CN207038551U - A kind of radiator and chip integrative packaging light-source structure - Google Patents
A kind of radiator and chip integrative packaging light-source structure Download PDFInfo
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- CN207038551U CN207038551U CN201720898297.7U CN201720898297U CN207038551U CN 207038551 U CN207038551 U CN 207038551U CN 201720898297 U CN201720898297 U CN 201720898297U CN 207038551 U CN207038551 U CN 207038551U
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- conductive circuit
- pcb board
- heat sink
- negative
- terminal pad
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 239000004020 conductor Substances 0.000 claims description 18
- 238000009413 insulation Methods 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims description 3
- 230000011218 segmentation Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 abstract description 8
- 238000009826 distribution Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 230000010354 integration Effects 0.000 abstract description 4
- 238000000605 extraction Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 5
- 241000218202 Coptis Species 0.000 description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 210000003739 neck Anatomy 0.000 description 4
- 239000007787 solid Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a kind of radiator and chip integrative packaging light-source structure, including heat sink, insulating fixing piece, LED chip, pcb board, lens, positive conductive circuit and negative conductive circuit.The direct die bond of LED chip of the present utility model is conducted in radiating plate surface by the positive conductive circuit on pcb board and negative conductive circuit with external circuit.Support is removed, the thermal resistance number of plies is reduced, greatly improves heat conduction efficiency；The packaged light source out of the utility model directly band lens, drastically increase light extraction efficiency, simplify related light distribution requirements, eliminate the technique for installing lens additional above traditional light source, be advantageous to substantially reduce relevant cost, production efficiency is improved, lens and LED chip realize integration, and luminous intensity distribution technology and light-source encapsulation technological perfectionism combine；Light source realizes waterproof requirement more than IP65 grades by insulating fixing piece, is adapted to different lamps field of employment to require；Due to eliminating support, it can accomplish the utility model relatively thin, it is very useful attractive in appearance.
Description
Technical field
It the utility model is related to a kind of radiator and chip integrative packaging light-source structure.Belong to LED light source encapsulation field.
Background technology
Existing light-source encapsulation technique generally comprises die bond, bonding wire, dot fluorescent powder, resin seal, long roasting, punching, aging
With life test, packaging, wherein, die bond is by die bonding on support, and support is fixed on pcb board, this light-source encapsulation
Technique has following defect：
1st, due to the installation steps of support, complex process is caused；
2nd, due to the presence of support, cause can not to accomplish in structure relatively thin；
3rd, because the presence of support, the thermal resistance number of plies increase, heat conduction efficiency is low.
Utility model content
The purpose of this utility model is to overcome drawbacks described above, there is provided a kind of radiator and chip integrative packaging light source knot
Structure.
To achieve these goals, the technical solution adopted in the utility model is as follows：
A kind of radiator and chip integrative packaging light-source structure, including heat sink, insulating fixing piece, LED chip, PCB
Plate, lens, positive conductive circuit and negative conductive circuit；The insulating fixing piece includes insulation fixed disk, and the insulation is fixed
The bottom fixing seal of disk is emptied to heat sink in the middle part of the insulation fixed disk on heat sink and forms one glass with heat sink
Chamber, this glass of chamber are led directly in lens bottom；The pcb board is fixed on the top of insulation fixed disk and positive conductive circuit and negative pole are led
Electric line on the pcb board, with positive pole lead respectively in the positive pole and negative pole of cup intracavitary and LED chip by the LED chip die bond
One end of electric line and negative conductive circuit conducts, and the other end of positive conductive circuit and negative conductive circuit is used for and outside
Circuit conducts；The lens are tightly connected by pcb board and insulating fixing piece with heat sink.
The direct die bond of the utility model LED chip in radiating plate surface, by the positive conductive circuit on pcb board and
Negative conductive circuit conducts with external circuit.Support is removed, the thermal resistance number of plies is reduced, greatly improves heat conduction efficiency；This reality
With new packaged light source out directly band lens, light extraction efficiency is drastically increased, related light distribution requirements is simplified, saves
The technique for installing lens above traditional light source additional, be advantageous to substantially reduce relevant cost, improve production efficiency, lens and
LED chip realizes integration, and luminous intensity distribution technology and light-source encapsulation technological perfectionism combine；Due to eliminating support, this practicality can be made new
Type accomplish it is relatively thin, it is very useful attractive in appearance, be particularly suitable for large-scale promotion use.
