CN204834690U - Emitting diode integrated optical source - Google Patents
Emitting diode integrated optical source Download PDFInfo
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- CN204834690U CN204834690U CN201520607364.6U CN201520607364U CN204834690U CN 204834690 U CN204834690 U CN 204834690U CN 201520607364 U CN201520607364 U CN 201520607364U CN 204834690 U CN204834690 U CN 204834690U
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- emitting diode
- light
- fluorescent glue
- substrate
- integrated optical
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Abstract
The utility model relates to an emitting diode (LED) light source especially relates to the emitting diode integrated optical source that heat dispersion improves. The utility model discloses an emitting diode integrated optical source, include: base plate, at least one emitting diode chip and fluorescent glue, the emitting diode chip is fixed at the base plate, and the fluorescent glue covers on the emitting diode chip. Wherein, the emitting diode chip bonds on the base plate through the nanometer elargol, and the fluorescent glue adopts the heat conduction fluorescent glue to come to cover the emitting diode chip. The utility model is used for as source of illumination, compare in prior art, improved heat dispersion greatly.
Description
Technical field
The utility model relates to light-emitting diode (LED) light source, particularly relates to the light-emitting diode integrated optical source that heat dispersion improves.
Background technology
The LED light source of COB encapsulation is the integrated area source technology of a kind of specular removal be directly attached to by LED chip on the mirror metal substrate of high reflecting rate.Common COB light source is used in large-power occasions, and therefore the caloric value of LED chip is larger.In the COB light source of prior art, the encapsulating structure of the COB type LED light source disclosed in CN103178197A, the heat radiation of LED chip closely relies on metal substrate and carries out heat conduction.In practical application, along with the increasing gradually of COB light source power, the COB light source of prior art cannot meet the thermal diffusivity requirement of great power LED.Therefore, the light-emitting diode integrated optical source needing a kind of heat dispersion to improve.
Utility model content
For the problems referred to above, the utility model proposes a kind of light-emitting diode integrated optical source, can greatly improve its heat dispersion.
The utility model adopts following technical scheme to realize:
A kind of light-emitting diode integrated optical source, comprising: substrate, at least one light-emitting diode chip for backlight unit and fluorescent glue, light-emitting diode chip for backlight unit is fixed on substrate, and fluorescent glue is covered on light-emitting diode chip for backlight unit.Wherein, light-emitting diode chip for backlight unit is bonded on substrate by nano-silver colloid, and fluorescent glue adopts heat conduction fluorescent glue to cover light-emitting diode chip for backlight unit.
Further, the back side of substrate is coated with gold-tin alloy layer.
Further, substrate is aluminium nitride substrate or mirror-surface aluminum base board.
Light-emitting diode integrated optical source of the present utility model, compared to prior art, substantially improves its heat dispersion, and the heat conduction of LED chip is fast, and heat radiation, without bottleneck, improves the stability of light-emitting diode integrated optical source.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model one preferred embodiment.
Embodiment
For further illustrating each embodiment, the utility model provides accompanying drawing.These accompanying drawings are a part for the utility model disclosure, and it is mainly in order to illustrate embodiment, and the associated description of specification can be coordinated to explain the operation principles of embodiment.Coordinate with reference to these contents, those of ordinary skill in the art will be understood that other possible execution modes and advantage of the present utility model.Assembly in figure not drawn on scale, and similar element numbers is commonly used to assembly like representation class.
Now with embodiment, the utility model is further illustrated by reference to the accompanying drawings.
