CN202633295U - LED support, LED area light source and LED lamp - Google Patents
LED support, LED area light source and LED lamp Download PDFInfo
- Publication number
- CN202633295U CN202633295U CN2012200587252U CN201220058725U CN202633295U CN 202633295 U CN202633295 U CN 202633295U CN 2012200587252 U CN2012200587252 U CN 2012200587252U CN 201220058725 U CN201220058725 U CN 201220058725U CN 202633295 U CN202633295 U CN 202633295U
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- CN
- China
- Prior art keywords
- led
- wafer
- support
- layer
- area source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model is suitable for the technical field of lighting and provides an LED support, an LED area light source and an LED lamp. The LED support is provided with a reflection layer used for fixing an LED chip. According to the utility model, the LED support is provided with the reflection layer used for fixing the LED chip. After die bonding and wire welding are realized on the LED support, side light and bottom light produced by the LED chip is reflected by the reflection layer to a lighting area, thereby improving the light emitting efficiency of an LED. The LED support can be especially applied to different LED area light sources and LED lamps.
Description
Technical field
The utility model belongs to lighting technical field, relates in particular to a kind of led support, LED area source and LED light fixture.
Background technology
At present, LED (light-emitting diode) light source mainly exists with the form of point-source of light.Along with development of technology, LED develops to high brightness, high power direction.The high power wafer can obtain higher brightness, but the light efficiency of high power wafer is not directly proportional with power, and high power wafer caloric value is higher, is difficult to dispel the heat effectively, and useful life is short, and it is high to form light fixture rear center illumination, and illumination is low all around.If use many point-source of lights to form light fixtures, then exist uniformity of illuminance not enough, ghost image is arranged, drawback such as dazzle is serious, and heat dispersion is bad.Even in order to obtain illumination, heat dispersion is good, long service life, and no ghost image, the light fixture that dazzle is little makes led light source developed to area source by point-source of light.
Existing led support is in the circuit board spaced apart by many low-power LED wafers, and overall package forms high-power LED surface light source together.Adopt that the LED wafer disperses in the circuit board in the area source that this kind method encapsulation forms, and insulating barrier is arranged in the wiring board, the thermal conductivity of insulating barrier is very low, and thermal resistance is high, is unfavorable for that the heat of LED distributes.The LED wafer is fixed on the relatively poor wiring board of reflecting effect, is unfavorable for the collection utilization of LED wafer low light and sidelight, makes that the led light source light extraction efficiency is low.This area source packing forms of directly the LED wafer being installed in the circuit board can be described as COB (chip on board) encapsulation or integrated encapsulation again.
The utility model content
The purpose of the utility model embodiment is to provide a kind of led support, is intended to solve the existing low problem of LED area source light extraction efficiency.
The utility model embodiment is achieved in that a kind of led support, and it has a reflector layer in order to fixed L ED wafer.
Another purpose of the utility model embodiment is to provide a kind of LED area source, and it comprises a plurality of LED wafers that are connected with drive circuit via lead, and said LED wafer is fixed on the above-mentioned led support reflector layer.
Another purpose of the utility model embodiment is to provide a kind of LED light fixture, and said LED light fixture comprises above-mentioned LED area source.
The utility model embodiment makes led support have a reflector layer in order to fixed L ED wafer; Behind the solid crystalline substance of this led support process, the bonding wire; Sidelight that the LED wafer sends and end light reflex to the field of illumination through reflector layer, have promoted the light extraction efficiency of LED, can be applicable to various LED area sources and light fixture especially.
Description of drawings
Fig. 1 is the operation principle sketch map of the led support that provides of the utility model embodiment;
Fig. 2 is the structural representation (circle) of the led support that provides of the utility model embodiment;
Fig. 3 is the structural representation (rectangle) of the led support that provides of the utility model embodiment;
Fig. 4 is the structural representation of the LED area source that provides of the utility model embodiment.
Embodiment
For the purpose, technical scheme and the advantage that make the utility model is clearer,, the utility model is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
The utility model embodiment makes led support have a reflector layer in order to fixed L ED wafer, and behind the solid crystalline substance of this led support process, the bonding wire, sidelight that the LED wafer sends and end light reflex to the field of illumination through reflector layer, have promoted the light extraction efficiency of LED.
Be described in detail below in conjunction with the realization of specific embodiment the utility model.
As shown in Figure 1; The led support that the utility model embodiment provides has a reflector layer 1 in order to fixed L ED wafer 2; Behind the solid crystalline substance of this led support process, the bonding wire; Sidelight that LED wafer 2 sends and end light (light 22 expressions of sending with the PN junction 21 of LED among the figure) reflex to the field of illumination through reflector layer 1, have greatly promoted the light extraction efficiency of led light source.
