CN105135278A - Module type high-definition LED panel lamp - Google Patents
Module type high-definition LED panel lamp Download PDFInfo
- Publication number
- CN105135278A CN105135278A CN201510519833.3A CN201510519833A CN105135278A CN 105135278 A CN105135278 A CN 105135278A CN 201510519833 A CN201510519833 A CN 201510519833A CN 105135278 A CN105135278 A CN 105135278A
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- CN
- China
- Prior art keywords
- led
- light source
- heat
- flat lamp
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/104—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using feather joints, e.g. tongues and grooves, with or without friction
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to a module type high-definition LED panel lamp. An area light source is composed of a square sealed type radiator frame, L-shaped connecting pieces, a diffusion plate, a lens type side incident light guiding plate, a reflecting plate, a radiating back plate, an integrated LED light source and an external power module. Each integrated LED light source module is formed by LED chips, metal wires, glass bead silica gel, fluorescent powder, connectors, a nanometer epoxy resin layer and a heat conduction substrate, wherein an optical reflecting cup is arranged on the upper portion of the heat conduction substrate, and a dovetail structure is arranged at the bottom of the heat conduction substrate; the LED chips are planted into the bottom of the reflecting cup, the LED chips are in electric communication, and the chips and the connectors are in electric communication; glass bead silica gel layers are cured on the upper faces of the chips and covered with fluorescent powder layers; and the LED chips, the metal wires, the glass bead composite silica gel layers, the fluorescent powder layers, the connectors and the heat conduction substrate are encapsulated into the integrated LED light source module through the nanometer epoxy resin layer. Multiple independent LED light source modules are freely combined, matched and integrated through the connectors. The LED light source modules are directly inserted into the square sealed type radiator frame through the dovetails of the heat conduction substrates.
Description
Technical field
The present invention relates to a kind of LED flat lamp, particularly power-supply controller of electric, light source, radiator, connector, light guide plate are all realized the modular high definition LED flat lamp of modular construction.
Background technology
Traditional LED flat lamp radiator is generally based on framework heat radiation, flat lamp backboard cannot play the effect of heat radiation, because the place that radiator frame contacts with backboard is opening shape structure, between radiator frame and backboard, contact area is too little, and heat cannot be transmitted over.And the area of dissipation of LED requires as 35-60cm2/W usually, radiator frame cannot be directly proportional to the area of dissipation of LED.If the radiating surface only by framework cooling LED is limited, the junction temperature of LED is directly caused to raise, reduction of service life.Existing LED flat lamp light source is all separation member frame mode, and production maintenance is very inconvenient.The light source of separation member formula structure is first placed in LED support by LED luminescence chip to carry out bonding wire encapsulation, forms single led light source, then be welded on aluminium base by multiple LED light source and form LED light source module.Be welded on the LED light source module that aluminium base is combined into by multiple LED light source, the heat of LED chip can only first pass on aluminium base by LED support, and aluminium base passes on radiator by heat conductive silica gel again, forms multiple thermal resistance.Its result is exactly the junction temperature rising of LED, the lost of life.
Because of the impact by pcb board, reliability is lower.Existing LED light source is owing to being multiple LED light source permutation and combination, once one of them damages, is just difficult to maintain and replace, and client only returns producer's process mostly, is also easy to damage electronic components associated therewith during dismounting maintenance.
The Lamp cup of existing single led light source forms with plastics die casting, and Lamp cup is little, exiting surface is narrow, reflection coefficient is low also will be subject to silica gel refractive effect, and light extraction efficiency is lower.Multiple LED light source permutation and combination forms LED light source module and easily produces condensing angle phenomenon, in the guide-lighting LED-backlit module in side, LED linearly arranges on lamp bar pcb board, certain gap is had between two LED, LED non-homogeneous bright dipping device, its light intensity in certain rising angle (about ± 50 °) is the strongest, and luminous intensity in all the other beam angles is very weak, just make position combined brightness between two LEDs lower than the brightness in 0 ° of beam angle, there is light beam clear zone at light guide plate near the region of LED light source, thus produce the phenomenon of bright dark inequality.
Existing ultra thin LED flat lamp is all side light emitting species, and light guide plate and light source distance are too near, and light guide plate expanded by heating easily causes light source to damage.
Existing LED flat lamp light guide plate is plane light inlet mode, because the angle of divergence of LED light source is restricted, occurs light beam clear zone, and produce the phenomenon of bright dark inequality at light guide plate near the region of LED light source.This phenomena reduces light guide plate light extraction efficiency.
Summary of the invention
In view of the deficiency that current LED flat lamp exists, the present invention seeks to design the modular high definition LED flat lamp that a kind of structure is simple, area of dissipation is large, light extraction efficiency is high, good evenness, cost are low, the life-span is long.
The present invention is a kind of modular high definition LED flat lamp, be made up of radiator frame, connector, diffuser plate, light guide plate, reflector, heat sinking back-plate, LED light source module and power module, LED light source module, radiator frame and connector are combined into LED flat lamp framework, diffuser plate, light guide plate, reflector, heat sinking back-plate load LED flat lamp framework successively, be fastened as a whole by securing member, it is characterized in that described radiator frame is square shape enclosed radiation framework, described light guide plate is side light inlet concave lens type light guide plate.
Described LED light source module is by blue-light LED chip, wire, circuit board, comprehensive silicon glue-line, phosphor powder layer, connector, compound resin layer and heat-conducting substrate composition, wire is by LED chip and circuit board electric connection, circuit board and connector electric connection, heat-conducting substrate top is optics reflector, multiple blue-light LED chip is implanted in the optics reflector on heat-conducting substrate top, LED chip is encapsulated by compound silica gel, compound silica gel covers layer of fluorescent powder layer, compound resin is by LED chip, wire, circuit board, comprehensive silicon glue-line, phosphor powder layer, connector becomes independently LED module overall with heat-conducting substrate secondary encapsulation, by the free matched combined of connector between module whole and module whole, form integrated LED flat-plate light source module.
In order to improve the light extraction efficiency of LED flat lamp, the present invention changes light guide plate plane light inlet mode into lens type side light inlet mode, i.e. lens type light guide plate.Light guide plate is made concave spherical surface in the position of the corresponding LED of light guide plate incident side by lens type light guide plate, and this is just equivalent to make concavees lens to light guide plate, can diverging incident light.The principle that lens type light inlet solves is: recessed light can play peptizaiton in the face of incident ray, makes the light dispersion incided in light guide plate medium, thus light is uniformly distributed in light guide plate incident side.Thus be conducive to alleviating HotSpot(condensing angle) phenomenon.
Occur light beam clear zone for eliminating light guide plate near the region of LED light source, the present invention adopts integrated form area source, effectively eliminates the phenomenon of light beam clear zone and bright dark inequality, improves brightness and the uniformity.
In order to more effectively improve the light extraction efficiency of LED light source, the present invention adopts MCOB integrated light source module, multiple LED chip is directly implanted bottom reflector, forms integrated form high definition LED light source module.Heat-conducting substrate upper design is become optics reflecting cup structure, increases lighting area.In silica gel, with the addition of glass microballoon, enhance silica gel refractive index, improve light source light extraction efficiency.With the addition of nano magnesia in the epoxy, improve thermal conductivity and light transmission, reduce material cost.
For effectively improving LED heat conductivility, the present invention adopts dovetail type heat-conducting substrate, LED dovetail substrate is embedded radiator inner, increase the heat transfer area of LED-baseplate and radiator, LED-baseplate and radiator are closely combined together, drastically increases the heat conduction efficiency between LED and radiator.
In order to strengthen LED flat lamp radiator area, the present invention changes radiator frame opening shape into closed square shape, increase the contact area of backboard and radiator frame, add the intensity of radiator frame, strengthen the area of dissipation of LED light source, thus effectively reduce the temperature of LED light source, extend its service life to greatest extent.
Lens type light guide plate feature:
1, lens type light inlet can make incident light disperse in light guide plate, allows uniform light distribute, thus is conducive to alleviating HotSpot(condensing angle) phenomenon.
2, lens type light inlet can make incident light diffusion in light guide plate, prevents light source direct projection to eye.LED blue light is effectively prevented to endanger retina.
3, lens type light inlet, can reduce the consumption of light guide plate sheet material, reduces production cost.
4, lens type light guide plate minute surface depression degree and light source have certain distance, and light guide plate expanded by heating can not cause light source to damage.
MCOB integrated light source module feature:
1, LED chip heat-conducting substrate, adopt the design of lightweight metal material swallowtail-shaped structure, heat-transfer surface sum lighting area is maximized, LED chip directly implants heat-conducting substrate optics reflector, the heat that LED chip produces directly imports radiator, decrease thermal resistance, improve radiating efficiency, extend the service life of chip.
2, directly implanted by chip in heat-conducting substrate optics reflector, LED performance is more stable, and light extraction efficiency is higher.
