CN103094454A - Packaging method of light-emitting diode (LED) device - Google Patents
Packaging method of light-emitting diode (LED) device Download PDFInfo
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- CN103094454A CN103094454A CN2013100040216A CN201310004021A CN103094454A CN 103094454 A CN103094454 A CN 103094454A CN 2013100040216 A CN2013100040216 A CN 2013100040216A CN 201310004021 A CN201310004021 A CN 201310004021A CN 103094454 A CN103094454 A CN 103094454A
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Abstract
The invention relates to a packaging method of a light-emitting diode (LED) device. The packaging method of the LED device comprises the following steps. A light source is packaged, and the LED light source is packaged in a light source packaging zone by utilizing chip on board (COB) technology. A drive circuit is packaged, and all the elements of the drive circuit are also directly packaged in a drive circuit packaging zone on a light source circuit board. Wire inputting pads are printed at two ends of a wire passing hole so that power wires can be conveniently input in a welding mode. The light source packaging zone and the drive circuit packaging zone are fixed, and the drive circuit packaging zone is fixed on the light source packaging zone to form a LED device main body. According to the packaging method of the Led device, a light and electric integrated module with high integration density is achieved. The COB packaging technology is utilized by the light source in the design method, materials of secondary packaging and a device support frame are removed, and cost is greatly reduced. Packaging procedures are simple and convenient, and size is greatly reduced so that light-emitting efficiency of the LED light source is improved. The design method of integration of the light source and a drive removes a position special for placing the drive in the design of the whole light, installation technology is simplified, and cost in whole light installation and production is greatly reduced, and the method of the LED device is suitable for massive automatic production.
Description
Technical field
The present invention relates to the LED lighting field, particularly a kind of method for packing of LED matrix.
Background technology
LED(Light Emitting Diode, light-emitting diode) be a kind of can be with electric energy conversion the solid-state semiconductor of visible light during, it can be electric energy conversion directly luminous energy.LED is widely used as a kind of new lighting source material.In the LED lighting field, the encapsulation technology of LED matrix and method have played the effect of a key to the luminous efficiency (light extraction efficiency) of light-emitting diode.Encapsulation technology and method to the luminous efficiency that improves illuminating high-power LED device in prior art roughly can be divided into following several:
One, directly adopt the higher LED of luminous efficiency as raw material, adopt this method can improve the luminous efficiency of this lighting device in limited scope, but the luminous efficiency of each LED is limited after all, and the use cost of selecting the high LED of luminous efficiency to bring uprises simultaneously;
Two: adopt and smear bulky grain fluorescent material as substrate, but bulky grain fluorescent material easily precipitates, thereby cause the hot spot step one, make the color temperature difference of LED lighting device more serious;
Three: adopt external all kinds of drive circuits, so that the electric current that each light-emitting diode receives keeps consistency, thereby guarantee the consistency of the color colour temperature of LED lighting device, adopt this kind method, to connect again in addition the one drive circuit parts in the outside of LED lighting device, the drive circuit parts include all kinds of drive circuits, so not only need secondary encapsulation, but also need the materials such as mounting bracket of circuit board, make the monnolithic case of LED lighting device huge, and the encapsulation flow process is loaded down with trivial details, also wastes a large amount of raw material, is unfavorable for large batch of production and use.
In sum, also there is a lot of weak points in prior art, awaits further improving.
Summary of the invention
The object of the invention is to the problem that prior art exists is solved, solve especially that in prior art, LED matrix in encapsulation process, causes the problem that luminous efficiency is low, the encapsulation flow process is loaded down with trivial details, waste of raw materials is serious.
For reaching above purpose, the present invention adopts following technical scheme to be achieved:
A kind of method for packing of LED matrix comprises the following steps:
The encapsulation of light source: adopt the COB packaged type directly to be encapsulated in the light-source encapsulation district of ceramic substrate the LED light source wafer;
The encapsulation of drive circuit: directly adopt bare chip to be encapsulated in the drive circuit encapsulation region of ceramic substrate all devices of drive circuit;
The setting of input line pad: the input line pad adopts printed wire technique, directly is printed on the input line pad locations of ceramic substrate;
The setting of circuit board cable-through hole: open position, a hole in the middle of ceramic substrate, from then on input power cord is passed the position, hole, be connected on the input line pad.
Further, in the encapsulation step of described light source, directly adopt the COB packaging technology to be bundled on the circuit of ceramic substrate the LED light source wafer, then on the terminals and the line pad on ceramic substrate of routing connecting wafer, after light source wafer die bond, routing are completed in the light-source encapsulation zone with point gum machine point on fluorescent glue.
Further, in the encapsulation step of described drive circuit, all devices of drive circuit adopt bare chip, print the circuit of drive circuit at the drive circuit encapsulation region of ceramic substrate, the bare chip of driving element directly is bundled on ceramic substrate, and then routing, couple together device pin terminals and line pad, after the driving element binding is completed, the drive circuit packaging area is fixed.
Further, the drive circuit packaging area just is fixed it with point gum machine fixedly the time.
Further, described point gum machine adopts heat conductive silica gel, heat-conducting resin glue or anti-clone's glue to be fixed.
the invention discloses a kind of method for packing of LED matrix, this method for packing is divided into the light-source encapsulation district with LED matrix, the drive circuit encapsulation region, the parts such as input line pad, realized the optoelectronic integration module of high integration, in this method for designing, light source adopts the COB packaging technology, directly with the light source wafer package on ceramic substrate, drive circuit also all adopt device wafer directly and the light source wafer package on a circuit board, secondary encapsulation and device timbering material have been saved, the cost decrease, and encapsulation simple flow, volume also significantly reduces, whole LED light source has saved one deck thermal resistance, reduced the junction temperature of LED light source, make the LED light source luminous efficiency improve high, and light source and the integrated method for designing of driving, saved the position that special placement drives when making whole lamp design, facilitate the appearance design of light fixture, mounting process is simplified, whole lamp is installed and production cost significantly reduces, be fit to automated production in enormous quantities.
Description of drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, the below will do simple the introduction to the accompanying drawing of required use in embodiment or description of the Prior Art, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the block diagram of embodiment provided by the present invention.
Fig. 2 is the overall package schematic layout pattern of embodiment provided by the present invention.
Fig. 3 is the overall package FB(flow block) of embodiment provided by the present invention.
The drawing reference numeral explanation
1-light-source encapsulation district; 2-drive circuit encapsulation region; 3-input line pad;
4-circuit board cable-through hole.
Embodiment
For the purpose, technical scheme and the advantage that make the embodiment of the present invention is clearer, below in conjunction with the embodiment of the present invention and accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described.Need to prove, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills belong to the scope of protection of the invention not paying the every other embodiment that obtains under the creative work prerequisite.
Embodiment
Below in conjunction with description of drawings the specific embodiment of the present invention.
As depicted in figs. 1 and 2, a kind of method for packing of LED matrix comprises:
The encapsulation of light source: adopt the COB packaged type directly to be encapsulated in the light-source encapsulation district 1 of ceramic substrate the LED light source wafer;
The encapsulation of drive circuit: directly adopt bare chip to be encapsulated in the drive circuit encapsulation region 2 of ceramic substrate all devices of drive circuit;
The setting of input line pad 3: input line pad 3 adopts printed wire technique, directly is printed on input line pad 3 positions of ceramic substrate;
The setting of circuit board cable-through hole 4: open position, a hole in the middle of ceramic substrate, from then on input power cord is passed the position, hole, be connected on input line pad 3.
As preferably, in the encapsulation step of described light source, directly adopt the COB packaging technology to be bundled on the circuit of ceramic substrate the LED light source wafer, then on the terminals of routing connecting wafer and the input line pad 3 on ceramic substrate, after light source wafer die bond, routing are completed light-source encapsulation district 1 interior with point gum machine point on fluorescent glue.
As preferably, in the encapsulation step of described drive circuit, all devices of drive circuit adopt bare chip, print the circuit of drive circuit at the drive circuit encapsulation region 2 of ceramic substrate, the bare chip of driving element directly is bundled on ceramic substrate, and then routing, couple together device pin terminals and input line pad 3, after the driving element binding is completed, drive circuit encapsulation region 2 is fixed.
As preferably, drive circuit encapsulation region 2 just is fixed it with point gum machine fixedly the time.
As preferably, described point gum machine adopts heat conductive silica gel, heat-conducting resin glue or anti-clone's glue to be fixed.
The above method that the present embodiment is provided on the principle is set forth, and the method that the present embodiment is provided below in conjunction with an instantiation is done and is described in detail:
As shown in Figure 3, the encapsulation that provides of the present embodiment can be divided into following steps in detail:
Printed wire and high temperature sintering: the needed circuit of circuit board is printed on ceramic substrate or aluminium base, by high temperature sintering, allow printed circuit be solidificated on circuit board;
Light source and driving element die bond: the wafer of light source wafer and driving element is fixed on circuit board.
Bonding wire: with the both positive and negative polarity of gold thread or aluminum steel connecting wafer both positive and negative polarity and circuit connection.
Be coated with box dam glue: the box dam glue of punctuating with point gum machine inside and outside light-source encapsulation district 1.
Be coated with fluorescent glue: 1 be coated with fluorescent glue with point gum machine in the light-source encapsulation district.
Be coated with heat conductive silica gel: be coated with heat conductive silica gel with point gum machine at driving encapsulation region 2.
Baking: send circuit board to high temperature oven, make the solid moulding of various gellings.
Encapsulated moulding: surface treatment and identification printing moulding.
compared with prior art, the invention discloses a kind of method for packing of LED matrix, this method for packing is divided into the light-source encapsulation district with LED matrix, the drive circuit encapsulation region, the parts such as input line pad, realized the optoelectronic integration module of high integration, in this method for designing, light source adopts the COB packaging technology, directly with the light source wafer package on ceramic substrate, drive circuit also all adopt device wafer directly and the light source wafer package on a circuit board, secondary encapsulation and device timbering material have been saved, the cost decrease, and encapsulation simple flow, volume also significantly reduces, whole LED light source has saved one deck thermal resistance, reduced the junction temperature of LED light source, make the LED light source luminous efficiency improve high, and light source and the integrated method for designing of driving, saved the position that special placement drives when making whole lamp design, facilitate the appearance design of light fixture, mounting process is simplified, whole lamp is installed and production cost significantly reduces, be fit to automated production in enormous quantities.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.Should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (5)
1. the method for packing of a LED matrix, is characterized in that, comprises the following steps:
The encapsulation of light source: adopt the COB packaged type directly to be encapsulated in the light-source encapsulation district of ceramic substrate the LED light source wafer;
The encapsulation of drive circuit: directly adopt bare chip to be encapsulated in the drive circuit encapsulation region of ceramic substrate all devices of drive circuit;
The setting of input line pad: the input line pad adopts printed wire technique, directly is printed on the input line pad locations of ceramic substrate;
The setting of circuit board cable-through hole: open position, a hole in the middle of ceramic substrate, from then on input power cord is passed the position, hole, be connected on the input line pad.
2. the method for packing of LED matrix according to claim 1, it is characterized in that: in the encapsulation step of described light source, directly adopt the COB packaging technology to be bundled on the circuit of ceramic substrate the LED light source wafer, then on the terminals and the line pad on ceramic substrate of routing connecting wafer, after light source wafer die bond, routing are completed in the light-source encapsulation zone with point gum machine point on fluorescent glue.
3. the method for packing of LED matrix according to claim 1, it is characterized in that: in the encapsulation step of described drive circuit, all devices of drive circuit adopt bare chip, print the circuit of drive circuit at the drive circuit encapsulation region of ceramic substrate, the bare chip of driving element directly is bundled on ceramic substrate, and then routing, couple together device pin terminals and line pad, after the driving element binding is completed, the drive circuit encapsulation region is fixed.
4. the method for packing of LED matrix according to claim 3 is characterized in that: the drive circuit encapsulation region just is fixed it with point gum machine fixedly the time.
5. the method for packing of LED matrix according to claim 4 is characterized in that: described point gum machine adopts heat conductive silica gel, heat-conducting resin glue or anti-clone's glue to be fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310004021.6A CN103094454B (en) | 2013-01-06 | 2013-01-06 | A kind of method for packing of LED matrix |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310004021.6A CN103094454B (en) | 2013-01-06 | 2013-01-06 | A kind of method for packing of LED matrix |
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| CN103094454A true CN103094454A (en) | 2013-05-08 |
| CN103094454B CN103094454B (en) | 2015-10-21 |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311419A (en) * | 2013-06-24 | 2013-09-18 | 量一光电科技(惠州)有限公司 | Method of improving lighting effect of COB (chip on board) light source |
| CN103346247A (en) * | 2013-06-18 | 2013-10-09 | 上海鼎晖科技有限公司 | Flexible COB packaging LED and preparation method thereof |
| CN103400930A (en) * | 2013-07-23 | 2013-11-20 | 沈阳利昂电子科技有限公司 | High-efficiency wide-optical angle LED (Light-Emitting Diode) module silicone lens structure and manufacturing method |
| CN103594464A (en) * | 2013-11-25 | 2014-02-19 | 广东威创视讯科技股份有限公司 | COB packaging structure of light-emitting diode |
| CN103779347A (en) * | 2013-09-26 | 2014-05-07 | 深圳市迈克光电子科技有限公司 | High-brightness dimmable COB light source, spot lamp COB process and fluorescent lamp COB process |
| CN104702340A (en) * | 2015-02-15 | 2015-06-10 | 长芯盛（武汉）科技有限公司 | Optical transmission terminal |
| CN105609620A (en) * | 2015-11-26 | 2016-05-25 | 东莞市盈伸电子科技有限公司 | LED optical engine encapsulation structure |
| CN106195659A (en) * | 2016-07-27 | 2016-12-07 | 佛山市国星光电股份有限公司 | A kind of COB light source and integration module and light fixture |
| CN110290650A (en) * | 2019-05-14 | 2019-09-27 | 广州视源电子科技股份有限公司 | LED lamp panel and packaging method thereof |
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| JP2006212825A (en) * | 2005-02-01 | 2006-08-17 | Oki Data Corp | Wiring board and led head |
| CN102214649A (en) * | 2011-05-25 | 2011-10-12 | 映瑞光电科技(上海)有限公司 | LED (light-emitting diode) packaging structure and manufacturing method thereof |
| CN102395236A (en) * | 2011-11-30 | 2012-03-28 | 陈卫平 | LED (light-emitting diode) lamp panel adopting COB (Chip On Board) technology |
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2013
- 2013-01-06 CN CN201310004021.6A patent/CN103094454B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2006212825A (en) * | 2005-02-01 | 2006-08-17 | Oki Data Corp | Wiring board and led head |
| CN102214649A (en) * | 2011-05-25 | 2011-10-12 | 映瑞光电科技(上海)有限公司 | LED (light-emitting diode) packaging structure and manufacturing method thereof |
| CN102395236A (en) * | 2011-11-30 | 2012-03-28 | 陈卫平 | LED (light-emitting diode) lamp panel adopting COB (Chip On Board) technology |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103346247A (en) * | 2013-06-18 | 2013-10-09 | 上海鼎晖科技有限公司 | Flexible COB packaging LED and preparation method thereof |
| CN103311419A (en) * | 2013-06-24 | 2013-09-18 | 量一光电科技(惠州)有限公司 | Method of improving lighting effect of COB (chip on board) light source |
| CN103400930A (en) * | 2013-07-23 | 2013-11-20 | 沈阳利昂电子科技有限公司 | High-efficiency wide-optical angle LED (Light-Emitting Diode) module silicone lens structure and manufacturing method |
| CN103779347A (en) * | 2013-09-26 | 2014-05-07 | 深圳市迈克光电子科技有限公司 | High-brightness dimmable COB light source, spot lamp COB process and fluorescent lamp COB process |
| CN103779347B (en) * | 2013-09-26 | 2017-03-22 | 深圳市迈克光电子科技有限公司 | High-brightness dimmable COB light source, spot lamp COB process and fluorescent lamp COB process |
| CN103594464A (en) * | 2013-11-25 | 2014-02-19 | 广东威创视讯科技股份有限公司 | COB packaging structure of light-emitting diode |
| CN104702340A (en) * | 2015-02-15 | 2015-06-10 | 长芯盛（武汉）科技有限公司 | Optical transmission terminal |
| CN105609620A (en) * | 2015-11-26 | 2016-05-25 | 东莞市盈伸电子科技有限公司 | LED optical engine encapsulation structure |
| CN105609620B (en) * | 2015-11-26 | 2018-08-28 | 东莞市盈伸电子科技有限公司 | A kind of preparation method of LED light engine encapsulating structure |
| CN106195659A (en) * | 2016-07-27 | 2016-12-07 | 佛山市国星光电股份有限公司 | A kind of COB light source and integration module and light fixture |
| CN106195659B (en) * | 2016-07-27 | 2020-03-20 | 佛山市国星光电股份有限公司 | COB light source, integrated module and lamp |
| CN110290650A (en) * | 2019-05-14 | 2019-09-27 | 广州视源电子科技股份有限公司 | LED lamp panel and packaging method thereof |
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| CN103094454B (en) | 2015-10-21 |
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