Consult shown in Fig. 1, as the light-emitting diode integrated optical source of the utility model one preferred embodiment, comprise: substrate 10, at least one light-emitting diode (LED, all be called for short with this below) chip 30 and fluorescent glue 20, LED chip 30 is fixed on substrate 10, and fluorescent glue 20 is covered on LED chip 30.Wherein, LED chip 30 is bondd on the substrate 10 by nano-silver colloid 50 admittedly, and fluorescent glue 30 adopts heat conduction fluorescent glue to cover LED chip 30.Wherein, fluorescent glue 30 adopt heat conduction fluorescent glue to be doping fluorescent powder add nano aluminum nitride and formed (preferred in transparent silica gel, nano aluminum nitride accounts for the proportion of heat conduction fluorescent glue at 0.4%-1.5%), utilize the high thermal conductivity of nano aluminum nitride to realize the thermal conductivity of fluorescent glue, its conductive coefficient can reach 25-35W/mK.Certain, fluorescent glue 30 adopt heat conduction fluorescent glue also can be doping fluorescent powder add the heat conduction fluorescent glue that other Heat Conduction Materials are formed in transparent silica gel.Nano-silver colloid 50 is primarily of resin and Nano Silver composition, and the conductive coefficient of nano-silver colloid can reach 25-35W/mK.
In this embodiment, the heat of LED chip 30 can be covered in the fluorescent glue 30 of the heat conduction fluorescent glue of chip from the nano-silver colloid 50 by die bond with parcel and be transmitted to substrate 10 fast.The radiating mode of LED chip 30 has the feature of three-dimensional heat dissipation, and relatively traditional technology, the heat transfer efficiency of this embodiment is accelerated greatly.
This embodiment example is preferred, and the back side of substrate 10 is coated with gold-tin alloy layer 40.Like this, the substrate 10 of this embodiment just can be welded together by Reflow Soldering with the LED lamp radiator be attached thereto (not drawing in figure), and the heat of substrate 10 is transmitted to LED lamp radiator by welding tin cream, realizes quick heat radiating.
This embodiment example is preferred, and substrate 10 is aluminium nitride substrate or mirror-surface aluminum base board.Substrate 10 adopts mirror-surface aluminum base board can obtain better bright dipping light efficiency and have heat dispersion concurrently, and substrate 10 adopts aluminium nitride substrate can obtain better heat dispersion, and its conductive coefficient is at 250-350W/mK.
As fully visible, the light-emitting diode integrated optical source of this embodiment, compared to prior art, substantially improves its heat dispersion, and the heat conduction of LED chip is fast, and heat radiation, without bottleneck, improves the stability of light-emitting diode integrated optical source.
Although specifically show in conjunction with preferred embodiment and describe the utility model; but those skilled in the art should be understood that; not departing from the spirit and scope of the present utility model that appended claims limits; can make a variety of changes the utility model in the form and details, be protection range of the present utility model.
Claims (3)
1. a light-emitting diode integrated optical source, comprise: substrate, at least one light-emitting diode chip for backlight unit and fluorescent glue, light-emitting diode chip for backlight unit is fixed on substrate, fluorescent glue is covered on light-emitting diode chip for backlight unit, it is characterized in that: light-emitting diode chip for backlight unit is bonded on substrate by nano-silver colloid, and fluorescent glue adopts heat conduction fluorescent glue to cover light-emitting diode chip for backlight unit.
2. light-emitting diode integrated optical source according to claim 1, is characterized in that: the back side of substrate is coated with gold-tin alloy layer.
3. light-emitting diode integrated optical source according to claim 1 and 2, is characterized in that: substrate is aluminium nitride substrate or mirror-surface aluminum base board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520607364.6U CN204834690U (en) | 2015-08-13 | 2015-08-13 | Emitting diode integrated optical source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520607364.6U CN204834690U (en) | 2015-08-13 | 2015-08-13 | Emitting diode integrated optical source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204834690U true CN204834690U (en) | 2015-12-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520607364.6U Expired - Fee Related CN204834690U (en) | 2015-08-13 | 2015-08-13 | Emitting diode integrated optical source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204834690U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107740972A (en) * | 2017-11-17 | 2018-02-27 | 赵永继 | A kind of lift Ceiling light |
-
2015
- 2015-08-13 CN CN201520607364.6U patent/CN204834690U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107740972A (en) * | 2017-11-17 | 2018-02-27 | 赵永继 | A kind of lift Ceiling light |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151202 Termination date: 20200813 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |