also just reduce gold-plated area, be conducive to reduce cost.
Indoor display screen also needs high contrast, just as light of flicker in the night sky of black, this light just seems very bright so, equally in order to improve contrast, we need increase the black area of sheet-shaped LED wiring board, traditional sheet-shaped LED PCB surface is that gold-plated area is big, and product colour is yellow partially, causes poor contrast.
The purpose of this utility model is to propose a kind of indoor display screen LED device, can solve the problem that existing indoor brightness of display screen is too high, contrast is low, production cost is high.
Summary of the invention
The purpose of this utility model is, provide a kind of cost low, can effectively solve the indoor display screen LED device that indoor brightness of display screen is too high, contrast is low.
For solving the problems of the technologies described above, the technical solution of the utility model is:
A kind of indoor display screen LED device, comprise: insulated substrate, be arranged at least one led chip on the described insulated substrate, be arranged at least two electrodes of described insulated substrate and at the packaging body of insulated substrate upper surface encapsulated moulding, it is characterized in that: at least one described led chip is directly installed on the insulated substrate.
Preferably, described insulated substrate is black.
Preferably, the length of described insulated substrate and width equate that size is at 0.9-1.1mm.
Preferably, the length of described insulated substrate and width are 1.0*1.0mm.
Preferably, the electrode of described LED device has four, be located at four angles of described substrate respectively, described each electrode comprises the surface electrode that is positioned at the insulated substrate upper surface and is positioned at the bottom electrode of insulated substrate lower surface, and described surface electrode and bottom electrode are that mode by the heavy copper of holing realizes electrically connecting.
Preferably, the thickness of described insulated substrate is 0.15mm-0.60mm.
Preferably, described led chip is bipolar slice, and described led chip is directly installed on the insulated substrate.
Preferably, described led chip also comprises at least one one pole chip, and described insulated substrate also comprises the metal forming that realizes electric connection, and described one pole chip is installed on the metal forming.
Preferably, described packaging body is transparent packing colloid or the packing colloid of black.
Preferably, at least one described led chip is directly installed on the insulated substrate by adhesive.
Compared with prior art, the utlity model has following advantage:
A kind of indoor display screen LED device that the utility model provides, adopt bipolar slice, bipolar slice does not need bottom conductive, and led chip is directly installed on the black insulated substrate, need not to adopt metal forming as weld pad, enlarge the black area of black insulated substrate, namely improved the contrast of sheet-shaped LED device when being used for indoor display screen; Because black surface can extinction, also reduced brightness simultaneously, improved the display effect of sheet-shaped LED device when being used for indoor display screen.In addition, owing to adopt bipolar slice, need not metal forming as weld pad, can effectively reduce on traditional sheet-shaped LED wiring board need be on metallic copper base material pad gold-plated area, thereby effectively reduce production cost and can realize mass production.
Description of drawings
Fig. 1 is the vertical view after the embodiment one LED device encapsulation of the present utility model;
Fig. 2 is the front view after the embodiment one LED device encapsulation of the present utility model;
Fig. 3 is the vertical view before the embodiment one LED device encapsulation of the present utility model;
Fig. 4 is the vertical view before the embodiment two LED devices encapsulation of the present utility model;
Fig. 5 is the vertical view after the embodiment two LED devices encapsulation of the present utility model.
Embodiment
For making the technical solution of the utility model clearer, below come the utility model is elaborated by specific embodiment.
Embodiment one
As shown in Figure 1 and Figure 2, a kind of indoor display screen that Fig. 1 provides for the present embodiment vertical view of LED device, a kind of indoor display screen that Fig. 2 provides for the present embodiment front view of LED device, comprise and have insulated substrate 1, be arranged on three led chips 2 on the insulated substrate 1, be arranged at the electrode 3 at 1 four angles of described insulated substrate and at the packaging body 4 of insulated substrate 1 upper surface encapsulated moulding.
The utility model provides a kind of undersized device architecture, and the length of described insulated substrate 1 and width equate that size is between 0.9-1.1mm, and the length of the preferred insulated substrate of present embodiment and width are 1.0*1.0mm.
