CN209766468U

CN209766468U - LED packaging structure

Info

Publication number: CN209766468U
Application number: CN201920962830.0U
Authority: CN
Inventors: 富彦龙
Original assignee: Shenzhen Jinghengxing Photoelectric Technology Co Ltd
Current assignee: Shenzhen Jinghengxing Photoelectric Technology Co Ltd
Priority date: 2019-06-25
Filing date: 2019-06-25
Publication date: 2019-12-10
Anticipated expiration: 2029-06-25

Abstract

The utility model discloses a LED packaging structure, including base plate, fluorescence glue film and LED chip, the base plate top is provided with the heat conduction copper post that runs through, the heat conduction copper post top is glued through the heat conduction and is connected the LED chip, base plate top periphery is provided with the reflection cup, be provided with focusing lens between the reflection cup, the focusing lens top is provided with the fluorescence glue film, the coating of base plate bottom has antistatic coating, antistatic coating lower surface is provided with heat conduction silicone grease layer, the base plate both sides are provided with the radiating groove, the radiating groove inboard is provided with the copper conducting strip. The utility model discloses the radiating effect is good, and the light-emitting efficiency is high, and can improve photochromic quality to possess and prevent the static function, be fit for being extensively promoted and used.

Description

LED packaging structure

Technical Field

the utility model relates to a LED encapsulates technical field, in particular to LED packaging structure.

Background

The LED package is a package of a light emitting chip, and the conventional LED package structure has poor heat dissipation and low light emitting efficiency.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a LED package structure, through setting up heat conduction silicone grease layer, can get off the heat conduction of heat conduction copper post, and simultaneously, partial heat can be conducted on aluminium matter fin through copper heat conduction fin, then spread in the air, thereby dispel the heat with higher speed, avoid this package structure internal temperature too high, through setting up focusing lens and fluorescence glue film, the refractivity of light can be improved to the fluorescence glue film, reduce the light scattering, can effectively promote luminous efficiency, and improve photochromic quality, through setting up reflection cup and reflection of light coating, can strengthen the light reflection, improve luminance, can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

The utility model provides a LED packaging structure, includes base plate, fluorescence glue film and LED chip, the base plate top is provided with the heat conduction copper post that runs through, the LED chip is connected through heat conduction glue in heat conduction copper post top, base plate top periphery is provided with the reflection cup, be provided with focusing lens between the reflection cup, the focusing lens top is provided with the fluorescence glue film, the coating of base plate bottom has antistatic coating, antistatic coating lower surface is provided with heat conduction silicone grease layer, the base plate both sides are provided with the radiating groove, the radiating groove inboard is provided with the copper conducting strip.

Further, the fluorescent glue layer is made of a fluorescent glue material.

Further, the inner surface of the reflecting cup is coated with a reflecting coating.

Furthermore, an aluminum radiating fin is arranged on one side of the copper heat conducting fin, and the lower end of the copper heat conducting fin is connected with the heat conducting silicone grease layer.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. Through setting up the heat conduction glue, not only can fix the LED chip bonding at heat conduction copper post top, and the heat conduction glue can conduct the heat conduction copper post with the LED chip operation production, prevents the static coating through the setting, can prevent static conduction to inside the structure, avoids static to produce harm to the LED chip.

2. Through setting up heat conduction silicone grease layer, can get off the heat conduction of heat conduction copper post, simultaneously, partial heat can be conducted on aluminium matter fin through copper heat conduction piece, then in the diffusion to the air to heat dissipation accelerates, avoids this packaging structure internal temperature too high.

3. The focusing lens and the fluorescent adhesive layer are arranged, so that the refractive index of light can be improved, light scattering is reduced, light emitting efficiency can be effectively improved, light color quality is improved, light reflection can be enhanced and the brightness is improved by arranging the reflecting cup and the reflecting coating.

Drawings

Fig. 1 is the utility model relates to a LED packaging structure's overall structure schematic diagram.

Fig. 2 is a top view of a LED chip of the LED package structure of the present invention.

Fig. 3 is a schematic view of a reflective coating of the LED package structure of the present invention.

In the figure: 1. an LED chip; 2. heat conducting glue; 3. a thermally conductive copper pillar; 4. a substrate; 5. an antistatic coating; 6. a thermally conductive silicone layer; 7. a copper heat-conducting sheet; 8. an aluminum heat sink; 9. a heat sink; 10. a reflective cup; 11. a fluorescent glue layer; 12. a focusing lens; 13. a light reflecting coating.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1-3, an LED package structure includes a substrate 4, a fluorescent adhesive layer 11 and an LED chip 1, wherein a heat conducting copper pillar 3 is disposed on the top of the substrate 4, the top of the heat conducting copper pillar 3 is connected to the LED chip 1 through a heat conducting adhesive 2, a reflective cup 10 is disposed on the periphery of the top of the substrate 4, a focusing lens 12 is disposed between the reflective cups 10, the fluorescent adhesive layer 11 is disposed on the top of the focusing lens 12, an anti-static coating 5 is coated on the bottom of the substrate 4, a heat conducting silicone layer 6 is disposed on the lower surface of the anti-static coating 5, heat dissipation grooves 9 are disposed on two sides of the substrate 4, and copper heat conduction fins 7 are disposed on the inner side of the.

Wherein, the fluorescent glue layer 11 is made of fluorescent glue material.

in the embodiment, as shown in fig. 1, the fluorescent adhesive layer 11 can increase the refractive index of light, reduce light scattering, effectively increase the light emitting efficiency, and improve the light color quality.

Wherein, the inner surface of the reflecting cup 10 is coated with a reflecting coating 13.

In this embodiment, as shown in fig. 3, the reflective coating 13 can enhance light reflection and improve brightness.

Wherein, an aluminum radiating fin 8 is arranged on one side of the copper heat conducting fin 7, and the lower end of the copper heat conducting fin 7 is connected with the heat conducting silicone grease layer 6.

In this embodiment, as shown in fig. 1, the copper heat-conducting fins 7 conduct heat to the aluminum heat-radiating fins 8, and then diffuse into the air, thereby accelerating heat dissipation.

It should be noted that, the utility model relates to a LED packaging structure, in operation, the heat conducting glue 2 can not only fix the LED chip 1 (manufactured by Sanan photoelectricity corporation) on the top of the heat conducting copper pillar 3 in a bonding manner, but also the heat conducting glue 2 can conduct the heat generated by the operation of the LED chip 1 to the heat conducting copper pillar 3, the anti-static coating 5 (manufactured by Ausbane corporation in Shenzhen city) can prevent static electricity from conducting to the inside of the structure, thereby avoiding the damage of static electricity to the LED chip 1, the heat conducting silicone layer 6 can conduct the heat of the heat conducting copper pillar 3, meanwhile, part of the heat can be conducted to the aluminum heat sink 8 through the copper heat conducting fin 7, and then diffused to the air, thereby accelerating the heat dissipation, avoiding the over-high temperature in the packaging structure, the focusing lens 12 can gather light, the fluorescent glue layer 11 can improve the refractive index of light, reduce the light scattering, and can effectively improve the light emitting efficiency, and improve the quality of light color, and the reflection cup 10 and the reflection coating 13 (manufactured by Shanghai Rongtu industries, Ltd.) can enhance the light reflection and improve the brightness.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a LED packaging structure, includes base plate (4), fluorescence glue film (11) and LED chip (1), its characterized in that: the LED light source is characterized in that a through heat conduction copper column (3) is arranged at the top of the base plate (4), the top of the heat conduction copper column (3) is connected with an LED chip (1) through a heat conduction adhesive (2), a reflection cup (10) is arranged on the periphery of the top of the base plate (4), a focusing lens (12) is arranged between the reflection cups (10), a fluorescent adhesive layer (11) is arranged at the top of the focusing lens (12), an anti-static coating (5) is coated at the bottom of the base plate (4), a heat conduction silicone grease layer (6) is arranged on the lower surface of the anti-static coating (5), heat dissipation grooves (9) are formed in the two sides of the base plate (4), and copper heat conduction fins (7.

2. The LED package structure of claim 1, wherein: the fluorescent glue layer (11) is made of fluorescent glue materials.

3. The LED package structure of claim 1, wherein: the inner surface of the reflecting cup (10) is coated with a reflecting coating (13).

4. The LED package structure of claim 1, wherein: an aluminum radiating fin (8) is arranged on one side of the copper heat conducting fin (7), and the lower end of the copper heat conducting fin (7) is connected with the heat conducting silicone grease layer (6).