CN111526664A - Circuit board BIN value marking method - Google Patents
Circuit board BIN value marking method Download PDFInfo
- Publication number
- CN111526664A CN111526664A CN202010347481.9A CN202010347481A CN111526664A CN 111526664 A CN111526664 A CN 111526664A CN 202010347481 A CN202010347481 A CN 202010347481A CN 111526664 A CN111526664 A CN 111526664A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- marking
- bin value
- film
- workbench
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
Abstract
The invention discloses a circuit board BIN value marking method which comprises the steps of disinfection, fixation, marking, drying, film coating and quality inspection warehousing, wherein quality inspection items comprise flatness, glossiness and marking effect. According to the invention, alcohol with the concentration of 75% is designed for disinfection before marking, so that the circuit board can be integrally cleaned without affecting the integral marking quality, meanwhile, the circuit board is placed on the workbench, the circuit board is fixed by using the fixing device, and the rubber pad is laid between the workbench and the circuit board, so that the rigid fixation is prevented from damaging the circuit board, and the circuit board is protected; the marking device is designed, the circuit board is marked with the BIN value by the marking device, the circuit board is taken out and then stands still in natural wind, and the circuit board is taken out after being completely dried, so that the marking effect is increased to the maximum extent; meanwhile, the invention plates a layer of film on the BIN value mark on the circuit board, the thickness of the film is 30-50 μm, the mark is protected, and the service life is prolonged.
Description
Technical Field
The invention relates to the field of marking of circuit boards, in particular to a BIN value marking method of a circuit board.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The circuit board may be referred to as a printed wiring board or a printed circuit board, and the english name is FPC board.
In the process of marking the BIN value of the circuit board, marking equipment is generally used, and when the BIN value is marked, laser is often used for marking, so that the marking effect is poor. Meanwhile, before marking, the circuit board may be polluted, resulting in poor price marking effect and influencing subsequent use.
In addition, after the marking is finished, if the film protection is not provided, the service life of the marked BIN value is short, and the long-term use is not facilitated.
Disclosure of Invention
In order to solve the defects mentioned in the background technology, the invention aims to provide a circuit board BIN value marking method, alcohol disinfection with the concentration of 75% is designed before marking, the whole circuit board can be cleaned without influencing the whole marking quality, meanwhile, the circuit board is placed on a workbench and fixed by a fixing device, a rubber pad is laid between the workbench and the circuit board, the circuit board is prevented from being damaged by rigid fixation, and the circuit board is protected;
the marking device is designed, the circuit board is marked with the BIN value by the marking device, the circuit board is taken out and then stands still in natural wind, and the circuit board is taken out after being completely dried, so that the marking effect is increased to the maximum extent;
meanwhile, the invention plates a layer of film on the BIN value mark on the circuit board, the thickness of the film is 30-50 μm, the mark is protected, and the service life is prolonged.
The purpose of the invention can be realized by the following technical scheme:
a circuit board BIN value marking method comprises the following steps:
taking 75% alcohol, dipping the alcohol by using cleaning cotton, and wiping the front side of the circuit board repeatedly for disinfection;
secondly, placing the sterilized circuit board to be marked on a workbench, and fixing the circuit board by using a fixing device;
thirdly, marking the BIN value of the circuit board by using marking equipment;
fourthly, taking out the circuit board, standing the circuit board under natural wind, and taking out the circuit board after the circuit board is completely dried;
fifthly, plating a layer of film on the BIN value mark on the circuit board;
and sixthly, inspecting the quality of the circuit board obtained in the fifth step, removing defective products after the quality inspection is finished, and packaging and warehousing the circuit board with the good mark number.
Further, the wiping and disinfecting times in the step one are 30-45 times, and the wiping time is 8-12 min.
Furthermore, a rubber pad is laid between the workbench and the circuit board in the second step, so that the circuit board is prevented from being damaged by rigid fixation.
Further, the single-labeling residence time of the probe of the labeling apparatus in step three is 3 to 5 seconds, and the distance between BIN values is 10 to 12 mm.
Further, the standing time in the fourth step is 30-40min, and the wind speed is 0.5-0.8 m/s.
Further, the thickness of the thin film in the fifth step is 30-50 μm.
Further, the items of the quality inspection include flatness, glossiness and marking effect.
The invention has the beneficial effects that:
1. according to the invention, alcohol with the concentration of 75% is designed for disinfection before marking, so that the circuit board can be integrally cleaned without affecting the integral marking quality, meanwhile, the circuit board is placed on the workbench, the circuit board is fixed by using the fixing device, and the rubber pad is laid between the workbench and the circuit board, so that the rigid fixation is prevented from damaging the circuit board, and the circuit board is protected;
2. the marking device is designed, the circuit board is marked with the BIN value by the marking device, the circuit board is taken out and then stands still in natural wind, and the circuit board is taken out after being completely dried, so that the marking effect is increased to the maximum extent;
3. the invention plates a layer of film on the BIN value mark position on the circuit board, the thickness of the film is 30-50 μm, the mark position is protected, and the service life is prolonged.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
a circuit board BIN value marking method comprises the following steps:
taking 75% alcohol, dipping the alcohol in a cleaning cotton, and wiping the front surface of the circuit board repeatedly for 30 times, wherein the wiping time is 8 min;
secondly, placing the sterilized circuit board to be marked on a workbench, fixing the circuit board by using a fixing device, and paving a rubber pad between the workbench and the circuit board to prevent rigid fixation from damaging the circuit board;
marking BIN values of the circuit board by using marking equipment, wherein the single marking residence time of a probe of the marking equipment is 3 seconds when the BIN values are marked, and the distance between the BIN values is 10 mm;
fourthly, taking out the circuit board, standing for 30min under natural wind with the wind speed of 0.5m/s, and taking out after complete drying;
fifthly, plating a layer of film on the BIN value mark on the circuit board, wherein the thickness of the film is 30 μm;
and sixthly, inspecting the quality of the circuit board obtained in the fifth step, removing defective products after quality inspection is finished, and packaging and warehousing the intact circuit board.
Example 2:
a circuit board BIN value marking method comprises the following steps:
taking 75% alcohol, dipping the alcohol in a cleaning cotton, and wiping the front surface of the circuit board repeatedly for 45 times, wherein the wiping time is 12 min;
secondly, placing the sterilized circuit board to be marked on a workbench, fixing the circuit board by using a fixing device, and paving a rubber pad between the workbench and the circuit board to prevent rigid fixation from damaging the circuit board;
marking BIN values of the circuit board by using marking equipment, wherein the single marking residence time of a probe of the marking equipment is 5 seconds when the BIN values are marked, and the distance between the BIN values is 12 mm;
fourthly, taking out the circuit board, standing for 40min under natural wind with the wind speed of 0.8m/s, and taking out after complete drying;
fifthly, plating a layer of film on the BIN value mark on the circuit board, wherein the thickness of the film is 50 μm;
and sixthly, inspecting the quality of the circuit board obtained in the fifth step, removing defective products after quality inspection is finished, and packaging and warehousing the intact circuit board.
Example 3:
a circuit board BIN value marking method comprises the following steps:
taking 75% alcohol, dipping the alcohol in a cleaning cotton, and wiping the front surface of the circuit board repeatedly for 35 times for disinfection, wherein the wiping time is 10 min;
secondly, placing the sterilized circuit board to be marked on a workbench, fixing the circuit board by using a fixing device, and paving a rubber pad between the workbench and the circuit board to prevent rigid fixation from damaging the circuit board;
marking BIN values of the circuit board by using marking equipment, wherein the single marking residence time of a probe of the marking equipment is 4 seconds when the BIN values are marked, and the distance between the BIN values is 11 mm;
fourthly, taking out the circuit board, standing for 35min under natural wind with the wind speed of 0.6m/s, and taking out after complete drying;
fifthly, plating a layer of film on the BIN value mark on the circuit board, wherein the thickness of the film is 40 μm;
and sixthly, inspecting the quality of the circuit board obtained in the fifth step, removing defective products after quality inspection is finished, and packaging and warehousing the intact circuit board.
Example 4:
a circuit board BIN value marking method comprises the following steps:
taking 75% alcohol, dipping the alcohol in a cleaning cotton, and wiping the front surface of the circuit board repeatedly for 32 times, wherein the wiping time is 9 min;
secondly, placing the sterilized circuit board to be marked on a workbench, fixing the circuit board by using a fixing device, and paving a rubber pad between the workbench and the circuit board to prevent rigid fixation from damaging the circuit board;
marking BIN values of the circuit board by using marking equipment, wherein the single marking residence time of a probe of the marking equipment is 4.5 seconds when the BIN values are marked, and the distance between the BIN values is 10.5 mm;
fourthly, taking out the circuit board, standing for 36min under natural wind with the wind speed of 0.8m/s, and taking out after complete drying;
fifthly, plating a layer of film on the BIN value mark on the circuit board, wherein the thickness of the film is 40 μm;
and sixthly, inspecting the quality of the circuit board obtained in the fifth step, removing defective products after quality inspection is finished, and packaging and warehousing the intact circuit board.
Comparative example 1:
a circuit board BIN value marking method comprises the following steps:
taking 75% alcohol, dipping the alcohol in cleaning cotton, and wiping the front surface of the circuit board repeatedly for 50 times, wherein the wiping time is 5 min;
secondly, placing the sterilized circuit board to be marked on a workbench, fixing the circuit board by using a fixing device, and paving a rubber pad between the workbench and the circuit board to prevent rigid fixation from damaging the circuit board;
marking BIN values of the circuit board by using marking equipment, wherein the single marking residence time of a probe of the marking equipment is 8 seconds when the BIN values are marked, and the distance between the BIN values is 5 mm;
fourthly, taking out the circuit board, standing for 50min under natural wind with the wind speed of 1m/s, and taking out after complete drying;
fifthly, plating a layer of film on the BIN value mark on the circuit board, wherein the thickness of the film is 55 mu m;
and sixthly, inspecting the quality of the circuit board obtained in the fifth step, removing defective products after quality inspection is finished, and packaging and warehousing the intact circuit board.
Comparative example 2:
a circuit board BIN value marking method comprises the following steps:
taking 75% alcohol, dipping the alcohol in a cleaning cotton, and wiping the front surface of the circuit board repeatedly for 55 times, wherein the wiping time is 4 min;
secondly, placing the sterilized circuit board to be marked on a workbench, fixing the circuit board by using a fixing device, and paving a rubber pad between the workbench and the circuit board to prevent rigid fixation from damaging the circuit board;
marking BIN values of the circuit board by using marking equipment, wherein the single marking residence time of a probe of the marking equipment is 7 seconds when the BIN values are marked, and the distance between the BIN values is 6 mm;
fourthly, taking out the circuit board, standing for 52min under natural wind with the wind speed of 1.1m/s, and taking out after complete drying;
fifthly, plating a layer of film on the BIN value mark on the circuit board, wherein the thickness of the film is 65 mu m;
and sixthly, inspecting the quality of the circuit board obtained in the fifth step, removing defective products after quality inspection is finished, and packaging and warehousing the intact circuit board.
Comparative example 3:
a circuit board BIN value marking method comprises the following steps:
taking 75% alcohol, dipping the alcohol in a cleaning cotton, and wiping the front surface of the circuit board repeatedly for 60 times, wherein the wiping time is 4 min;
secondly, placing the sterilized circuit board to be marked on a workbench, fixing the circuit board by using a fixing device, and paving a rubber pad between the workbench and the circuit board to prevent rigid fixation from damaging the circuit board;
marking BIN values of the circuit board by using marking equipment, wherein the single marking residence time of a probe of the marking equipment is 10 seconds when the BIN values are marked, and the distance between the BIN values is 6 mm;
fourthly, taking out the circuit board, standing for 58min under natural wind with the wind speed of 1.2m/s, and taking out after complete drying;
fifthly, plating a layer of film on the BIN value mark on the circuit board, wherein the thickness of the film is 61 mu m;
and sixthly, inspecting the quality of the circuit board obtained in the fifth step, removing defective products after quality inspection is finished, and packaging and warehousing the intact circuit board.
The circuit boards obtained in examples 1 to 3 and comparative example were tested, and the test results were as follows:
| item | Example 1 | Example 2 | Example 3 | Example 4 | Comparative example 1 | Comparative example 2 | Comparative example 3 |
| Degree of flatness | 0.05 | 0.08 | 0.07 | 0.10 | 0.25 | 0.29 | 0.20 |
| Degree of gloss | Is excellent in | Good effect | Good effect | Good effect | In general | In general | Is poor |
| Marking effect | Good effect | Good taste | Good effect | Good effect | In general | Is poor | In general |
Flatness refers to the deviation of the height of a macro relief of a substrate from an ideal plane. The tolerance zone is the area between two parallel planes at a distance of the tolerance value t. The flatness belongs to the shape error in the form and position errors.
Gloss is the surface characteristic of an object, and is dependent on the specular reflectance of light by the surface, and specular reflection is a reflection phenomenon in which the reflection angle is equal to the incident angle. Gloss is a physical quantity that evaluates the ability of a material surface to reflect light under a set of geometrically specified conditions.
As can be seen from the above table, the circuit boards obtained in examples 1 to 4 were significantly superior to those obtained in comparative examples 1 to 3 in three aspects of flatness, gloss and marking effect, and the procedure was different for each example.
The circuit boards obtained in the embodiments 1-4 have small performance difference and good overall performance, wherein the circuit board obtained in the embodiment 1 has the best glossiness, and the circuit board obtained in the embodiment 2 has the best planeness and marking effect;
the circuit boards obtained in comparative examples 1 to 3 were not very different in performance and poor in overall performance, wherein the circuit board obtained in comparative example 2 was the worst in flatness and marking effect and the circuit board obtained in comparative example 3 was the worst in gloss.
According to the invention, alcohol with the concentration of 75% is designed for disinfection before marking, so that the circuit board can be integrally cleaned without affecting the integral marking quality, meanwhile, the circuit board is placed on the workbench, the circuit board is fixed by using the fixing device, and the rubber pad is laid between the workbench and the circuit board, so that the rigid fixation is prevented from damaging the circuit board, and the circuit board is protected;
the marking device is designed, the circuit board is marked with the BIN value by the marking device, the circuit board is taken out and then stands still in natural wind, and the circuit board is taken out after being completely dried, so that the marking effect is increased to the maximum extent;
the invention plates a layer of film on the BIN value mark position on the circuit board, the thickness of the film is 30-50 μm, the mark position is protected, and the service life is prolonged.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (7)
1. A circuit board BIN value marking method is characterized by comprising the following steps:
taking 75% alcohol, dipping the alcohol by using cleaning cotton, and wiping the front side of the circuit board repeatedly for disinfection;
secondly, placing the sterilized circuit board to be marked on a workbench, and fixing the circuit board by using a fixing device;
thirdly, marking the BIN value of the circuit board by using marking equipment;
fourthly, taking out the circuit board, standing the circuit board under natural wind, and taking out the circuit board after the circuit board is completely dried;
fifthly, plating a layer of film on the BIN value mark on the circuit board;
and sixthly, inspecting the quality of the circuit board obtained in the fifth step, removing defective products after the quality inspection is finished, and packaging and warehousing the circuit board with the good mark number.
2. The method as claimed in claim 1, wherein the wiping and sterilizing time in the first step is 30-45 times and the wiping time is 8-12 min.
