CN114980518A - Production process of flexible circuit board - Google Patents
Production process of flexible circuit board Download PDFInfo
- Publication number
- CN114980518A CN114980518A CN202210562763.XA CN202210562763A CN114980518A CN 114980518 A CN114980518 A CN 114980518A CN 202210562763 A CN202210562763 A CN 202210562763A CN 114980518 A CN114980518 A CN 114980518A
- Authority
- CN
- China
- Prior art keywords
- etching
- cutting
- film
- producing
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000005520 cutting process Methods 0.000 claims abstract description 34
- 238000005530 etching Methods 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 21
- 238000004140 cleaning Methods 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000013461 design Methods 0.000 claims abstract description 16
- 238000009713 electroplating Methods 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000126 substance Substances 0.000 claims abstract description 11
- 239000002253 acid Substances 0.000 claims abstract description 10
- 230000001681 protective effect Effects 0.000 claims abstract description 9
- 238000005406 washing Methods 0.000 claims abstract description 9
- 238000001035 drying Methods 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 5
- 239000007921 spray Substances 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 3
- 230000003647 oxidation Effects 0.000 claims abstract 2
- 238000007254 oxidation reaction Methods 0.000 claims abstract 2
- 239000010408 film Substances 0.000 claims description 29
- 238000007639 printing Methods 0.000 claims description 12
- 238000007650 screen-printing Methods 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 6
- 230000007547 defect Effects 0.000 claims description 5
- 238000011161 development Methods 0.000 claims description 5
- 239000013039 cover film Substances 0.000 claims description 4
- 238000012216 screening Methods 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000003814 drug Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000005554 pickling Methods 0.000 claims description 2
- 125000004122 cyclic group Chemical group 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000012864 cross contamination Methods 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000011165 process development Methods 0.000 description 1
- 239000003223 protective agent Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Abstract
The invention provides a production process of a flexible circuit board, which relates to the technical field of circuit boards and comprises the following steps: the method comprises the following steps: cutting, wherein the raw material of the base material is a double-layer coil material with a bottom protective film; setting the double-layer coil material into a corresponding size according to the design requirement by using a cutting machine, automatically cutting the upper layer, and keeping the lower layer; step two: chemical cleaning, namely chemically cleaning the bare copper surface of the circuit formed after etching; step three: the acid etching specifically comprises the following steps: developing, etching, film stripping, pattern electroplating, micro-etching, acid washing, oxidation resistance and drying; step four: chemical cleaning, wherein a plurality of cleaning and water washing sprays are arranged at the etching section. The invention improves the production of the LOL coil stock mode from the single sheet manufacture of the traditional process, and greatly improves the product efficiency and quality guarantee; the high-temperature film is coated on the raw material, and the protective film is coated on the surface of the product for cyclic utilization; greatly improving the product quality so as to achieve the aim of higher practical value.
Description
Technical Field
The invention belongs to the technical field of circuit boards, and particularly relates to a flexible circuit board production process.
Background
The flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent property, is called as a flexible printed circuit board or FPC for short, and has the characteristics of high wiring density, light weight and thin thickness.
The rapid development of the electronic product industry is pushing the FPC (flexible printed circuit) to develop at a high speed, and the traditional production technology and process cannot meet the development of the market process.
Therefore, in view of the above, research and improvement are made for the existing structure and defects, and a flexible circuit board production process is provided, so as to achieve the purpose of having higher practical value.
Disclosure of Invention
In order to solve the technical problems, the invention provides a flexible circuit board production process, which aims to solve the problem that the traditional production technology and process cannot meet the market process development.
The purpose and the effect of the production process of the flexible circuit board are achieved by the following specific technical means:
a production process of a flexible circuit board comprises the following steps:
the method comprises the following steps: cutting, wherein the raw material of the base material is a double-layer coil material with a bottom protective film; setting the double-layer coil materials into corresponding sizes according to design requirements by using a cutting machine, automatically cutting the upper layer, and keeping the lower layer;
step two: chemical cleaning, namely chemically cleaning the bare copper surface of the circuit formed after etching;
step three: the acid etching specifically comprises the following steps: developing, etching, pattern electroplating, film stripping, micro-etching, acid washing, antioxidation and drying;
step four: chemical cleaning, namely arranging a plurality of cleaning and water washing sprays at the etching section to remove redundant foreign matters on the line and clean liquid medicine;
step five: the shape of the soft board covering film is manufactured and formed, and the shape of the covering film is processed by using a die cutting die coil stock;
step six: pressing, curing after pressing to prevent leakage;
step seven: baking, namely baking at high temperature to enable glue used between the copper foil and the covering film to flow and spread, so that the circuit board and the glue are fully combined;
step eight: silk-screen printing, namely manufacturing character film design data on a screen printing plate by using a film screen printing plate in a photosensitive paste exposure mode; printing characters on a product in a printing mode;
step nine: and (3) checking by using a scanner, specifically: and importing the design data into a scanner for scanning, comparing and confirming the produced product with the design data, and screening the product defects through comparison.
