CN201344394Y

CN201344394Y - A high-power white light LED module

Info

Publication number: CN201344394Y
Application number: CNU2009200667946U
Authority: CN
Inventors: 李上宾
Original assignee: AMERTRON TECHNOLOGY (KUNSHAN) Co Ltd
Current assignee: Andrea International Co., Ltd.
Priority date: 2009-01-13
Filing date: 2009-01-13
Publication date: 2009-11-11
Anticipated expiration: 2019-01-13

Abstract

The utility model discloses a high-power white light LED module, which comprises a heat diffusion printed circuit board, a plurality of LED chips that set on the heat diffusion printed circuit board, a frame pressed on the heat diffusion printed circuit board and connects with the heat diffusion printed circuit board, and center of the frame is provided with a through hole that surrounds the plurality of LED chips inside; transparent silica gel that set in area surrounded by the through hole of the frame and covers over the plurality of LED chips; the transparent silica gel is provided with dispersed fluorescent powder and upper surface of the transparent silica gel if flat. In the utility model, number of the LED chips is bigger than or equal to 40, and every three neighboring LED chips constitute an equilateral triangle. In the utility model, the fluorescent powder is dispersed in the silica gel directly, and luminous efficiency of the LED module as a whole is improved by utilizing high light transmittance ratio and high refractive ratio of the silica gel itself; meanwhile, the arrange way of equilateral triangles composed by every three neighboring LED chips improves heat dispersion of the LED module.

Description

The large power white light LED module

Technical field

The utility model relates to the LED luminescent device, relates in particular to performance number and is the large power white light LED module more than or equal to 50 watts.

Background technology

Recently, along with the fast development of white light LEDs, it has surpassed at aspects such as brightness, power or approaching traditional energy-conserving light source.Thereby the large power white light LED module has obtained in fields such as street lamp, view, Xi Qiang, room lightings widely applying.The peak power of single the high-power LED chip of having released on market at present, is 5 watts.In high-power applications fields such as street lamps, normally up to a hundred great power LEDs or thousands of 0.1 watt of packaged LED of left and right sides low-power combine, and reach required luminous flux and illumination.The module size of this mode is relatively large, and required radiator structure design is complicated, has directly limited its range of application.Can accomplish less than 12 degrees centigrade every watt that even the another one shortcoming is the packaging thermal resistance of single LEDs the thermal resistance of the LED module after integrated but is difficult to control, work can cause the junction temperature of led chip to surpass allowed band and the performance and life-span of damaging chip for a long time.Other shortcoming comprises that also the external optical design when giving concrete the application brings great difficulty, is difficult to obtain a desirable beam distribution owing to be the spot light that disperses.

Summary of the invention

Technical problem to be solved in the utility model is to provide a kind of large power white light LED module with good light extraction efficiency.

Further technical problem to be solved in the utility model is to provide a kind of large power white light LED module of low thermal resistance.

The technical scheme that the utility model adopted is: a kind of large power white light LED module comprises:

The heat conduction printed circuit board (PCB);

A plurality of led chips are arranged on the heat conduction printed circuit board (PCB);

Framework is pressed on the heat conduction printed circuit board (PCB), and links to each other with this heat conduction printed circuit board (PCB), is provided with one at the center of framework a plurality of led chips are trapped among wherein through hole;

Transparent silica gel is arranged in the zone that through hole surrounded of framework, and is covered on a plurality of led chips, has the fluorescent material that disperses setting in this transparent silica gel, and the upper surface of transparent silica gel is the plane.

Above-mentioned large power white light LED module wherein, also comprises a transparent overhead guard, and this transparent overhead guard is arranged on the peristome of the through hole of framework, and the lower surface of this transparent overhead guard is the plane; The upper surface of transparent overhead guard is the plane or is provided with and a plurality of one to one hemispherical protuberances of described a plurality of led chips.

Above-mentioned large power white light LED module, wherein, the quantity of led chip is more than or equal to 40, and adjacent per three led chips constitute equilateral triangle.

Above-mentioned large power white light LED module, wherein, the light-emitting area area of each led chip is greater than 0.05 square millimeter.

Above-mentioned large power white light LED module, wherein, the hole wall of the through hole of framework is the inclined-plane, the angle between the bottom surface of described inclined-plane and framework is more than or equal to 45 ° and smaller or equal to 70 °.

After adopting technique scheme, the utility model is by directly being dispersed in fluorescent material in the silica gel, and utilize the high transmission rate of silica gel itself and whole light extraction efficiency that high index of refraction makes led module to be improved, the intrinsic mechanical property of silica gel can avoid because the stress that the causes destruction to chip of expanding with heat and contract with cold, and owing to arrange in adjacent per three led chips formation equilateral triangle mode, improve the heat dispersion of led module, reduced overall thermal resistance.And the arrangement mode of equilateral triangle can improve the uniformity that the face luminous intensity distributes.In addition, the utility model is area source rather than spot light independently, has reduced the intensity of dazzle.The utility model also has compact conformation, energy-saving advantages.

Description of drawings

Fig. 1 is the structural representation of first kind of embodiment of the utility model large power white light LED module;

Fig. 2 is the generalized section of Fig. 1;

Fig. 3 is the generalized section of second kind of embodiment of the utility model large power white light LED module;

Fig. 4 A is the structural representation of the third embodiment of the utility model large power white light LED module;

Fig. 4 B is the generalized section of Fig. 4 A;

Fig. 5 is the local enlarged diagram of the utility model large power white light LED module.

The specific embodiment

Below in conjunction with accompanying drawing of the present utility model making further specified.