Specifically, the positive conductive circuit includes the first electric conductor and is respectively arranged on the positive pole weldering at the first electric conductor both ends
Disk；The negative conductive circuit includes the second electric conductor and is respectively arranged on the negative terminal pad at the second electric conductor both ends；Located at relative
The positive terminal pad and negative terminal pad of inner side are used to conduct with LED chip, located at the positive terminal pad and negative terminal pad of opposite exterior lateral sides
For being conducted with external circuit.
Further for conducting for positive wire circuit and negative conductive circuit and external circuit is realized, the positive pole is led
Electric line and negative conductive circuit also include being used for the conductive pin/conducting strip connected with external circuit, the conductive pin/conducting strip
Conducted respectively with the positive terminal pad located at opposite exterior lateral sides and negative terminal pad.
As a preferred embodiment, the positive pole and negative pole of the LED chip are welded in the positive pole of relative inner by gold thread respectively
Pad and negative terminal pad.
In order to play more preferable waterproof and installation effect, the conductive pin/conducting strip is passed through to top from the bottom of heat sink
Portion, then pass through insulating fixing piece and welded respectively with the positive terminal pad located at opposite exterior lateral sides and negative terminal pad, cup chamber, positive conductive
Circuit, negative conductive circuit, pcb board are arranged at the top of heat sink.
Further for the fixed effect that insulating fixing piece is better achieved, the insulating fixing piece also includes pin, should
Pin is multiple and located at the bottom of insulation fixed disk, correspondingly, corresponding and quantity is provided with prong position on heat sink
Consistent jack.
At least there are two pins to be provided with the through hole being used for through conductive pin/conducting strip, the through hole is relative with being located at
The positive terminal pad in outside and the position correspondence of negative terminal pad, and it is logical at least to have two jacks corresponding with the prong position
Hole, for through conductive pin/conducting strip.
Encapsulation for the ease of insulating fixing piece and pcb board and thickness of the present utility model is done thin, the insulation is solid
The groove for placing pcb board is additionally provided with the top of price fixing；The pcb board is integrated, and is provided with and cup in the middle part of pcb board
The through hole of chamber position correspondence, positive conductive circuit and negative conductive circuit are respectively arranged on the pcb board of the through hole both sides；It is described
Pcb board is segmentation structure, including the first pcb board and the second pcb board being respectively arranged in glass chamber grooves on two sides, positive conductive line
Road and negative conductive circuit are respectively arranged on the first pcb board and the second pcb board.
Further, the cup intracavitary is inoculated with fluid sealant, forms lighting cavity.
Further, the insulating fixing piece uses rubber, and first electric conductor and the second electric conductor use copper
Piece, the heat sink are made of high conductivity material.
In addition, the lens are detachably connected with heat sink, more than one neck is provided with the edge of heat sink, in lens
Relevant position be provided with matching clamping block.
Compared with prior art, the utility model has the advantages that：
(1) for the utility model by designing a kind of radiator and chip integrative packaging light-source structure, LED chip is directly solid
Crystalline substance is conducted in radiating plate surface by the positive conductive circuit on pcb board and negative conductive circuit with external circuit.Go
Except support, the thermal resistance number of plies is reduced, greatly improves heat conduction efficiency.
(2) the packaged light source out of the utility model directly band lens, drastically increase light extraction efficiency, simplify phase
Light distribution requirements are closed, eliminate the technique for installing lens additional above traditional light source, is advantageous to substantially reduce relevant cost, improves life
Efficiency is produced, lens and LED chip realize integration, and luminous intensity distribution technology and light-source encapsulation technological perfectionism combine.
(3) light source of the present utility model realizes more than IP65 grades waterproof requirement by insulating fixing piece, is adapted to difference
Light fixture field of employment requires.