Step ten: and (5) cutting, namely cutting the inspected coil stock by using a cutting machine, and cutting the coil stock into single finished products for shipment.
Further, in the first step, guide plates are installed on two sides of a discharge port of the cutting machine.
Further, in the second step, the component of the pickling agent is H 2 SO 4 And H is 2 SO 4 The content of (A) is controlled to be 0.8-1.2%.
Further, in the third step, the drying and curing time is 20-30 min.
Further, after development, plating of copper foil wiring was performed on a VCP vertical continuous plating line to thicken the wiring portion to 35 μm.
Further, in the pattern electroplating step, the current density is controlled to be 1.6A/dm2, and the electroplating time is 35 min.
Furthermore, in the sixth step, before the cover film is pressed, pure glue needs to be pre-pasted on the surface of the flexible circuit.
Further, in the seventh step, the baking heating temperature is 160-200 ℃.
Compared with the prior art, the invention has the following beneficial effects:
according to the production process of the flexible circuit board, the LOL coil stock mode is improved from the traditional process of single-sheet manufacture, and the product efficiency and quality guarantee are greatly improved; the high-temperature film is coated on the raw material, and the protective film is coated on the surface of the product for cyclic utilization; greatly improving the product quality so as to achieve the aim of higher practical value.
Detailed Description
The following examples further describe embodiments of the present invention in detail. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Example (b):
the invention provides a production process of a flexible circuit board, which comprises the following steps:
the method comprises the following steps: cutting, wherein the raw material of the base material is a double-layer coil material with a bottom protective film; the upper layer of the double-layer coil stock is automatically cut according to the corresponding size set by a cutting machine according to the design requirement, the lower layer of the double-layer coil stock is reserved, the base material is preliminarily cut, the waste of the base material is reduced, the waste caused by excessive materials due to large cutting during cutting is avoided, and meanwhile, the cross contamination between the circuit board and the coil stock in the whole production step can be avoided by utilizing the bottom protective film;
step two: chemical cleaning, namely chemically cleaning the bare copper surface of the circuit after etching to protect the cleaned circuit surface, and protecting the circuit surface after being coated with a covering film CVL or printing ink for a long time;
step three: acid etching (FPC flexible circuit etching), developing (Na2CO3), etching (HCL), pattern electroplating, film stripping (NaOH), and microetching (SPS + H) 2 SO 4 ) Acid washing (H) 2 SO 4 ) Anti-oxidation (copper protecting agent) and drying;
step four: chemical cleaning, i am provided with a plurality of cleaning and water-washing sprays on an etching line after an etching section so as to remove redundant foreign matters on the line and wash out liquid medicine, and preventing residual solution from being etched in the line through chemical cleaning;
step five: the shape of the soft board covering film is manufactured and formed, and the shape of the covering film is processed by using a die cutting die coil stock;
step six: pressing, curing is carried out after pressing to prevent leakage, and bubbles are prevented from being generated in the pressing process;
step seven: baking, namely baking at high temperature to enable glue used between the copper foil and the covering film to flow and spread, so that the circuit board and the glue are fully combined;
step eight: silk screen printing, namely manufacturing character film design data on a screen printing plate by using a film screen printing plate in a photosensitive paste exposure mode, printing characters on a product in a printing mode, preventing characters from missing printing and few printing, fully detecting whether the screen printing plate is blocked by the characters after the screen printing is dried, and checking the product and comparing whether the characters are missing printing or few printing are carried out in the printing process;
step nine: and (3) checking by using a scanner, specifically: and introducing design data into the scanner for scanning, comparing and confirming the produced product with the design data, and screening the product defects through comparison.
Step ten: and (3) cutting, namely cutting the inspected coil stock by using a cutting machine, cutting the coil stock into single finished products and delivering the single finished products, wherein cross contamination cannot be generated due to the film interval between every two single products.
Wherein, in step one, all install the guide board in the both sides of guillootine discharge gate, through the setting of guide board, prevent that the soft board from being drawn into transmission device.
Wherein, in the second step, the acid washing agent H 2 SO 4 The content of (A) is controlled to be 0.8-1.2%.
Wherein, in the third step, the drying and curing time is 20-30 min.
In the third step, electroplating of copper foil circuit is carried out on the VCP vertical continuous electroplating line after development, and the circuit part is thickened to 35 μm.
Wherein, the current density is controlled to be 1.6A/dm2 in the pattern electroplating step, and the electroplating time is 35 min.
And step six, pre-pasting pure glue on the surface of the flexible circuit before laminating the cover film.
Wherein, in the seventh step, the heating temperature is 160-200 ℃.
The specific use mode and function of the embodiment are as follows:
in the invention, firstly, a double-layer coil material is set to a corresponding size by a cutting machine to automatically cut the upper layer and keep the lower layer according to the design requirement, the waste of the base material is reduced by primarily cutting the base material, the waste caused by excessive material due to large cutting during cutting is avoided, meanwhile, the coil material in the whole production step can be ensured not to generate cross contamination between the circuit board and the circuit board by utilizing a bottom protective film, the production is carried out by chemical cleaning, acid etching, chemical cleaning, shaping, pressing, baking, silk-screen printing and the like of the shape of a soft board cover film, finally, design data is introduced by a scanner to carry out scanning, the produced product is compared with the design data to confirm, and the product defect screening is carried out by comparison, the production process of the flexible circuit board is produced by improving an LOL coil material mode from the traditional single-sheet process, the efficiency and quality of the product are greatly improved, and the high-temperature film is coated on the raw material and the protective film is coated on the surface of the product for cyclic utilization; greatly improving the product quality so as to achieve the aim of higher practical value.
The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to practitioners skilled in this art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (8)
1. A flexible circuit board production process is characterized by comprising the following steps:
the method comprises the following steps: cutting, wherein the raw material of the base material is a double-layer coil material with a bottom protective film; setting the double-layer coil material into a corresponding size according to the design requirement by using a cutting machine, automatically cutting the upper layer, and keeping the lower layer;
step two: chemical cleaning, namely chemically cleaning the bare copper surface of the circuit formed after etching;
step three: the acid etching specifically comprises the following steps: developing, etching, pattern electroplating, film stripping, micro-etching, acid washing, oxidation resistance and drying;
step four: chemical cleaning, namely arranging a plurality of cleaning and water washing sprays at the etching section to remove redundant foreign matters on the line and clean liquid medicine;
step five: the shape of the soft board covering film is manufactured and formed, and the shape of the covering film is processed by using a die cutting die coil stock;
step six: pressing, curing after pressing to prevent leakage;
step seven: baking, namely baking at high temperature to enable glue used between the copper foil and the covering film to flow and spread, so that the circuit board and the glue are fully combined;
step eight: silk-screen printing, namely manufacturing character film design data on a screen printing plate by using a film screen printing plate in a photosensitive paste exposure mode; printing characters on a product in a printing mode;
step nine: and (3) checking by using a scanner, specifically: and importing the design data into a scanner for scanning, comparing and confirming the produced product with the design data, and screening the product defects through comparison.
Step ten: and (5) cutting, namely cutting the inspected coil stock by using a cutting machine, and cutting the coil stock into single finished products for shipment.
2. The process for producing a flexible wiring board according to claim 1, wherein: in the first step, guide plates are arranged on two sides of a discharge port of the cutting machine.
3. The process for producing a flexible wiring board according to claim 1, wherein: in the second step, the pickling agent is H 2 SO 4 And H is 2 SO 4 The content of (A) is controlled to be 0.8-1.2%.
4. The process for producing a flexible wiring board according to claim 1, wherein: in the third step, the drying and curing time is 20-30 min.
5. The process for producing a flexible wiring board according to claim 1, wherein: in the third step, electroplating of copper foil circuit is carried out on the VCP vertical continuous electroplating line after development, and the circuit part is thickened to 35 μm.
6. The process for producing a flexible wiring board according to claim 1, wherein: in the pattern electroplating step, the current density is controlled to be 1.6A/dm2, and the electroplating time is 35 min.
7. The process for producing a flexible wiring board according to claim 1, wherein: in the sixth step, before the cover film is pressed, the surface of the flexible circuit needs to be pre-pasted with pure glue.
8. The process for producing a flexible wiring board according to claim 1, wherein: in the seventh step, the baking heating temperature is 160-200 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210562763.XA CN114980518A (en) | 2022-05-23 | 2022-05-23 | Production process of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210562763.XA CN114980518A (en) | 2022-05-23 | 2022-05-23 | Production process of flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114980518A true CN114980518A (en) | 2022-08-30 |
Family
ID=82984356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210562763.XA Pending CN114980518A (en) | 2022-05-23 | 2022-05-23 | Production process of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114980518A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116801515A (en) * | 2023-05-23 | 2023-09-22 | 扬州市玄裕电子有限公司 | Flexible circuit board etching processing method capable of preventing copper layer from cracking |
-
2022
- 2022-05-23 CN CN202210562763.XA patent/CN114980518A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116801515A (en) * | 2023-05-23 | 2023-09-22 | 扬州市玄裕电子有限公司 | Flexible circuit board etching processing method capable of preventing copper layer from cracking |
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