CN101457917A - High heat radiation optical module of LED and method for making same - Google Patents
High heat radiation optical module of LED and method for making same Download PDFInfo
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- CN101457917A CN101457917A CNA2007101722344A CN200710172234A CN101457917A CN 101457917 A CN101457917 A CN 101457917A CN A2007101722344 A CNA2007101722344 A CN A2007101722344A CN 200710172234 A CN200710172234 A CN 200710172234A CN 101457917 A CN101457917 A CN 101457917A
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Abstract
The invention relates to a high heat radiating light module of a light emitting diode and a production method thereof. The module comprises radiating base material, a printed circuit board, an electric conductor, an electric insulator, a light-emitting element, metal wires and encapsulation adhesive. The radiating base material is provided with a through hole; the electric conductor is arranged in the through hole and coated with the electric insulator; one end of the electric conductor is connected with the printed circuit board and then a radiating base board with a light emitting diode composite structure is formed; subsequently, the light-emitting element is attached to the radiating base material and connected with the electric conductor by the metal wires; the encapsulation adhesive is used for encapsulation; and then the high heat radiating light module of the light emitting diode is formed. The light-emitting body can also be formed by the combination of the light-emitting element, the metal wires and the encapsulation adhesive; or light-emitting elements of red light, blue light and green light are combined to adjust the colors of the light-emitting body by controlling the input electrical signals.
Description
Technical field
The invention relates to the height heat radiation optical mode group and the preparation method of light-emittingdiode, be one to comprise the composite construction of electric substrate and heat radiation module function, characteristic with the heat conduction of managing independently and conduction, and can dwindle the area of the height heat radiation optical mode group of whole light-emittingdiode, increase its level of application.The height of this light-emittingdiode heat radiation optical mode group and then can be chimeric with existing tube face is to form the bulb that illumination is used.
Background technology
Light-emittingdiode tool long service life, brightness height, luminous efficiency height and the low characteristic of power consumption, and its impact resistance height, reaction speed are fast, color recognition height, color rendering are good, have the traditional lighting of replacement light source, become the potential of following lighting source main flow.But at present the package design of light-emittingdiode bulb causes the interface resistance that a plurality of package interface is arranged on the heat dissipation path and produce still to be encapsulated as the basis at many levels, particularly accumulates on the printed circuit board (PCB) and reduces radiating efficiency.Because the problems affect that radiating effect is not good, the temperature of light-emittingdiode can't effectively reduce, and can reduce the luminous efficiency and the service life of light-emittingdiode.
In addition, when increasing the quantity of light-emittingdiode in order to improve brightness, also must increase the number of electrodes of feed-in power supply simultaneously, not only can produce outside the problem of aforementioned poor heat radiation, also can produce the problem that the electrode configuration is difficult for and entire area enlarges.
In addition, also have in the known techniques light-emittingdiode is electrically connected mutually with heat radiating material, using provides the ground connection signal.But thus, this heat radiating material has the function of heat radiation and ground connection simultaneously concurrently, but easily because heat radiating material is when contacting with other conductors and cause the short circuit effect, thereby make the infringement of whole light-emittingdiode, reduce the product yield, therefore allow the shape of heat radiating material, size limited on the contrary.
Moreover, though light-emittingdiode provides the usefulness of illumination gradually,, not only hinder light-emittingdiode and be used in lighting use with the present light fixture that uses and incompatible, more need spend great amount of cost changes light fixture equipment and is used in lighting use to reach light-emittingdiode, quite uneconomical also not environmental protection.
Summary of the invention
In order to solve the shortcoming that prior art is mentioned, main purpose of the present invention is by light-emitting component (the particularly naked Jingjing sheet of light-emittingdiode) directly is encapsulated in (chip onheat-dissipating board) on the heat radiating material structure, design a kind of composite construction and packaged type with heat radiation module function, make the height heat radiation optical mode group of the light-emittingdiode of the high and stable height of thermal conductivity, thereby avoid heat energy to accumulate the service life that in printed circuit board (PCB), also can prolong light-emitting component.
A kind of heat radiating material that provides light-emittingdiode and printed circuit board (PCB) directly to electrically conduct mutually is provided in the present invention's time purpose system, thereby dwindles the area of the height heat radiation optical mode group of whole light-emittingdiode, increases its level of application.
The present invention's a purpose again system provides the height heat radiation optical mode group of a light-emittingdiode, when avoiding heat radiating material to contact and cause the short circuit effect with other conductors, thus raising product yield.
The present invention's another purpose system can be directly chimeric with existing tube face with the height heat radiation optical mode group of light-emittingdiode, need not to change existing light fixture equipment and get final product height with this light-emittingdiode optical mode group of dispelling the heat and directly apply to the advantage of illumination.
The preparation method of the height heat radiation optical mode group of this light-emittingdiode is that a heat radiating material is provided earlier, and this heat radiating material has the through hole more than; Provide more than one peripheral and coat the electric conductor of electrical insulator and be mounted in the through hole of this heat radiating material, this electric conductor is column structure and its two ends evaporation metal as electrode; One printed circuit board (PCB) is provided, has the electrode more than on this printed circuit board (PCB), and the electrode of electric conductor one end electrically connected mutually with electrode on this printed circuit board (PCB), thereby this heat radiating material and this printed circuit board (PCB) form the light-emittingdiode composite construction heat-radiating substrate of tool heat conduction and conductive characteristic; Light-emitting component afterwards is provided and is attached on the heat radiating material; Then provide plain conductor that the electrode of light-emitting component is engaged (wire bond) mode with the electrode of electric conductor one end with routing and do electric connection, and form a complete electric loop, make electric current energy mutual conduction, add phosphor powder at last again, and use the material of packaging plastic as encapsulation, with height of the light-emittingdiode that the forms the present invention optical mode group of dispelling the heat.
In addition, about the combination of heat radiating material and electric conductor and electrical insulator, can earlier electrical insulator be coated on enclose outside this electric conductor after, integral body is filled in the through hole of this heat radiating material again.The second way then is electric conductor and electrical insulator to be taken up in order of priority insert in the through hole of this heat radiating material, this electrical insulator can be a form of powdery particles and between this electric conductor and this heat radiating material, afterwards again through high temperature sintering by electric conductor, electrical insulator and the heat radiating material one of combining closely.The third is that a heat radiating material is provided with heat radiating material and electric conductor and electrical insulator combination, and this heat radiating material comprises first, second; Face second face in first of this heat radiating material afterwards and be arranged with a cannelure, entreat this electric conductor that then is shaped among this cannelure; Again electrical insulator is filled between this Baltimore groove, again through high temperature sintering by electric conductor, electrical insulator and the heat radiating material one of combining closely; Afterwards second of this heat radiating material being faced first reduces thickness, thereby allows this electric conductor and electrical insulator be revealed in this second by mill, mode such as scrape or dig again.
Description of drawings
Fig. 1 is the STRUCTURE DECOMPOSITION figure of the present invention's first preferred embodiment.
Fig. 2 A is heat radiating material and the peripheral decomposing schematic representation that coats the electric conductor of electrical insulator.
Fig. 2 B is the peripheral profile that coats the electric conductor of electrical insulator.
Fig. 3 A is mounted on behind the heat radiating material decomposing schematic representation with printed circuit board (PCB) for the peripheral electric conductor that coats electrical insulator.
Fig. 3 B is the generalized section that heat radiating material and printed circuit board (PCB) group are set as light-emittingdiode composite construction heat-radiating substrate.
Fig. 3 C is the enlarged diagram of the I part of 3B figure.
Fig. 4 is the profile that installs light-emitting component additional and finish encapsulation on light-emittingdiode composite construction heat-radiating substrate.
Fig. 5 A installs illuminator for the present invention's the sharp exploded view of the second preferable enforcement additional on light-emittingdiode composite construction heat-radiating substrate.
Fig. 5 B is the illuminator profile among the 5A figure.
Fig. 6 is mounted on the profile of existing tube face for the height heat radiation optical mode group of the present invention's light-emittingdiode.
Fig. 7 is mounted on the cut-away section side view of the existing tube face of another kind for the height heat radiation optical mode group of the present invention's light-emittingdiode.
Fig. 8 is the schematic diagram of Fig. 7 in the peripheral finned of lampshade of tube face.
Fig. 9 A is arranged with the profile of cannelure for this heat radiating material.
Fig. 9 B is Fig. 9 A fills this electrical insulator in cannelure a profile.
Fig. 9 C for second of the heat radiating material of Fig. 9 B via mill, scrape or dig the heat radiating material profile of back.
The specific embodiment
Embodiments of the present invention are described in detail as follows.Yet except this was described in detail, the present invention can also carry out at other embodiment widely.That is scope of the present invention is not subjected to the restriction of the embodiment that proposed, and should be as the criterion with the claim of the present invention's proposition.Moreover in the middle of the following description, the different piece of each element is not drawn according to size, and some yardstick is compared with other scale dependents and exaggerated, so that clearer description and understanding of the present invention to be provided.
