CN107146787B - A kind of production technology of integrated Surface Mount luminescent device - Google Patents
A kind of production technology of integrated Surface Mount luminescent device Download PDFInfo
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- CN107146787B CN107146787B CN201710257580.6A CN201710257580A CN107146787B CN 107146787 B CN107146787 B CN 107146787B CN 201710257580 A CN201710257580 A CN 201710257580A CN 107146787 B CN107146787 B CN 107146787B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000005516 engineering process Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 238000012360 testing method Methods 0.000 claims abstract description 13
- 238000005538 encapsulation Methods 0.000 claims description 15
- 239000000084 colloidal system Substances 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- 230000003760 hair shine Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000003292 glue Substances 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 235000003392 Curcuma domestica Nutrition 0.000 description 1
- 244000008991 Curcuma longa Species 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 235000003373 curcuma longa Nutrition 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 235000013976 turmeric Nutrition 0.000 description 1
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of production technologies of integrated Surface Mount luminescent device, the following steps are included: step 1, by several luminous point group array packages on the front of substrate, each luminous point group includes at least one red LED chip, at least one green LED chip and at least one blue-light LED chip, and all LED chips are encapsulated on substrate using COB；Substrate cut is divided into several independent luminescent devices by step 2, is equipped with a luminous point group in each luminescent device；Step 3, the red LED chip by each luminescent device, green LED chip and blue-light LED chip light test wavelength and brightness value respectively, divide all luminescent devices to BIN according to test data；The forward voltage and reverse leakage current of step 4, each luminescent device of test, choose underproof.Simple production process of the invention, the luminescent device high resolution of production.
Description
Technical field
The present invention relates to light emitting component technical field more particularly to a kind of production technologies of integrated Surface Mount luminescent device.
Background technique
Existing light-emitting display device largely uses SMD to encapsulate, and SMD encapsulation is by LED chip conducting resinl and insulation
Glue is fixed on the pad of lamp bead bracket, is then carried out the welding of LED chip conduction property and is used epoxy resin after that functional test
Glue encapsulating, then it is divided, cut and beaten braid.
This SMD, which is encapsulated in manufactured luminescent device, only has single RGB chip, although the packing of single lamp bead singulation is easy to add
Work, but quadrangle used in its encapsulation or hexagonal bracket are that subsequent production link brings technical difficulty and reliability hidden danger.
When needing to produce sharpness screen, the dot density that shines increases, and luminescent device needs patch to be worked into display screen circuit board
On, there are the bracket pins of substantial amounts to weld yield issues for this SMD encapsulating structure, can not produce sharpness screen.
Summary of the invention
In order to solve drawbacks described above existing in the prior art, the present invention proposes a kind of production of integrated Surface Mount luminescent device
Technique has filled up high definition, the blank of sharpness screen.
The technical solution adopted by the present invention is that designing a kind of production technology of integrated Surface Mount luminescent device, including following step
It is rapid:
Step 1, by several luminous point group array packages on the front of substrate, each luminous point group include at least one
Red LED chip, at least one green LED chip and at least one blue-light LED chip, all LED chips are encapsulated in using COB
On substrate；
Substrate cut is divided into several independent luminescent devices by step 2, is equipped with a luminous point in each luminescent device
Group；
Step 3, the red LED chip by each luminescent device, green LED chip and blue-light LED chip are lighted respectively
Test wavelength and brightness value divide all luminescent devices to BIN according to test data；
The forward voltage and reverse leakage current of step 4, each luminescent device of test, choose underproof.
Preferably, include multiple red LED chips, multiple green LED chips and multiple in step 1 in each luminous point group
Blue-light LED chip, red LED chip, green LED chip and blue-light LED chip ranks spacing in luminous point group can be arranged arbitrarily
Column combination.
Preferably, all LED chips are encapsulated using formal dress COB in step 1 or upside-down mounting COB is encapsulated.
Preferably, substrate front side is equipped with the pad for packaging LED chips, and the back side of substrate is equipped with draws for welding control
The pin pad of foot.
Preferably, substrate is black double-sided wiring board or multilayer circuit board, and the material of substrate is BT, carbon fiber or FR4.
In the first embodiment, production technology further include: qualified luminescent device arrangement is mounted on high-resolution by step 5
On the circuit board of rate display screen, mask is covered on circuit boards.
