CN108461613A - A kind of UV-LED light sources and its lamps and lanterns - Google Patents
A kind of UV-LED light sources and its lamps and lanterns Download PDFInfo
- Publication number
- CN108461613A CN108461613A CN201810552507.6A CN201810552507A CN108461613A CN 108461613 A CN108461613 A CN 108461613A CN 201810552507 A CN201810552507 A CN 201810552507A CN 108461613 A CN108461613 A CN 108461613A
- Authority
- CN
- China
- Prior art keywords
- led light
- light sources
- substrate
- led
- condenser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 241001465382 Physalis alkekengi Species 0.000 title claims description 13
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000013078 crystal Substances 0.000 claims abstract description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000004020 conductor Substances 0.000 claims abstract description 7
- 238000005286 illumination Methods 0.000 claims abstract description 5
- 241000218202 Coptis Species 0.000 claims description 5
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910017083 AlN Inorganic materials 0.000 claims description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical group [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 abstract description 6
- 229910002027 silica gel Inorganic materials 0.000 abstract description 6
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 239000002699 waste material Substances 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000003292 glue Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000011324 bead Substances 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000002285 radioactive effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Abstract
The invention discloses a kind of UV LED light sources, including substrate, chip, heat conduction elargol and inorganic encapsulated lens cover board, it is provided with crystal bonding area and pad area on the substrate, heat conduction elargol is provided on the crystal bonding area, the chip is fixed on the heat conduction elargol, the electrode of the chip is electrically connected by electric conductor and the pad area, and being provided with inorganic encapsulated lens cover board on the substrate is packaged.Include that such as above-mentioned UV LED light sources, pcb board and condenser, the UV LED light sources are arranged above the pcb board, the condenser is arranged on the direction of illumination of the UV LED light sources the invention also discloses a kind of UV LED lamps.The present invention relates to LED technology field, a kind of UV LED lamps carry out inorganic encapsulated to inorganic encapsulated lens cover board, and compared with existing use silica gel packaging, reliability is stronger, meanwhile, optically focused is carried out to ultraviolet light using condenser, avoids the waste of ultraviolet light, it is cost-effective.
Description
Technical field
The present invention relates to LED technology field more particularly to a kind of UV-LED light sources and its lamps and lanterns.
Background technology
The type of application with UV-LED in fields such as printing, solidification, medical treatment, UV-LED light sources is also more and more, mesh
Before, the single lamp bead that the prior art mostly uses greatly the package dimensions such as 3535,5050,6565 is attached to copper base or aluminum substrate is first-class
It radiates and realizes point, face, linear light source on carrier, also have using plurality of LEDs chip package into high-power UV-LED area sources, and linear light
The problem of source or single lamp bead are mounted on pcb board and realize, existing UV equipment encounters has：
(1) UV-LED lamp beads in use for some time due to the problem of heat occur silica gel yellow even blackening or
Person's glue is split, and so that the energy of UV equipment is significantly decayed, and normal production requirement cannot be met；
(2) ultraviolet light that conventional UV-LED light sources are sent out is more dispersed, largely waste ultraviolet light and
Increase cost.
Invention content
The object of the present invention is to provide a kind of UV-LED light sources, it is intended to solve above-mentioned technical problem (1), avoid using glue material
Yellow, glue caused by encapsulation such as split at the problem of reliabilities deficiency.
The present invention also provides a kind of UV-LED lamps and lanterns, it is intended to solve above-mentioned technical problem (1) and (2), avoid using glue
The problem for the reliabilities deficiencies such as material encapsulates caused yellow, glue is split, strong applicability avoid wasting, being cost-effective for ultraviolet light.
The technical solution adopted in the present invention is：A kind of UV-LED light sources, including substrate, chip, heat conduction elargol and inorganic
Package lens cover board is provided with crystal bonding area and pad area on the substrate, heat conduction elargol, the core is provided on the crystal bonding area
Piece is fixed on the heat conduction elargol, and the electrode of the chip is electrically connected by electric conductor and the pad area, the substrate
On be provided with inorganic encapsulated lens cover board and be packaged.
As being further improved for said program, the electric conductor is gold thread.
As being further improved for said program, the crystal bonding area surface is provided with Gold plated Layer.
