CN2879427Y - Visible light power luminous tube for metal ceramic casing package - Google Patents
Visible light power luminous tube for metal ceramic casing package Download PDFInfo
- Publication number
- CN2879427Y CN2879427Y CNU200620023320XU CN200620023320U CN2879427Y CN 2879427 Y CN2879427 Y CN 2879427Y CN U200620023320X U CNU200620023320X U CN U200620023320XU CN 200620023320 U CN200620023320 U CN 200620023320U CN 2879427 Y CN2879427 Y CN 2879427Y
- Authority
- CN
- China
- Prior art keywords
- luminous tube
- chip
- copper
- electrode
- ceramic ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU200620023320XU CN2879427Y (en) | 2006-01-10 | 2006-01-10 | Visible light power luminous tube for metal ceramic casing package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU200620023320XU CN2879427Y (en) | 2006-01-10 | 2006-01-10 | Visible light power luminous tube for metal ceramic casing package |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2879427Y true CN2879427Y (en) | 2007-03-14 |
Family
ID=37861846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU200620023320XU Expired - Lifetime CN2879427Y (en) | 2006-01-10 | 2006-01-10 | Visible light power luminous tube for metal ceramic casing package |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2879427Y (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101997066A (en) * | 2009-08-26 | 2011-03-30 | 李东明 | High-power light-emitting diode (LED) package structure |
US9601676B2 (en) | 2013-06-27 | 2017-03-21 | Byd Company Limited | LED support assembly and LED module |
CN108878055A (en) * | 2018-05-14 | 2018-11-23 | 中国电子科技集团公司第五十五研究所 | The preparation method of high conductivity metal layer applied to high-temperature co-fired ceramics |
-
2006
- 2006-01-10 CN CNU200620023320XU patent/CN2879427Y/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101997066A (en) * | 2009-08-26 | 2011-03-30 | 李东明 | High-power light-emitting diode (LED) package structure |
US9601676B2 (en) | 2013-06-27 | 2017-03-21 | Byd Company Limited | LED support assembly and LED module |
CN108878055A (en) * | 2018-05-14 | 2018-11-23 | 中国电子科技集团公司第五十五研究所 | The preparation method of high conductivity metal layer applied to high-temperature co-fired ceramics |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Hebei Lede Electronics Co., Ltd. Assignor: Inst No.13, Chinese Electronic Science and Technology Group Co Contract fulfillment period: 2007.8.20 to 2012.8.20 Contract record no.: 2008130000001 Denomination of utility model: Visible light power luminous tube for metal ceramic casing package Granted publication date: 20070314 License type: Exclusive license Record date: 20081008 |
|
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Hebei Lede Electronics Co., Ltd. Assignor: Inst No.13, Chinese Electronic Science and Technology Group Co Contract fulfillment period: 2007.8.20 to 2012.8.20 Contract record no.: 2008130000001 Denomination of utility model: Visible light power luminous tube for metal ceramic casing package Granted publication date: 20070314 License type: Exclusive license Record date: 20081008 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2007.8.20 TO 2012.8.20; CHANGE OF CONTRACT Name of requester: HEBEI LIDE ELECTRONICS CO., LTD. Effective date: 20081008 |
|
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Tonghui Electronics Corporation Co., Ltd. Assignor: Inst No.13, Chinese Electronic Science and Technology Group Co Contract record no.: 2010130000063 Denomination of utility model: Visible light power luminous tube for metal ceramic casing package Granted publication date: 20070314 License type: Exclusive License Record date: 20100825 |
|
CX01 | Expiry of patent term |
Granted publication date: 20070314 |
|
EXPY | Termination of patent right or utility model |