CN107845722A - A kind of LED car lamp heat conduction encapsulating structure, LED car lamp and manufacture method - Google Patents
A kind of LED car lamp heat conduction encapsulating structure, LED car lamp and manufacture method Download PDFInfo
- Publication number
- CN107845722A CN107845722A CN201711183083.2A CN201711183083A CN107845722A CN 107845722 A CN107845722 A CN 107845722A CN 201711183083 A CN201711183083 A CN 201711183083A CN 107845722 A CN107845722 A CN 107845722A
- Authority
- CN
- China
- Prior art keywords
- led
- heat pipe
- led chip
- heat
- car lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 238000000034 method Methods 0.000 title claims abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000003466 welding Methods 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 10
- 239000006071 cream Substances 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 6
- 230000005496 eutectics Effects 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000005619 thermoelectricity Effects 0.000 abstract description 6
- 229910052802 copper Inorganic materials 0.000 description 30
- 239000010949 copper Substances 0.000 description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 28
- 239000000758 substrate Substances 0.000 description 21
- 229910017083 AlN Inorganic materials 0.000 description 13
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 13
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 10
- 229910052736 halogen Inorganic materials 0.000 description 10
- 150000002367 halogens Chemical class 0.000 description 9
- 239000004411 aluminium Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000010276 construction Methods 0.000 description 6
- 229910052724 xenon Inorganic materials 0.000 description 6
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000012536 packaging technology Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000002146 bilateral effect Effects 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 241000784732 Lycaena phlaeas Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- POIUWJQBRNEFGX-XAMSXPGMSA-N cathelicidin Chemical compound C([C@@H](C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CO)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H]([C@@H](C)CC)C(=O)NCC(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](CCC(N)=O)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CC(N)=O)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](C(C)C)C(=O)N1[C@@H](CCC1)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)O)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CO)C(O)=O)NC(=O)[C@H](CC=1C=CC=CC=1)NC(=O)[C@H](CC(O)=O)NC(=O)CNC(=O)[C@H](CC(C)C)NC(=O)[C@@H](N)CC(C)C)C1=CC=CC=C1 POIUWJQBRNEFGX-XAMSXPGMSA-N 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000035755 proliferation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The present invention provides a kind of LED car lamp heat conduction encapsulating structure, LED car lamp and manufacture method, and LED car lamp heat conduction encapsulating structure includes LED chip, at least two heat pipes, mutually insulated between adjacent heat pipe；The LED chip is arranged on two adjacent heat pipes, and the positive and negative electrode of LED chip is connected with a wherein heat pipe respectively, and conductive channel of the heat pipe as LED chip, LED chip uses flip-chip.The present invention is using the integral structure of thermoelectricity, LED chip is directly welded on heat pipe, eliminate original all media, the soldering-tin layer of very thin welding chip is only remained between LED chip and heat pipe, heat caused by chip is directly transferred on heat pipe through very thin metallic tin, and thermal resistance substantially reduces, the excellent heat conductivility of heat pipe has been played to greatest extent, the temperature of chip is reduced to greatest extent, meanwhile, heat pipe is also the supplying channels of LED chip.
Description
Technical field
The invention belongs to Vehicular illumination device technical field, be related to a kind of LED car lamp heat conduction encapsulating structure, LED car lamp and
Manufacture method.
Background technology
Traditional automobile front is Halogen lamp LED and xenon lamp, and emerging LED automobile headlamp is with its efficient, energy-conservation, longevity
The advantage of life just starts to popularize with swift and violent speed.LED car headlights are divided to two kinds, and a kind of is the full set that former car inherently specially designs
LED car headlights including optical system, a kind of is with LED replacement original-pack Halogen lamp LED and xenon lamp.LED cars in the market
Headlight substantially refers to the latter, in the case where original optically and electrically system can not be changed directly with LED replacement Halogen lamp LED and
Xenon lamp, it is cheap to change conveniently.
One eternal problem of LED illumination is exactly heat, and none not consider heat conduction and heat radiation problem to all LEDs, because
LED brightness, color are directly related with temperature to the life-span, particularly in the illumination of high-power high density, and automobile LED headlight
It is wherein the most typical represent：
(1) light emitting source of conventional halogen lamp is a filament, and LED replacing halogen lamps will utilize original lampshade and optical system
System, just determines that LED light-emitting area, shape and position must be similar with the filament of Halogen lamp LED；
(2) brightness of Halogen lamp LED is reached and exceeded on so small area, it must be Gao Gong just to determine car light LED
Rate high density, chip as few as possible and electric current as big as possible；
(3) LED must be deep into the inside of closed lampshade by an aperture, and inner space, which is not put, can fill in radiating yet
Device, and can not also be radiated in closed lampshade, it is necessary to heat caused by LED chip is transferred out to be radiated outside lampshade, this
It is the characteristics of car light LED mono- is the most unusual, makes dissipating for the high power high density LED natively in airtight lampshade
Hot problem is more extremely difficult, so greatest problem common existing for all automobile LED headlights is exactly to overheat at present.