(4) the utility model can accomplish the utility model relatively thin due to eliminating support, very useful attractive in appearance,
It is particularly suitable for large-scale promotion use.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model-embodiment 1.
Fig. 2 is the structural representation of the utility model-embodiment 2.
Wherein, the title corresponding to reference：
1- heat sinks, 101- necks, 2- insulating fixing pieces, 201- insulation fixed disks, 202- pins, 203- cup chambers, 3-LED
Chip, 4-PCB plates, 5- conductive pins, 6- lens, 601- clamping blocks, 602- lens frameworks, 603- eyeglasses.
Embodiment
The utility model is described in further detail with reference to the accompanying drawings and examples, and embodiment of the present utility model includes
But it is not limited to the following example.
Explanation of nouns:Die bond is also known as DieBond or load.Die bond (is usually conduction for LED i.e. by colloid
Glue or insulating cement) wafer bonding in the designated area of support, form heat passage or electric pathway, connect and provide for the routing of postorder
Condition.
Embodiment 1
As shown in figure 1, a kind of radiator and chip integrative packaging light-source structure, including heat sink 1, insulating fixing piece 2,
LED chip 3, pcb board 4, the conducting strip of conductive pin 5/, lens 6, positive conductive circuit and negative conductive circuit.
The interconnected relationship of above-mentioned part is as follows：Insulating fixing piece includes insulation fixed disk, the bottom for the fixed disk that insulate
Fixed seal connection is emptied to heat sink in the middle part of the fixed disk that insulate on heat sink and forms one glass of chamber formation one with heat sink
Cup chamber, this glass of chamber are led directly in lens bottom.
Pcb board is fixed on the top of insulation fixed disk and positive conductive circuit and negative conductive circuit are on the pcb board,
LED chip die bond in cup intracavitary radiating plate surface and LED chip positive pole and negative pole respectively with positive conductive circuit and negative pole
One end of conducting wire conducts, and the other end of positive conductive circuit and negative conductive circuit is used to conduct with external circuit；
Positive conductive circuit includes the first electric conductor and is respectively arranged on the positive terminal pad at the first electric conductor both ends；Negative conductive circuit includes
Second electric conductor and the negative terminal pad for being respectively arranged on the second electric conductor both ends；Located at the positive terminal pad and negative terminal pad of relative inner
For conducting with LED chip, it is used to conduct with external circuit located at the positive terminal pad and negative terminal pad of opposite exterior lateral sides, and then
LED chip is set to be conducted with external circuit.Lens are tightly connected by pcb board and insulating fixing piece with heat sink.
In the present embodiment, the positive pole and negative pole of LED chip respectively by gold thread be welded in relative inner positive terminal pad and
Negative terminal pad.Specifically：The positive pole and negative pole of LED chip weld with one end of gold thread respectively, the other end of gold thread respectively with phase
Positive terminal pad and negative terminal pad welding realization to inner side conduct.
Further for conducting for positive wire circuit and negative conductive circuit and external circuit is realized, the present embodiment carries
Realized for a kind of mode：Positive conductive circuit and negative conductive circuit also include being used for the conduction connected with external circuit
Pin/conducting strip, the conductive pin/conducting strip conduct with the positive terminal pad located at opposite exterior lateral sides and negative terminal pad respectively.
The related waterproof of light source and installation requirement are reached by insulating fixing piece, in order to play more preferable waterproof and installation
Effect, cup chamber, positive conductive circuit, negative conductive circuit, pcb board are arranged at the top of heat sink, conductive pin/conducting strip from
The bottom of heat sink is passed through to top, is then passed through insulating fixing piece and is welded respectively with the positive terminal pad located at opposite exterior lateral sides and negative pole
Disk welds.
Further for the fixed effect that insulating fixing piece is better achieved, insulating fixing piece also includes pin, the pin
For it is multiple and located at insulation fixed disk bottom, correspondingly, on heat sink be provided with corresponding and quantity is consistent with prong position
Jack, pin insertion jack in, insulating fixing piece is more firmly fixed on heat sink.
Due to conductive pin/conducting strip be present, in order that structure is simpler, by the position of conductive pin/conducting strip set with
Pin, jack integration, in the present embodiment, there are two pins to be provided with the through hole being used for through conductive pin/conducting strip, this is logical
Hole and the positive terminal pad and the position correspondence of negative terminal pad located at opposite exterior lateral sides, and it is corresponding with the prong position with two
Jack is through hole, for through conductive pin/conducting strip.
Encapsulation for the ease of insulating fixing piece and pcb board and thickness of the present utility model is done it is thin, also for realization
More preferable waterproof effect, the groove for placing pcb board is additionally provided with the top of the fixed disk that insulate, the height of groove is in PCB thickness
Degree is consistent, and in the present embodiment, pcb board is integrated, and the through hole with cup chamber position correspondence, positive pole are provided with the middle part of pcb board
Conducting wire and negative conductive circuit are respectively arranged on the pcb board of the through hole both sides, as shown in Figure 1.
In the present embodiment, cup intracavitary is inoculated with fluid sealant, forms lighting cavity.
In the present embodiment, insulating fixing piece uses rubber, and the first electric conductor and the second electric conductor use copper sheet.
Lens are detachably connected with heat sink, and in the present embodiment, the mode of preferably buckle is detachably connected, simple and convenient.
More than one neck 101 is provided with the edge of heat sink, the clamping block 601 of matching is provided with the relevant position of lens.Lens bag
Lens framework 602 and eyeglass 603 are included, eyeglass is located at the middle part of lens framework and is convex lens, and the lower surface of lens framework leads to
The front sealed connection of pcb board and heat sink is crossed, and forms a cavity, clamping block is located at the edge of lens framework.Lens
It is made of the related thermostability engineering plastic material such as PC, PMMA.
In the present embodiment, heat sink is square plate, and is equipped with more than one neck in four edges edge.Heat sink is
Special high conductivity material is made.High conductivity material is aluminium base, glass-fiber-plate or ceramics.
Embodiment 2
As shown in Fig. 2 a kind of radiator and chip integrative packaging light-source structure, as different from Example 1, this implementation
The pcb board of example is segmentation structure, including the first pcb board and the second pcb board, positive pole that are respectively arranged in glass chamber grooves on two sides are led
Electric line and negative conductive circuit are respectively arranged on the first pcb board and the second pcb board.
According to above-described embodiment, the utility model can be realized well.What deserves to be explained is based on above-mentioned design principle
On the premise of, to solve same technical problem, some nothings made on architecture basics disclosed in the utility model
Substantial change or polishing, the essence of used technical scheme is still as the utility model, therefore it should also be as at this
In the protection domain of utility model.
Claims (10)
1. a kind of radiator and chip integrative packaging light-source structure, it is characterised in that including heat sink (1), insulating fixing piece
(2), LED chip (3), pcb board (4), lens (6), positive conductive circuit and negative conductive circuit；
The insulating fixing piece include insulation fixed disk (201), it is described insulation fixed disk bottom fixing seal on heat sink,
Emptied in the middle part of the insulation fixed disk to heat sink and form one glass of chamber (203) with heat sink, this glass of chamber is led directly in lens bottom
Portion；
The pcb board is fixed on the top of insulation fixed disk and positive conductive circuit and negative conductive circuit are on the pcb board,
The LED chip die bond in cup intracavitary and LED chip positive pole and negative pole respectively with positive conductive circuit and negative conductive circuit
One end conduct, the other end of positive conductive circuit and negative conductive circuit is used to conduct with external circuit；
The lens are tightly connected by pcb board and insulating fixing piece with heat sink.
2. a kind of radiator according to claim 1 and chip integrative packaging light-source structure, it is characterised in that it is described just
Pole conducting wire includes the first electric conductor and is respectively arranged on the positive terminal pad at the first electric conductor both ends；
The negative conductive circuit includes the second electric conductor and is respectively arranged on the negative terminal pad at the second electric conductor both ends；
It is used to conduct with LED chip located at the positive terminal pad and negative terminal pad of relative inner, the positive pole located at opposite exterior lateral sides welds
Disk and negative terminal pad are used to conduct with external circuit.