For strengthening 2 heat radiations of LED wafer, above-mentioned reflector layer 1 is preferably metal reflective layer (like the minute surface aluminium sheet).At this moment, the heat that LED wafer 2 produces is directly distributed by said metal reflective layer, and radiating effect is splendid.For example, said metal reflective series of strata are above reflective aluminium sheet, minute surface aluminium sheet or electroplate, the copper coin of aluminizing of 90% (being preferably 95%～98%) to the reflectivity of visible light.
Like Fig. 2, shown in 3, reflector layer 1 described in the utility model embodiment is provided with the line layer 3 that provides power circuit to connect for LED wafer 2, and said line layer 3 has one in order to forming the through hole 4 of packaging area, and has and have LED like Fig. 2, shown in 3.Wherein, said line layer 3 forms a complete led support via glue and reflector layer 1 bonding pressing.Particularly, said line layer 3 can be common pcb board, aluminum base PCB plate or copper base pcb board, and said glue can be bonding silica gel.
As shown in Figure 4, the LED area source that the utility model embodiment provides comprises a plurality of LED wafers 2 that are connected with drive circuit via lead 5, and said LED wafer 2 is fixed in the reflector layer 1 of above-mentioned led support.For further promoting the light extraction efficiency of this LED area source, said LED wafer 2 is fixed in said reflector layer 1 via transparent adhesive tape, so will make light of the more end reflex to the field of illumination through said reflector layer 1.
Even, soft for the light that this LED area source is sent, a plurality of LED wafers 2 are arranged the formation array in regular turn, the foregoing circuit of series connection back parallel connection access earlier layer.Said LED wafer 2 is by 6 coverings of the formed encapsulating material of multilayer transmission substance, and the refractive index of this multilayer transmission substance is along successively decreasing successively away from the direction of said LED wafer 2 and less than the refractive index of said LED wafer 2.The transmission substance that successively decreases layer by layer of refractive index light shooting angle that LED wafer 2 is sent increases step by step like this, and this encapsulating structure helps to promote the LED area source and goes out uniformity of light; Reduce the probability that total reflection takes place light simultaneously in transmission substance, also helped improving light extraction efficiency.
The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; Any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection range of the utility model.
Claims (10)
1. a led support is characterized in that, said led support has a reflector layer in order to fixed L ED wafer.
2. led support as claimed in claim 1 is characterized in that, said reflector layer is the metal reflective layer.
3. led support as claimed in claim 2 is characterized in that, said metal reflective series of strata are reflective aluminium sheet, minute surface aluminium sheet more than 90% to the reflectivity of visible light.
4. like claim 1,2 or 3 described led supports, it is characterized in that said reflector layer is provided with the line layer that provides power circuit to connect for the LED wafer, said line layer has one in order to form the through hole of packaging area.
5. led support as claimed in claim 4 is characterized in that, said line layer forms via glue and the bonding pressing of reflector layer.
6. a LED area source comprises a plurality of LED wafers that are connected with drive circuit via lead, it is characterized in that, said LED wafer is fixed in like each described led support in the claim 1 ~ 5.
7. LED area source as claimed in claim 6 is characterized in that, said LED wafer is fixed on the said reflector layer via transparent adhesive tape.
8. LED area source as claimed in claim 6 is characterized in that, a plurality of LED wafers form array, and the parallel connection of series connection back is through soldered wires place in circuit layer earlier.
9. LED area source as claimed in claim 6; It is characterized in that; Said LED wafer is covered by the formed encapsulating material of multilayer transmission substance, and the refractive index of this multilayer transmission substance is along successively decreasing successively away from the direction of said LED wafer and less than the refractive index of said LED wafer.
10. a LED light fixture is characterized in that, said LED light fixture comprises like each described LED area source in the claim 6 ~ 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200587252U CN202633295U (en) | 2012-02-22 | 2012-02-22 | LED support, LED area light source and LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200587252U CN202633295U (en) | 2012-02-22 | 2012-02-22 | LED support, LED area light source and LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202633295U true CN202633295U (en) | 2012-12-26 |
Family
ID=47386453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200587252U Expired - Fee Related CN202633295U (en) | 2012-02-22 | 2012-02-22 | LED support, LED area light source and LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202633295U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311419A (en) * | 2013-06-24 | 2013-09-18 | 量一光电科技(惠州)有限公司 | Method of improving lighting effect of COB (chip on board) light source |
| CN104676376A (en) * | 2015-02-11 | 2015-06-03 | 深圳市西德利集团有限公司 | LED (light emitting diode) illuminating device and LED lamp |
-
2012
- 2012-02-22 CN CN2012200587252U patent/CN202633295U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311419A (en) * | 2013-06-24 | 2013-09-18 | 量一光电科技(惠州)有限公司 | Method of improving lighting effect of COB (chip on board) light source |
| CN104676376A (en) * | 2015-02-11 | 2015-06-03 | 深圳市西德利集团有限公司 | LED (light emitting diode) illuminating device and LED lamp |
| CN104676376B (en) * | 2015-02-11 | 2018-04-24 | 深圳市西德利集团有限公司 | A kind of LED lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 Termination date: 20160222 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |