CN206774543U - LED module BGA package fixed structure - Google Patents
LED module BGA package fixed structure Download PDFInfo
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- CN206774543U CN206774543U CN201720462775.XU CN201720462775U CN206774543U CN 206774543 U CN206774543 U CN 206774543U CN 201720462775 U CN201720462775 U CN 201720462775U CN 206774543 U CN206774543 U CN 206774543U
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- led module
- bga
- light source
- pcb board
- led
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Abstract
The utility model proposes LED module BGA package fixed structure, LED module, pcb board and BGA attachment welding fixtures；The LED module is the light source device of BGA package；The solder joint of salient point array is located at the bga substrate back side；The LSI chips are located at bga substrate front；It is provided with the LSI chips and fixed LED and support circuit is packaged with molding or filling resin material；It is electrically connected between LSI chips and salient point array；BGA light source pads are provided with the pcb board；The BGA attachments welding fixture is a location-plate, and the location-plate is provided with more than one light source fixing hole；When being mounted or being welded to LED module, the location-plate is removably fixed on pcb board, LED module mounts positioning and welding positioning with light source fixing hole on pcb board, remove location-plate again after LED module is fixedly welded on pcb board, the utility model can manufacture the LED light source of high availability by BGA package.
Description
Technical field
It the utility model is related to LED light source technical field, especially LED module BGA package fixed structure.
Background technology
LED method for packing has at present：Support row's encapsulation, paster encapsulation, module packaging is several, and these method for packing are all
We are common and conventional.
Support row's encapsulation is to use earliest, and for producing single led device, here it is our common wire types luminous two
Pole pipe（Encapsulated including Piranha）, it is adapted to do instrument indicator lamp, city lighting engineering, advertisement screen, guardrail pipe, traffic instruction
Lamp, and China applies some commonplace products and field at present.
Paster encapsulates（SMD）It is a kind of non-leaded package, it is small volume, thin, it is well suited for doing the keyboard ＆ display illumination of mobile phone, electricity
Depending on the back lighting of machine, and the electronic product for illuminating or indicating is needed, paster encapsulates oriented large scale and high power in recent years
Direction develop, three, four led chips of encapsulation in paster, available for assembling illuminating product.
Module packaging is also a kind of multi-chip package, with less size, high envelope on aluminum oxide or aluminium nitride substrate
Fill density and encapsulate tens or hundreds of LED chips, internal on line is series-parallel connection pattern, that is, the series connection for there are multiple chips has again
The parallel connection on several roads.This encapsulation mainly expands power, is used as illuminating product.
The general LED using support row's encapsulation, support row is to be stamped to form using copper or ferrous material through precision die,
The support row of iron will pass through silver-plated.It is silver-plated to have two effects, first, in order to prevent oxidation and rusting, second, conveniently welding, support row
Electroplating quality it is very crucial, it is related to LED life-span, but our in general LED encapsulation enterprises do not possess inspection branch
Frame arranges the ability of electroplating quality, and this has just given some electroplating enterprises to have an opportunity to take advantage of, and the support of plating is arranged silver coating and is thinned, reduces
Cost payout.The product worked it out with such support row is to affirm that use is not permanent, such as high humidity in air, it is easy to cause
The metalwork oxidation of plating difference is raw to embroider rust, LED element is failed.Also can be because of the too thin adhesive force of silver coating even if the LED encapsulated
Not strong, solder joint departs from support, causes dead lamp phenomenon.The lamp obtained carefully here it is the use that we encounter does not work, in fact
Internal solder joint with support departing from.
SMD packaging plastic water in the market is substantially silica gel（There is good heat resistance）, ready-made product is first
Phase lights test aging has good performance afterwards, but over time, it finds that having glue-line and PPA supports
Peel off, LED discolorations（Silver coating, which turns yellow, to black）Situation occur.The indigo plant that the titanium dioxide added in PPA is sent by chip
Light causes its caused photocatalyst effect, and in the case that silica gel does not have aging in itself, PPA is in itself slowly caused by aging.Epoxy
The encapsulating materials such as resin because heat and light decomposition after residue produce DIC because there is the presence of DIC, blue light, it is silver-plated,
Oxygen and moisture make it accelerate catalysis to cause LED to change colour.
Module packaging is big using caused heat because the density of encapsulation is higher, and radiating is that solve the primary of application to ask
Topic.There is no good radiating effect, allow for the lost of life of lamp, it is not economical and practical enough.
