CN101252157A - Packaging structure of a light emitting diode (LED) light source - Google Patents
Packaging structure of a light emitting diode (LED) light source Download PDFInfo
- Publication number
- CN101252157A CN101252157A CNA2007100099337A CN200710009933A CN101252157A CN 101252157 A CN101252157 A CN 101252157A CN A2007100099337 A CNA2007100099337 A CN A2007100099337A CN 200710009933 A CN200710009933 A CN 200710009933A CN 101252157 A CN101252157 A CN 101252157A
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- China
- Prior art keywords
- led chip
- led
- base body
- boss
- printed circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
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- Led Device Packages (AREA)
Abstract
一种发光二极管(LED)光源的封装结构，包括用于封装LED芯片及电路的基座，其特征在于：基座包括一高导热金属材料制成的基座本体，基座本体的安装面中部设有沿长度布置的凸台，LED芯片固装于该凸台顶面上；凸台两侧的基座本体安装面上对应装设有印刷电路板；LED芯片的两接线端分别搭线与对应的印刷电路板导接形成回路；LED芯片及电路封装于一体的透明封装体内。LED芯片直接固装在基座本体安装面的凸台上，LED芯片产生的热能直接通过高导热的基座本体发散，热能被迅速疏导并排除，散热效果好，LED芯片结温就低，很好地保障LED芯片的发光性能，延长LED芯片和灯具的使用寿命，大大降低能耗；且结构设计合理，制作简单。
A packaging structure for a light-emitting diode (LED) light source, including a base for packaging LED chips and circuits, characterized in that: the base includes a base body made of a high thermal conductivity metal material, and the middle part of the mounting surface of the base body is There is a boss arranged along the length, and the LED chip is fixed on the top surface of the boss; the mounting surface of the base body on both sides of the boss is correspondingly equipped with a printed circuit board; the two terminals of the LED chip are connected to the Corresponding printed circuit boards are connected to form a loop; LED chips and circuits are packaged in an integrated transparent package. The LED chip is directly fixed on the boss on the mounting surface of the base body, the heat energy generated by the LED chip is directly dissipated through the high thermal conductivity base body, the heat energy is quickly channeled and eliminated, the heat dissipation effect is good, and the junction temperature of the LED chip is low The luminous performance of the LED chip is well guaranteed, the service life of the LED chip and the lamp is prolonged, and the energy consumption is greatly reduced; the structure design is reasonable, and the manufacture is simple.
Description
Technical field
The present invention relates to light-emitting diode (LED) light source encapsulation technology, particularly a kind of encapsulating structure with light-emitting diode (LED) light source of high-cooling property.
Background technology
With reference to Fig. 1.The encapsulating structure of common light-emitting diode (LED) light source is in regular turn led chip 2 to be fixedly mounted on the circuit board (PCB or aluminium wiring board) 3, again circuit board 3 is utilized insulating cement to be fixed on the base body 1 of high-cooling property, the counter electrode district 301,302 that the P of led chip 2, N electrode terminal 21,22 are made contact respectively with circuit board 3 electrically connects, external circuit imposes direct current by P, the N level of 301,302 pairs of led chips 2 of circuit board 3 electrode districts, impels led chip 2 to produce brightness.The heat that led chip 2 produces is got rid of by base body 1 after circuit board 3 transmits.But, because printed circuit board (PCB) 3 is non-high heat conductive body, its thermal conductivity coefficient is low, heat dispersion is poor, particularly a large amount of heat energy of the power type LED light source generation of most led chip 2 concentrating types encapsulation compositions can't in time be dredged and be got rid of, directly cause led chip 2 junction temperatures to raise, light source hot polymerization effect and thermal resistance are excessive, make led chip short and light decay phenomenon in 2 useful lifes easily, and therefore improve energy consumption.
Summary of the invention
The objective of the invention is to overcome existing light-emitting diode (LED) light source because of dispel the heat bad cause shorten useful life, light decay and the high deficiency of power consumption, a kind of encapsulating structure of light-emitting diode (LED) light source of high-cooling property is provided.
Purpose of the present invention is achieved through the following technical solutions:
The encapsulating structure of a kind of light-emitting diode (LED) light source, comprise the pedestal that is used for packaging LED chips and circuit, it is characterized in that: described pedestal comprises the base body that a high-thermal conductive metal material is made, the installed surface middle part of this base body is provided with the boss of arranging along length, and led chip is installed on this boss end face; Correspondence is equiped with printed circuit board (PCB) on the base body installed surface of boss both sides; Two terminals of led chip are made contact respectively to connect with corresponding printed circuit board (PCB) and are formed the loop; Led chip and circuit package are in the transparent encapsulating body of one.
Two terminals of described led chip are positioned at the front of chip, and led chip is inverted and fixedly is welded on the boss, and two terminals on its front are made contact respectively and are electrically conducted with corresponding printed circuit board (PCB).
Two terminals of described led chip are positioned at the above and below of chip, and led chip fixedly is mounted on the described boss end face by high heat conductive insulating glue; Its upper and lower terminals are made contact respectively and are electrically conducted with corresponding printed circuit board (PCB).
End face middle part between the base body two ends is provided with groove, and groove runs through the length direction of base body, and groove floor forms described led chip installed surface; The integrated described transparent encapsulating body of perfusion in the described groove.
Described pedestal integral body is strip, discoid or square frame shape.
The encapsulating structure of above-mentioned light-emitting diode (LED) light source; at first at the middle part of base body moulding boss; and on the base body installed surface of boss both sides, mount printed circuit board (PCB); a plurality of led chips are adopted directly welding or gluingly are fixedly mounted on the boss in an orderly manner; adopt ways customary that two terminals of led chip are made contact respectively to be electrically conducted with corresponding printed circuit board (PCB) again and form the loop; utilize integrated transparent encapsulating body (transparent materials such as epoxy resin or silica gel) to encapsulate all led chips at last again, with protection chip and circuit structure thereof.
The encapsulating structure of above-mentioned light-emitting diode (LED) light source has following beneficial effect:
Led chip directly is packed on the boss at the base body middle part that the high-thermal conductive metal material makes, the heat energy that led chip is produced is directly dispersed by the base body of high heat conduction, a large amount of heat energy that light fixture is produced are dredged by base body rapidly and are got rid of, the heat susceptor conductive performance is good, heat dissipation channel is unimpeded, thermal resistance is little, and the led chip junction temperature is just low, ensures the luminescent properties of led chip well, prolong the useful life of led chip and light fixture, cut down the consumption of energy greatly.Structural design of the present invention is ingenious rationally, makes simply, has very good practical value, is specially adapted to power shape LED lighting, improves the competitiveness of product in market greatly.
Description of drawings
Below in conjunction with accompanying drawing the present invention is described in further detail.
Fig. 1 is the encapsulating structure cutaway view of existing light-emitting diode (LED) light source.
Fig. 2 is the structural representation of first embodiment of the invention.
Fig. 3 is the cutaway view Amplified image along A-A direction among Fig. 2.
Fig. 4 is the structure cutaway view of invention second embodiment.
Embodiment
Embodiment 1: with reference to Fig. 2, Fig. 3.The encapsulating structure of light-emitting diode (LED) light source comprises the pedestal that is used for a plurality of led chips 2 of device, and pedestal comprises the base body 1 that adopts high-thermal conductive metal material such as aluminium, alloy etc. to make; On the installed surface of the base body 1 that a plurality of led chips 2 are installed in order along base body 1 length direction.Two terminals 21,22 of led chip all are positioned at the front of chip.
With reference to Fig. 2, Fig. 3.The end face middle part of base body 1 is provided with down trapezoidal groove 11, and groove 11 runs through the length direction of base body 1, and groove floor 111 forms the installed surface that led chip 2 is installed.The central part of groove floor 111 is provided with along its length the boss of arranging 12, the correspondence printed circuit board (PCB) 31,32 that has been sticked on the groove floor 111 of boss 12 both sides, and printed circuit board (PCB) 31,32 and external power source are connected to led chip provides electric current.But, being not limited to this, printed circuit board (PCB) also can only be sticked on the groove floor of a protruding side.The printed circuit board (PCB) 31,32 after the fixed installation and the end face of boss 12 are positioned on the same water surface.All led chips 2 fixedly are welded on the boss 12 with upside down, and led chip 2 is fixed on the base body 1.Two terminals 21,22 on inverted led chip 2 fronts are electrically conducted with corresponding printed circuit board (PCB) 31,32 by the habitual mode of making contact respectively, two printed circuit board (PCB)s 31,32 form required series, parallel loop according to required laying circuit form to realize a plurality of concentrating type encapsulated LED chips 2.The integrated transparent encapsulating body 4 of perfusion in the groove, packaging body 4 adopts epoxy resin, silica gel or other transparent materials to make; Packaging body 4 is covered on led chip 2 and the printed circuit board (PCB) 31,32, with protection led chip 2 and circuit.
As Fig. 2, shown in Figure 3, base body 1 integral body is strip.But the shape of pedestal is not limited to shown in the figure, can be designed to other moulding such as discoid, oval plate-like or square frame shape according to concrete needs.