3, MCOB integrated optical source is area source bright dipping, effectively eliminates light beam clear zone and bright dark inequality appear in light guide plate phenomenon near the region of LED light source, improves brightness and the uniformity.
4, accurate secondary encapsulation structure, solves the technical barrier of fluorescent material precipitation, considerably improves the uniformity of LED light source product.
5, in silica gel, add glass microballoon, increase silica gel refractive index, improve light extraction efficiency, reduce material cost.
6, add nano magnesia in the epoxy, increase thermal conductivity and light transmission.
7, each light source module all exchanges by connector, and local fault does not affect the normal work of whole light fixture, is convenient to judgement, analyzing failure cause and device failure place, and for convenience detach and maintenance, saves maintenance cost, make maintenance work become very light.
8, LED light source is encapsulated as separate modular structure, can freely arrange in pairs or groups and combine, and forms the LED flat lamp product of different capacity and brightness, fast easy to assembly.
In sum, the present invention has that light extraction efficiency is high, uniformity good, the life-span is long, structure is simple, and keeping in repair, produce convenient, that cost is lower advantage, is the perfect light source of LED illumination product of new generation.
Accompanying drawing explanation
Fig. 1 is this modular high definition LED flat lamp light-source structure schematic diagram;
Fig. 2 is this modular high definition LED flat lamp source plane schematic diagram;
Fig. 3 is this modular high definition LED flat lamp structural representation;
Fig. 4 is this modular high definition LED flat lamp light conducting plate structure schematic diagram;
Fig. 5 is this modular high definition LED flat lamp radiator frame structural representation;
Fig. 6 is this modular high definition LED flat lamp assembly structure schematic diagram.
Detailed description of the invention
Embodiment 1
As shown in Fig. 1,2,3,4,5,6, the present invention is a kind of modular high definition LED flat lamp, and light fixture is made up of radiator frame 9, L connector 10, diffuser plate 11, lens type light guide plate 12, reflector 13, integrating optical source module 16, backboard 14, screw 15, power module 17, wire 18.
Integrated type LED light source module, comprising blue-light LED chip 1, wire 2, circuit board 3, glass microballoon comprehensive silicon glue-line 4, phosphor powder layer 5, connector 6, nano magnesia epoxy resin layer 7 and aluminium matter heat-conducting substrate 8, is optics reflector bottom this heat-conducting substrate.Adopt high accuracy chip die bonder, multiple blue-light LED chip 1 is implanted in the optics reflector of heat-conducting substrate 8, then with bonding equipment by wire 2 and PC circuit board 3 electric connection.Glue dispenser with high precision is adopted to click and enter in the reflector of heat-conducting substrate by glass microballoon silica gel 4, first time encapsulation is carried out to blue-light LED chip 1, high-precision dot powder machine is used again by 5, fluorescent material above glass microballoon compound silica gel 4 when glass microballoon compound silica gel 4 is solidified to 40%, LED chip 1, glass microballoon compound silica gel 4, fluorescent material 5 is allowed to form 3-D solid structure form, the precipitation of effective Fluorophotometry powder 5, improves silica gel refractive index.Load onto connector 6, carry out second time encapsulation with nano magnesia composite epoxy resin 7, namely form integrated type LED light source module 16.
Lens type light guide plate, makes a concave spherical surface in the position of the corresponding LED light source of light guide plate incident side by light guide plate with professional production equipment, namely forms lens type light guide plate 12.
First LED light source module 16 is loaded in radiator frame 9 by connector 6, then L connector 10 is connected with radiator frame 9 is combined into LED flat lamp framework.Diffuser plate 11, lens type light guide plate 12, reflector 13, backboard 14 are loaded in LED flat lamp framework successively, fixes with screw 15, connect upper conductor 18, power module 17, be namely combined into a complete modular high definition LED flat lamp.
Claims (5)
1. a modular high definition LED flat lamp, by radiator frame (9), connector (10), diffuser plate (11), light guide plate (12), reflector (13), heat sinking back-plate (14), LED light source module (16) and power module (17) composition, LED light source module (16) is combined into LED flat lamp framework with radiator frame (9) and connector (10), diffuser plate, light guide plate, reflector, heat sinking back-plate loads LED flat lamp framework successively, securing member is fastened as a whole, it is characterized in that described radiator frame is square shape enclosed radiation framework, described light guide plate is side light inlet concave lens type light guide plate.
