CN101997066A

CN101997066A - High-power light-emitting diode (LED) package structure

Info

Publication number: CN101997066A
Application number: CN2009101896491A
Authority: CN
Inventors: 庄杰富
Original assignee: 李东明
Priority date: 2009-08-26
Filing date: 2009-08-26
Publication date: 2011-03-30

Abstract

The invention discloses a high-power light-emitting diode (LED) package and heat sink structure, comprising an LED chip, a crystal sealing face and an LED thermal sedimentation main support. The LED package structure is characterized in that the lower end of the high-power LED thermal sedimentation main support is provided with a prolongation part, the prolongation part and the original thermal sedimentation main support can be an integrally molded cylindrical object; and taping and thread chaing are carried out on the prolongation part to form a fastening thread. A high-power LED package is installed on a thermal radiator by a threaded connection mode, thereby greatly simplifying the installation technology of the high-power LED package, improving light flux, effectively reducing light decline level, increasing stable lightening property, largely reducing defective goods rate at later stage and prolonging the service life of light source equipment.

Description

High-power LED encapsulation structure

[technical field]

The present invention relates to lighting apparatus light source LED encapsulation field, relate in particular to the structure that a kind of normal temperature is installed high-power LED encapsulation.

[background technology]

As everyone knows, so-called LED is meant light-emitting diode, LED develops new type light source rapidly as a kind of present extensive use, compared energy-conservation with conventional light source, efficiently, volume is little, life-span is long, response speed is fast, driving voltage is low, advantages such as shock resistance brilliance, thereby can develop the expansion industry size rapidly, market share, the industry tendency leads under, its technology is also being brought in constant renewal in and in-depth, but the maximum technology barriers that restricting the led light source development at present are exactly the heat conduction and the heat sink problem of falling of LED encapsulation, bad encapsulation technology and fixed installation scheme can be damaged the stable ability of lighting of led chip encapsulation, shorten the useful life of LED.LED is as light source, usually all need long continuous firing, even if for this cold light source of LED, work also can produce a large amount of thermal accumlations for a long time, this just requires the radiating element operating efficiency of led light source good, can remove to dredge heat energy by short pathway, reduce the infringement that high temperature brings to chip as far as possible, present way is that led chip is encapsulated into heat sink falling on the main support, then the heat sink main support that falls is installed and fixed on the large-scale radiating element, such as heat-radiating substrate, perhaps aluminum base plate, heat sinkly fall fixedly connected between main support and the radiating element and normally realize by dual mode, the first is via the heat-conducting cream transfer of heat, and it two is to use the mode of tin cream by the reflow soldering transfer of heat.This dual mode all respectively has its inferior position: first kind of mode need be used the high heat-conducting glue of conductive coefficient, such cost and specification requirement will correspondingly improve, heat-conducting glue is after the use of a period of time in addition, and its heat conductivility reduces, and loses most heat-conducting effect; And the second way needs the heat sink material that falls main support and radiating element to have weldability.And most importantly the technology of this dual mode all is connected at led chip and will contacts high temperature between the radiator, very easily hurts the chip of LED, causes luminous flux to descend, and the LED encapsulating structure damages, and electrical parameter changes, and produces light decay.

[summary of the invention]

The present invention provides a kind of simple and reliable for addressing the above problem, and can increase the heat sink heat conduction contact-making surface of LED, simplifies the high-power LED encapsulation mounting process, saves cost, improves conductive coefficient, realizes heat sink falling, and strengthens the heat dispersion structure of whole LED encapsulation.

The technical scheme that the present invention addresses the above problem is: described high-power LED encapsulation structure, comprise led chip, envelope crystal face, LED is heat sink to fall main support, in the heat sink upper end that falls main support of described LED is the envelope crystal face, on described envelope crystal face, then be led chip, its characteristics are, in the heat sink lower end that falls main support of described great power LED, done an elongated segment part, this prolongation can be integrated column with the heat sink main support that falls originally, in described prolongation tapping, mantle fiber forms binding thread.

Described LED is heat sink to fall main body rack and can be many geometric forms, garden cylindricality or ellipse garden cylindricality or cuboid or trigone or quadrangle body, and its external shape can design according to demand, to satisfy different production needs.

Be used for fixing on the heat sink radiating element that falls main support also correspondingly mantle fiber, formation can be in the screw thread of the binding thread interlock of described prolongation.