Therefore, automobile LED headlight is generally using heat pipe for thermal conductivity caused by LED outside heat derives lamp housing, by dissipating naturally
Heat or fan cooling mode dissipate heat.Heat pipe is the copper pipe that a kind of inside has capillary pipe structure, is absorbed heat using liquid phase-change
Heat release principle heat conduction, its heat transfer efficiency are significantly larger than the metal materials such as gold, silver and bronze aluminium.The envelope of one typical automobile LED headlight
Assembling structure is as shown in Figure 1.As seen from Figure 1：Many layer materials are spaced into heat pipe 1 from LED chip 7, except thermal conductivity
Can be outside good metallic copper 4 and aluminium nitride substrate 8, the also insulating barrier 9 and heat-conducting cream 2 of heat conductivility extreme difference.Applied in LED chip 7
Fluorescent material 6 is covered with, LED chip is welded on aluminium nitride substrate 8 by scolding tin 5, and the two sides of aluminium nitride substrate 8 is all covered with copper 4, nitrogen
Change aluminium base 8 to be welded on copper base 10 by scolding tin 5, conductive layer is set between aluminium nitride substrate 8 and copper base 10, utilize
Copper 4 is conductive, and avoids copper base 10 powered using insulating barrier 9, and wire is connected with copper 4 (between insulating barrier 9 and scolding tin 5),
Copper base 10 is connected by heat-conducting cream with heat pipe 1, after heat leads heat pipe caused by LED chip, is radiated in the direction of the arrow.
So the subject matter of automobile LED headlight is exactly that the thermal resistance from LED chip to heat pipe is too big at present, therefore, having
Many patents propose improvement project, and representative has the following patent：Application for a patent for invention CN102095151A,
CN106594627A, CN105737115A, utility model patent CN204285394U, CN203010557U, CN205877976U,
CN205480664U、CN205535477U、CN206469177U。
Publication No. CN105737115A application for a patent for invention discloses a kind of LED headlamp conductive structure, including：One
LED-baseplate, copper heat conducting pipe more than individual, aluminum alloy heat sink；Wherein, LED chip is set in LED-baseplate, and LED chip is 5 × 1
Or 4 × 1 array；LED-baseplate is pasted on one end of copper heat conducting pipe by heat-conductive bonding agent；Aluminum alloy heat sink is in annular shape, set
In the other end of copper heat conducting pipe, the two is fixedly connected using heat-conductive bonding agent；Copper heat conducting pipe is provided with car light installation position.
Publication No. CN106594627A application for a patent for invention discloses a kind of LED car lamp, and LED light source includes being welded on
The luminous members of LED of heat-conducting substrate and the multiple such as LED lamp beads or LED chip that are arranged on heat-conducting substrate on light source mounting surface
Part.
Notification number is that CN206469177U utility model patent discloses a kind of LED car lamp, including LED lamp, shading
Piece, lamp assembly assembly parts and radiator fan.LED lamp includes two strip circuit plates for being welded with several LED, and LED
Positioned at the outside of strip circuit plate.Heat sink, the rear end connection radiating tube of heat sink are provided between two strip circuit plates.Every
The downside of circuit board is provided with copper-based flaggy, and upper and lower surface of the copper-based flaggy respectively with the front edge of board that radiates directly contacts.
Notification number is that CN205535477U utility model patent discloses a kind of LED car lamp, and LED car lamp includes radiation shell
Body, power supply lead wire, snap ring and photoelectric subassembly；Photoelectric subassembly is located in radiating shell, and photoelectric subassembly and power supply lead wire are located at
The first terminal electrical connection in radiating shell, realize the luminous lighting of photoelectric subassembly；Snap ring is installed in outside radiating shell, is easy to
Connection between LED car lamp and car body.Radiating shell includes the first radiation shell and the second radiation shell, and photoelectric subassembly includes LED core
Piece, substrate and heat pipe, LED chip are fitted on substrate, and substrate is Nian Jie with heat pipe and the first terminal of substrate and power supply lead wire
Electrical connection, for LED chip on the inside of the light hole on radiating shell top, substrate makes the luminous base simultaneously of LED chip after receiving power supply
Plate produces heat, in heat transfer to heat pipe.
Above-mentioned patent or the scheme of patent application are all the medium numbers of plies between chip and heat pipe to be reduced, and improve thermal conductivity
Can, summary has following two ways：
Mode one, LED chip are encapsulated in 10 on copper base, and copper base 10 passes through heat-conducting cream 2 or scolding tin 5 and heat with heat pipe 1
Pipe 1 is connected, as shown in Fig. 2 although which eliminates several layers of media, but copper base is because there is dielectric insulation layer 9, its thermal conductivity factor
Very low, overall thermal resistance remains unchanged very big.
Mode two, LED chip 7 are encapsulated on aluminium nitride substrate 8, aluminium nitride substrate 8 again by heat-conducting cream 2 or scolding tin 5 with
Heat pipe 1 is connected, as shown in figure 3, which is better than the heat conduction of mode one, eliminates the very low dielectric insulation layer 9 of thermal conductivity factor,
But the size for needing to increase aluminium nitride substrate 8 is to reserve the space of bonding wire, the double-side copper-applying 4 of aluminium nitride substrate 8, double-side copper-applying nitrogen
It is expensive to change aluminium, undoubtedly improves cost, and still has several layers medium from LED chip 7 to heat pipe 1, gross thickness is also thicker, according to
It is old in the presence of certain thermal resistance.
Above-mentioned all patents and existing car light are led to using the structure of thermoelectricity separation, i.e. heat caused by LED chip
Superheater tube is guided, and the electric energy that LED chip needs is powered by the metal conducting layer on copper base or aluminium base or ceramic substrate, and
Conductive layer is insulated with heat pipe, i.e., respectively walks each road, therefore, must just have conductive layer, insulating barrier between LED chip and heat pipe
And tack coat, this is essential.
The content of the invention
To solve the problems, such as that prior art is present, the present invention provides a kind of LED car lamp heat conduction encapsulating structure, using thermoelectricity one
LED chip is directly installed on heat pipe by the structure of body, eliminates Jie that prior art is arranged between LED chip and heat pipe
Matter, LED chip heat are passed directly on heat pipe, and thermal resistance substantially reduces, meanwhile, heat pipe is also the supplying channels of LED chip.
LED car lamp heat conduction encapsulating structure provided by the invention, including LED chip, at least two heat pipes, between adjacent heat pipe
Mutually insulated；The LED chip is arranged on two adjacent heat pipes, the positive and negative electrode of LED chip respectively with a wherein heat pipe
Connection, conductive channel of the heat pipe as LED chip, the LED chip is flip-chip.
The LED chip of the present invention is directly welded on heat pipe, reduces the thermal resistance between chip and heat pipe to greatest extent.Adopt
With the new structure of two heat pipes of mutually insulated, solves the problem that LED chip can not be directly welded on heat pipe.Eliminate nitrogen
Change aluminium ceramic substrate and copper base, not only reduce material cost and also simplify packaging technology, reduce packaging cost, subtract significantly
Small thickness, original Halogen lamp LED and xenon lamp is more nearly in light type, light type is more preferable with hot spot.New construction thermal conductivity of the present invention
Substantially improving for energy, reduces the temperature of LED chip, particularly important for the service life of extension automobile LED headlight.
One end of the tube surface is provided with a group layer, and solder mask is reserved with the pad of installation LED chip, the heat pipe
The other end on surface is connection heat sink area.By two surface rubbing polishings up and down after bonding, one layer of white of coating or printing
Solder mask, the effect of solder mask are scolding tin to be limited in the region specified, and prevent LED chip position to be moved, while white
Solder mask has good reflective.
Connected between the adjacent heat pipe of the present invention by the adhesive linkage that insulate.By the heat pipe suppressed of two sections of equal lengths simultaneously
Row bonds together, and adhesives is the epoxy resin for being mixed with ceramic powders, the high high temperature resistant of hardness and electric insulation, and insulate adhesive linkage
Thickness may be configured as 0.2mm.
LED chip preferred flip chip chip, the both positive and negative polarity of LED flip chip is all arranged in parallel in chip bottom, and interval only has
0.15~0.2mm or so, it is mutual using two to be directly welded in both positive and negative polarity just short circuit, the present invention on the copper heat pipe of existing structure
Bonding and the heat pipe of electrically insulated from one another, the cross section of heat pipe is square or rectangle or other shapes, and two heat pipe sides are with absolutely
Edge material bonds together, and the gap size between the thickness for the adhesive linkage that insulate and the both positive and negative polarity of LED chip is same or equivalent, thick
Scope is spent in 0.1~0.3mm, usually 0.2mm.
Into single setting, i.e., more heat pipes are in a row is arranged side by side heat pipe of the present invention, such as two heat pipes side by side, three
Heat pipe side by side etc., can also use the form of multiple rows of setting, i.e. heat pipe be divided into multiple rows of bonding, and a such as row sets two heat pipes, altogether
Two rows are set, now there are four heat pipes.LED chip, LED chip are all installed in the unilateral installation LED chip of adjacent heat pipe, or both sides
Between can be using in parallel, series connection or series connection be connected in the form of combination in parallel.
The mounting means of LED chip of the present invention is tin cream weldering, eutectic weldering or is bonded with elargol.
The present invention also provides a kind of LED car lamp, including radiator and LED car lamp heat conduction provided by the present invention encapsulation knot
Structure, the heat pipe of the LED car lamp heat conduction encapsulating structure are connected with radiator.Automobile LED headlight is bilateral structure, is exactly heat pipe
Two sides symmetric packages LED, new construction of the invention eliminates the aluminium nitride substrate and copper base on heat pipe two sides, substantially reduces
Thickness, original Halogen lamp LED and xenon lamp is more nearly in light type, light type is more preferable with hot spot, and this is also current LED headlamp one
The problem of individual anxious to be resolved.
The present invention also provides a kind of manufacture method of LED car lamp heat conduction encapsulating structure, including：
Heat pipe is bonded：Two sections of heat pipes are bonded together side by side, insulated between heat pipe；One end of heat pipe sets solder mask,
The pad of the reserved installation LED chip in the end, the other end of heat pipe is connection heat sink area；
LED chip is welded：LED chip is arranged on the pad reserved on adjacent heat pipe, the positive and negative electrode point of LED chip
It is not connected with a wherein heat pipe；Fluorescent material is coated with LED chip.
The present invention has following beneficial effect：
1st, direct chip attachment reduces the thermal resistance between chip and heat pipe to greatest extent on heat pipe.
2nd, using mutually insulated two heat pipes new structure, solving LED chip directly can not be welded on heat pipe
Problem.
3rd, the material of thermotube wall is copper, and hot horizontal proliferation performance is very strong, the heat of chip can be rapidly diffused into
Whole heat pipe.
4th, aluminum nitride ceramic substrate and copper base are eliminated, material cost is not only reduced and also simplify packaging technology, is dropped
Low packaging cost.
5th, automobile LED headlight is bilateral structure, is exactly the two sides symmetric packages LED of heat pipe, and new construction of the invention is gone
Fallen the aluminium nitride substrate and copper base on heat pipe two sides, substantially reduced thickness, be more nearly in light type original Halogen lamp LED and
Xenon lamp, light type is more preferable with hot spot, and this is also the problem of current LED headlamp one is anxious to be resolved.
6th, substantially improving due to new construction heat conductivility of the present invention, the temperature of LED chip is reduced, for extending automobile
The service life of LED headlamp is particularly important.
7th, because LED chip temperature reduces, brightness is improved, safe driving and pedestrains safety is also substantially improved.
8th, because LED chip temperature reduces, identical chip can leads to bigger electric current, and the bigger power of use is bright
Degree is also higher.
Brief description of the drawings
Fig. 1 is prior-art illustration one；
Fig. 2 is prior-art illustration two；
Fig. 3 is prior-art illustration three；
Fig. 4 is the schematic diagram of LED car lamp heat conduction encapsulating structure embodiment one of the present invention；
Fig. 5 is the profile of LED car lamp heat conduction encapsulating structure embodiment one of the present invention；
Fig. 6 is circular heat pipe schematic diagram；
Fig. 7 is rectangle heat pipe schematic diagram；
Fig. 8 is that heat pipe is bonded schematic diagram；
Fig. 9 is heat pipe coated group layer schematic diagram；
Figure 10 is that heat pipe welds LED chip schematic diagram；
Figure 11 is that heat pipe welds LED chip profile；
Figure 12 is the schematic diagram of LED car lamp embodiment one of the present invention；
Figure 13 is the profile of LED car lamp heat conduction encapsulating structure embodiment two of the present invention；
Figure 14 is the profile of LED car lamp heat conduction encapsulating structure embodiment three of the present invention；
Figure 15 is the schematic diagram of LED car lamp embodiment two of the present invention.
In figure：1- heat pipes；2- heat-conducting creams；3- wires；4- copper；5- scolding tin；6- fluorescent material；7-LED chips；8- is aluminum-nitride-based
Plate；9- insulating barriers；10- copper bases；11- insulation adhesive linkages；12- solder masks；13- pads；14- connection heat sink areas；15- is nitrogenized
Aluminium ceramics；16- aluminum casings；17- fin；The reflective protective cap of 18- insulation.
Embodiment
The present invention provides a kind of new automobile front LED high heat conduction encapsulating structure, using the structure of thermoelectricity one
LED chip is directly welded on heat pipe, original all media is eliminated, very thin welding is only remained between chip and heat pipe
The soldering-tin layer or adhesive linkage of chip, heat caused by chip are directly transferred on heat pipe through very thin metallic tin or elargol, heat
Resistance substantially reduces, and has played the excellent heat conductivility of heat pipe to greatest extent, reduces the temperature of chip to greatest extent, together
When, heat pipe is also the supplying channels of LED chip.
LED car lamp heat conduction encapsulating structure embodiment one：
It is not simply to weld that LED chip is directly welded on heat pipe by the present invention, but has done basic improvement, is a kind of
New structure, because the both positive and negative polarity of LED flip chip is all arranged in parallel in chip bottom, interval only has 0.15~0.2mm or so,
Directly it is welded in both positive and negative polarity just short circuit on the copper heat pipe of existing structure.The profile of LED flip chip is generally square, profile
0.4~3.0mm of size or rectangle, appearance and size is from 0.2~3.0mm.The present invention preferentially uses LED flip chip.
As shown in Figure 4,5, the present invention is mutually bonded using two and the heat pipe of electrically insulated from one another 1, the cross section of heat pipe are
Square or rectangle or other shapes, but during use other shapes, the part that heat pipe welds with LED chip is preferably
It is convenient to weld for plane, while the contact area between LED chip and heat pipe is increased, beneficial to radiating.The length of every heat pipe
For 5~15cm, width 2mm~10mm, if in particular cases can be with longer wider, but basic structure is identical.The species of heat pipe
Can be various modes, internal capillary materials medium can be netted, powdered or channel structure, and the heat conduction of inside heat pipe is situated between
Matter can be water or other media.In some cases, for example heat is little or power is not high, and heat pipe can also use identical size
Copper rod or aluminium bar replace.That is, the heat pipe described in the present invention, can both refer to internal with capillary materials medium, utilization
The device of the heat-conducting medium heat conduction such as water, common copper rod or aluminium bar can also be referred to.
Two heat pipe sides are bonded together with insulating materials, and the insulating adhesive as adhesives can be containing pottery
The epoxy resin or other materials of porcelain powder, there is high temperature resistant and higher hardness and adhesive strength, be exhausted between two heat pipes 1
Edge adhesive linkage 11, the thickness for the adhesive linkage 11 that insulate is suitable with the interval of LED flip chip bottom both positive and negative polarity, from 0.1 to 0.3mm models
Enclose, generally 0.2mm.
The both positive and negative polarity of LED chip 7 is welded on two heat pipes 1 respectively, heat pipe 1 is that passage of heat is conductive logical again in itself
Road, i.e. thermoelectric integral structure, electric current is transmitted to LED chip by heat pipe.LED chip welding manner on heat pipe welds for tin cream,
Can also be that eutectic is welded or is directly bonded with elargol.
Three LEDs chips have been welded in one side between two heat pipes 1 in Fig. 4, and three LEDs chips form a line, symmetrical
Side can also weld LED chip, and according to the length of heat pipe, one arranges 1~10 LEDs chip that can arrange.The luminous face of LED chip
Color is blueness, can also use the White-light LED chip for being coated with fluorescent material in advance；Fluorescent material can also may be used with yellow YAG phosphor
To be the mixing of multiple color fluorescent material by a certain percentage.