Wherein, referring to figs. 2 and 3, wherein shown in Figure 3 is the schematic diagram of described LED device before the described packaging body of encapsulation, insulated substrate 1 can be bismaleimide-triazine resin (bismaleimide triazine, abbreviation " BT ") substrate, composite epoxy (composit epoxy material, abbreviation " CEM ") mixing of one or more in substrate or the ceramic substrate, present embodiment is black BT plate preferably.In other embodiments, can also be with white BT plate.Described insulated substrate 1 thickness is 0.15mm-0.60mm.
Four angles of described insulated substrate 1 are the on-right angle shape, and present embodiment is preferably circular-arc.Described at least two electrodes 3 that are arranged on 1 four angles of insulated substrate are used for being electrically connected led chip 2.In the present embodiment, the quantity of described electrode is four, each electrode comprises the surface electrode that is positioned at the insulated substrate upper surface and is positioned at the bottom electrode of insulated substrate lower surface, and described surface electrode and bottom electrode are that the mode by the heavy copper of holing realizes electrically connecting, and four electrodes are arranged at respectively on four arc chord angles of described insulated substrate 1.
Wherein, led chip 2 is a kind of in ultraviolet light chip, blue chip, green glow chip or the red light chips or three kinds, is preferably the combination of red, green, blue three color chips.
Led chip 2 can be one pole chip or bipolar slice.Adopt bipolar slice in the present embodiment, bipolar slice does not need bottom conductive, and led chip 2 is directly installed on the insulated substrate 1; Bipolar slice is to adopt adhesive to be installed on the insulated substrate 1.In the present embodiment, adhesive is silica gel; In other embodiments, adhesive also can be epoxy resin.
As shown in Figure 1 and Figure 2, packaging body 4 can be transparent packing colloid, can also be the packing colloid of black.In the present embodiment, packing colloid is preferably transparent.
In the present embodiment, adopt bipolar slice, bipolar slice does not need bottom conductive, and led chip is directly installed on the insulated substrate of black, need not to adopt metal forming as weld pad, enlarge the black area of black substrate, namely improved the contrast of sheet-shaped LED device when being used for indoor display screen; Because black surface can extinction, also reduced brightness simultaneously, improved the display effect of sheet-shaped LED device when being used for indoor display screen.In addition, because present embodiment adopts bipolar slice, need not metal forming as weld pad, can effectively reduce on traditional sheet-shaped LED wiring board need be on metallic copper base material pad gold-plated area, thereby effectively reduce production cost and can realize mass production.
Embodiment two
In conjunction with Fig. 4,5, introduce this patent embodiment 2 described a kind of indoor display screen LED devices.
As shown in Figure 4, the described a kind of indoor display screen of present embodiment is similar to embodiment one with the LED device, difference is: wherein led chip 21,22 adopts bipolar slice, and bipolar slice 21,22 does not need bottom conductive, and namely led chip 21,22 is directly installed on the insulated substrate 1 of black; Another one led chip 23 adopts the one pole chips, and the one pole chip is owing to need bottom conductive, so led chip 23 needs to adopt metal pad to realize electrically connecting; In the present embodiment, also be provided with the metal forming 31 in order to electrically connect on the insulated substrate 1, led chip 23 adopts the silver slurry to be bonded on the metal forming 31.In the present embodiment, as shown in Figure 5, packing colloid 4 can be the packing colloid of black, in order to improve contrast, is not limited to present embodiment.
In the present embodiment, adopt bipolar slice by led chip 21,22, do not need bottom conductive, be that led chip 21,22 is directly installed on the insulated substrate 1 of black, need not metal forming as weld pad, enlarge the black area of insulated substrate 1, namely improved contrast and the display effect of sheet-shaped LED device when being used for indoor display screen; In addition, because led chip 21,22 adopts bipolar slice and is directly installed on the insulated substrate 1, need not metal forming as weld pad, so effectively reduced on traditional sheet-shaped LED wiring board need be on metallic copper base material pad gold-plated area, thereby effectively reduce production cost and can realize mass production.
