CN103311419A - Method of improving lighting effect of COB (chip on board) light source - Google Patents
Method of improving lighting effect of COB (chip on board) light source Download PDFInfo
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- CN103311419A CN103311419A CN2013102525067A CN201310252506A CN103311419A CN 103311419 A CN103311419 A CN 103311419A CN 2013102525067 A CN2013102525067 A CN 2013102525067A CN 201310252506 A CN201310252506 A CN 201310252506A CN 103311419 A CN103311419 A CN 103311419A
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Abstract
The invention discloses a method of improving lighting effect of a COB (chip on board) light source. A mirror aluminum substrate with high light reflectivity is used as a direct carrier for an LED chip. The processes of insulating injection-molded electrode structure, LED die-bonding, bonding wires and glue-dispensing packaging are applied. Compared with like plane light source packaging forms, the method has the advantages that integration level is increased, reliability is increased, efficiency is greatly increased, the plane light source is effective, and dazzling effect is weakened.
Description
Technical field
The present invention relates to a kind of method of the COB of raising luminous efficiency of source.
Background technology
Led light source is the focus in 21 century light source market, and LED must be the trend of future development as a kind of novel energy-saving and environmental protection green light source product, is called as the new light sources revolution of the 4th generation.Have that the life-span is long, light efficiency is high, stability is high, fail safe good, without advantages such as mercury, radiationless, low-power consumption.But high light efficiency is the shortage of integrated optical source industrial technology cheaply, is the bottleneck that the domestic and international white light LEDs indoor universal illumination of at present restriction develops rapidly, is the general character key issue that needs to be resolved hurrily.COMMB-LED light source technology Chinese implication is interpreted as the integrated area source technology of high light efficiency on the mirror metal substrate that led chip directly is attached to high reflecting rate, this technology has been rejected the support concept, electroless plating, without Reflow Soldering, without the paster operation, therefore operation reduces closely 1/3rd, and cost has also saved 1/3rd.At present, the LED packing forms is varied.But integral body is continued to use the semiconductor packaging process technology and is adapted to, and different application scenarios, different overall dimension, heat sink conception and illumination effect, its packing forms are also different.LED mainly contains Lamp-LED, TOP-LED, Side-LED, SMD-LED, High-Power-LED, Flip Chip-LED, COB LED etc. by the packing forms classification.Generally speaking, COB LED encapsulation technology is the LED general illumination industry mainstream technology scheme that at present domestic and international industrial circle is tending towards admitting, and whole world LED general illumination industrial circle is all in the production decision of making great efforts to seek high performance-price ratio.But, which kind of LED of above packing forms need to be for different application occasions and light fixture type packing forms reasonable in design, because only have the packaged light source product that just can become terminal of cost performance and light source combination property, could obtain good practical application.
Summary of the invention
Technical problem to be solved: the object of the invention provides a kind of method of the COB of raising luminous efficiency of source.The lamp area source is effective, and has reduced glare effect.
Technical scheme: a kind of method that improves the COB luminous efficiency of source is characterized in that: the specular aluminium substrate of described employing high reflecting rate is as the direct supporting body of led chip, by insulation injection moulding electrode structure, LED die bond, bonding wire, some rubber seal dress technique.
Effect of the present invention is: compare with similar planar light source packing forms, integrated degree is higher, reliability is higher, efficient improves greatly, from control with raw material to finished product detection technique, is different from stent-type, SMD-LED formula technique fully, the integrated advantage of collection COB packing forms, its operation greatly reduces, and has reduced labour intensity, has improved production efficiency.The not only product energy-conserving and environment-protective of this project, radiationless without mercury, the also energy-saving and environmental protection of its production process have reduced the highly energy-consuming of electroplating technology in the PCB technique, and there is not the highly energy-consuming of electricity-saving lamp workshop in the high pollution process, the air pollution of a large amount of dust.This process using the raw material substrate of special import high reflecting rate (emissivity is greater than 98%), greatly excited the light extraction efficiency of chip and fluorescent material, with similar area source relatively, its light efficiency has improved 15%.Unique aluminum steel wire soldering technology,, reduced repeatedly point, improved an accuracy and reliability, improved operating efficiency; Increase the work area of workpiece, improved integrated degree.Area source goes out light effect, obtains more perfect embodiment, and is different from stent-type, the lattice luminous effect of SMD, closer to common fluorescent lamp area source effect, and reduced glare effect.LED fluorescent tube and manufacture method thereof, adopt the minute surface aluminium sheet as the parallel line supporting body of LED luminous element, can be from carrying out the light distribution curved surface design by the luminous element requirement easily, so that the party B of will trying to achieve of mat woven of fine bamboo strips secondary light-distribution just realizes, and simplified follow-up manufacture craft, under the prerequisite that guarantees the light source board quality, reduced the cost of raw material, the light extraction efficiency of bright dipping end is effectively improved.Ban reflow soldering process, reduced dead lamp failure, improved the chip life-span; Cancel soldering tin technique, adopted the higher little spot-welding technology of efficient, greatly improved reliability and the efficient of fluorescent tube general assembly.The reflective cup packaging technology of traditional punch forming is domestic, international luminous element production method, but its cost can be expected, realize the significantly reduction of cost, existing technical scheme can't realize material alterations, must carry out revolutionary change to existing technique.Realize thus the significantly reduction to production cost; with the cost control of illuminator in the close level of common fluorescent tube lighting lamp system; realized that LED enters the worldwide of general illumination field cost control; historical breakthrough; the remarkable cost performance feature that embodies; this is to the in the world creationary change of existing technical scheme; just this change; formed the chance that China LED encapsulation industry surmounts world standard; this is Chinese LED fluorescent tube industry emergence historic mission and sacred responsibility; sufficient proof is intended the Project Product of enforcement, has industrialization fully; the condition of large-scale production.Proposition of the present invention and product marketization will have very important strategic importance to popularizing rapidly of social new type light source.