LED car lamp heat conduction encapsulating structure embodiment two：
There is three chips chip array in parallel different from every face shown in embodiment one, be actually not limited to three cores
Piece, it can be arranged single, two or more than three per face.In fact, a row chip-in series, parallel connection are also not limited solely to per face, also
Can be two row chip series and parallels, as shown in figure 13, the string of every face two row chip can be achieved simultaneously in adhesion to three heat pipes 1 side by side
Townhouse is arranged, and insulation adhesive linkage 11 is formed between adjacent heat pipe, and LED chip 7 is arranged on adjacent heat pipe 1, and three one side of heat pipe 1 can
To set two row LED chips 7, two row LED chips can carry out series and parallel.
LED car lamp heat conduction encapsulating structure embodiment three：
Embodiment one, two is the scheme of two sides packaging LED chips, can also use four heat pipe four sides packaging LED chips, is such as schemed
Shown in 14, four heat pipes 1 are sticked together into two rows, and LED chip is arranged on adjacent heat pipe 1, set four row LED chips altogether.
LED car lamp embodiment one：
As shown in figure 12, LED car lamp includes LED car lamp heat conduction encapsulating structure provided by the invention and radiator, radiator
Using existing radiator structure, including aluminium nitride ceramics 15, aluminum casing 16, fin 17 etc..By the uncoated welding resistance of heat pipe bottom 1
The expose portion (connection heat sink area 14) of layer is connected on fin 17, by natural heat dissipation or fan cooling, while left and right
Two heat pipes connect power positive cathode and are powered to LED chip respectively, metal shell and fin 17 by aluminium nitride ceramics 15 with
The large area of heat pipe 1 is in close contact, and aluminum casing 16 is cased with outside aluminium nitride ceramics 15, and it is outer heat to be dissipated can in time and can guarantee
Shell and fin are not charged, the reflective protective cap 18 of heat pipe front end suit insulation.
LED car lamp embodiment two：
As shown in figure 15, the LED car lamp heat conduction envelope that the present embodiment is provided using LED car lamp heat conduction encapsulating structure embodiment three
Assembling structure.
(it is not limited thereto) by taking three LEDs chip parallel connections as an example below and illustrates that New LED car light provided by the invention is led
Seal the manufacture method of assembling structure.
The first step, forming heat pipe.Common heat pipe is circular, and the heat pipe that section is circle is suppressed growth with hydraulic press
It is square, as shown in Figure 6,7.
Second step, heat pipe bonding.The heat pipe suppressed of two sections of equal lengths is bonded together side by side, adhesives
To be mixed with the epoxy resin of ceramic powders, the high high temperature resistant of hardness and electric insulation, thickness of adhibited layer 0.2mm, it is illustrated in figure 8 viscous
The sectional view connect.
3rd step, by the polishing of two surface rubbings up and down after bonding, one layer of white solder mask 12 of coating or printing, welding resistance
Layer 12 effect be scolding tin to be limited in the region specified, prevent LED chip position to be moved, at the same white solder mask have it is good
Good is reflective, and coating and the printed patterns of solder mask are as shown in figure 9, reserve the region of pad 13 and bottom of welding LED chip
For connecting the connection heat sink area 14 of fin.
4th step, welding LED chip and coating fluorescent powder.LED chip uses inverted structure chip, the both positive and negative polarity of LED chip 7
Be respectively welded at mark+and-heat pipe 1 on, welding manner be tin cream weldering, eutectic weldering or elargol bonding.The coating of fluorescent material 6 is
LED chip surface and side are coated in after being mixed with a certain proportion of fluorescent material with silica gel, or is coated in LED chip in advance
Surface and side are (i.e.：White chip CSP).It is illustrated in fig. 10 shown below as top view, Figure 11 is profile, two up and down of heat pipe 1
The symmetrical packaging LED chips 7 in face.
The core of the present invention is thermoelectric integral, different from the thermoelectricity isolating construction of current various schemes.By LED upside-down mounting cores
Piece is directly welded on heat pipe, and heat is directly transferred to heat pipe caused by LED chip, is transmitted to fin again by heat pipe, is removed from
It is current by the way of aluminum nitride ceramic substrate and copper base are excessive, LED chip is greatly reduced to the thermal resistance between heat pipe,
Chip temperature is reduced, simplifies packaging technology, reduces cost, improves LED performance, brightness and service life.Heat pipe
Powered simultaneously as conductive channel to LED chip, the both positive and negative polarity of LED chip is respectively welded at two heat pipes of electrically insulated from one another
On, the new structure of this thermoelectric integral has fundamental difference with current thermoelectricity isolating construction.