3. a kind of radiator according to claim 2 and chip integrative packaging light-source structure, it is characterised in that it is described just
Pole conducting wire and negative conductive circuit also include being used for conductive pin (the 5)/conducting strip connected with external circuit, the conduction
Pin/conducting strip conducts with the positive terminal pad located at opposite exterior lateral sides and negative terminal pad respectively.
4. a kind of radiator according to claim 3 and chip integrative packaging light-source structure, it is characterised in that described to lead
Acusector/conducting strip is passed through to top from the bottom of heat sink, then pass through insulating fixing piece respectively with located at opposite exterior lateral sides just
Pole pad and negative terminal pad welding, cup chamber, positive conductive circuit, negative conductive circuit, pcb board are arranged at the top of heat sink
Portion.
5. a kind of radiator according to claim 4 and chip integrative packaging light-source structure, it is characterised in that described exhausted
Edge fixture also includes pin (202), and the pin is multiple and located at the bottom of insulation fixed disk, correspondingly, in heat sink
It is provided with the jack corresponding and consistent quantity with prong position.
6. a kind of radiator according to claim 5 and chip integrative packaging light-source structure, it is characterised in that at least have
There are two pins to be provided with the through hole being used for through conductive pin/conducting strip, the through hole and the positive terminal pad located at opposite exterior lateral sides
With the position correspondence of negative terminal pad, and it is through hole at least to have two jacks corresponding with the prong position, for through leading
Acusector/conducting strip.
7. a kind of radiator according to claim 6 and chip integrative packaging light-source structure, it is characterised in that described exhausted
The groove for placing pcb board is additionally provided with the top of edge fixed disk；
The pcb board is integrated, and is provided with through hole with cup chamber position correspondence in the middle part of pcb board, positive conductive circuit and
Negative conductive circuit is respectively arranged on the pcb board of the through hole both sides；
The pcb board is segmentation structure, including the first pcb board and the second pcb board being respectively arranged in glass chamber grooves on two sides, just
Pole conducting wire and negative conductive circuit are respectively arranged on the first pcb board and the second pcb board.
8. a kind of radiator and chip integrative packaging light-source structure according to claim 1-7 any one, its feature
It is, the cup intracavitary is inoculated with fluid sealant, forms lighting cavity.
9. a kind of radiator and chip integrative packaging light-source structure according to claim 2-7 any one, its feature
It is, the insulating fixing piece uses rubber, and first electric conductor and the second electric conductor use copper sheet, and the heat sink is adopted
It is made of high conductivity material.
10. a kind of radiator and chip integrative packaging light-source structure according to claim 1-7 any one, its feature
It is, the lens are detachably connected with heat sink, more than one neck (101) are provided with the edge of heat sink, in lens
Relevant position is provided with the clamping block (601) of matching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720898297.7U CN207038551U (en) | 2017-07-21 | 2017-07-21 | A kind of radiator and chip integrative packaging light-source structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720898297.7U CN207038551U (en) | 2017-07-21 | 2017-07-21 | A kind of radiator and chip integrative packaging light-source structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207038551U true CN207038551U (en) | 2018-02-23 |
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ID=61465458
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720898297.7U Active CN207038551U (en) | 2017-07-21 | 2017-07-21 | A kind of radiator and chip integrative packaging light-source structure |
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| Country | Link |
|---|---|
| CN (1) | CN207038551U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107331756A (en) * | 2017-07-21 | 2017-11-07 | 湖南粤港模科实业有限公司 | A kind of radiator and chip integrative packaging light-source structure |
-
2017
- 2017-07-21 CN CN201720898297.7U patent/CN207038551U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107331756A (en) * | 2017-07-21 | 2017-11-07 | 湖南粤港模科实业有限公司 | A kind of radiator and chip integrative packaging light-source structure |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Hunan Moke Mold Manufacturing Co.,Ltd. Assignor: HUNAN YUEGANG MOOKRAY INDUSTRIAL Co.,Ltd. Contract record no.: X2023980045230 Denomination of utility model: A Light Source Structure with Integrated Package of Heat Sink and Chip Granted publication date: 20180223 License type: Common License Record date: 20231031 |