CN209418539U

CN209418539U - A kind of high-efficient large power LED light source encapsulating structure

Info

Publication number: CN209418539U
Application number: CN201920012681.1U
Authority: CN
Inventors: 张勇; 郑汉武
Original assignee: Shenzhen Suijing Optoelectronics Co Ltd
Current assignee: Shenzhen Suijing Optoelectronics Co Ltd
Priority date: 2019-01-04
Filing date: 2019-01-04
Publication date: 2019-09-20
Anticipated expiration: 2029-01-04

Abstract

The utility model discloses a kind of high-efficient large power LED light source encapsulating structures, including thermal conductivity pedestal, the thermal conductivity two sides of base is fixedly installed with bracket respectively, the bracket is fixedly installed with pin far from the side of thermal conductivity pedestal, thermal conductivity pedestal upper end is fixedly installed LED blue light chip, the LED blue light both sides of wafers is fixedly installed with bonding gold thread respectively, the LED blue light chip between bonding gold thread and thermal conductivity pedestal by being electrically connected, the bracket middle inside is fixedly installed pad, the pad is respectively at pin, it is electrically connected between thermal conductivity pedestal, the LED blue light chip outer surface is fixedly installed transparent LENS layer of silica gel, the transparent LENS layer of silica gel outer surface is fixedly installed yellow fluorescent powder glue-line.The simple using effect of the utility model structure is good, and whole device changes conventional light source and first puts the encapsulating structure that yellow fluorescent glue refills transparent silica gel, so that the light extraction efficiency of product is significantly promoted.

Description

A kind of high-efficient large power LED light source encapsulating structure

Technical field

The utility model relates to high efficiency light source technical field, specially a kind of high-efficient large power LED light source encapsulating structure.

Background technique

High-power point light source is widely used in various commercial illumination as illumination electron-like element, such as high-power outdoor road Lamp illumination, room lighting, Landscape Lighting and other illumination applications etc., conventional high-power point light source, to the reliability of light source There is very big requirement, be usually made of LED high-power support and LED wafer, using bonding gold thread by LED wafer electrode and bracket Conductive coating is bonded, and realizes electrically conducting, then the bowl internal point yellow fluorescent glue inside LED support, and LED blue light is brilliant Piece excites yellow fluorescent powder to generate white light, then secondary optical lens are covered on bracket, fills transparent silica gel baking and is solidified into Type, since fluorescent glue is put in light source bracket bowl by elder generation, LED blue light directly excites Huang for the LED light source encapsulating structure of this mode Color fluorescent glue generates white light, and then under exterior clear filling glue effect, being formed, there is white light the white light of certain light emitting angle to produce Product, one defect of this encapsulating structure are exactly that LED has quite a few photon loss when lighting and issuing blue light, if directly Yellow fluorescence arogel is excited, will lead to the problem that fluorescent powder stimulation effect is poor, causes the universal light efficiency of such light source lower.

Utility model content

The purpose of this utility model is to provide a kind of high-efficient large power LED light source encapsulating structures, to solve above-mentioned back The problem of being proposed in scape technology.

To achieve the above object, the utility model provides the following technical solutions: a kind of high-efficient large power LED light source encapsulation Structure, including thermal conductivity pedestal, the thermal conductivity two sides of base are fixedly installed with bracket respectively, and the bracket is far from thermally conductive The side of conductive base is fixedly installed with pin, and thermal conductivity pedestal upper end is fixedly installed LED blue light chip, described LED blue light both sides of wafers is fixedly installed with bonding gold thread respectively, and the LED blue light chip passes through bonding gold thread and thermal conductivity base It is electrically connected between seat, the bracket middle inside is fixedly installed pad, the pin, pad, between thermal conductivity pedestal It is electrically connected, the LED blue light chip outer surface is fixedly installed transparent LENS layer of silica gel, outside the transparent LENS layer of silica gel Side surface is fixedly installed yellow fluorescent powder glue-line.

Preferably, the pedestal upper end is fixedly installed optical lens, and optical lens is for protecting chip luminous zone and guarantor Hold the light emitting angle of light source.

Preferably, the pin offers mounting hole far from one end outer surface of optical lens, can be with by mounting hole Facilitate pin connecting wire.

Preferably, the thermal conductivity pedestal has good thermal conductivity effect using copper product, copper.

Preferably, the bracket uses PPA plastic material, and PPA plastic insulation wear-resistant strength is high, and performance is good.

Preferably, fixed between the LED blue light chip lower end outside surface and thermal conductivity pedestal upper end outer surface It is provided with elargol layer, elargol layer can bind LED blue light chip and thermal conductivity pedestal forms it into more firm physics knot Structure.

Compared with prior art, the utility model has the beneficial effects that

1, the utility model issues blue light after being powered by LED blue light chip, blue light first pass through transparent LENS layer of silica gel into It after row convergence and diverging, enters back into and then excites yellow fluorescent powder in yellow fluorescent powder glue-line, issue efficient white light, it can be very The quantum efficiency of good promotion blue light, the whole light efficiency of light source promote 10% or more.