Claims (10)
- A kind of 1. LED car lamp heat conduction encapsulating structure, it is characterised in that：Including LED chip, at least two heat pipes, adjacent heat pipe it Between mutually insulated；The LED chip is arranged on two adjacent heat pipes, the positive and negative electrode of LED chip respectively with a wherein heat Pipe connects, and conductive channel of the heat pipe as LED chip, the LED chip is flip-chip.
- 2. LED car lamp heat conduction encapsulating structure as claimed in claim 1, it is characterised in that：The one end on the surface of the heat pipe applies A group layer is covered with, the region that solder mask is reserved with welding LED chip dissipates as pad, the other end of the tube surface for connection Backing area.
- 3. LED car lamp heat conduction encapsulating structure as claimed in claim 1, it is characterised in that：Pass through insulating sticky between adjacent heat pipe Connect layer connection.
- 4. LED car lamp heat conduction encapsulating structure as claimed in claim 3, it is characterised in that：It is described insulation adhesive linkage thickness with Gap size between the both positive and negative polarity of LED chip is same or equivalent.
- 5. LED car lamp heat conduction encapsulating structure as claimed in claim 3, it is characterised in that：It is described insulation adhesive linkage thickness be 0.1~0.3mm.
- 6. LED car lamp heat conduction encapsulating structure as claimed in claim 1, it is characterised in that：The heat pipe into it is single setting or it is more Row is set.
- 7. LED car lamp heat conduction encapsulating structure as claimed in claim 1, it is characterised in that：The unilateral installation LED core of adjacent heat pipe LED chip is all installed in piece, or both sides.
- 8. LED car lamp heat conduction encapsulating structure as claimed in claim 1, it is characterised in that：The mounting means of LED chip is tin cream Weldering, eutectic weldering are bonded with elargol.
- 9. a kind of LED car lamp, including radiator and the LED car lamp heat conduction encapsulation described in claim 1-8 any claims Structure, the heat pipe of the LED car lamp heat conduction encapsulating structure are connected with radiator.
- A kind of 10. manufacture method of LED car lamp heat conduction encapsulating structure, it is characterised in that including：Heat pipe is bonded：Two sections of heat pipes are bonded together side by side, insulated between heat pipe；One end of heat pipe sets solder mask, the end The pad of reserved installation LED chip, the other end of heat pipe is connection heat sink area；LED chip is welded：LED chip is arranged on the pad reserved on adjacent heat pipe, the positive and negative electrode of LED chip respectively with A wherein heat pipe connection；Fluorescent material is coated with LED chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711183083.2A CN107845722A (en) | 2017-11-23 | 2017-11-23 | A kind of LED car lamp heat conduction encapsulating structure, LED car lamp and manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711183083.2A CN107845722A (en) | 2017-11-23 | 2017-11-23 | A kind of LED car lamp heat conduction encapsulating structure, LED car lamp and manufacture method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107845722A true CN107845722A (en) | 2018-03-27 |
Family
ID=61679194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711183083.2A Pending CN107845722A (en) | 2017-11-23 | 2017-11-23 | A kind of LED car lamp heat conduction encapsulating structure, LED car lamp and manufacture method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107845722A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108461613A (en) * | 2018-05-31 | 2018-08-28 | 深圳市瑞丰光电紫光技术有限公司 | A kind of UV-LED light sources and its lamps and lanterns |
| CN110701584A (en) * | 2019-11-12 | 2020-01-17 | 深圳市欣上科技有限公司 | Method for manufacturing light-emitting diode light source and method for manufacturing light-emitting diode car lamp |
| WO2020048766A1 (en) * | 2018-09-07 | 2020-03-12 | Lumileds Holding B.V. | Support for light-emitting elements and lighting device |
| FR3107752A1 (en) * | 2020-02-28 | 2021-09-03 | Valeo Iluminacion | Automotive lighting device |
| WO2021225804A1 (en) * | 2020-05-07 | 2021-11-11 | Lumileds Llc | Lighting device comprising support structure with improved thermal and optical properties |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101097978A (en) * | 2007-06-26 | 2008-01-02 | 上海大学 | Copper inter-linkage flip-chip LED and its preparing process |