The device produced using the method for packing of the above, there is a common feature：The road number of thermal resistance is more, it is difficult to produces
Go out the illuminator of high quality, and module is higher with the connection processing requirement of radiator in itself.Method for packing all at present
All it is by yellow fluorescent powder（YAG）With epoxy resin by row are not well mixed on year-on-year basis, directly on point to the LED chip of blue light-emitting,
Reheat solidification.This common way advantage be save material, shortcoming be detrimental to radiating, fluorescent material also can aging.Because
Epoxy resin and fluorescent material are not the good materials of heat conduction, and the whole chip of parcel will influence to radiate.For manufacturing LED illumination
Light fixture is apparently not best scheme in this way.
BGA package is the conventional packing forms of modern integrated circuits, possesses the advantages of more, but this class wrapper is not because have
Grafting part, so need specific fixed structure that chip is fixed, and LED chip is a kind of light source device, is had certain
Waterproof, shockproof requirements, and how the power of LED chip, deadweight and size pass through also much larger than common integrated circuit
BGA package manufactures the LED light source of high availability, is a research direction.
The content of the invention
The utility model proposes LED module BGA package fixed structure, the LED of high availability can be manufactured by BGA package
Light source.
The utility model uses following technical scheme.
LED module BGA package fixed structure, LED module of the BGA package fixed structure including BGA package form,
Pcb board and BGA attachment welding fixtures；The LED module is the light source device of BGA package；LED module include bga substrate,
LSI chips, salient point array；The salient point array by by predetermined arrangement mode ordered arrangement in the more of bga substrate solder side
Individual spherical or cylindricality solder joint composition；Salient point array is located at the bga substrate back side；The LSI chips are being located at bga substrate just
Face；It is provided with the LSI chips and fixed LED and support circuit is packaged with molding or filling resin material；
It is electrically connected between LSI chips and salient point array；BGA light source pads are provided with the pcb board；The BGA mounts welding fixture
For a location-plate, the location-plate is provided with more than one light source fixing hole；The size and LED module of the light source fixing hole
Matching；The position of light source fixing hole matches with BGA light sources pad locations on pcb board；When being mounted or welded to LED module
When, the location-plate is removably fixed on pcb board, LED module mounted with light source fixing hole on pcb board positioning and
Welding positioning, location-plate is removed after LED module is fixedly welded on pcb board again.
The salient point array connects is divided into peripheral type array, staggered array and full array by solder joint spread geometry.
In the salient point array of the LED module, the solder joint being connected with the power pins and grounding pin of LSI chips is located at battle array
Row central part；The solder joint being connected with the I/O interface pins of LSI chips is located at array periphery.
In the LSI chips, with the waterproof outside molding or filling resin material formation LED and support circuit
Layer.
Solder mask and pad solder point are provided with the BGA light sources pad, welding resistance hole is offered on solder mask；Enclose in welding resistance hole
Around pad pad, welding resistance gap is left between welding resistance hole and pad solder point；The solder mask is covered in via and pad solder
On lead between point.
Connected between the via and pad solder point with track.
When location-plate is provided with multiple light sources fixing hole, the light source fixing hole is evenly distributed in length and breadth on location-plate；
Such location-plate is used for the pcb board provided with multiple BGA light sources pads, and LED module mounts through light source fixing hole on such pcb board
And LED luminous matrix is formed after welding.
Comprise the following steps successively in the method for LED module manufacture LED luminous matrix；
A1, location-plate is removably fixed on pcb board；
A2, at the BGA light source pads of pcb board coated with tin cream；
A3, LED module is mounted at the BGA light source pads of pcb board through light source fixing hole, forms LED hairs to be welded
Light matrix workpiece；
A4, with welding bench or solder reflow device LED luminous matrix workpiece are welded, be fixedly welded on LED module
At the BGA light source pads of pcb board；
A5, remove location-plate.
In the utility model, the I/O terminals of the BGA package used are distributed in envelope with circular or column solder joint by array format
Face is loaded, not over the encapsulation of LED module；The LED module encapsulated using BGA technologies, the LED quantity phase in module
With in the case of, it is possible to reduce the pin of more than half.I.e. under same volume, although the advantages of BGA technologies being I/O number of pins
Add, but reduction does not add pin spacing on the contrary；The electrical property of LED light source for lifting high integration extremely has
Benefit.
The location-plate that the utility model mounts welding fixture as a result of BGA is carried out to the LED module of BGA package form
Positioning when attachment or welding, so that BGA package can apply to heavy weight LED module, has expanded the application of BGA package
Field, the advantages of making LED also to realize BGA package, realize unexpected technique effect.