Detailed description of the invention

Fig. 1 is a kind of high-efficient large power LED light source encapsulating structure overall structure diagram of the utility model；

Fig. 2 is a kind of high-efficient large power LED light source encapsulating structure top view of the utility model；

Fig. 3 is the enlarged view in a kind of high-efficient large power LED light source encapsulating structure Fig. 1 of the utility model at A.

In figure: 1, thermal conductivity pedestal；2, bracket；3, pin；4, LED blue light chip；5, it is bonded gold thread；6, pad；7, Transparent LENS layer of silica gel；8, yellow fluorescent powder glue-line；9, optical lens；10, mounting hole；11, elargol layer.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of high-efficient large power LED light source encapsulation knot Structure, including thermal conductivity pedestal 1,1 two sides of thermal conductivity pedestal are fixedly installed with bracket 2 respectively, and the bracket 2 is separate to lead The side of thermal conducting pedestal 1 is fixedly installed with pin 3, and 1 upper end of thermal conductivity pedestal is fixedly installed LED blue light chip 4, 4 two sides of LED blue light chip are fixedly installed with bonding gold thread 5 respectively, and the LED blue light chip 4 is by being bonded gold thread 5 and leading Be electrically connected between thermal conducting pedestal 1,2 middle inside of bracket is fixedly installed pad 6, the pad 6 respectively with pin 3, it is electrically connected between thermal conductivity pedestal 1,4 outer surface of LED blue light chip is fixedly installed transparent LENS layer of silica gel 7, transparent 7 outer surface of LENS layer of silica gel is fixedly installed yellow fluorescent powder glue-line 8.

2 upper end of bracket is fixedly installed optical lens 9, and optical lens 9 is for protecting chip luminous zone and keeping light The light emitting angle in source, the pin 3 offer mounting hole 10 far from one end outer surface of optical lens 9, pass through mounting hole 10 It can be convenient 3 connecting wire of pin, the thermal conductivity pedestal 1 is imitated using copper product, copper with good thermal conductivity Fruit, the bracket 2 use PPA plastic material, and PPA plastic insulation wear-resistant strength is high, and performance is good, 4 lower end of LED blue light chip It is fixedly installed elargol layer 11 between 1 upper end outer surface of outer surface and thermal conductivity pedestal, elargol layer 11 can bind LED Blue light chip 4 and thermal conductivity pedestal 1 form it into more firm physical structure.

Working principle: first passing through mounting hole 10 and install device pin 3 with power supply when use device, pin 3 is connected It can be the energization of LED blue light chip 4 by pad 6, thermal conductivity pedestal 1, bonding gold thread 5 after power supply, LED blue light chip 4 is powered After issue blue light, blue light first passes through after transparent LENS layer of silica gel 7 converged and dissipated, and enters back into yellow fluorescent powder glue-line 8 In after excite yellow fluorescent powder, issue efficient white light, entire light source, which changes conventional light source, first to be put yellow fluorescent glue and refill The encapsulating structure of bright silica gel, so that the light extraction efficiency of product is significantly promoted, and device generates heat when in use and can lead to The quickly export diverging of thermal conductivity pedestal 1 is crossed, anti-locking apparatus internal temperature is excessively high, and here it is a kind of high photosynthetic efficiency of the utility model is big The working principle of power LED light source encapsulating structure.

It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.

While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims

1. a kind of high-efficient large power LED light source encapsulating structure, including thermal conductivity pedestal (1), it is characterised in that: described thermally conductive Conductive base (1) two sides are fixedly installed with bracket (2) respectively, and the bracket (2) is fixed far from the side of thermal conductivity pedestal (1) It is equipped with pin (3), thermal conductivity pedestal (1) upper end is fixedly installed LED blue light chip (4), the LED blue light chip (4) two sides are fixedly installed with bonding gold thread (5) respectively, and the LED blue light chip (4) passes through bonding gold thread (5) and thermal conductivity Pedestal is electrically connected between (1), and bracket (2) middle inside is fixedly installed pad (6), the pad (6) respectively with draw Foot (3), thermal conductivity pedestal are electrically connected between (1), and LED blue light chip (4) outer surface is fixedly installed transparent LENS layer of silica gel (7), transparent LENS layer of silica gel (7) outer surface are fixedly installed yellow fluorescent powder glue-line (8).

2. a kind of high-efficient large power LED light source encapsulating structure according to claim 1, it is characterised in that: the bracket (2) upper end is fixedly installed optical lens (9).

3. a kind of high-efficient large power LED light source encapsulating structure according to claim 1 or 2, it is characterised in that: described to draw Foot (3) offers mounting hole (10) far from one end outer surface of optical lens (9).

4. a kind of high-efficient large power LED light source encapsulating structure according to claim 1, it is characterised in that: described thermally conductive Conductive base (1) is using copper product.

5. a kind of high-efficient large power LED light source encapsulating structure according to claim 1, it is characterised in that: the bracket (2) PPA plastic material is used.

6. a kind of high-efficient large power LED light source encapsulating structure according to claim 1, it is characterised in that: the LED is blue Elargol layer (11) are fixedly installed between light chip (4) lower end outside surface and thermal conductivity pedestal (1) upper end outer surface.