In a second embodiment, in step 2 before cutting substrate, molding sealing first is carried out to substrate, makes the front of substrate
Cover the colloid of layer of transparent.Preferably, the thickness range of colloid is 0.8mm to 1.2mm.In a second embodiment, work is produced
Skill further include: qualified and positioned at same BIN range luminescent device is incorporated into carrier band by step 5, and protective film is sealed on carrier band.
The present invention is integrated with COB encapsulation and SMD encapsulation technology, several RGB primary-color LED chips are encapsulated using COB
On substrate, the spacing between LED chip can adjust as required, be cut into independent shine after the completion of LED chip encapsulation again
Device, luminescent device is small in size, and one group of red, green and blue LED chip or multiple groups red, green and blue LED can be packaged in a luminescent device
Chip, the high resolution of luminescent device are suitable for processing high-resolution and high brightness product.
Compared with prior art, LED chip of the invention is encapsulated on substrate using COB, in removal tradition SMD encapsulation
Bracket can be improved the LED chip quantity in single luminescent device, substrate cut be formed single luminescent device after encapsulation, then divide
It is other that luminescent device is divided, is tested, solve in traditional COB encapsulation that product First Pass Yield is difficult to control, yield rate is low
Problem.
Detailed description of the invention
Below with reference to embodiment and attached drawing, the present invention is described in detail, in which:
Fig. 1 is full page structural schematic diagram when substrate is not cut in the present invention；
Fig. 2 is the front pad arrangement schematic diagram in single luminescent device region on substrate in the present invention；
Fig. 3 is the pin on back surface pad arrangement schematic diagram in single luminescent device region on substrate in the present invention；
Fig. 4 is that LED chip is encapsulated in the structural schematic diagram on substrate in the present invention；
Fig. 5 is the structural schematic diagram of the non-sealing of single luminescent device in the present invention；
Fig. 6 is the structural schematic diagram of single luminescent device sealing in the present invention.
Specific embodiment
The production technology of luminescent device proposed by the present invention, including encapsulation, cut, divide BIN, test and etc..
Each step is illustrated in detail below:
Step 1, as shown in Figure 1, substrate 1 carries out layout design in advance as required, the two sides up and down of substrate 1 are equipped with technique
Side 11, technique edges 11 are equipped with location hole 12, convenient for carrying out following process on substrate 1.Substrate 1 be black double-sided wiring board or
Multilayer circuit board, the material of substrate 1 are BT, carbon fiber or FR4, and surface is turmeric technique, except light emitting region full page is black
Group weldering, it is blind hole that via hole, which is connected, in Double-side line.As shown in Figure 2,3,1 front of substrate is equipped with several for packaging LED chips
Pad 13, the back side of substrate 1 are equipped with several pin pads 14 for being used to weld control pin.
As shown in figure 4, each luminous point group includes extremely by several luminous point group array packages on the front of substrate 1
A few red LED chip, at least one green LED chip and at least one blue-light LED chip, all LED chips 2 are Dan Ji
Color bare chip, and on substrate 1 using COB encapsulation.
For ease of description, three-color LED chip referred to herein is red LED chip, green LED chip and blue light
The abbreviation of LED chip.The quantity of three-color LED chip and arrangement can be identical or not identical in each luminous point group, preferably, step
It include multiple red LED chips, multiple green LED chips and multiple blue-light LED chips, luminous point in each luminous point group in 1
Three-color LED chip arbitrary arrangement combination in group, according to the spacing between actual needs adjustment three-color LED chip, luminous point group
Interior adjacent three-color LED die colors are mixed to form a virtual luminous point, form point spacing by the combination of several luminous points
Different miniature matrix light emitting device 3.For existing SMD element, using can be arranged in the luminescent device 3 processed of the present invention
Several three-color LED chips of cloth, and can arbitrarily adjust the spacing of three-color LED chip, small in size, high resolution.
In addition, formal dress COB encapsulation can be used in all LED chips 2 in step 1 or upside-down mounting COB encapsulation, formal dress COB i.e. will be naked
Chip is just being put on substrate 1, and the conducting of LED chip and substrate is realized by wire bonding.Bare chip is inverted by anti-dress COB
It puts on substrate 1, LED chip 2 is directly connected with substrate by chip electrode, and upside-down mounting COB size can accomplish smaller, and optics is more
It is easy matching, heat sinking function, chip service life and antistatic effect are good.
After the completion of step 2, the encapsulation of luminous point group, as shown in figure 5, the cutting of substrate 1 is divided into several independent photophores
Part 3, each luminescent device 3 is interior to be equipped with a luminous point group, and the size of luminescent device 3 is within 15 × 15mm, and luminescent device 3 is just
Face shines, bottom surface is equipped with control pin 31；
Three-color LED chip in each luminescent device 3 is lighted test wavelength and brightness value by step 3 respectively, according to test
Data divide all luminescent devices 3 to BIN；
Step 4, simple scan test the forward voltage and reverse leakage current of each luminescent device 3, choose underproof.
In the first embodiment, as shown in figure 5, production technology further include: after step 5, luminescent device 3 that will be qualified solidify
On circuit boards, the cured process of luminescent device 3 is exactly the 2 surface dispensing of LED chip in luminescent device 3 for arrangement installation, covering
LED chip 2 prevents it to be oxidized, and covers the LED chip 2 on mask protection luminescent device on circuit boards, what LED chip issued
Light is projected across mask, and the form of mask covering is conducive to later period demolition and maintenance, and shine more evenly, it is brighter.
In a second embodiment, as shown in fig. 6, in step 2 before cutting substrate 1, molding envelope first is carried out to full page substrate
Glue makes the colloid 4 of the front covering layer of transparent of substrate 1, protects LED chip 2, the light that LED chip 2 issues by the colloid 4
Line is projected across colloid 4.Preferably, the thickness range of colloid 4 is 0.8mm to 1.2mm.In a second embodiment, production technology
Further include: qualified and positioned at same BIN range luminescent device 3 is incorporated into carrier band by step 5, and protective film is sealed on carrier band.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (9)
1. a kind of production technology of integrated Surface Mount luminescent device, which comprises the following steps:
Step 1, by several luminous point group array packages on the front of substrate, each luminous point group include at least one feux rouges
LED chip, at least one green LED chip and at least one blue-light LED chip, all LED chips are encapsulated in substrate using COB
On, substrate front side is equipped with several pads for being used for packaging LED chips, and the back side of substrate is equipped with several and draws for welding control
The pin pad of foot；
Substrate cut is divided into several independent luminescent devices by step 2, is equipped with a luminous point group in each luminescent device,
Luminescent device front shines, bottom surface is equipped with control pin；
Step 3, the red LED chip by each luminescent device, green LED chip and blue-light LED chip light test respectively
Wavelength and brightness value divide all luminescent devices to BIN according to test data；
The forward voltage and reverse leakage current of step 4, each luminescent device of test, choose underproof.
2. production technology as described in claim 1, which is characterized in that comprising multiple in each luminous point group in the step 1
Red LED chip, multiple green LED chips and multiple blue-light LED chips, red LED chip, green light LED in luminous point group
Chip and blue-light LED chip ranks spacing can arbitrary arrangement combinations.
3. production technology as claimed in claim 2, which is characterized in that further include: step 5 arranges qualified luminescent device
Installation on circuit boards, covers mask on circuit boards.
4. production technology as claimed in claim 1 or 2, which is characterized in that in the step 2 before cutting substrate, first to base
Plate carries out molding sealing, makes the colloid of the front covering layer of transparent of substrate.
5. production technology as claimed in claim 4, which is characterized in that the thickness range of the colloid is 0.8mm to 1.2mm.
6. production technology as claimed in claim 4, which is characterized in that further include: step 5, will be qualified and be located at same BIN model
The luminescent device enclosed is incorporated into carrier band, and protective film is sealed on carrier band.
7. production technology as described in any one of claims 1 to 3, which is characterized in that all LED chips are adopted in the step 1
With formal dress COB encapsulation or upside-down mounting COB encapsulation.
8. production technology as described in any one of claims 1 to 3, which is characterized in that the substrate front side is equipped with for encapsulating
The pad of LED chip, the back side of the substrate are equipped with the pin pad for welding control pin.