| CN101344232A (en) * | 2008-02-13 | 2009-01-14 | 和谐光电科技（泉州）有限公司 | Surface type LED lamp |
| CN201339833Y (en) * | 2008-12-24 | 2009-11-04 | 和谐光电科技（泉州）有限公司 | Packaging structure of surface package type light emitting diode lamp |
| CN106784274A (en) * | 2017-01-05 | 2017-05-31 | 格瑞电子（厦门）有限公司 | A kind of LED component of positive and negative separation, automobile lamp and flashlight |
-
2017
- 2017-11-23 CN CN201711183083.2A patent/CN107845722A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101097978A (en) * | 2007-06-26 | 2008-01-02 | 上海大学 | Copper inter-linkage flip-chip LED and its preparing process |
| CN101344232A (en) * | 2008-02-13 | 2009-01-14 | 和谐光电科技（泉州）有限公司 | Surface type LED lamp |
| CN201339833Y (en) * | 2008-12-24 | 2009-11-04 | 和谐光电科技（泉州）有限公司 | Packaging structure of surface package type light emitting diode lamp |
| CN106784274A (en) * | 2017-01-05 | 2017-05-31 | 格瑞电子（厦门）有限公司 | A kind of LED component of positive and negative separation, automobile lamp and flashlight |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108461613A (en) * | 2018-05-31 | 2018-08-28 | 深圳市瑞丰光电紫光技术有限公司 | A kind of UV-LED light sources and its lamps and lanterns |
| WO2020048766A1 (en) * | 2018-09-07 | 2020-03-12 | Lumileds Holding B.V. | Support for light-emitting elements and lighting device |
| CN111226072A (en) * | 2018-09-07 | 2020-06-02 | 亮锐控股有限公司 | Support for light emitting elements and lighting devices |
| CN111226072B (en) * | 2018-09-07 | 2021-07-13 | 亮锐控股有限公司 | Support for light emitting elements and lighting devices |
| US11266017B2 (en) | 2018-09-07 | 2022-03-01 | Lumileds Llc | Support for light-emitting elements and lighting device |
| CN110701584A (en) * | 2019-11-12 | 2020-01-17 | 深圳市欣上科技有限公司 | Method for manufacturing light-emitting diode light source and method for manufacturing light-emitting diode car lamp |
| FR3107752A1 (en) * | 2020-02-28 | 2021-09-03 | Valeo Iluminacion | Automotive lighting device |
| WO2021225804A1 (en) * | 2020-05-07 | 2021-11-11 | Lumileds Llc | Lighting device comprising support structure with improved thermal and optical properties |
| US20230235862A1 (en) * | 2020-05-07 | 2023-07-27 | Lumileds Llc | Lighting device comprising support structure with improved thermal and optical properties |
| US11821591B2 (en) * | 2020-05-07 | 2023-11-21 | Lumileds Llc | Lighting device comprising support structure with improved thermal and optical properties |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107314258B (en) | LED bulb lamp | |
| CN107170733B (en) | LED filament and LED bulb lamp thereof | |
| CN107845722A (en) | A kind of LED car lamp heat conduction encapsulating structure, LED car lamp and manufacture method | |
| TWI332067B (en) | ||
| US20130250585A1 (en) | Led packages for an led bulb | |
| US20080296590A1 (en) | LED-Based Light Source Having Improved Thermal Dissipation | |
| CN201412704Y (en) | Light source of integrated LED chip | |
| CN101614333A (en) | High-efficiency radiating LED illumination light source and manufacture method | |
| CN105387355A (en) | Parallel-connection type light emitting diode (LED) illuminants and LED illuminating lamp | |
| CN101532612A (en) | Method for manufacturing integrated LED chip light source | |
| WO2013139295A1 (en) | Led bulb-type lamp having strong heat dissipation capability and manufacturing method thereof | |
| CN202405323U (en) | Structure for directly packaging LED chips on vapor chamber and lamp employing same | |
| US20110122630A1 (en) | Solid State Lamp Having Vapor Chamber | |
| CN207602619U (en) | A kind of LED car lamp heat conduction encapsulating structure, LED car lamp | |
| CN202013881U (en) | Integrated packaging structure with vertically structured LED chips | |
| CN110165035B (en) | Manufacturing method of semiconductor diode chip packaging structure | |
| CN101457917A (en) | High heat radiation optical module of LED and method for making same | |
| CN201443693U (en) | LED light source module | |
| CN206349387U (en) | LED lamp bead structure based on ceramet substrate | |
| CN201412705Y (en) | High-efficiency heat radiating LED lighting light source | |
| CN203560754U (en) | LED bulb lamp | |
| CN104061464B (en) | High-power LED lamp | |
| CN203836739U (en) | Silicon-substrate LED road lamp light source module | |
| CN202633383U (en) | Integrally-packaged light-emitting diode (LED) illumination lamp | |
| JP3180453U (en) | Integrated high-efficiency lighting device with multilayer structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |