CN208753370U - A kind of highly reliable large power LED light source encapsulating structure - Google Patents

Abstract

The utility model discloses a kind of highly reliable large power LED light source encapsulating structures, including light source bracket, the shape of the light source bracket is bowl shape, the cup inner bottom of the light source bracket is provided with LED blue light chip, the LED blue light chip is bundled in the cup inner bottom of light source bracket by die bond mode, metal heat-conducting structure is fixedly installed on the cup inner wall of the light source bracket, the metal heat-conducting structure material is red metal material, the bottom end of the metal heat-conducting structure is connected to the bottom of light source bracket, transparent silicon glue-line has been sequentially filled inside the cup of the light source bracket, yellow fluorescence glue-line.The utility model is by designing special encapsulating structure and packaging technology, it can be very good to go by great power LED blue light chip and its in the export that the heat that yellow fluorescence glue-line excitation layer generates is exceedingly fast in this way, so that light-source system thermal resistance is extremely low, while the light-out effect of integrated light source can be promoted and promote the reliability and optical property of product.

Description

A kind of highly reliable large power LED light source encapsulating structure

Technical field

The utility model relates to headlamp technical field, specially a kind of highly reliable large power LED light source encapsulating structure.

Background technique

Highly reliable large power LED light source is led to using the encapsulating structure for binding flip chip on aluminium nitride ceramics bracket It often applies and is widely used in the harsh environment high to light source reliability requirement, such as automobile front, shot-light, bulkhead lamp Various general illumination fields, it has also become the important component of general illumination LED light source；

A kind of traditional LED light source encapsulating structure has the disadvantage that

Traditional high-power LED light source generallys use after LED blue light chip is bundled on bracket, directly passes through a little Adhesive process coats the mode of fluorescent powder, coats fluorescent glue on LED wafer surface, and then LED blue light excitated fluorescent powder generates white light, The great power LED cooling poor performance of such Mode encapsulations, system thermal resistance is very high, thus causes light source overall attenuation excessive, very To the risk for causing failure.

Utility model content

It is above-mentioned to solve the purpose of this utility model is to provide a kind of highly reliable large power LED light source encapsulating structure The problem of being proposed in background technique.

To achieve the above object, the utility model provides the following technical solutions: a kind of highly reliable large power LED light source envelope Assembling structure, including light source bracket, the shape of the light source bracket are bowl shape, and the cup inner bottom of the light source bracket is arranged There is LED blue light chip, the LED blue light chip is bundled in the cup inner bottom of light source bracket, the light source by die bond mode Metal heat-conducting structure is fixedly installed on the cup inner wall of bracket, the metal heat-conducting structure material is red metal material, the metal The bottom end of conductive structure is connected to the bottom of light source bracket, be sequentially filled inside the cup of the light source bracket transparent silicon glue-line, Yellow fluorescence glue-line, the transparent silicon glue-line are located at the upper surface of LED blue light chip, and the yellow fluorescence glue-line passes through dispensing work Skill is made, and the substratum transparent, yellow fluorescence glue-line are contacted with the inner wall of metal heat-conducting structure.

Preferably, middle-end is vertically fixedly installed divider wall inside the cup of the light source bracket, and the divider wall is nitridation Aluminium ceramic material, the divider wall are located at the middle part bottom end of LED blue light chip and metal heat-conducting structure are divided into two.

Preferably, the bottom material of the light source bracket is metal material.

Preferably, one layer of reflective silver slurry layer is electroplate on the inner wall of the metal heat-conducting structure.

Preferably, the outer wall of the light source bracket is using made of nitridation aluminium material.

Compared with prior art, the utility model has the beneficial effects that

1, the utility model is by coating layer of transparent glue-line in LED blue light wafer surface, and again on substratum transparent One layer of yellow fluorescence glue-line of point, can effectively assemble in this way and reflect LED blue light chip, so that yellow fluorescence glue-line be excited to produce Raw white light, and then improve light efficiency；

2, the utility model is by being arranged metal heat-conducting structure in light source bracket inner wall, not only can promote light efficiency and And the heat of yellow fluorescence glue-line can be exported to the bottom of light source bracket at a terrific speed；

3, the utility model, in this way can be very big by the way that silver coating is arranged in the metal heat-conducting structure inside light source bracket Reflection and aggregation LED blue light chip internal quantum efficiency, sufficiently excite top layer yellow fluorescence glue-line generate white light, and simultaneously because The radiating block for exporting to light source bracket bottom that the heat of light source of LED blue light chip is exceedingly fast, so that light source bracket is whole Body heat resistance substantially reduces, so that the incident photon-to-electron conversion efficiency of LED blue light chip is more preferable and makes the whole light efficiency of light source big Amplitude is promoted.

Detailed description of the invention

Fig. 1 is a kind of highly reliable large power LED light source encapsulating structure schematic cross-sectional view of the utility model；

Fig. 2 is a kind of highly reliable large power LED light source encapsulating structure entirety overlooking structure figure of the utility model.