More than the utility model is described in detail, use specific case in the literary composition principle of the present utility model and execution mode set forth, the explanation of above embodiment just is used for helping to understand method of the present utility model and core concept thereof.Should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model principle, can also carry out some improvement and modification to the utility model, these improvement and modification also fall in the protection range of the utility model claim.
Claims (10)
1. indoor display screen LED device, comprise: insulated substrate, be arranged at least one led chip on the described insulated substrate, be arranged at least two electrodes of described insulated substrate and at the packaging body of insulated substrate upper surface encapsulated moulding, it is characterized in that at least one described led chip is directly installed on the insulated substrate.
2. a kind of indoor display screen LED device according to claim 1 is characterized in that described insulated substrate is black.
3. a kind of indoor display screen LED device according to claim 1 is characterized in that, the length of described insulated substrate and width equate that size is between 0.9-1.1mm.
4. a kind of indoor display screen LED device according to claim 1 is characterized in that the length of described insulated substrate and width are 1.0*1.0mm.
5. a kind of indoor display screen LED device according to claim 1, it is characterized in that, the electrode of described LED device has four, be located at four angles of described insulated substrate respectively, described each electrode comprises the surface electrode that is positioned at the insulated substrate upper surface and is positioned at the bottom electrode of insulated substrate lower surface, and described surface electrode and bottom electrode are that mode by the heavy copper of holing realizes electrically connecting.
6. a kind of indoor display screen LED device according to claim 1 is characterized in that the thickness of described insulated substrate is 0.15mm-0.60mm.
7. a kind of indoor display screen LED device according to claim 1 and 2 it is characterized in that described led chip is bipolar slice, and described led chip is directly installed on the insulated substrate.
8. a kind of indoor display screen LED device according to claim 1 and 2, it is characterized in that, described led chip also comprises at least one one pole chip, and described insulated substrate also comprises the metal forming that realizes electric connection, and described one pole chip is installed on the metal forming.
9. a kind of indoor display screen LED device according to claim 1 is characterized in that, described packaging body is transparent packing colloid or the packing colloid of black.
10. a kind of indoor display screen LED device according to claim 1 is characterized in that at least one described led chip is directly installed on the insulated substrate by adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320212739 CN203218331U (en) | 2013-04-25 | 2013-04-25 | LED device for indoor display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320212739 CN203218331U (en) | 2013-04-25 | 2013-04-25 | LED device for indoor display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203218331U true CN203218331U (en) | 2013-09-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320212739 Expired - Lifetime CN203218331U (en) | 2013-04-25 | 2013-04-25 | LED device for indoor display screen |
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| CN (1) | CN203218331U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979338A (en) * | 2014-04-10 | 2015-10-14 | 光宝光电(常州)有限公司 | Light-emitting diode packaging structure |
| CN106784253A (en) * | 2017-01-18 | 2017-05-31 | 苏州晶台光电有限公司 | A kind of inverted structure LED core chip package for realizing the close display of superelevation |
| CN107681037A (en) * | 2017-09-14 | 2018-02-09 | 苏州晶台光电有限公司 | A kind of method for packing of the close display LED light source component of achievable superelevation |
-
2013
- 2013-04-25 CN CN 201320212739 patent/CN203218331U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979338A (en) * | 2014-04-10 | 2015-10-14 | 光宝光电(常州)有限公司 | Light-emitting diode packaging structure |
| CN104979338B (en) * | 2014-04-10 | 2018-07-27 | 光宝光电(常州)有限公司 | Light-emitting diode encapsulation structure |
| CN106784253A (en) * | 2017-01-18 | 2017-05-31 | 苏州晶台光电有限公司 | A kind of inverted structure LED core chip package for realizing the close display of superelevation |
| CN107681037A (en) * | 2017-09-14 | 2018-02-09 | 苏州晶台光电有限公司 | A kind of method for packing of the close display LED light source component of achievable superelevation |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130925 |
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| CX01 | Expiry of patent term |