As depicted in figs. 1 and 2, large power white light LED module of the present utility model comprises heat conduction printed circuit board (PCB) 1, a plurality of led chip 2, transparent silica gel 3 and framework 4.Heat conduction printed circuit board (PCB) 1 can adopt high heat conduction aluminium, also can adopt materials such as oxygen-free copper, pottery, can fully contact with radiating seat when using, and reduces thermal resistance.A plurality of led chips 2 are arranged on the heat conduction printed circuit board (PCB) 1, and each led chip is connected with circuit by gold thread or aluminum steel 12 on the weld pad 11 of circuit board, as shown in Figure 5.Weld pad 11 is provided with reflection layer 110 by the main body insulation of insulating barrier 13 with heat conduction printed circuit board (PCB) 1 on the surface of this weld pad 11, and reflection layer 110 for example can be a Gold plated Layer.In the utility model, preferably, the quantity of led chip 2 is more than or equal to 40, and adjacent per three led chips 2 formation equilateral triangles, and such being furnished with is beneficial to the heat dispersion that improves this led module.The light-emitting area area of each led chip 2 is preferably greater than 0.05 square millimeter.In one embodiment, 10 * 10 circuit can be set on heat conduction printed circuit board (PCB) 1, connect 10 led chips 2 on every series circuit, this 10 series circuits both positive and negative polarity parallel connection each other at last can be luminous under 30 volts～35 volts DC voltage.

Framework 4 is pressed on the heat conduction printed circuit board (PCB) 1, and links to each other with heat conduction printed circuit board (PCB) 1, is provided with one at the center of framework 4 a plurality of led chips 2 are trapped among wherein through hole 41.In Fig. 1, position at four angles of heat conduction printed circuit board (PCB) 1 and framework 4 is provided with corresponding positioning hole, and the screw of the locating hole 46 that can be by passing framework 4 and the locating hole 16 of heat conduction printed circuit board (PCB) links together heat conduction printed circuit board (PCB) 1 and framework 4.The material of framework 4 can be selected resistant to elevated temperatures engineering plastics for use.Transparent silica gel 3 is arranged in the zone that the through hole 41 of framework surrounded, and is covered on a plurality of led chips 2, has to disperse the fluorescent material 5 that is provided with in this transparent silica gel 3, and fluorescent material directly is mixed in the transparent silica gel, and the upper surface of transparent silica gel 4 is the plane.By the concentration of the fluorescent material in the control transparent silica gel and the thickness of transparent silica gel, can adjust the colour temperature and the colour developing coefficient of outgoing white light.In order to improve the outside light emission rate of led module, the hole wall of the through hole 41 of framework is the inclined-plane, and the angle α between the bottom surface of this inclined-plane and framework is more than or equal to 45 ° and smaller or equal to 70 °, thereby can the reflecting part beam split.

For the bright dipping light distribution of adjusting module, the utility model also can comprise a transparent overhead guard 6, and this transparent overhead guard 6 is arranged on the peristome of the through hole 41 of framework, and the material of transparent overhead guard can be selected glass or Merlon for use.In Fig. 3, the upper and lower surface of transparent overhead guard 6 is the plane.In Fig. 4 A and 4B, the lower surface of transparent overhead guard 6 is the plane, and upper surface is provided with and a plurality of one to one hemispherical protuberances 63 of a plurality of led chips 2.These hemispherical protuberances 63 play the effect of convex lens, can improve the rising angle and the beam shape of led module effectively, are suitable for street lamp or projecting apparatus special light source etc. have specific (special) requirements to the light beam spatial distribution occasion.

Led chip of the present utility model can adopt ternary InGaN or quaternary AlInGaN blue chip, and fluorescent material is yellow fluorescent powder.The utility model can be applied to street lamp, projecting lamp, projecting apparatus etc.

Though description of the present utility model combines certain embodiments, but it should be understood by one skilled in the art that the utility model is not limited to embodiment described here, and can carry out various modifications and variations and do not deviate from spirit and scope of the present utility model.

Claims

1. a large power white light LED module is characterized in that, comprising:

The heat conduction printed circuit board (PCB);

A plurality of led chips are arranged on the described heat conduction printed circuit board (PCB);

Framework is pressed on the heat conduction printed circuit board (PCB), and links to each other with this heat conduction printed circuit board (PCB), is provided with one at the center of framework described a plurality of led chips are trapped among wherein through hole;

2. large power white light LED module as claimed in claim 1 is characterized in that, also comprises a transparent overhead guard, and described transparent overhead guard is arranged on the peristome of the through hole of framework, and the lower surface of this transparent overhead guard is the plane.

3. large power white light LED module as claimed in claim 2 is characterized in that, the upper surface of described transparent overhead guard is the plane.

4. large power white light LED module as claimed in claim 2 is characterized in that, the upper surface of described transparent overhead guard is provided with and a plurality of one to one hemispherical protuberances of described a plurality of led chips.

5. as any one described large power white light LED module in the claim 1 to 4, it is characterized in that the quantity of described led chip is more than or equal to 40, and adjacent per three led chips constitute equilateral triangle.

6. large power white light LED module as claimed in claim 5 is characterized in that, the light-emitting area area of each led chip is greater than 0.05 square millimeter.

7. large power white light LED module as claimed in claim 1 is characterized in that, the hole wall of the through hole of described framework is the inclined-plane, and the angle between the bottom surface of described inclined-plane and framework is more than or equal to 45 ° and smaller or equal to 70 °.

8. large power white light LED module as claimed in claim 1 is characterized in that, the weld pad surface of described heat conduction printed circuit board (PCB) is provided with reflection layer.

9. large power white light LED module as claimed in claim 1 is characterized in that, described led chip is a blue-light LED chip, and described fluorescent material is yellow fluorescent powder.