Embodiment 2: with reference to Fig. 4.Present embodiment with implement 1 and different be:
Two terminals 21,22 of led chip 2 are positioned at the above and below of chip, it is upper and lower electrode led chip, led chip 2 terminals 22 are for being fixed in the metallic plate on led chip 2 bottom surfaces, the lower surface of terminals 22 fixedly is mounted on described boss 12 end faces by high heat conductive insulating glue 5, guarantees that reaching thermoelectricity between electrode and the base body separates.Two terminals 21,22 are to be electrically conducted with corresponding printed circuit board (PCB) 31,32 by the habitual mode of making contact equally.High heat conductive insulating glue 5 can select to adopt ALN, SIC, the contour heat-conducting insulation material of AL203, and the heat energy that led chip is produced directly is passed to base body by high heat conductive insulating glue and disperses, and a large amount of heat energy that light fixture is produced are dredged rapidly and got rid of.All the other structures are identical with embodiment 1, do not repeat them here.
The above only is preferred embodiment of the present invention, so can not limit scope of the invention process with this, i.e. the equivalence of doing according to the present patent application claim and description changes and modifies, and all should still belong in the scope that patent of the present invention contains.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100099337A CN101252157A (en) | 2007-11-30 | 2007-11-30 | Packaging structure of a light emitting diode (LED) light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100099337A CN101252157A (en) | 2007-11-30 | 2007-11-30 | Packaging structure of a light emitting diode (LED) light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101252157A true CN101252157A (en) | 2008-08-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100099337A Pending CN101252157A (en) | 2007-11-30 | 2007-11-30 | Packaging structure of a light emitting diode (LED) light source |
Country Status (1)
| Country | Link |
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| CN (1) | CN101252157A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102364684A (en) * | 2011-06-17 | 2012-02-29 | 杭州华普永明光电股份有限公司 | LED (Light-Emitting Diode) module and manufacturing process thereof |
| CN102368530A (en) * | 2011-10-09 | 2012-03-07 | 常熟市华海电子有限公司 | LED (light-emitting diode) chip packaging structure |
| CN101713521B (en) * | 2008-10-07 | 2012-05-30 | 海立尔股份有限公司 | AC light emitting diode structure |
| CN102569627A (en) * | 2012-02-21 | 2012-07-11 | 东莞市万丰纳米材料有限公司 | Copper substrate for LED light source, LED light source module and preparation method thereof, LED street lamp |
| CN103120041A (en) * | 2010-07-20 | 2013-05-22 | Lg伊诺特有限公司 | Heat radiation circuit board and manufacturing method thereof |
| CN104091876B (en) * | 2014-07-29 | 2016-11-23 | 中国科学院苏州纳米技术与纳米仿生研究所 | Transparency carrier LED encapsulation structure |
| CN107305871A (en) * | 2016-04-19 | 2017-10-31 | 富士通天株式会社 | Printed wiring board |
| CN114783987A (en) * | 2022-04-01 | 2022-07-22 | Tcl华星光电技术有限公司 | Miniature light-emitting diode packaging device and display panel |
| CN119895290A (en) * | 2022-11-18 | 2025-04-25 | 深圳引望智能技术有限公司 | Integrated device, detection device, terminal and manufacturing method |
-
2007
- 2007-11-30 CN CNA2007100099337A patent/CN101252157A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101713521B (en) * | 2008-10-07 | 2012-05-30 | 海立尔股份有限公司 | AC light emitting diode structure |
| CN103120041A (en) * | 2010-07-20 | 2013-05-22 | Lg伊诺特有限公司 | Heat radiation circuit board and manufacturing method thereof |
| CN103120041B (en) * | 2010-07-20 | 2016-06-29 | Lg伊诺特有限公司 | Radiant heat circuit board and manufacture method thereof |
| US9844142B2 (en) | 2010-07-20 | 2017-12-12 | Lg Innotek Co., Ltd. | Radiant heat circuit board and method for manufacturing the same |
| CN102364684A (en) * | 2011-06-17 | 2012-02-29 | 杭州华普永明光电股份有限公司 | LED (Light-Emitting Diode) module and manufacturing process thereof |
| CN102368530A (en) * | 2011-10-09 | 2012-03-07 | 常熟市华海电子有限公司 | LED (light-emitting diode) chip packaging structure |
| CN102569627A (en) * | 2012-02-21 | 2012-07-11 | 东莞市万丰纳米材料有限公司 | Copper substrate for LED light source, LED light source module and preparation method thereof, LED street lamp |
| CN104091876B (en) * | 2014-07-29 | 2016-11-23 | 中国科学院苏州纳米技术与纳米仿生研究所 | Transparency carrier LED encapsulation structure |
| CN107305871A (en) * | 2016-04-19 | 2017-10-31 | 富士通天株式会社 | Printed wiring board |
| CN107305871B (en) * | 2016-04-19 | 2019-12-03 | 富士通天株式会社 | printed wiring board |
| CN114783987A (en) * | 2022-04-01 | 2022-07-22 | Tcl华星光电技术有限公司 | Miniature light-emitting diode packaging device and display panel |
| CN119895290A (en) * | 2022-11-18 | 2025-04-25 | 深圳引望智能技术有限公司 | Integrated device, detection device, terminal and manufacturing method |
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Open date: 20080827 |