9. production technology as described in any one of claims 1 to 3, which is characterized in that the substrate is black double-sided wiring board
Or multilayer circuit board, the material of the substrate are BT, carbon fiber or FR4.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710257580.6A CN107146787B (en) | 2017-04-19 | 2017-04-19 | A kind of production technology of integrated Surface Mount luminescent device |
| PCT/CN2017/112774 WO2018192221A1 (en) | 2017-04-19 | 2017-11-24 | Manufacturing process for integrated surface-mounted light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710257580.6A CN107146787B (en) | 2017-04-19 | 2017-04-19 | A kind of production technology of integrated Surface Mount luminescent device |
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| Publication Number | Publication Date |
|---|---|
| CN107146787A CN107146787A (en) | 2017-09-08 |
| CN107146787B true CN107146787B (en) | 2019-08-09 |
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| CN201710257580.6A Active CN107146787B (en) | 2017-04-19 | 2017-04-19 | A kind of production technology of integrated Surface Mount luminescent device |
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| WO (1) | WO2018192221A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107146787B (en) * | 2017-04-19 | 2019-08-09 | 深圳市梓光智能科技有限公司 | A kind of production technology of integrated Surface Mount luminescent device |
| CN108767087A (en) * | 2018-05-17 | 2018-11-06 | 山西高科华兴电子科技有限公司 | A method of manufacturing LED display modules with multilayer compound glass ceramic substrate |
| TWI688809B (en) * | 2019-02-01 | 2020-03-21 | 友達光電股份有限公司 | Light emitting module and display module |
| CN111526664A (en) * | 2020-04-28 | 2020-08-11 | 苏州狮威电子科技有限公司 | Circuit board BIN value marking method |
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| CN101640244A (en) * | 2009-08-20 | 2010-02-03 | 张九六 | Device for automatic material stripping and automatic Bin splitting for serial flaky LEDs |
| CN104167412A (en) * | 2014-08-25 | 2014-11-26 | 广东威创视讯科技股份有限公司 | LED packaging structure and manufacturing method thereof |
| CN105170487A (en) * | 2015-06-05 | 2015-12-23 | 中山市利光电子有限公司 | Automatic control system for LED sorting machine |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3627478B2 (en) * | 1997-11-25 | 2005-03-09 | 松下電工株式会社 | Light source device |
| JP2007207833A (en) * | 2006-01-31 | 2007-08-16 | Sanyo Electric Co Ltd | Light-emitting diode light source |
| CN202660269U (en) * | 2012-04-19 | 2013-01-09 | 浙江英特来光电科技有限公司 | High density integrated packaging red, green, and blue (RGB) module |
| CN103078044A (en) * | 2013-01-09 | 2013-05-01 | 宏齐光电子(深圳)有限公司 | Production method of ultrasmall-sized red-green-blue (RGB) full-color light emitting diode (LED) for high-definition display screen |
| CN107146787B (en) * | 2017-04-19 | 2019-08-09 | 深圳市梓光智能科技有限公司 | A kind of production technology of integrated Surface Mount luminescent device |
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- 2017-04-19 CN CN201710257580.6A patent/CN107146787B/en active Active
- 2017-11-24 WO PCT/CN2017/112774 patent/WO2018192221A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101640244A (en) * | 2009-08-20 | 2010-02-03 | 张九六 | Device for automatic material stripping and automatic Bin splitting for serial flaky LEDs |
| CN104167412A (en) * | 2014-08-25 | 2014-11-26 | 广东威创视讯科技股份有限公司 | LED packaging structure and manufacturing method thereof |
| CN105170487A (en) * | 2015-06-05 | 2015-12-23 | 中山市利光电子有限公司 | Automatic control system for LED sorting machine |
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| Publication number | Publication date |
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| WO2018192221A1 (en) | 2018-10-25 |
| CN107146787A (en) | 2017-09-08 |
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Effective date of registration: 20180517 Address after: 518000 Guangdong province Shenzhen Longgang District Bantian Street Tianan cloud Valley 3C1702-1 Applicant after: Shenzhen Zi Guang Intelligent Technology Co., Ltd. Applicant after: Mao Xiuzhong Address before: 518000 two unit 16F, G tower, Swan Castle street, Xiangshan middle street, Nanshan District, Shenzhen, Guangdong Applicant before: Zhu Xijie |
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