It is provided with the utility model, in the LSI chips and fixed LED is packaged with molding or filling resin material
Luminous tube and support circuit；It is electrically connected between LSI chips and salient point array；The design forms two to LED circuit structure
Secondary encapsulation, so as to which most power supply and ground pin are placed among encapsulating structure, the lead of I/O mouths is placed on periphery, letter
Change circuit.
LED module is formed as a result of BGA package, therefore control collapsed chip method can be used to weld, so as to change
Kind electric heating property.
The utility model can increase pin spacing using BGA package, and because pin is soldered ball, parasitic parameter reduces, letter
Number transmission delay is small, and working frequency can be greatly improved when LED module works, and can obviously improve coplanarity in welding, and
And surface tension during soldered ball thawing has obvious " autoregistration " effect, so as to greatly reduce the crash rate of installation, welding.
Use BGA package in LED module, number of pins can it is fewer than existing encapsulation technology more than half.It is such as single led
Full-color three-in-one light emitting diode is packaged with 4 pins, and 2*2 matrix then has 4*4=16 pin, and uses BGA package,
8 pins are only needed, remaining can internally be completed.Similarly, there are 4*9=36 during the encapsulation technology encapsulation 3*3 matrixes first having
Individual pin, and there was only 12 pins using BGA package.
Brief description of the drawings
With reference to the accompanying drawings and detailed description to the further details of explanation of the utility model：
Accompanying drawing 1 is the schematic diagram of the LED module of BGA package form of the present utility model；
Accompanying drawing 2 is the schematic diagram of BGA light sources pad on pcb board described in the utility model；
Accompanying drawing 3 is the schematic diagram of BGA attachments welding fixture described in the utility model；
Accompanying drawing 4 is the schematic diagram of LED luminous matrix made of the LED module described in the utility model in the form of BGA package；
Accompanying drawing 5 is three kinds of solder joint arrangement modes of the utility model salient point array；
In figure：1-LSI chips；2-BGA package substrates；3- solder joints；4- salient point arrays；5-BGA light source pads；6- vias；
7- solder masks；8- light source fixing holes；9-BGA encapsulates the LED module of form；10-PCB plates；11- welding resistances hole；12- pad solders
Point；13- location-plates；14- welding resistances gap.
Embodiment
As Figure 1-5, LED module BGA package fixed structure, the BGA package fixed structure include BGA package form
LED module 9, pcb board 10 and BGA attachment welding fixture；The LED module 9 is the light source device of BGA package；LED module bag
Include bga substrate 2, LSI chips 1, salient point array 4；The salient point array 4 by by predetermined arrangement mode ordered arrangement in BGA
The multiple spherical or cylindricality solder joint 3 of the solder side of package substrate 2 forms；Salient point array 4 is located at the back side of bga substrate 2；It is described
LSI chips 1 are located at the front of bga substrate 2；It is provided with the LSI chips and is packaged with molding or filling resin material
Fixed LED and support circuit；It is electrically connected between LSI chips and salient point array；BGA is provided with the pcb board 10
Light source pad 5；The BGA attachments welding fixture is a location-plate 13, and the location-plate 13 is consolidated provided with more than one light source
Determine hole 8；The size of the light source fixing hole 8 matches with LED module 9；BGA light sources weld on the position of light source fixing hole 8 and pcb board
The location matches of disk 5；When LED module 9 is mounted or welded, the location-plate is removably fixed on pcb board,
LED module mounts positioning and welding positioning with light source fixing hole on pcb board, is taken again after LED module is fixedly welded on pcb board
Lower location-plate.
The salient point array 4 connects is divided into peripheral type array, staggered array and full array by the spread geometry of solder joint 3.
In the salient point array of the LED module, the solder joint 3 being connected with the power pins and grounding pin of LSI chips is located at
The central part of array 4；The solder joint 3 being connected with the I/O interface pins of LSI chips is located at the periphery of array 4.
In the LSI chips, with the waterproof outside molding or filling resin material formation LED and support circuit
Layer.
Solder mask 7 and pad solder point 12 are provided with the BGA light sources pad, welding resistance hole 11 is offered on solder mask 7；Resistance
Welding hole 11 surrounds pad solder point 12, and welding resistance gap 14 is left between welding resistance hole and pad solder point；The solder mask was covered in
On lead between hole and pad solder point.
Connected between the via and pad solder point with track.
