CN102013450A - COB integrated encapsulation technology of special technology - Google Patents
COB integrated encapsulation technology of special technology Download PDFInfo
- Publication number
- CN102013450A CN102013450A CN2009101953511A CN200910195351A CN102013450A CN 102013450 A CN102013450 A CN 102013450A CN 2009101953511 A CN2009101953511 A CN 2009101953511A CN 200910195351 A CN200910195351 A CN 200910195351A CN 102013450 A CN102013450 A CN 102013450A
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- CN
- China
- Prior art keywords
- led
- technology
- cob
- reflected light
- special
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
Abstract
The invention is a COB integrated encapsulation technology of a special technology, relating to the fields of LED photoelectric technology manufacture and the illumination lamps manufacture. Reflected light chambers (2) with a back taper shape are drilled on an aluminium PCB (1) to form a rectangle array or any other special array. Single or a plurality of LED chips (3) are implanted into the reflected light chamber (2). Function PCB circuit (4) is drown around the reflected light chamber (2). Electrode lead wires (5) of the LED chips(3) are bonded to the function PCB circuit (4) of the aluminium PCB (1) so as to conduct the circuit. Circular fences (6) are accumulated around the single or the plurality of LED reflected light chamber (2). Forming silica gel containing YAG fluorescent powder or any powder which can change color under LED excitation is uniformly coated within the fence, and then integrated LED COB integration component is formed.
Description
Affiliated technical field:
The present invention relates to manufacturing of LED photoelectric technology and lighting manufacturing field for a kind of integrated encapsulation technology of COB of special process.
Background technology:
Existing general lighting production method commonly used: be that led chip is packaged in the individual devices, be welded on the aluminum substrate again, such production method exists multilayer faying face and long heat conduction distance, make that the heat radiation thermal resistance is too high, when LED lighted the generation heat, temperature can not get in time transmitting heat radiation, made the LED junction temperature put aside rising, cause the LED light emission rate to reduce, serious meeting causes LED to damage.
Goal of the invention:
The present invention seeks at above-mentioned defective, provide a kind of new technical scheme: the faying face that further reduces LED heat dissipation channel when luminous, thereby the thickness that shortens heat-conducting layer reduces the structure thermal resistance, increases thermal heat transfer capability, reduces the LED junction temperature, improve the light emission rate of LED, avoided any infringement that causes because of thermal resistance is excessive LED.
Summary of the invention:
The present invention is achieved through the following technical solutions:
(1) upward bores back taper reflector cavity (2) at aluminium matter PCB (1) with rectangular array or in other any specific arrangement modes.
(2) single or plurality of LEDs chip (3) are implanted in the reflector cavity (2).
(3) draw function PCB circuit (4) on every side at reflector cavity (2).
(4), be bonded on the function circuit (4) of aluminium matter PCB (1) the conducting circuit with led chip (3) contact conductor (5).
(5) pile up building height around single or multiple LED reflector cavities (2) circularizes and encloses grid (6).
(6) even coating moulding silica gel (7) or contain YAG fluorescent material or any LED of being subjected to excites the pulvis that causes color and luster to change in enclosing grid.
(7) form incorporate LED COB integrated package with this.
The effect of invention:
Advantage of the present invention:
(1) the assembly thermal resistance of using the integrated encapsulation technology of COB of this special process to make is low.
(2) passage of heat reduces to the shortest.
(3) heat conduction is rapid.
(4) be of value to the light emission rate that improves LED.
(5) useful life of raising LED.
(6) heat radiation aluminium face can adhere on the various material by heat radiation
(7) integral process install and use convenient
(8) realize ultrathin luminescence component, the thinnest only is 0.95mm
(9) reduce the LED encapsulating material, thereby reduced the assembly cost.
Description of drawings:
The present invention is further described in conjunction with the accompanying drawings with embodiment.
Accompanying drawing 1 is the whole 3-D effect schematic diagram of the present invention.
Accompanying drawing 2 is an integral planar schematic diagram of the present invention.
Accompanying drawing 3 is a profile of the present invention.
Accompanying drawing 4 is that plurality of LEDs chip of the present invention is implanted the schematic diagram in the reflector cavity.
Accompanying drawing 5 is the figure that illustrates of reflector cavity arranged mode of the present invention.
As shown in drawings: the present invention goes up at aluminium matter PCB (1) and bores back taper reflector cavity (2) with rectangular array or in other any specific arrangement modes.Single or plurality of LEDs chip (3) are implanted in the reflector cavity (2).Draw function PCB circuit (4) on every side at reflector cavity (2).With led chip (3) contact conductor (5), be bonded on the function circuit (4) of aluminium matter PCB (1) the conducting circuit.Accumulation base height circularizes and encloses grid (6) around single or multiple LED reflector cavities (2).Even coating shaping silica gel (7) or contain YAG fluorescent material or any LED of being subjected to excites the pulvis that causes color and luster to change in enclosing grid.
Claims (4)
1. the present invention relates to manufacturing of LED photoelectric technology and lighting manufacturing field for a kind of integrated encapsulation technology of COB of special process.
2. according to claim 1 is on aluminium matter PCB substrate, drills through the back taper reflector cavity, and chip is directly implanted a kind of COB encapsulation implanted prosthetics of cavity.
3. according to claim 1 is on aluminium matter PCB substrate, builds that high annular is enclosed grid and coating moulding silica gel and contain YAG fluorescent material or any LED of being subjected to excites the pulvis that causes color and luster to change in enclosing grid.Thus at the injecting glue and the coating technology of LED COB encapsulation.
4. also the plurality of LEDs chip can be planted in the technology of same reflector cavity and a plurality of reflector cavity array arrangements according to claim 2 is described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101953511A CN102013450A (en) | 2009-09-08 | 2009-09-08 | COB integrated encapsulation technology of special technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101953511A CN102013450A (en) | 2009-09-08 | 2009-09-08 | COB integrated encapsulation technology of special technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102013450A true CN102013450A (en) | 2011-04-13 |
Family
ID=43843544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101953511A Pending CN102013450A (en) | 2009-09-08 | 2009-09-08 | COB integrated encapsulation technology of special technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102013450A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102306700A (en) * | 2011-06-22 | 2012-01-04 | 浙江英特来光电科技有限公司 | Light and color regulable COBLED structure |
| CN102593323A (en) * | 2012-03-10 | 2012-07-18 | 江苏索尔光电科技有限公司 | LED (light-emitting diode) surface light source packaging piece |
| CN102779908A (en) * | 2011-05-10 | 2012-11-14 | 惠州多尔数码科技有限公司 | Graphite heat conduction high-powder flat plane light source encapsulation method |
| CN105135278A (en) * | 2015-08-24 | 2015-12-09 | 郑雅文 | Module type high-definition LED panel lamp |
-
2009
- 2009-09-08 CN CN2009101953511A patent/CN102013450A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102779908A (en) * | 2011-05-10 | 2012-11-14 | 惠州多尔数码科技有限公司 | Graphite heat conduction high-powder flat plane light source encapsulation method |
| CN102306700A (en) * | 2011-06-22 | 2012-01-04 | 浙江英特来光电科技有限公司 | Light and color regulable COBLED structure |
| CN102593323A (en) * | 2012-03-10 | 2012-07-18 | 江苏索尔光电科技有限公司 | LED (light-emitting diode) surface light source packaging piece |
| CN105135278A (en) * | 2015-08-24 | 2015-12-09 | 郑雅文 | Module type high-definition LED panel lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110413 |