Embodiment
A kind of method that improves the COB luminous efficiency of source is characterized in that: the specular aluminium substrate of described employing high reflecting rate is as the direct supporting body of led chip, by insulation injection moulding electrode structure, LED die bond, bonding wire, some rubber seal dress technique.
The present invention only limits to absolutely not these examples.The above only is preferably embodiment of the present invention, only is used for describing the present invention, can not be interpreted as the restriction to scope of the present invention.Should be pointed out that all any modifications of making within the spirit and principles in the present invention, be equal to replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (1)
1. method that improves the COB luminous efficiency of source is characterized in that: the specular aluminium substrate of described employing high reflecting rate is as the direct supporting body of led chip, by insulation injection moulding electrode structure, LED die bond, bonding wire, some rubber seal dress technique.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102525067A CN103311419A (en) | 2013-06-24 | 2013-06-24 | Method of improving lighting effect of COB (chip on board) light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102525067A CN103311419A (en) | 2013-06-24 | 2013-06-24 | Method of improving lighting effect of COB (chip on board) light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103311419A true CN103311419A (en) | 2013-09-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013102525067A Pending CN103311419A (en) | 2013-06-24 | 2013-06-24 | Method of improving lighting effect of COB (chip on board) light source |
Country Status (1)
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| CN (1) | CN103311419A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104565884A (en) * | 2013-10-14 | 2015-04-29 | 惠州市华阳光电技术有限公司 | LED lamp structure with relatively high light emission efficiency |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201536111U (en) * | 2009-07-03 | 2010-07-28 | 福建中科万邦光电股份有限公司 | Packaging structure of high-performance high-power LED |
| US20100308350A1 (en) * | 2008-08-26 | 2010-12-09 | Jeffrey Bisberg | LED Chip-Based Lighting Products And Methods Of Building |
| CN102270634A (en) * | 2010-06-07 | 2011-12-07 | 江苏日月照明电器有限公司 | COB (chip on board)-modularized LED (light-emitting diode) glue-dispensing structure |
| CN202633295U (en) * | 2012-02-22 | 2012-12-26 | 柏年春 | LED support, LED area light source and LED lamp |
| CN103094454A (en) * | 2013-01-06 | 2013-05-08 | 广州奥迪通用照明有限公司 | Packaging method of light-emitting diode (LED) device |
-
2013
- 2013-06-24 CN CN2013102525067A patent/CN103311419A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100308350A1 (en) * | 2008-08-26 | 2010-12-09 | Jeffrey Bisberg | LED Chip-Based Lighting Products And Methods Of Building |
| CN201536111U (en) * | 2009-07-03 | 2010-07-28 | 福建中科万邦光电股份有限公司 | Packaging structure of high-performance high-power LED |
| CN102270634A (en) * | 2010-06-07 | 2011-12-07 | 江苏日月照明电器有限公司 | COB (chip on board)-modularized LED (light-emitting diode) glue-dispensing structure |
| CN202633295U (en) * | 2012-02-22 | 2012-12-26 | 柏年春 | LED support, LED area light source and LED lamp |
| CN103094454A (en) * | 2013-01-06 | 2013-05-08 | 广州奥迪通用照明有限公司 | Packaging method of light-emitting diode (LED) device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104565884A (en) * | 2013-10-14 | 2015-04-29 | 惠州市华阳光电技术有限公司 | LED lamp structure with relatively high light emission efficiency |
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Application publication date: 20130918 |