CN202868382U - Integrated high definition light-emitting diode (LED) light source module - Google Patents
Integrated high definition light-emitting diode (LED) light source module Download PDFInfo
- Publication number
- CN202868382U CN202868382U CN2012204857725U CN201220485772U CN202868382U CN 202868382 U CN202868382 U CN 202868382U CN 2012204857725 U CN2012204857725 U CN 2012204857725U CN 201220485772 U CN201220485772 U CN 201220485772U CN 202868382 U CN202868382 U CN 202868382U
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- light source
- led
- source module
- high definition
- radiator
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Abstract
An integrated high definition light-emitting diode (LED) light source module comprises LED chips, a metal wire, a PC circuit board, a transparent silicone layer, a phosphor powder layer, a connector assembly, a transparent epoxy resin layer and a radiator. A plurality of heat dissipation scales are arranged on the surface of the radiator and the bottom of the radiator is a reflection cup structure. The LED chips are directly embedded into the bottom of the reflection cup. The LED chips are communicated with the PC circuit board through a spun gold. The transparent silicone layer is solidified on the LED chips. The phosphor powder layer is arranged on the transparent silicone layer. The LED chips, the metal wire, the PC circuit board, the transparent silicone layer, the phosphor powder layer, the connector assembly, and the radiator are solidified into a whole by the transparent epoxy resin layer. The LED chips are connected by the connector assembly and form the integrated high definition LED light source module. The integrated high definition LED light source module has the advantages that light effect is good, service life of the chips is long, structure is simple, repair, replacement and combination are convenient, cost is relatively low, and the problem of sedimentation of the phosphor powder is solved, therefore luminous flux and color rendering of LED light source products are improved.
Description
Technical field
The utility model relates to a kind of led light source, particularly with led chip, radiator integrated, realizes the integrated form high definition led light source module of modularized encapsulation structure.
Background technology
Existing led light source all is the separation member frame mode, safeguards inconvenient.Separation member formula structure is the LED luminescence chip to be placed first carry out the bonding wire encapsulation in the led support, forms single led light source, a plurality of led light sources is welded to forms the led light source module on the aluminium base again.Owing to be a plurality of led light source permutation and combination, when work dazzle larger, aberration is inconsistent, causes easily visual fatigue.In case one of them damage just is difficult to maintain and replace, the client mostly only returns producer and processes, and is easy to damage electronic components associated therewith during the maintenance of folding dress, also has some hidden danger after fixing.
Moreover, be welded on the led light source module that is combined on the aluminium base by a plurality of led light sources, the heat of led chip can only pass on the aluminium base by led support welding shank first, and aluminium base passes on the radiator by heat conductive silica gel again, forms a plurality of thermal resistances.Its result is exactly so that the junction temperature of LED raises the lost of life.
Summary of the invention
In view of the deficiency that present led light source module exists, the integrated form high definition led light source module that the utility model purpose is a kind of simple in structure, rapid heat dissipation of design, cost is low, the life-span is long.
The utility model is a kind of integrated form high definition led light source module, it is characterized in that the led light source module is by led chip, wire, circuit board, the transparent silicon glue-line, phosphor powder layer, connector, transparent epoxy layer and radiator consist of, the radiator bottom is a reflecting cup structure, a plurality of led chips are directly implanted the reflector bottom, between led chip and the circuit board by the wire electric connection, be solidified with the transparent silicon glue-line above the led chip, above the transparent silicon glue-line phosphor powder layer is arranged, transparent epoxy layer is with led chip, wire, circuit board, the transparent silicon glue-line, phosphor powder layer, connector and radiator are cured as led module integral body, connected by connector between the module, form integrated form high definition led light source module.
The utility model is integrated led chip and fansink designs, has following advantage:
One, aspect the led chip heat radiation, adopt aluminum material and flake type radiator, make the radiator surface area maximization, led chip is directly implanted the radiator reflector, the heat that led chip produces directly imports radiator, by scale with dissipation of heat in air, reduced thermal resistance, improve radiating efficiency, prolonged the service life of chip;
Two, chip is directly implanted in the radiator reflector, made the LED performance more stable, it is little to decay, luminous evenly soft, and free from glare is not hindered eyes, the bright dipping high conformity, and optical efficiency is high;
Three, accurate secondary encapsulation structure has solved the technical barrier that fluorescent material precipitates, and has improved significantly luminous flux and the colour rendering of led light source product;
Four, each light source module all can exchange by connector, and local fault does not affect the normal operation of whole light fixture, is convenient to judgement, analyzing failure cause and device failure place, for convenience detach and maintenance, saves maintenance cost, makes maintenance work become very light;
Five, led light source is encapsulated as the separate modular structure, can freely arrange in pairs or groups and make up, and forms the LED light fixture product of different capacity and brightness, and is easy to assembly quick;
Six, simplified structure has reduced production cost and maintenance cost.