As being further improved for said program, the substrate is aluminium nitride substrate.
As being further improved for said program, the substrate surrounding is provided with metal box dam.
As being further improved for said program, the substrate is in bar shaped, and the crystal bonding area is in linear on the substrate
Arrangement.
A kind of UV-LED lamps and lanterns include that such as above-mentioned UV-LED light sources, pcb board and condenser, the UV-LED light sources are set
It sets above the pcb board, the condenser is arranged on the direction of illumination of the UV-LED light sources.
As being further improved for said program, the condenser is quartz glass bar.
As being further improved for said program, the light emitting angle of the quartz glass bar is 60 degree.
The beneficial effects of the invention are as follows：
A kind of UV-LED light sources carry out inorganic encapsulated to inorganic encapsulated lens cover board, compared with existing use silica gel packaging,
Reliability is stronger, avoids ultraviolet radioactive yellow problem caused by organic material, avoids organic packages material interface heat and answers
Problem of Failure caused by power avoids Problem of Failure caused by the wet stress of organic packages and impurity intrusion.
The present invention another advantageous effect be：
A kind of UV-LED lamps and lanterns carry out inorganic encapsulated to inorganic encapsulated lens cover board, compared with existing use silica gel packaging,
Reliability is stronger, meanwhile, optically focused is carried out to ultraviolet light using condenser, avoids the waste of ultraviolet light, it is cost-effective.
Description of the drawings
The specific implementation mode of the present invention is described further below in conjunction with the accompanying drawings：
Fig. 1 is a kind of UV-LED light source embodiments front schematic view of the present invention；
Fig. 2 is a kind of UV-LED light source embodiments side sectional view of the present invention；
Fig. 3 is the close-up schematic view of A in Fig. 2；
Fig. 4 is a kind of UV-LED lamps and lanterns example structure schematic diagram of the present invention；
Fig. 5 is pcb board example structure schematic diagram of the present invention.
Specific implementation mode
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.
Fig. 1 is a kind of UV-LED light source embodiments front schematic view of the present invention, and Fig. 2 is that a kind of UV-LED light sources of the present invention are real
A side sectional view is applied, combined with Figure 1 and Figure 2, a kind of UV-LED light sources, including substrate 100, chip 200 and electric conductor 300.
Specifically, being provided with crystal bonding area 101 and pad area 102 on substrate 100, wherein 101 surface of crystal bonding area is provided with plating
Layer gold 103 is provided with heat conduction elargol 400 on crystal bonding area 101, and chip 200 is fixed on heat conduction elargol 400.
In the present embodiment, substrate 100 is aluminium nitride substrate, and substrate 100 is in bar shaped, and crystal bonding area 101 is in line on the substrate 100
Shape is arranged, and die bond has 12 chips 200 on single substrate 100, forms UV-LED linear light sources, to solve existing UV-LED light sources
There is the problem of silica gel yellow decaying, being provided with inorganic encapsulated lens cover board 500 on substrate 100 is packaged, and avoids UV-LED
The problem for the reliabilities deficiencies such as light source encapsulates caused yellow using glue material, glue is split, avoids organic packages material interface thermal stress
Problem of Failure caused by caused Problem of Failure and the intrusion of wet stress and impurity.
Specifically, 100 surrounding of substrate is additionally provided with metal box dam 600, substrate 100, inorganic encapsulated cover board 500 and metal enclose
Dam 600 forms closed cavity, avoids inside chip 200 from making moist, dust is avoided to enter.
Fig. 3 is the close-up schematic view of A in Fig. 2, and in conjunction with Fig. 1, Fig. 2 and Fig. 3, the electrode 201 of chip 200 passes through conduction
Body 300 is electrically connected with pad area 102, and in the present embodiment, electric conductor 300 is gold thread, and one end of gold thread passes through the first tin ball 701
It is welded on pad area 102, the other end of gold thread is welded on by the second tin ball 702 on chip electrode 201, and realization electrically connects
It connects.
Fig. 4 is a kind of UV-LED lamps and lanterns example structure schematic diagram of the present invention, with reference to Fig. 4, a kind of UV-LED lamps and lanterns, including
Pcb board 10, such as above-mentioned UV-LED light sources 20 and condenser 30.UV-LED light sources 20 are arranged above pcb board 10, condenser 30
It is arranged on the direction of illumination of UV-LED light sources 20.
In the present embodiment, condenser 30 is quartz glass bar, and the light emitting angle of quartz glass bar is 60 degree, in UV-LED light
Increase quartz glass bar on the direction of illumination in source, reduce UV equipment light decay caused by due to increasing UV-LED light source operation heights,
With existing UV-LED light sources in the case where operation height changes equal height, the radianting capacity of UV-LED light sources of the present invention carries
It is high by 10%.
Fig. 5 is pcb board example structure schematic diagram of the present invention, and with reference to Fig. 5, pcb board 10 includes welding resistance area 11 and UV-LED
Light source pad 12.In the present embodiment, two row UV-LED light sources pad 12, total 12pcs are distributed on pcb board 10, by UV-LED light
After UV-LED light sources pad 12 is sticked in source, the positive and negative anodes of UV-LED light sources are connected using die bond elargol, realize UV-LED light sources
Be connected in series with or be connected in parallel.UV wavelength, UV light sources can be freely combined according to the difference of application field, Output optical power
Quantity, meanwhile, it can be according to the different series-parallel system of the output current of power supply, combinations of voltages, such as the UV- of the 365nm of 5pcs
The UV-LED light sources of the 385nm of LED light source and 7pcs.
A kind of UV-LED lamps and lanterns carry out inorganic encapsulated to inorganic encapsulated lens cover board, compared with existing use silica gel packaging,
Reliability is stronger, meanwhile, optically focused is carried out to ultraviolet light using condenser, avoids the waste of ultraviolet light, it is cost-effective.
It is to be illustrated to the preferable implementation of the present invention, but the invention is not limited to the implementation above
Example, those skilled in the art can also make various equivalent variations or be replaced under the premise of without prejudice to spirit of that invention
It changes, these equivalent deformations or replacement are all contained in the application claim limited range.
Claims (9)
1. a kind of UV-LED light sources, which is characterized in that it includes substrate, chip, heat conduction elargol and inorganic encapsulated lens cover board, institute
It states and is provided with crystal bonding area and pad area on substrate, heat conduction elargol is provided on the crystal bonding area, the chip is fixed on described lead
On hot elargol, the electrode of the chip is electrically connected by electric conductor and the pad area, and inorganic envelope is provided on the substrate
Dress lens cover board is packaged.
2. a kind of UV-LED light sources according to claim 1, which is characterized in that the electric conductor is gold thread.
3. a kind of UV-LED light sources according to claim 1 or 2, which is characterized in that the crystal bonding area surface is provided with plating
Layer gold.
4. a kind of UV-LED light sources according to claim 1, which is characterized in that the substrate is aluminium nitride substrate.
5. a kind of UV-LED light sources according to claim 3, which is characterized in that the substrate surrounding is provided with metal and encloses
Dam.
6. a kind of UV-LED light sources according to claim 5, which is characterized in that the substrate is in bar shaped, the crystal bonding area
It is in linear arrangement on the substrate.
7. a kind of UV-LED lamps and lanterns, which is characterized in that it include as claim 1 to 6 any one of them UV-LED light sources,
Pcb board and condenser, the UV-LED light sources are arranged above the pcb board, and the condenser is arranged in the UV-LED light
On the direction of illumination in source.
8. a kind of UV-LED lamps and lanterns according to claim 7, which is characterized in that the condenser is quartz glass bar.
9. a kind of UV-LED lamps and lanterns according to claim 8, which is characterized in that the light emitting angle of the quartz glass bar is
60 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810552507.6A CN108461613A (en) | 2018-05-31 | 2018-05-31 | A kind of UV-LED light sources and its lamps and lanterns |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810552507.6A CN108461613A (en) | 2018-05-31 | 2018-05-31 | A kind of UV-LED light sources and its lamps and lanterns |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108461613A true CN108461613A (en) | 2018-08-28 |
Family
ID=63215974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810552507.6A Pending CN108461613A (en) | 2018-05-31 | 2018-05-31 | A kind of UV-LED light sources and its lamps and lanterns |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108461613A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112786759A (en) * | 2019-11-08 | 2021-05-11 | 宁波安芯美半导体有限公司 | Light-emitting diode substrate, preparation method and light-emitting diode bulb |
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