When location-plate is provided with multiple light sources fixing hole, the light source fixing hole is evenly distributed in length and breadth on location-plate；
Such location-plate is used for the pcb board provided with multiple BGA light sources pads, and LED module mounts through light source fixing hole on such pcb board
And LED luminous matrix is formed after welding.
Comprise the following steps successively in the method for LED module manufacture LED luminous matrix；
A1, location-plate is removably fixed on pcb board；
A2, at the BGA light source pads of pcb board coated with tin cream；
A3, LED module is mounted at the BGA light source pads of pcb board through light source fixing hole, forms LED hairs to be welded
Light matrix workpiece；
A4, with welding bench or solder reflow device LED luminous matrix workpiece are welded, be fixedly welded on LED module
At the BGA light source pads of pcb board；
A5, remove location-plate.
In this product, LED is LED light emitting diodes.
Claims (7)
1. LED module BGA package fixed structure, it is characterised in that：The BGA package fixed structure includes BGA package form
LED module, pcb board and BGA attachment welding fixtures；The LED module is the light source device of BGA package；LED module includes BGA
Package substrate, LSI chips, salient point array；The salient point array by predetermined arrangement mode ordered arrangement in bga substrate by being welded
The multiple spherical or cylindricality solder joint composition of junction；Salient point array is located at the bga substrate back side；The LSI chips are located at BGA envelopes
Fill substrate front side；It is provided with the LSI chips and fixed LED is packaged with molding or filling resin material and matched somebody with somebody
Cover circuit；It is electrically connected between LSI chips and salient point array；BGA light source pads are provided with the pcb board；The BGA attachments weldering
It is a location-plate to connect tool, and the location-plate is provided with more than one light source fixing hole；The size of the light source fixing hole with
LED module matches；The position of light source fixing hole matches with BGA light sources pad locations on pcb board；Mounted when to LED module
Or during welding, the location-plate is removably fixed on pcb board, and LED module is mounted with light source fixing hole on pcb board
Positioning and welding positioning, location-plate is removed after LED module is fixedly welded on pcb board again.
2. LED module BGA package fixed structure according to claim 1, it is characterised in that：The salient point array is connect by weldering
Point spread geometry is divided into peripheral type array, staggered array and full array.
3. LED module BGA package fixed structure according to claim 2, it is characterised in that：The salient point of the LED module
In array, the solder joint being connected with the power pins and grounding pin of LSI chips is located at array centre position；With the I/O of LSI chips
The connected solder joint of interface pin is located at array periphery.
4. LED module BGA package fixed structure according to claim 1, it is characterised in that：In the LSI chips, with mould
The waterproof layer that pressure or filling resin material are formed outside LED and support circuit.
5. LED module BGA package fixed structure according to claim 1, it is characterised in that：At the BGA light sources pad
Provided with solder mask and pad solder point, welding resistance hole is offered on solder mask；Welding resistance hole surrounds pad solder point, welding resistance hole and pad
Welding resistance gap is left between pad；The solder mask is covered on the lead between via and pad solder point.
6. LED module BGA package fixed structure according to claim 5, it is characterised in that：The via and pad solder
Connected between point with track.
7. LED module BGA package fixed structure according to claim 1, it is characterised in that：When location-plate is provided with multiple
During light source fixing hole, the light source fixing hole is evenly distributed in length and breadth on location-plate；Such location-plate is used to be provided with multiple BGA light
The pcb board of source pad, LED module form LED luminous matrix after light source fixing hole is mounted and welded on such pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720462775.XU CN206774543U (en) | 2017-04-28 | 2017-04-28 | LED module BGA package fixed structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720462775.XU CN206774543U (en) | 2017-04-28 | 2017-04-28 | LED module BGA package fixed structure |
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| Publication Number | Publication Date |
|---|---|
| CN206774543U true CN206774543U (en) | 2017-12-19 |
Family
ID=60635164
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| Application Number | Title | Priority Date | Filing Date |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106898602A (en) * | 2017-04-28 | 2017-06-27 | 福建祥云光电科技有限公司 | LED module BGA package fixed structures |
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2017
- 2017-04-28 CN CN201720462775.XU patent/CN206774543U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106898602A (en) * | 2017-04-28 | 2017-06-27 | 福建祥云光电科技有限公司 | LED module BGA package fixed structures |
| CN106898602B (en) * | 2017-04-28 | 2023-08-04 | 福建祥云光电科技有限公司 | LED module BGA package fixing structure |
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