See also shown in Figure 1, be the STRUCTURE DECOMPOSITION figure of first preferred embodiment of the height of light-emittingdiode of the present invention heat radiation optical mode group 1, height of this light-emittingdiode optical mode group 1 primary structure that dispels the heat includes: heat radiating material 10, electric conductor 21 and be coated on electrical insulator 20, printed circuit board (PCB) 30, light-emitting component 40, plain conductor 50 and the packaging plastic 60 of its periphery.
See also shown in Fig. 2 A, the 2B, this heat radiating material 10 is the metal material of column, and shape can be cylindrical or square column type, is to be example with cylindrical in first preferred embodiment.The material of this heat radiating material 10 can be fine copper or copper alloy, fine aluminium or aluminium alloy or copper and the formed composite of aluminum metal, comprises first 11, second 12 and a plurality of through hole 13 that runs through first 11 and second 12.This electric conductor 21 is to be used for conduct power and to be column structure, its peripheral electrical insulator 20 that coats, and the top 211 of this electric conductor 21 and bottom 212 be evaporation one metal level all, uses as electrode 25 with the conducting electric current; This electrical insulator 20 can be macromolecular material, ceramic material or aforementioned both composite.And the metal of evaporation in these electric conductor 21 two ends can be gold or silver-colored.Thereby the electric conductor 21 that should the periphery coats electrical insulator 20 is mounted in the through hole 13 of this heat radiating material 10 and is combined into one, and make first 11 of contiguous these heat radiating materials 10 in top 211 of this electric conductor 21, and second 12 of bottom 212 contiguous these heat radiating materials 10 of this electric conductor 21.
See also shown in Fig. 3 A, 3B and the 3C, this heat radiating material 10, peripheral electric conductor 21 and the printed circuit board (PCB) 30 that coats electrical insulator 20 can form a light-emittingdiode composite construction heat-radiating substrate P, and wherein this printed circuit board (PCB) 30 comprises upper face 31, a plurality of electrode 32 and first input electrode 33 and second input electrode 34 that is mounted on this upper face 31.In this plurality of electrodes 32, a part of electrically connects mutually with first input electrode 33,32 at other electrode and second is failed path electrode 34 and is electrically connected mutually, and the electric signal of using the outside conducts to electrode 32 through first and second input electrode 33,34.Second 12 upper face 31 with this printed circuit board (PCB) 30 of this heat radiating material 10 is relative, thereby allow the electrode 25 on the bottom 212 of electric conductor 21 electrically connect mutually with the electrode 32 of the upper face 31 of this printed circuit board (PCB) 30, and 32 at the electrode that binds the upper face 31 of mode or the electrode 25 on the bottom 212 of electric conductor 21 and this printed circuit board (PCB) 30 by the contraposition of emplastics such as screw closure mode, resin is integral by heat radiating material 10 and printed circuit board (PCB) 30 secure bond through the scolding tin welding manner, and forms a light-emittingdiode composite construction heat-radiating substrate P.Please refer to Fig. 3 B, this preferred embodiment promptly is integral heat radiating material 10 and printed circuit board (PCB) 30 secure bond by locking mode with screw S, and forms a light-emittingdiode composite construction heat-radiating substrate P; And this first and second input electrode 33,34 be positioned at upper face 31 to the side, it is equipped to be convenient to subsequent conditioning circuit.
See also shown in Figure 4ly, this light-emitting component 40 includes electrode 41 and will not have partly pasting of electrode 41 and is fixed on first 11 of heat radiating material 10, and fixed form can be used tin cream, conductive silver glue to stick together or fix with the mode of soldering.This light-emitting component 40 can be naked Jingjing sheet of light-emittingdiode or illuminator 8 (knowing clearly as described later).Then use plain conductor 50, the one end is electrically connected at the electrode 41 of light-emitting component 40, the other end is electrically connected at the electrode 25 on the top 211 of electric conductor 21, to form a complete electric loop.In this preferred embodiment, each light-emitting component 40 two electric conductors 21 of all arranging in pairs or groups, one of them is that electric signal is provided, another then provides the ground connection signal, thereby forms a complete electric loop.In addition, can also provide the ground connection signal to a plurality of light-emitting components 40 by an electric conductor 21, thereby these a plurality of light-emitting components 40 will form parallel-connection structure.In like manner, can also provide electric signal to a plurality of light-emitting components 40 by an electric conductor 21, thereby these a plurality of light-emitting components 40 will form parallel-connection structure.
The problem of oxidation that when plain conductor 50 uses in atmosphere, is produced, then can use the material of packaging plastic 60 as encapsulation, this packaging plastic 60 can be silica gel, and the encapsulation scope mainly comprises first 11 of heat radiating material 10, minimum electrode 25, light-emitting component 40, the plain conductor 50 that should contain the top 211 of electric conductor 21, thereby make aforementioned components and atmospheric isolation, with height of the light-emittingdiode that the forms the present invention optical mode group 1 of dispelling the heat.Can add the periphery of phosphor powder 70 in addition in light-emitting component 40, the adding purpose of this phosphor powder 70 is the colors that are used to change the light that light-emitting component 40 sent, therefore phosphor powder 70 is for can add or not add, and the interpolation of phosphor powder 70 order can begin to encapsulate in encapsulating to add separately before or mix the back with packaging plastic 60 in addition.
Except above-mentioned use light-emitting component 40 and plain conductor 50, see also shown in Fig. 5 A, also light-emitting component 40 and plain conductor 50 can be packaged into illuminator 8, and directly soldering or be bonding on first 11 of heat radiating material 10 of light-emittingdiode composite construction heat-radiating substrate P, and become the present invention's second preferred embodiment.Please refer to Fig. 5 B, this illuminator 8 comprises substrate 81, radiating seat 82, the light-emitting component 40 more than, a plurality of plain conductor 50, two electrode terminals 83,84 and packaging plastics 60.This substrate 81 is an insulator, comprises first 811, through hole 812 and is mounted on first 811 circuit 813; This radiating seat 82 is a column, is mounted in the through hole 812 of this substrate 81, comprises end face 821 and bottom surface 822; This light-emitting component 40 fits in the end face 821 of this radiating seat 82, and by the circuit 813 on plain conductor 50 these light-emitting components 40 of connection and the substrate 81; This electrode terminal 83,84 is connected to the circuit 813 on the substrate 81, and using provides electric signal input, afterwards with packaging plastic 60 first 811 of substrate 81 is coated encapsulation again.In addition, this light-emitting component 40 fits in the end face 821 of this radiating seat 82 after can being made up with the light-emitting component 40 of the ruddiness of the different colours of number, blue light, green glow, and adjusts the color of this illuminator 8 by control input electric signal size.
Please again referring to Fig. 5 A, this illuminator 8 is fitted on first 11 of heat radiating material 10, this moment, the bottom surface 822 of this radiating seat 82 will fit with first 11 of heat radiating material 10, using the thermal source that light-emitting component 40 is produced conducts, and make the electrode terminal 83,84 of this illuminator 8 electrically connect with the end face 211 of electric conductor 21 respectively, height that forms the light-emittingdiode optical mode group 1 of dispelling the heat.
See also shown in Fig. 6,7, the height heat radiation optical mode group 1 of light-emittingdiode can be installed on the existing tube face 9, directly steep as illuminator lamp.
This tube face 9 comprises metal material and is the lamp socket 91 of tubular and is fixed in one of lamp socket 91 side and cup-shaped lampshade 92, this lampshade 92 comprises the inboard 921 and the outside 922, and the height heat radiation optical mode group 1 of this light-emittingdiode is mounted in these lampshade 92 inboard spaces that surrounded.This lampshade 92 is by ceramic material or insulator that macromolecular material formed, also can be metal material, within this lampshade 92 side 921 can aluminize, metal such as nickel or silver and form reflective surface, its objective is that light that the height heat radiation optical mode group 1 that makes light-emittingdiode is sent has increases and the effect of optically focused.And comprise the first electric signal input 911 and the second electric signal input 912 on this lamp socket 91, all electrically connects mutually with first and second input electrode 33,34 of the printed circuit board (PCB) 30 of the height of light-emittingdiode heat radiation optical mode group 1 respectively, the height that provides electric signal the to make light-emittingdiode optical mode group 1 of dispelling the heat is provided is able to luminous via lead 913.
See also shown in Figure 8, can be in lampshade 92 outsides of tube face 9 922 applying fin 93, this fin 93 comprises a pedestal 931 and a plurality of fin 932 that is parallel to each other and separates and be vertically connected at this pedestal 931, uses the function that increases its heat radiation.
The preparation method of the height heat radiation optical mode group 1 of the present invention's light-emittingdiode, its step comprises provides a heat radiating material 10, this heat radiating material 10 to comprise first 11, second 12 and a plurality of through hole 13 that runs through first 11 and second 12; A plurality of peripheral electric conductors 21 that coat electrical insulator 20 are provided, and are mounted in the through hole 13 of this heat radiating material 10, respectively this electric conductor 21 is column structure; One printed circuit board (PCB) 30 is provided, and this printed circuit board (PCB) 30 comprises upper face 31 and is mounted on the plurality of electrodes 32 of this upper face 31; One of relative and electric conductor 21 end electrically connects with this electrode 32 with second 12 of this heat radiating material 10 upper face 31 with this printed circuit board (PCB) 30; Light-emitting component 40 more than one is provided, comprises electrode 41 on it, and this light-emitting component 40 is pasted on first 11 that is fixed in heat radiating material 10; A plurality of plain conductors 50 are provided, and electrode 41, one ends that the one end is electrically connected at this light-emitting component 40 are electrically connected at electric conductor 21 end that one of is not connected with the electrode 32 of printed circuit board (PCB) 30; Provide packaging plastic 60 to encapsulate.These packaging plastic 60 encapsulation scopes mainly comprise first 11 of heat radiating material 10, minimum top 211, light-emitting component 40, the plain conductor 50 that should contain the conductor 21 that conducts electricity.Periphery that phosphor powder 70 makes an addition to light-emitting component 40 can be provided in addition or mix use with packaging plastic 60.
In addition, about the combination of heat radiating material 10 with electric conductor 21 and electrical insulator 20, can earlier electrical insulator 20 be coated on enclose outside this electric conductor 21 after, integral body is filled in the through hole 13 of this heat radiating material 10 again.The second way then is that electric conductor 21 and electrical insulator 20 are taken up in order of priority in the through hole 13 of inserting this heat radiating material 10, this electrical insulator 20 can be form of powdery particles and between this electric conductor 21 and this heat radiating material 10, afterwards again through high temperature sintering by electric conductor 21, electrical insulator 20 and heat radiating material 10 one of combining closely.
Please refer to Fig. 9 A to 9C, is the third with heat radiating material 10 and electric conductor 21 and electrical insulator 20 combinations, and a heat radiating material 10 is provided, and this heat radiating material 10 comprises first 11, second 12; Be arranged with a cannelure 14 in first 11 of this heat radiating material 10 towards second 12 afterwards, centre this electric conductor 21 that then is shaped among this cannelure 14; Again electrical insulator 20 is filled in 14 of this cannelures, again through high temperature sintering by electric conductor 21, electrical insulator 20 and heat radiating material 10 one of combining closely; Afterwards again second 12 of this heat radiating material 10 is reduced thickness, thereby allow this electric conductor 21 be revealed in this second 12 with electrical insulator 20 by mill, mode such as scrape or dig towards first 11.
As mentioned above, the present invention directly is encapsulated in light-emitting component 40 on the heat radiating material 10, designs a kind of height heat radiation optical mode group 1 with light-emittingdiode of the good and stable height of heat radiation, thereby successfully reaches the present invention's main purpose.
Again, electrode on the printed circuit board (PCB) 30 32 is designed side under heat radiating material 10, make the electrode 41 on the light-emitting component 40 directly to electrically connect by the electrode 32 on electric conductor in the heat radiating material 10 21 and the printed circuit board (PCB) 30, thereby dwindle the area of the height heat radiation optical mode group 1 of whole light-emittingdiode, increase its level of application, successfully reach the present invention's a time purpose.
Again, each light-emitting component 40 of the height of light-emittingdiode heat radiation optical mode group 1 two electric conductors 21 of all arranging in pairs or groups, one of them is that electric signal is provided, another then provides the ground connection signal, and do not use heat radiating material 10 that the ground connection signal is provided, thereby the short circuit effect that is caused when avoiding heat radiating material 10 to contact with other conductors successfully reaches the present invention's a purpose again.
Again, the height of light-emittingdiode heat radiation optical mode group 1 can be directly chimeric with existing tube face 9, need not to change existing light fixture equipment and the height heat radiation optical mode group 1 of this light-emittingdiode directly can be applied to illumination, successfully reaches the present invention's another purpose.
The above only is the present invention's better embodiment, is not in order to limit the present invention's claim.Still can be changed in the category of the flesh and blood that does not break away from the present invention and implemented, these variations should still belong to the present invention's scope.Therefore, the present invention's category system is defined by following claim.
Claims (28)
1. the height of light-emittingdiode heat radiation optical mode group is that illumination, luminous usefulness are provided, and it is characterized in that, comprises:
Heat radiating material is the metal material of column, comprises first, second and a plurality of through hole that runs through first and second;
Electric conductor in a plurality of through holes that are mounted on this heat radiating material, respectively this electric conductor becomes column structure and its peripheral electrical insulator that coats;
Printed circuit board (PCB) comprises upper face and is mounted on the plurality of electrodes of this upper face, and one of relative and electric conductor of this upper face and this heat radiating material second end electrically connects mutually with this electrode;
Electrode is gone up and comprised to light-emitting component more than one for first that is mounted on this heat radiating material;
A plurality of plain conductors, an end is electrically connected at this light-emitting element electrode, and an end is electrically connected at the electric conductor end that one of is not connected with the electrode of printed circuit board (PCB); And
Packaging plastic covers first of heat radiating material.
2. the height of light-emittingdiode according to claim 1 heat radiation optical mode group is characterized in that this heat radiating material is fine copper or copper alloy, fine aluminium or aluminium alloy or copper and the formed composite of aluminum metal.
3. the height of light-emittingdiode according to claim 1 heat radiation optical mode group is characterized in that the two ends of this electric conductor can be gold-plated or silver-colored.
4. the height of light-emittingdiode according to claim 1 heat radiation optical mode group is characterized in that, this electrical insulator comprises macromolecular material, ceramic material or aforementioned both composite.
5. the height of light-emittingdiode according to claim 1 heat radiation optical mode group is characterized in that, can stick together the affixed one of mode of fitting or welding the WU welding by screw closure, resin between this heat radiating material and this printed circuit board (PCB).
6. the height of light-emittingdiode according to claim 1 heat radiation optical mode group is characterized in that, can add the periphery of phosphor powder in light-emitting component in addition.
7. the height of light-emittingdiode according to claim 1 heat radiation optical mode group is characterized in that this packaging plastic can add phosphor powder in addition and mix with it.
8. the height of light-emittingdiode according to claim 1 heat radiation optical mode group is characterized in that, this light-emitting component can stick together or be fixed on the heat radiating material with the mode of soldering with tin cream, conductive silver glue.
9. the height of light-emittingdiode according to claim 1 heat radiation optical mode group, it is characterized in that, can be mounted in the tube face in addition, this tube face comprises metal material and is the lamp socket of tubular and is fixed in one of lamp socket side and cup-shaped lampshade, this lampshade comprises the inboard and the outside, and the height heat radiation optical mode group of this light-emittingdiode is mounted in the inboard space that is surrounded of this lampshade.
10. as the height heat radiation optical mode group of the light-emittingdiode as described in the claim 9, it is characterized in that can aluminize in this lampshade inboard, nickel or silver are thought reflector layer.
11. the height heat radiation optical mode group as the light-emittingdiode as described in the claim 9 is characterized in that, but the outside finned of this lampshade, and this fin comprises a pedestal and a plurality of fin that is parallel to each other and separates and be vertically connected at this pedestal.
12. the height of light-emittingdiode heat radiation optical mode group is that illumination, luminous usefulness are provided, and it is characterized in that, comprises:
Heat radiating material is the metal material of column, comprises first, second and a plurality of through hole that runs through first and second;
Electric conductor in a plurality of through holes that are mounted on this heat radiating material, respectively this electric conductor becomes column structure and its peripheral electrical insulator that coats;
Printed circuit board (PCB) comprises upper face and is mounted on the plurality of electrodes of this upper face, and one of relative and electric conductor of this upper face and this heat radiating material second end electrically connects mutually with this electrode; And
Illuminator more than one is mounted on first of this heat radiating material, comprises substrate, radiating seat, the light-emitting component more than, a plurality of plain conductor, two electrode terminals and packaging plastic; This substrate is an insulator, comprises first, through hole and is mounted on first circuit; This radiating seat is a column, is mounted in the through hole of this substrate, comprises end face and bottom surface, and first face of this bottom surface and heat radiating material fits; This light-emitting component fits in the end face of this radiating seat, and connects circuit on this light-emitting component and the substrate by plain conductor; This electrode terminal one end is connected to the circuit on the substrate, and the other end is connected in the other end that electric conductor does not electrically connect mutually with the electrode of printed circuit board (PCB); And this packaging plastic covers first of this substrate.
13. the height heat radiation optical mode group as the light-emittingdiode as described in the claim 12 is characterized in that this heat radiating material is fine copper or copper alloy, fine aluminium or aluminium alloy or copper and the formed composite of aluminum metal.
14. the height heat radiation optical mode group as the light-emittingdiode as described in the claim 12 is characterized in that the two ends of this electric conductor can be gold-plated or silver-colored.
15. the height heat radiation optical mode group as the light-emittingdiode as described in the claim 12 is characterized in that, this electrical insulator comprises macromolecular material, ceramic material or aforementioned both composite.
16. the height heat radiation optical mode group as the light-emittingdiode as described in the claim 12 is characterized in that, can stick together by screw closure, resin between this heat radiating material and this printed circuit board (PCB) and fit or the affixed one of mode that weldering WU welds.
17. the height heat radiation optical mode group as the light-emittingdiode as described in the claim 12 is characterized in that, can add the periphery of phosphor powder in light-emitting component in addition.
18. the height heat radiation optical mode group as the light-emittingdiode as described in the claim 12 is characterized in that this packaging plastic can add phosphor powder in addition and mix with it.
19. the height heat radiation optical mode group as the light-emittingdiode as described in the claim 12 is characterized in that, this light-emitting component can stick together or be fixed on the radiating seat with the mode of soldering with tin cream, conductive silver glue.
20. height heat radiation optical mode group as the light-emittingdiode as described in the claim 12, it is characterized in that, can be mounted in the tube face in addition, this tube face comprises metal material and is the lamp socket of tubular and is fixed in one of lamp socket side and cup-shaped lampshade, this lampshade comprises the inboard and the outside, and the height heat radiation optical mode group of this light-emittingdiode is mounted in the inboard space that is surrounded of this lampshade.
21. the height heat radiation optical mode group as the light-emittingdiode as described in the claim 20 is characterized in that, can aluminize in this lampshade inboard, nickel or silver.
22. the height heat radiation optical mode group as the light-emittingdiode as described in the claim 20 is characterized in that, but the outside finned of this lampshade, and this fin comprises a pedestal and a plurality of fin that is parallel to each other and separates and be vertically connected at this pedestal.
23. the preparation method of the height of light-emittingdiode heat radiation optical mode group, its step comprises:
One heat radiating material is provided, and this heat radiating material comprises first, second and a plurality of through hole that runs through first and second;
A plurality of electric conductors that are column structure are provided, are mounted in the through hole of this heat radiating material, respectively the peripheral electrical insulator that coats of this electric conductor;
One printed circuit board (PCB) is provided, and this printed circuit board (PCB) comprises upper face and is mounted on the plurality of electrodes of this upper face;
One of relative and electric conductor end electrically connects mutually with this electrode with second upper face with this printed circuit board (PCB) of this heat radiating material;
The light-emitting component that comprises electrode more than one is provided, and this light-emitting component pasted is fixed on the heat radiating material;
A plurality of plain conductors are provided, and the one end is electrically connected at the electrode of this light-emitting component, and an end is electrically connected at the electric conductor end that one of is not connected with the electrode of printed circuit board (PCB); And
Provide a packaging plastic to encapsulate, and cover first of heat radiating material.
24. the height heat radiation optical mode group manufacture method as the light-emittingdiode as described in the claim 23 is characterized in that, periphery that a phosphor powder makes an addition to light-emitting component can be provided in addition or mix use with packaging plastic.
25. the preparation method of the height of light-emittingdiode heat radiation optical mode group, its step comprises:
One heat radiating material is provided, and this heat radiating material comprises first, second and a plurality of through hole that runs through first and second;
A plurality of electric conductors that are column structure are provided, are mounted in the through hole of this heat radiating material;
Electrical insulator is provided, is filled in this through hole, and isolate this electric conductor and heat-radiating substrate;
Provide a high temperature sintering program allow electric conductor, electrical insulator and the heat radiating material one of combining closely;
One printed circuit board (PCB) is provided, and this printed circuit board (PCB) comprises upper face and is mounted on the plurality of electrodes of this upper face;
One of relative and electric conductor end electrically connects mutually with this electrode with second upper face with this printed circuit board (PCB) of this heat radiating material;
The light-emitting component that comprises electrode more than one is provided, and this light-emitting component pasted is fixed on the heat radiating material;
A plurality of plain conductors are provided, and the one end is electrically connected at the electrode of this light-emitting component, and an end is electrically connected at the electric conductor end that one of is not connected with the electrode of printed circuit board (PCB); And
Provide a packaging plastic to encapsulate, and cover first of heat radiating material.
26. the height heat radiation optical mode group manufacture method as the light-emittingdiode as described in the claim 25 is characterized in that, periphery that a phosphor powder makes an addition to light-emitting component can be provided in addition or mix use with packaging plastic.
