JP3180453U - Integrated high-efficiency lighting device with multilayer structure - Google Patents

Abstract

Provided is an integrated high-efficiency lighting device having a multilayer structure that significantly reduces the amount of raw material used and improves the luminance and uniformity of light emission.
An integrated high-efficiency lighting device having a multilayer structure includes a heat dissipation base, an LED die, and a lead frame. The heat dissipation base includes a chamber having an accommodation space, and is provided on a bottom surface of the chamber. A groove 111 having two inner wall surfaces facing each other is opened. Since the groove has a low volume ratio, a fluorescent layer and a silicone resin layer covering the LED die can be formed in the groove only by using a small amount of fluorescent compound and silicone resin, and both inner wall surfaces 1111 of the groove are inclined. By being installed so as to form a surface, the light beam of the LED die is effectively reflected out of the chamber.
[Selection] Figure 2

Description

  The present invention relates to a kind of lighting device, and in particular, an integrated high-efficiency lighting device having a multi-layer structure that can greatly reduce the amount of fluorescent compound and silicone resin raw materials used, and can increase emission luminance and uniformity. About.

  The light emission principle of an LED utilizes a characteristic inherent to a semiconductor, which differs from the previous principle of discharge and exothermic light emission of an incandescent lamp tube, and generates a light beam when an electric current flows into a semiconductor PN junction in the forward direction. Therefore, the LED is referred to as a cold light. LEDs have advantages such as durability, long life, light and compact, low power consumption, and no harmful substances such as mercury, so they are widely applied in the lighting equipment industry, and it is usually The LED array package system is applied to commercial areas such as electronic signs and traffic signals.

  Currently, most of the manufactured LEDs are manufactured by coating the light emitting surface of the LED with a single fluorescent coating layer containing a fluorescent agent, and when forming a fluorescent coating layer with existing technology, A solution containing a fluorescent agent is prepared, and the solution is further used to cover the light emitting surface in a filling, coating or dripping manner, and the first color light emitted from the LED chip is partially obtained by the action of the fluorescent agent. The first color light and the second color light are mixed with each other to form the required illumination color light.

  Please refer to FIG. It is a cross-sectional view of a multilayer array type light emitting diode package structure of a known technique. It includes a substrate 10a, a package mold block 12a, a lead frame 14a, and a cover 16a. The substrate 10a is provided in the lowermost layer of the package structure, and the package mold block 12a is used to combine the substrate 10a and the lead frame 14a so as to be integrated. A diode die 18a is attached. The substrate 10a is made of a metal material, and the light emitting diode die 18a and the lead frame 14a are electrically connected by wire bonding. The cover 16a is closed with the package mold block 12a.

  Among them, an insulation protective layer 20a is formed on the light emitting diode die 18a, the insulation protective layer 20a covers the light emitting diode die 18a, and at least a fluorescent layer 22a is further formed on the insulation protective layer 20a. ing.

  The disadvantages of the known techniques are as follows. In order to increase the light emission luminance, a plurality of spaces for installing the light emitting diode die 18a must be reserved in the package mold block 12a. However, if a large amount of fluorescent compound and silicone resin raw material are not used, the package mold block 12a is uniform. Further, the insulating protective layer 20a and the fluorescent layer 22a covering the light emitting diode die 18a cannot be formed, which causes a significant increase in raw material cost.

  In addition, although the light emitting diode dies 18a are arranged in an array to increase the light emission luminance, the light emitting diode dies 18a of different matrixes have different angles of incident light on the inner wall surface of the package mold block 12a. Therefore, the traveling modes of the emitted light beams are also likely to cross each other, so that the light emission uniformity is relatively low.

  Therefore, it is essential to provide an integrated high-efficiency lighting device having a multilayer structure that can improve the above-mentioned drawbacks.

The main object of the present invention is to provide a kind of integrated high-efficiency lighting device having a multilayer structure,
A heat dissipating base having a base upper portion and a chamber having an accommodation space at the base upper portion, the chamber having a chamber bottom surface, a groove being formed at the chamber bottom surface, the grooves being opposed to both inner wall surfaces Both of the inner wall surfaces are formed as inclined surfaces that reflect light rays to the outside of the chamber, and the heat dissipation base includes at least one channel penetrating in a longitudinal direction, and the heat dissipation base,
A plurality of LED dies arranged in the groove, spaced apart from each other by a distance, and electrically connected by wire bonding between the LED dies; ,
A lead frame mounted in the at least one channel, the ends of the at least one channel being filled and sealed with a sealing resin to hold the lead frame, the lead frame comprising two lead rods and a package sleeve; The two conductor rods are packaged in the package sleeve, and both ends of the two conductor rods are exposed to the outside of the package sleeve, and the two conductor rods and the LED dies are wire bonded. Forming an electrical connection with the lead frame, and
It shall be included.