In sum, the utlity model has that bright dipping is effective, the chip life-span is long, simple in structure, maintenance, change, combination is convenient, cost is relatively low advantage, be the perfect light source of LED illuminating product of new generation.
Description of drawings
Fig. 1 is this integrated form high definition led light source floor map
Fig. 2 is this integrated form high definition led light source modular structure schematic diagram
The specific embodiment
As shown in the figure, this integrated form high definition led light source module comprises in blue-light LED chip 1, the wire 2(present embodiment and adopts spun gold), circuit board 3 (in the present embodiment adopt PC circuit board), transparent silicon glue-line 4, phosphor powder layer 5, connector 6, transparent epoxy layer 7 and radiator 8.Adopt high accuracy chip die bond machine, a plurality of blue-light LED chips 1 implanted in the reflector of radiators 8, again with bonding equipment with spun gold 2 and PC circuit board 3 electric connections.Adopt glue dispenser with high precision transparent silica gel 4 to be clicked and entered in the reflector of radiator, blue-light LED chip 1 is carried out the encapsulation first time, when transparent silica gel 4 is solidified to 40%, use again high-precision dot powder machine with 5 in fluorescent material above transparent silica gel 4, allow led chip 1, transparent silica gel 4, fluorescent material 5 form 3-D solid structure form, the precipitation of establishment fluorescent material 5.Load onto connector 6, carry out the encapsulation second time with transparent epoxy resin 7, namely form integrated form high definition led light source module.
Claims (4)
1. integrated form high definition led light source module, it is characterized in that the led light source module is by led chip (1), wire (2), circuit board (3), transparent silicon glue-line (4), phosphor powder layer (5), connector (6), transparent epoxy layer (7) and radiator (8) consist of, radiator (8) bottom is a reflecting cup structure, a plurality of led chips (1) are directly implanted the reflector bottom, between led chip (1) and the circuit board (3) by wire (2) electric connection, be solidified with transparent silicon glue-line (4) above the led chip, phosphor powder layer (5) is arranged above the transparent silicon glue-line (4), transparent epoxy layer (7) is with led chip (1), wire (2), circuit board (3), transparent silicon glue-line (4), phosphor powder layer (5), connector (6) and radiator (8) are cured as led module integral body, connected by connector (6) between the module, form integrated form high definition led light source module.
2. integrated form high definition led light source module according to claim 1 is characterized in that this radiator adopts aluminum material to make, and has a plurality of heat radiation scales on it.
3. integrated form high definition led light source module according to claim 1 is characterized in that described wire (2) adopts spun gold.
4. integrated form high definition led light source module according to claim 2 is characterized in that described wire (2) adopts spun gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204857725U CN202868382U (en) | 2012-09-23 | 2012-09-23 | Integrated high definition light-emitting diode (LED) light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204857725U CN202868382U (en) | 2012-09-23 | 2012-09-23 | Integrated high definition light-emitting diode (LED) light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202868382U true CN202868382U (en) | 2013-04-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012204857725U Expired - Fee Related CN202868382U (en) | 2012-09-23 | 2012-09-23 | Integrated high definition light-emitting diode (LED) light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202868382U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105135278A (en) * | 2015-08-24 | 2015-12-09 | 郑雅文 | Module type high-definition LED panel lamp |
| CN108870100A (en) * | 2017-11-28 | 2018-11-23 | 潘煜彬 | A kind of shell structure of LED energy-saving lamp |
-
2012
- 2012-09-23 CN CN2012204857725U patent/CN202868382U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105135278A (en) * | 2015-08-24 | 2015-12-09 | 郑雅文 | Module type high-definition LED panel lamp |
| CN108870100A (en) * | 2017-11-28 | 2018-11-23 | 潘煜彬 | A kind of shell structure of LED energy-saving lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130410 Termination date: 20130923 |