In figure: 1- metal heat-conducting structure；2-LED blue light chip；3- yellow fluorescence glue-line；4- substratum transparent；5- light source branch Frame；6- radiating block；7- divider wall.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

The utility model provides a kind of technical solution referring to FIG. 1-2: a kind of highly reliable large power LED light source encapsulation The shape of structure, including light source bracket 5, the light source bracket 5 is bowl shape, and the cup inner bottom of the light source bracket 5 is set It is equipped with LED blue light chip 2, the LED blue light chip 2 is bundled in the cup inner bottom of light source bracket 5 by die bond mode, described Metal heat-conducting structure 1 is fixedly installed on the cup inner wall of light source bracket 5,1 material of metal heat-conducting structure is red metal material, institute The bottom end for stating metal heat-conducting structure 1 is connected to the bottom of light source bracket 5, has been sequentially filled inside the cup of the light source bracket 5 Bright layer of silica gel 4, yellow fluorescence glue-line 3, the transparent silicon glue-line 4 are located at the upper surface of LED blue light chip 2, the yellow fluorescence Glue-line 3 is made up of gluing process, and the substratum transparent 4, yellow fluorescence glue-line 3 are contacted with the inner wall of metal heat-conducting structure 1.

Middle-end is vertically fixedly installed divider wall 6 inside the cup of the light source bracket 5, and the divider wall 6 is aluminium nitride pottery Porcelain material, the divider wall 6 are located at the middle part bottom end of LED blue light chip 2 and metal heat-conducting structure 1 are divided into two, in this way every Hot wall can be used for separating positive and negative electrode circuit；The bottom material of the light source bracket 5 is metal material, can make heat in this way Inside light source bracket 5, environment is exported to from 5 bottom metal functional areas of light source bracket；The metal heat-conducting structure 1 It is electroplate with one layer of reflective silver slurry layer on inner wall, is convenient for reflected light in this way；The outer wall of the light source bracket 5 is using nitridation aluminium material system At.

Working principle: light source bracket 5 is arranged to special bowl structure by setting by the utility model, by with die bond LED blue light chip 2 is bundled on light source bracket 5 by mode, and it is red metal that the cup inner wall in light source bracket 5, which is provided with material, Metal heat-conducting structure 1 can be used for exporting in this way LED blue light chip 2 and excite the heat generated after yellow fluorescence glue-line 3, passes through It is electroplate with one layer of reflective silver slurry layer on the inner wall of metal heat-conducting structure 1, can be used to reflect the light of LED blue light chip 2 in this way Source by the way that the bottom end of metal heat-conducting structure 1 to be connected to the bottom of light source bracket 5, and sets metal material for 5 bottom of light source bracket Matter, so that be welded on application end pcb board, heat finally can be by the inside of light source bracket 5, then from light source bracket 5 7 functional areas of radiating block of bottom metal export to environment, secondly, on encapsulating structure, first on 2 surface of LED blue light chip Layer of transparent glue-line 4 is coated, since substratum transparent 4 is equivalent to the reflected refraction effect of lens, can be gathered to the greatest extent in this way The photon of collection and reflection LED blue light chip 2, and yellow fluorescence glue-line 3 is coated by gluing process in 4 upper surface of substratum transparent, Yellow fluorescence glue-line 3 is excited to issue white light convenient for LED blue light chip 2 in this way, so that finally generating large power white light LED light source Effect, and then reach packaging effect.

It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.

While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims (5)

1. a kind of highly reliable large power LED light source encapsulating structure, including light source bracket (5), it is characterised in that: the light source branch The shape of frame (5) is bowl shape, and the cup inner bottom of the light source bracket (5) is provided with LED blue light chip (2), the LED Blue light chip (2) is bundled in the cup inner bottom of light source bracket (5), the cup inner wall of the light source bracket (5) by die bond mode On be fixedly installed metal heat-conducting structure (1), metal heat-conducting structure (1) material be red metal material, the metal heat-conducting knot The bottom end of structure (1) is connected to the bottom of light source bracket (5), has been sequentially filled substratum transparent inside the cup of the light source bracket (5) (4), yellow fluorescence glue-line (3), the substratum transparent (4) are located at the upper surface of LED blue light chip (2), the yellow fluorescent glue Layer (3) is made up of gluing process, and the substratum transparent (4), yellow fluorescence glue-line (3) are interior with metal heat-conducting structure (1) Wall contact.

2. a kind of highly reliable large power LED light source encapsulating structure according to claim 1, it is characterised in that: the light Middle-end is vertically fixedly installed divider wall (7) inside the cup of source bracket (5), and the divider wall (7) is aluminium nitride ceramics material, institute Divider wall (7) is stated to be located at the middle part bottom end of LED blue light chip (2) and metal heat-conducting structure (1) is divided into two.

3. a kind of highly reliable large power LED light source encapsulating structure according to claim 1, it is characterised in that: the light The bottom material of source bracket (5) is the radiating block (6) of metal material.

4. a kind of highly reliable large power LED light source encapsulating structure according to claim 1, it is characterised in that: the gold Belong to and is electroplate with one layer of reflective silver slurry layer on the inner wall of conductive structure (1).

5. a kind of highly reliable large power LED light source encapsulating structure according to claim 1, it is characterised in that: the light The outer wall of source bracket (5) is using made of nitridation aluminium material.