  Among them, a fluorescent layer and a silicone resin layer are formed in the groove, and the groove is formed as a slit, so that the groove can be filled with very little fluorescent compound and silicone resin, and these LED dies can be uniformly coated. , Shall greatly save raw materials and manufacturing costs.

  Furthermore, when these LED dies are installed in the groove, the angle of incidence on both inner wall surfaces of the groove substantially coincides when the LED dies emit light so that the light output uniformity can be further increased. As a result, the traveling direction of the reflected light beam is regularized, thereby effectively increasing the light output uniformity, thereby the present invention solves the drawbacks of the known technology and effectively increases the light output uniformity. The amount of fluorescent compound and silicone resin used can be reduced.

The invention of claim 1 is an integrated high-efficiency lighting device having a multilayer structure.
A heat dissipating base having a base upper portion and a chamber having an accommodation space at the base upper portion, the chamber having a chamber bottom surface, a groove being formed at the chamber bottom surface, the grooves being opposed to both inner wall surfaces Both of the inner wall surfaces are formed as inclined surfaces that reflect light rays to the outside of the chamber, and the heat dissipation base includes at least one channel penetrating in a longitudinal direction, and the heat dissipation base,
A plurality of LED dies arranged in the groove, spaced apart from each other by a distance, and electrically connected by wire bonding between the LED dies; ,
A lead frame mounted in the at least one channel, the ends of the at least one channel being filled and sealed with a sealing resin to hold the lead frame, the lead frame comprising two lead rods and a package sleeve; The two conductor rods are sealed in the package sleeve, and both ends of the two conductor rods are exposed outside the package sleeve, and the two conductor rods and the LED dies are wire The lead frame forming an electrical connection by bonding; and
An integrated high-efficiency lighting device having a multilayer structure.
The invention of claim 2 is the integrated high-efficiency lighting device having the multilayer structure according to claim 1, wherein the groove is formed by milling, and the integrated height having the multilayer structure. It is an efficient lighting device.
The invention of claim 3 is the integrated high-efficiency lighting device having the multilayer structure according to claim 1, wherein the groove has at least one of a ring shape, a square shape, a rectangular shape, and a triangular shape. The integrated high-efficiency lighting device has a multilayer structure.
The invention of claim 4 is the integrated high-efficiency lighting device having the multilayer structure according to claim 1, wherein a depression angle formed between the inner wall surfaces and the chamber bottom surface is between 10 and 80 degrees. Thus, an integrated high-efficiency lighting device having a multilayer structure is provided.
The invention of claim 5 is an integrated high-efficiency lighting device having a multilayer structure according to claim 1, wherein a gold wire is used for the wire bonding. High-efficiency lighting device.
The invention of claim 6 is an integrated high-efficiency lighting device having a multilayer structure according to claim 1, wherein the sealing resin is a silicone resin. It is an efficient lighting device.
The invention of claim 7 is the integrated high-efficiency lighting device having the multilayer structure according to claim 1, further comprising a fluorescent layer and a silicone resin layer, wherein the fluorescent layer and the silicone resin layer are in the groove. An integrated high-efficiency lighting device having a multilayer structure, wherein the fluorescent layer covers the LED die and the silicone resin layer is positioned on the fluorescent layer.
The invention of claim 8 is the integrated high-efficiency lighting device comprising the multilayer structure according to claim 1, further comprising a lens cover, the lens cover being fixed so as to cover the chamber, An integrated high-efficiency lighting device having a multi-layer structure is characterized in that a sealed space is formed in the internal space of the chamber.
The invention of claim 9 is the integrated high-efficiency lighting device having the multilayer structure according to claim 1, wherein the material of the package sleeve is at least one of polyphthalamide, polyamide 9T, and liquid crystal polyester resin. This is an integrated high-efficiency lighting device having a multilayer structure.
The invention of claim 10 is the integrated high-efficiency lighting device having the multilayer structure according to claim 1, wherein a metal reflective layer is plated on the inner wall surface of the groove, and the material of the metal reflective layer is copper, An integrated high-efficiency lighting device having a multilayer structure characterized in that it is made of at least one of silver.
The invention of claim 11 is an integrated high-efficiency lighting device having a multilayer structure.
A heat dissipating base having a base upper portion and a chamber having an accommodation space at the base upper portion, the chamber having a chamber bottom surface, a groove being formed at the chamber bottom surface, the grooves being opposed to both inner wall surfaces Both of the inner wall surfaces are formed as inclined surfaces that reflect light rays to the outside of the chamber, and the heat dissipation base is provided with two adjacent channels penetrating vertically. ,
A plurality of LED dies arranged in the groove, spaced apart from each other by a distance, and electrically connected by wire bonding between the LED dies; ,
A lead frame mounted in each of the channels, the ends of the at least one channel being filled and sealed with sealing resin to hold the lead frame, the lead frame having a single lead rod in the package sleeve; The lead frame configured to be sealed, and both ends of the wire rod are exposed to the outside of the package sleeve, and the two wire rods and the LED die form an electrical connection by wire bonding;
An integrated high-efficiency lighting device having a multilayer structure.
The invention of claim 12 is the integrated high-efficiency lighting device having the multilayer structure according to claim 11, wherein the thickness of the central portion of the heat dissipation base is greater than the thickness of the outer portion of the heat dissipation base. A plurality of spaced apart radiating fins extending downward are provided on the bottom surface of the base, and the length of the radiating fins located on the outer portion of these radiating fins is longer than the length of the radiating fins located on the central portion. This is an integrated high-efficiency lighting device having a multilayer structure.
The invention of claim 13 is the integrated high-efficiency lighting device having the multilayer structure according to claim 12, wherein the surfaces of the heat dissipating fins have a high and low undulation shape. High-efficiency lighting device.

  The present invention provides an integrated high-efficiency lighting device having a kind of multilayer structure, which includes a heat dissipation base, an LED die, and a lead frame, the heat dissipation base comprising a chamber with a receiving space, A groove with two inner wall surfaces facing each other is opened on the bottom surface, and since the groove has a low volume ratio, a fluorescent layer that covers the LED die in the groove can be obtained by using only a small amount of a fluorescent compound and silicone resin. And a silicone resin layer can be formed, thereby greatly reducing the amount of raw material used and saving manufacturing costs, and the inner wall surfaces of the groove are installed to form inclined surfaces, thereby effectively utilizing the light rays of the LED die. Reflected out of the chamber, the emission luminance and uniformity can be improved.

1 is a cross-sectional view of a multilayer array type light emitting diode package structure of a known technology. 1 is a display diagram of a first embodiment of an integrated high-efficiency lighting device having a multilayer structure according to the present invention. It is sectional drawing of the thermal radiation base of 1st Example of this invention. It is sectional drawing of the thermal radiation base and lead frame of 1st Example of this invention. It is a display figure which further provides the fluorescent layer and silicone resin layer of 1st Example of this invention. It is a display figure of 2nd Example of the integrated high efficiency illuminating device which has the multilayer type structure of this invention. It is a display figure of 3rd Example of the integrated high efficiency illuminating device which provides the multilayer type structure of this invention. It is sectional drawing of FIG. It is sectional drawing of 4th Example of the integrated high efficiency illuminating device which comprises the multilayer type structure of this invention.

  In order to describe in detail the technical contents, structural features, and objects to be achieved of the present invention, examples will be described below in combination with the drawings.

  Please refer to FIG. 1 is a display diagram of a first embodiment of an integrated high-efficiency lighting device having a multilayer structure according to the present invention. The present invention relates to an integrated high-efficiency lighting device having a kind of multilayer structure, which includes a heat dissipation base 1, a plurality of LED dies 3, and a lead frame 5.

  The heat dissipating base 1 includes a base upper portion, and a central portion of the base upper portion includes a chamber 11 including an accommodation space. The chamber 11 includes a chamber bottom portion, along a periphery of the chamber bottom portion, or along A groove 111 is opened at the periphery. The LED dies 3 are disposed in the groove 111, the LED dies 3 are separated from each other by a certain distance, and the LED dies 3 are joined and electrically connected by wire bonding. Among these, the formation of the groove 111 is processed by milling.

  The heat dissipating base 1 includes a plurality of heat dissipating fins 13, and these heat dissipating fins 13 are extended outward from the outer wall surface of the heat dissipating base 1 in a radial arrangement manner. The surfaces of both side surfaces of the heat radiating fins 13 are separated from each other and have an uneven shape.

  The LED dies 3 are separated from each other by a predetermined distance, and the distance between the LED dies 3 effectively prevents the heat accumulation effect caused by the LED dies 3 being too close to each other, and each LED die 3 emits light to generate thermal energy. However, due to the heat radiation space formed by the distance, the heat storage effect does not occur, and the heat energy is quickly dissipated and discharged.

  The inner wall surfaces 1111 opposite to each other provided in the groove 111 are each formed in an inclined surface so as to discharge the received light beam out of the chamber 11. Of these, the included angle between the inner wall surfaces 1111 and the bottom surface of the chamber is between 10 and 80 degrees.

  It should be noted that in the first embodiment of the present invention described above, the groove 111 is provided in an annular shape, but this is only an embodiment convenient for explanation, thereby limiting the scope of the present invention. In other words, the present invention can be provided with a groove having an appropriate shape according to the needs of actual application.

  The inner wall surface of the groove 111 can be plated with a metal reflection layer, thereby enhancing the light reflection effect, and the metal reflection layer can be made of copper, silver, or other suitable metal material.

  The groove 111 may have a ring shape, a square shape, a rectangular shape, a triangular shape, or other shapes.

  Please refer to FIG. It is a sectional view of the heat dissipation base of the first embodiment of the present invention. See also FIG. It is a sectional view of the heat dissipation base and lead frame of the first embodiment of the present invention. The heat dissipation base 1 is also provided with one channel 15 penetrating in the vertical direction, and the upper end and the bottom end of the channel 15 are located at the bottom of the chamber and the bottom end of the heat dissipation base, respectively. The lead frame 5 is installed in the channel 15, and both ends of the channel 15 are filled with the sealing resin 6 and sealed, whereby the lead frame 5 is held, and the channel 15 is completely sealed, so that fine dust and moisture can be removed. The entry into the chamber 11 is prevented. Of these, the sealing resin 6 may be a silicone resin.

  Among them, the lead frame 5 is composed of two conductive rods 51 and a package sleeve 53, the two conductive rods 51 are sealed in the package sleeve 53, and the two conductive rods 51 are not in contact with each other. Both ends of 51 are exposed outside the package sleeve 53.

  The material of the package sleeve 53 is at least one of polyphthalamide (PPA), polyamide 9T (Polyamide 9T, PA9T), and liquid crystal polyester resin (LCP).

  The upper ends of the two conductive rods 51 are electrically connected to these LED dies 3 by wire bonding, and the bottom ends of the two conductive rods 51 form an electrical connection with the positive and negative electrodes of the power source, thereby The drive voltage is transmitted to these LED dies 3 to emit light. According to a preferred embodiment of the present invention, wire bonding is performed using a gold wire.

  Please refer to FIG. It is a display diagram of the fluorescent layer and the silicone resin layer of the first embodiment of the present invention. In the present invention, a fluorescent layer 10 and a silicone resin layer 20 are further formed, and the fluorescent layer 10 and the silicone resin layer 20 are located in the groove 111. The fluorescent layer 10 covers these LED dies 3, and light rays emitted from the LED dies 3 are surely emitted through the fluorescent layer 10, and the silicone resin layer 20 is placed on the fluorescent layer 10.

  Among them, the fluorescent layer 10 and the silicone resin layer 20 are injected into the groove 111 by filling and spotting.

  The fluorescent layer 10 performs a light mixing effect with the light rays emitted by the LED dies 3, and the silicone resin layer 20 prevents external moisture and fine dust from entering the fluorescent layer 10. Preferably, the silicone resin layer 20 is a silicone resin having high permeability.

  Among them, the groove 111 presents a kind of slit, so that the groove can be filled with a very small amount of fluorescent compound and silicone resin, and these LED dies 3 can be uniformly coated, thereby greatly reducing raw materials and manufacturing costs. Can save.

  In addition, the present invention may further use a lens cover 30, which is fixed so as to cover the chamber 11, thereby forming a sealed state in the inner space of the chamber 11. The moisture and fine dust are prevented from entering the chamber 11.

  See FIG. It is a display diagram of a second embodiment of an integrated high-efficiency lighting device having a multilayer structure according to the present invention. The structure of the second embodiment is substantially the same as the structure of the first embodiment, but in the second embodiment, two adjacent channels 15 penetrating vertically in the heat dissipation base 1 are provided.

  One lead frame 5 is inserted into each of the two channels 15, but the lead frame 5 in the second embodiment is merely sealed with one conductor rod 51 in the package sleeve 53, which is shown in FIG. As you can see.

  Please refer to FIG. 7 and FIG. These are a display diagram of a third embodiment of an integrated high-efficiency lighting device having a multilayer structure of the present invention, and a cross-sectional view of FIG. FIG. 7 shows a flat plate-type heat radiation base 1. The thickness of the central portion of the heat radiation base 1 is larger than the thickness of the outer portion thereof, and a plurality of the heat radiation bases 1 are arranged in a spaced manner downward on the bottom surface of the heat radiation base 1. The radiating fins 13 are installed.

  Of these radiating fins 13, the length of the radiating fins 13 located in the outer portion is longer than the length of the radiating fins 13 located in the central portion. FIG. 7 shows a good arrangement method of the radiating fins 13, and the free ends of the radiating fins 13 are all evenly aligned.

  Among them, the surface of the radiating fin 13 located in the outer portion exhibits a high and low undulation shape, thereby increasing the radiating surface area of the radiating fin 13, thereby rapidly dissipating thermal energy. Naturally, the surface of all the radiation fins 13 may be formed in a high and low undulation shape, whereby the heat radiation effect and the heat radiation speed of the heat radiation fins 13 can be made better.

  Further, since the thickness of the central portion of the main body of the heat radiating base 1 is larger than the thickness of the outer portion thereof, the central portion of the main body of the heat radiating base 1 has a high structural strength. Etc. can be installed. The third embodiment is different from the first embodiment in the radiating fins 13, but the other structures are the same as described in the previous sentence, and thus a redundant description will not be given.

  As can be seen from the third embodiment, the structure of the chamber 11, the channel 15, the groove 111 and the like described in the present invention can be directly installed on the heat dissipation base 1 of a different type.

  Thus, each of the above-described embodiments is merely an embodiment that is convenient for explanation, and is not used to limit the scope of the present invention.

  See FIG. It is a cross-sectional view of a fourth embodiment of an integrated high-efficiency lighting device having a multilayer structure according to the present invention. The structure of the fourth embodiment is the same as the structure of the third embodiment, except that the heat dissipation base 1 of the third embodiment is provided with two channels 15 penetrating vertically and corresponding to each other. Yes.

  One lead frame 5 is mounted in each of these two channels 15, but the lead frame 5 in the fourth embodiment is sealed with a single wire rod 51 in a package sleeve 53, which is shown in FIG. As shown.

  As described above, since the fluorescent layer 10 and the silicone resin layer 20 are installed in the groove 111 having a very small volume ratio, the usage amount of the raw materials such as the fluorescent compound and the silicone resin is greatly reduced. Reduces manufacturing costs.

  In addition, even when these LED dies 3 are installed in the groove 111, the light output uniformity is increased. This is because the angle at which the light beams emitted from the LED dies 3 enter both inner wall surfaces 1111 of the grooves 111 is increased. This is because the directions of travel of the reflected light beams are almost the same and regular, thereby increasing the light emission uniformity. Thus, the present invention solves the drawbacks of known techniques and can effectively save the light output uniformity and the manufacturing cost.

  The names and contents of the present invention described above are only used for explaining the technical contents of the present invention, and do not limit the present invention. All equivalent applications based on the spirit of the present invention, parts (structures) conversion, replacement, and quantity increase / decrease shall be included in the protection scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Radiation base 11 Chamber 111 Groove 1111 Inner wall surface 13 Radiation fin 15 Channel 3 LED die 5 Lead frame 51 Lead rod 53 Package sleeve 6 Sealing resin 10 Fluorescent layer 20 Silicone resin layer 30 Lens cover 10a Substrate 12a Package mold block 14a Lead frame 16a Cover 18a Light emitting diode die 20a Insulating protective layer 22a Fluorescent layer

Claims (13)

In an integrated high-efficiency lighting device having a multilayer structure,
A heat dissipating base having a base upper portion and a chamber having an accommodation space at the base upper portion, the chamber having a chamber bottom surface, a groove being formed at the chamber bottom surface, the grooves being opposed to both inner wall surfaces Both of the inner wall surfaces are formed as inclined surfaces that reflect light rays to the outside of the chamber, and the heat dissipation base includes at least one channel penetrating in a longitudinal direction, and the heat dissipation base,
A plurality of LED dies arranged in the groove, spaced apart from each other by a distance, and electrically connected by wire bonding between the LED dies; ,
A lead frame mounted in the at least one channel, the ends of the at least one channel being filled and sealed with a sealing resin to hold the lead frame, the lead frame comprising two lead rods and a package sleeve; The two conductor rods are sealed in the package sleeve, and both ends of the two conductor rods are exposed outside the package sleeve, and the two conductor rods and the LED dies are wire The lead frame forming an electrical connection by bonding; and
An integrated high-efficiency lighting device comprising a multi-layer structure.   2. The integrated high-efficiency lighting device having a multilayer structure according to claim 1, wherein the groove is formed by milling.   2. The integrated high-efficiency lighting device having a multilayer structure according to claim 1, wherein the groove has at least one of an annular shape, a square shape, a rectangular shape, and a triangular shape. Integrated high-efficiency lighting device.   2. The integrated high-efficiency lighting device having a multilayer structure according to claim 1, wherein a depression angle formed between the inner wall surfaces and the bottom surface of the chamber is between 10 and 80 degrees. An integrated high-efficiency lighting device with a multilayer structure.   The integrated high-efficiency lighting device having a multilayer structure according to claim 1, wherein a gold wire is used for the wire bonding.   2. The integrated high-efficiency lighting device having a multilayer structure according to claim 1, wherein the sealing resin is a silicone resin.   2. The integrated high-efficiency lighting device having a multilayer structure according to claim 1, further comprising a fluorescent layer and a silicone resin layer, wherein the fluorescent layer and the silicone resin layer are located in the groove, An integrated high-efficiency lighting device comprising a multilayer structure, characterized in that it covers the LED die and the silicone resin layer is located on the fluorescent layer.   2. The integrated high-efficiency lighting device having a multilayer structure according to claim 1, further comprising a lens cover, the lens cover being fixed so as to cover the chamber, and a sealed space in the internal space of the chamber. An integrated high-efficiency lighting device comprising a multilayer structure, characterized in that   2. The integrated high-efficiency lighting device having a multilayer structure according to claim 1, wherein the material of the package sleeve is at least one of polyphthalamide, polyamide 9T and liquid crystal polyester resin. Integrated high-efficiency lighting device with a formula structure.   2. The integrated high-efficiency lighting device having a multilayer structure according to claim 1, wherein a metal reflection layer is plated on the inner wall surface of the groove, and the material of the metal reflection layer is at least one of copper and silver. An integrated high-efficiency lighting device having a multilayer structure. In an integrated high-efficiency lighting device having a multilayer structure,
A heat dissipating base having a base upper portion and a chamber having an accommodation space at the base upper portion, the chamber having a chamber bottom surface, a groove being formed at the chamber bottom surface, the grooves being opposed to both inner wall surfaces Both of the inner wall surfaces are formed as inclined surfaces that reflect light rays to the outside of the chamber, and the heat dissipation base is provided with two adjacent channels penetrating vertically. ,
A plurality of LED dies arranged in the groove, spaced apart from each other by a distance, and electrically connected by wire bonding between the LED dies; ,
A lead frame mounted in each of the channels, the ends of the at least one channel being filled and sealed with sealing resin to hold the lead frame, the lead frame having a single lead rod in the package sleeve; The lead frame configured to be sealed, and both ends of the wire rod are exposed to the outside of the package sleeve, and the two wire rods and the LED die form an electrical connection by wire bonding;
An integrated high-efficiency lighting device comprising a multi-layer structure.   12. The integrated high-efficiency lighting device having a multilayer structure according to claim 11, wherein a thickness of a central portion of the heat radiating base is thicker than a thickness of an outer portion of the heat radiating base and extends downward to a bottom surface of the heat radiating base. A plurality of spaced apart heat dissipating fins, and the length of the heat dissipating fins located in the outer part of these heat dissipating fins is longer than the length of the heat dissipating fins located in the central part. Integrated high-efficiency lighting device with a formula structure.   13. The integrated high-efficiency lighting apparatus having a multilayer structure according to claim 12, wherein the surfaces of the heat radiation fins have a high and low undulation shape.

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