By being welded, electrode does shockproof, anti-skidding processing.

By 90 ° of angle processing of double thread body, symmetry is left the twice gap, forms dilatation joint.

The invention has the beneficial effects as follows: only finished the fixing of high-power LED encapsulation with theory of mechanics, the mode that employing is threaded is installed on high-power LED encapsulation on the radiating element, greatly simplified the mounting process of high-power LED encapsulation, and guaranteed that led chip was not subjected to the high temperature injury of technical process before dispelling the heat by radiating element, just can finish installation at normal temperatures, not only improved luminous flux, effectively reduced the light decay degree, increased the stable property lighted, reduce the defect ware rate that the later stage can occur largely, prolonged the useful life of light source.And the mode of this screw threads for fastening, can also increase LED heat conduction contact-making surface, in the process that its work is used, the perfect heat dissipation problem of realizing more is applicable to monocrystalline, polycrystalline high-power LED encapsulation or be applicable to the ACLED encapsulation and use heat conductive rod heat conduction.

[description of drawings]

Fig. 1 is one embodiment of the invention structural representation;

Fig. 2 is one embodiment of the invention mounting structure schematic diagram;

Fig. 3 is a cutaway view of the present invention.

Among the figure: 1, led chip; 2, envelope crystal face; 3, radiating element; 4, the heat sink main support that falls; 5, prolongation; 6 fastening internal threads; 7, fastening external screw thread; 8, dilatation joint.

[embodiment]

In order to make purpose of the present invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with drawings and Examples.

Described high-power LED encapsulation structure, comprise led chip 1, Feng Jingdian 2, LED is heat sink to fall main support 4, is the envelope crystal face in the heat sink upper end that falls main support of described LED, then is led chip on described envelope crystal face, its characteristics are, in the heat sink lower end that falls main support 4 of described great power LED, done an elongated segment part 5, this prolongation 5 can be integrated column with the heat sink main support 4 that falls originally, in described prolongation tapping, form fastening internal thread 6.

Be used for fixing on the heat sink radiating element 3 that falls main support 4 also correspondingly mantle fiber, formation can be in the external screw thread of the fastening internal thread interlock of described prolongation 5.Directly great power LED is fixedly installed on the radiating element 3 by being threaded.Described radiating element 7 is heat-radiating substrate or aluminum base plate.

By being welded, electrode does shockproof, anti-skidding processing.By 90 ° of angle processing of double thread body, symmetry is left the twice gap, forms dilatation joint 8, also can offer gap as required, forms the multiple tracks dilatation joint, selects employing that the design of twice dilatation joint is set in the present embodiment.

Advantage of the present invention just is to have finished the fixing of high-power LED encapsulation with theory of mechanics, the mode that employing is threaded is installed on high-power LED encapsulation on the radiating element, greatly simplified the mounting process of high-power LED encapsulation, and guaranteed that led chip was not damaged by the temperature of technical process before dispelling the heat by radiating element, just can finish installation at normal temperatures, not only improved luminous flux, effectively reduced the light decay degree, increased the stable property lighted, reduce largely the defect ware rate that the later stage can occur, prolonged the service life of light source. And the mode of this screw threads for fastening, can also increase LED heat conduction contact-making surface, in the process that its work is used, the perfect heat dissipation problem of realizing.

This structural manufacturing process is simple, can significantly save production cost, and can produce obvious beneficial effect.

Claims

1. high-power LED encapsulation heat sink structure, comprise led chip, envelope crystal face, LED is heat sink to fall main support, its characteristics are, in the heat sink lower end that falls main support of described great power LED, done an elongated segment part, this prolongation can be integrated column with the heat sink main support that falls originally, in described prolongation tapping, mantle fiber forms binding thread.

2. according to the described high-power LED encapsulation heat sink structure of claim 1, it is characterized in that, do shockproof, anti-skidding processing by electrode is welded.

3. according to the described high-power LED encapsulation structure of claim 1, it is characterized in that, be processed into, leave the twice gap, form dilatation joint by 90 ° of angles of double thread body.

4. according to the described high-power LED encapsulation structure of claim 1, it is characterized in that described LED is heat sink to fall main body rack and can be many geometric forms, garden cylindricality or ellipse garden cylindricality or cuboid or trigone or quadrangle body.