27. the preparation method of the height of light-emittingdiode heat radiation optical mode group, its step comprises:
One heat radiating material is provided, and this heat radiating material comprises first, second, and this first faces second mask one cannelure is arranged, the centre electric conductor that then is shaped among this cannelure;
One electrical insulator is provided and is filled in this cannelure;
Provide a high temperature sintering program allow electric conductor, electrical insulator and the heat radiating material one of combining closely;
Second of this heat radiating material is faced first to be reduced thickness, thereby allows this electric conductor and electrical insulator be revealed in this second by mill, mode such as scrape or dig;
One printed circuit board (PCB) is provided, and this printed circuit board (PCB) comprises upper face and is mounted on the plurality of electrodes of this upper face;
One of relative and electric conductor end electrically connects mutually with this electrode with second upper face with this printed circuit board (PCB) of this heat radiating material;
The light-emitting component that comprises electrode more than one is provided, and this light-emitting component pasted is fixed on the heat radiating material;
A plurality of plain conductors are provided, and the one end is electrically connected at the electrode of this light-emitting component, and an end is electrically connected at the electric conductor end that one of is not connected with the electrode of printed circuit board (PCB); And
Provide a packaging plastic to encapsulate, and cover first of heat radiating material.
28. the height heat radiation optical mode group manufacture method as the light-emittingdiode as described in the claim 27 is characterized in that, periphery that a phosphor powder makes an addition to light-emitting component can be provided in addition or mix use with packaging plastic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101722344A CN101457917A (en) | 2007-12-13 | 2007-12-13 | High heat radiation optical module of LED and method for making same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101722344A CN101457917A (en) | 2007-12-13 | 2007-12-13 | High heat radiation optical module of LED and method for making same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101457917A true CN101457917A (en) | 2009-06-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101722344A Pending CN101457917A (en) | 2007-12-13 | 2007-12-13 | High heat radiation optical module of LED and method for making same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101457917A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102224604A (en) * | 2008-11-25 | 2011-10-19 | 电气化学工业株式会社 | Method for manufacturing substrate for light emitting element package, and light emitting element package |
| CN102734654A (en) * | 2011-04-12 | 2012-10-17 | 上海矽卓电子科技有限公司 | High power LED (light-emitting diode) daylight lamp and heat rejection method |
| CN102884376A (en) * | 2010-02-23 | 2013-01-16 | 宗拓贝尔照明器材有限公司 | Heat sink for a light source |
| CN103369924A (en) * | 2012-04-17 | 2013-10-23 | 苏州方林科技股份有限公司 | Cooling fin and power supply module applying cooling fin |
| CN105042473A (en) * | 2015-05-26 | 2015-11-11 | 华南理工大学 | High spotlight matrix LED lamp |
| CN111336412A (en) * | 2018-12-18 | 2020-06-26 | 正扬科技有限公司 | uV LED array with electrical interconnect and heat sink and high power device with both interconnect and heat sink |
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2007
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102224604A (en) * | 2008-11-25 | 2011-10-19 | 电气化学工业株式会社 | Method for manufacturing substrate for light emitting element package, and light emitting element package |
| CN102884376A (en) * | 2010-02-23 | 2013-01-16 | 宗拓贝尔照明器材有限公司 | Heat sink for a light source |
| CN102734654A (en) * | 2011-04-12 | 2012-10-17 | 上海矽卓电子科技有限公司 | High power LED (light-emitting diode) daylight lamp and heat rejection method |
| CN103369924A (en) * | 2012-04-17 | 2013-10-23 | 苏州方林科技股份有限公司 | Cooling fin and power supply module applying cooling fin |
| CN103369924B (en) * | 2012-04-17 | 2016-05-04 | 苏州方林科技股份有限公司 | Fin and apply the power supply module of this fin |
| CN105042473A (en) * | 2015-05-26 | 2015-11-11 | 华南理工大学 | High spotlight matrix LED lamp |
| CN111336412A (en) * | 2018-12-18 | 2020-06-26 | 正扬科技有限公司 | uV LED array with electrical interconnect and heat sink and high power device with both interconnect and heat sink |
| CN111336412B (en) * | 2018-12-18 | 2022-08-09 | 正扬科技有限公司 | uV LED array with electrical interconnect and heat sink and high power device with both interconnect and heat sink |
| US11664484B2 (en) | 2018-12-18 | 2023-05-30 | Soulnano Limited | UV LED array with power interconnect and heat sink |
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