2. modular high definition LED flat lamp according to claim 1, it is characterized in that described LED light source module is by LED chip (1), wire (2), circuit board (3), comprehensive silicon glue-line (4), phosphor powder layer (5), connector (6), compound resin layer (7) and heat-conducting substrate (8) composition, wire is by LED chip and circuit board electric connection, connector and circuit board electric connection, heat-conducting substrate top is optics reflector, multiple blue-light LED chip is implanted in the optics reflector on heat-conducting substrate top, LED chip is encapsulated by compound silica gel, compound silica gel covers layer of fluorescent powder layer, compound resin is by LED chip, wire, circuit board, comprehensive silicon glue-line, phosphor powder layer, connector and heat-conducting substrate secondary encapsulation, be solidified into independently LED module overall, connector is had to be connected between module whole with module whole, form integrated LED modular surface light source.
3. modular high definition LED flat lamp according to claim 2, it is characterized in that described comprehensive silicon glue-line is the comprehensive silicon glue-line being mixed with glass microballoon, described compound resin layer is the epoxy resin layer having mixed nano magnesia.
4. modular high definition LED flat lamp according to claim 2, is characterized in that being swallowtail-shaped structure bottom described heat-conducting substrate.
5. modular high definition LED flat lamp according to claim 3, is characterized in that being swallowtail-shaped structure bottom described heat-conducting substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510519833.3A CN105135278A (en) | 2015-08-24 | 2015-08-24 | Module type high-definition LED panel lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510519833.3A CN105135278A (en) | 2015-08-24 | 2015-08-24 | Module type high-definition LED panel lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105135278A true CN105135278A (en) | 2015-12-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510519833.3A Pending CN105135278A (en) | 2015-08-24 | 2015-08-24 | Module type high-definition LED panel lamp |
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| Country | Link |
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| CN (1) | CN105135278A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107255229A (en) * | 2017-07-24 | 2017-10-17 | 中山市华南理工大学现代产业技术研究院 | A kind of new integrated lamp just assembled and its manufacture method |
| CN110617446A (en) * | 2018-06-20 | 2019-12-27 | 北京汉能光伏投资有限公司 | Solar energy light-emitting block and light-emitting path |
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| CN201439890U (en) * | 2009-06-12 | 2010-04-21 | 铜陵三极照明科技有限责任公司 | Liquid-cooling and nanometer panel LED energy-saving lamp |
| CN201521863U (en) * | 2009-10-21 | 2010-07-07 | 瑞仪光电(苏州)有限公司 | Backlight module and light guide plate thereof |
| CN102013450A (en) * | 2009-09-08 | 2011-04-13 | 上海鼎晖科技有限公司 | COB integrated encapsulation technology of special technology |
| CN202868382U (en) * | 2012-09-23 | 2013-04-10 | 罗业富 | Integrated high definition light-emitting diode (LED) light source module |
| CN203162774U (en) * | 2013-02-07 | 2013-08-28 | 无锡通明科技有限公司 | Ultra-thin LED plane lamp |
| CN204962465U (en) * | 2015-08-24 | 2016-01-13 | 郑雅文 | Dull and stereotyped lamp of modular high definition LED |
-
2015
- 2015-08-24 CN CN201510519833.3A patent/CN105135278A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201439890U (en) * | 2009-06-12 | 2010-04-21 | 铜陵三极照明科技有限责任公司 | Liquid-cooling and nanometer panel LED energy-saving lamp |
| CN102013450A (en) * | 2009-09-08 | 2011-04-13 | 上海鼎晖科技有限公司 | COB integrated encapsulation technology of special technology |
| CN201521863U (en) * | 2009-10-21 | 2010-07-07 | 瑞仪光电(苏州)有限公司 | Backlight module and light guide plate thereof |
| CN202868382U (en) * | 2012-09-23 | 2013-04-10 | 罗业富 | Integrated high definition light-emitting diode (LED) light source module |
| CN203162774U (en) * | 2013-02-07 | 2013-08-28 | 无锡通明科技有限公司 | Ultra-thin LED plane lamp |
| CN204962465U (en) * | 2015-08-24 | 2016-01-13 | 郑雅文 | Dull and stereotyped lamp of modular high definition LED |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107255229A (en) * | 2017-07-24 | 2017-10-17 | 中山市华南理工大学现代产业技术研究院 | A kind of new integrated lamp just assembled and its manufacture method |
| CN110617446A (en) * | 2018-06-20 | 2019-12-27 | 北京汉能光伏投资有限公司 | Solar energy light-emitting block and light-emitting path |
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Application publication date: 20151209 |
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| WD01 | Invention patent application deemed withdrawn after publication |