3. The method as claimed in claim 1, wherein a rubber pad is disposed between the worktable and the circuit board in the second step to prevent rigid fixation from damaging the circuit board.
4. The method for marking BIN value of circuit board as claimed in claim 1, wherein the single marking residence time of the probe of the marking device in the third step is 3-5 seconds, and the distance between BIN value is 10-12 mm.
5. The method for marking BIN value of circuit board as claimed in claim 1, wherein the standing time in the fourth step is 30-40min, and the wind speed is 0.5-0.8 m/s.
6. The method as claimed in claim 1, wherein the thickness of the film in the fifth step is 30-50 μm.
7. The method as claimed in claim 1, wherein the quality control items include flatness, gloss and marking effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010347481.9A CN111526664A (en) | 2020-04-28 | 2020-04-28 | Circuit board BIN value marking method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010347481.9A CN111526664A (en) | 2020-04-28 | 2020-04-28 | Circuit board BIN value marking method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111526664A true CN111526664A (en) | 2020-08-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010347481.9A Pending CN111526664A (en) | 2020-04-28 | 2020-04-28 | Circuit board BIN value marking method |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW594897B (en) * | 2001-01-19 | 2004-06-21 | Taiwan Semiconductor Mfg | High efficiency chip probe testing method |
| KR20060029444A (en) * | 2004-10-01 | 2006-04-06 | 디케이 유아이엘 주식회사 | Printed circuit board |
| JP2008244122A (en) * | 2007-03-27 | 2008-10-09 | Mitsumi Electric Co Ltd | Defective-marking method for semiconductor device, and failure classification method for the semiconductor device using the same |
| JP2009283541A (en) * | 2008-05-20 | 2009-12-03 | Shinko Electric Ind Co Ltd | Multi-chip production wiring board and method of marking on multi-chip production wiring board |
| CN202931661U (en) * | 2010-03-12 | 2013-05-08 | 夏普株式会社 | Circuit substrate, substrate module and display device |
| CN105427752A (en) * | 2015-11-03 | 2016-03-23 | 景旺电子科技(龙川)有限公司 | Synchronous marking method for LEDs of multiple BINs |
| CN106796325A (en) * | 2014-10-24 | 2017-05-31 | 日东电工株式会社 | Optical/electrical mixed mounting substrate and its manufacture method |
| CN107146787A (en) * | 2017-04-19 | 2017-09-08 | 朱希婕 | A kind of production technology of integrated Surface Mount luminescent device |
-
2020
- 2020-04-28 CN CN202010347481.9A patent/CN111526664A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW594897B (en) * | 2001-01-19 | 2004-06-21 | Taiwan Semiconductor Mfg | High efficiency chip probe testing method |
| KR20060029444A (en) * | 2004-10-01 | 2006-04-06 | 디케이 유아이엘 주식회사 | Printed circuit board |
| JP2008244122A (en) * | 2007-03-27 | 2008-10-09 | Mitsumi Electric Co Ltd | Defective-marking method for semiconductor device, and failure classification method for the semiconductor device using the same |
| JP2009283541A (en) * | 2008-05-20 | 2009-12-03 | Shinko Electric Ind Co Ltd | Multi-chip production wiring board and method of marking on multi-chip production wiring board |
| CN202931661U (en) * | 2010-03-12 | 2013-05-08 | 夏普株式会社 | Circuit substrate, substrate module and display device |
| CN106796325A (en) * | 2014-10-24 | 2017-05-31 | 日东电工株式会社 | Optical/electrical mixed mounting substrate and its manufacture method |
| CN105427752A (en) * | 2015-11-03 | 2016-03-23 | 景旺电子科技(龙川)有限公司 | Synchronous marking method for LEDs of multiple BINs |
| CN107146787A (en) * | 2017-04-19 | 2017-09-08 | 朱希婕 | A kind of production technology of integrated Surface Mount luminescent device |
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