CN114245589A - Production process of PTFE high-frequency plate - Google Patents
Production process of PTFE high-frequency plate Download PDFInfo
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- CN114245589A CN114245589A CN202111625549.6A CN202111625549A CN114245589A CN 114245589 A CN114245589 A CN 114245589A CN 202111625549 A CN202111625549 A CN 202111625549A CN 114245589 A CN114245589 A CN 114245589A
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- 239000004810 polytetrafluoroethylene Substances 0.000 title claims abstract description 31
- 229920001343 polytetrafluoroethylene Polymers 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 79
- 239000010949 copper Substances 0.000 claims abstract description 79
- 229910052802 copper Inorganic materials 0.000 claims abstract description 79
- 238000000151 deposition Methods 0.000 claims abstract description 34
- 230000008021 deposition Effects 0.000 claims abstract description 34
- 238000005553 drilling Methods 0.000 claims abstract description 32
- 238000007747 plating Methods 0.000 claims abstract description 27
- 238000012360 testing method Methods 0.000 claims abstract description 21
- 238000007689 inspection Methods 0.000 claims abstract description 17
- 238000009713 electroplating Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000005520 cutting process Methods 0.000 claims abstract description 8
- 230000008569 process Effects 0.000 claims abstract description 8
- 238000000678 plasma activation Methods 0.000 claims abstract description 6
- 238000004806 packaging method and process Methods 0.000 claims abstract description 4
- 238000004381 surface treatment Methods 0.000 claims abstract description 4
- 230000008646 thermal stress Effects 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 30
- 238000007639 printing Methods 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 238000001994 activation Methods 0.000 claims description 13
- 230000004913 activation Effects 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- -1 phenolic aldehyde Chemical class 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 7
- 238000011417 postcuring Methods 0.000 claims description 6
- 238000007796 conventional method Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims description 4
- 239000012286 potassium permanganate Substances 0.000 claims description 3
- 238000000746 purification Methods 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 2
- 238000001514 detection method Methods 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 238000007781 pre-processing Methods 0.000 claims description 2
- 238000001556 precipitation Methods 0.000 claims 2
- 238000004140 cleaning Methods 0.000 claims 1
- 230000003472 neutralizing effect Effects 0.000 claims 1
- 238000001465 metallisation Methods 0.000 abstract description 4
- 238000003801 milling Methods 0.000 abstract description 4
- 239000012467 final product Substances 0.000 abstract description 2
- 239000003513 alkali Substances 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 238000007641 inkjet printing Methods 0.000 description 5
- 238000000227 grinding Methods 0.000 description 4
- 230000001680 brushing effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004061 bleaching Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a production process and application of a PTFE high-frequency board, and relates to the technical field of production and manufacturing of printed boards. The invention discloses a production process of a PTFE high-frequency plate, which comprises the following steps: s1 cutting; s2 drilling; s3 plasma activation; s4, copper deposition and flash plating; s5 electroplating and quality inspection; s6 outer layer pretreatment; s7, plating and quality inspection; s8 testing the outer layer alkali corrosion and the via hole thermal stress; s9 resistance welding; s10 character, surface treatment, quality inspection, final inspection and packaging. The invention provides a production process of a PTFE high-frequency plate, which has the advantages of simple process flow and single parameter, can reduce the problems of more drilling and milling burrs, difficult hole wall metallization and the like, and simultaneously ensures the acceptance standard of a final product and the use requirement of a user.
Description
Technical Field
The invention belongs to the technical field of printed board production and manufacturing, and particularly relates to a production process of a PTFE high-frequency board.
Background
The high-frequency board has various types, different material components have different requirements on the processing of the printed board, and particularly, the high-frequency board containing PTFE has special requirements on production equipment, processes, process parameters and the like, which are mainly limited by the characteristics of the PTFE material, otherwise, the problems of more drilling and milling burrs, difficult hole wall metallization and the like easily occur.
Disclosure of Invention
The invention mainly aims to provide a production process of a PTFE high-frequency plate, which has the advantages of simple process flow and single parameter, can reduce the problems of more drilling and milling burrs, difficult hole wall metallization and the like, and simultaneously ensures the acceptance standard of a final product and the use requirement of a user.
In order to realize the purpose of the invention, the invention provides a production process of a PTFE high-frequency plate, which specifically comprises the following steps:
s1, cutting and ensuring the core plates to be flat, marking plate corners to avoid mixing with other core plates;
s2, drilling: drilling the core plate material according to the set drilling parameters, wherein the total thickness of the core plate material plus the thickness of the cover plate and the backing plate does not exceed the length of the groove of the drill bit, and blowing by using an air gun after drilling without grinding the plate;
s3, activating plasma, wherein the activation parameters are as follows: n is a radical of2：H2600: 1400, 7000W of power and 70min of activation time, and testing with a dyne pen to enable the dyne value to be larger than 40 after activation;
s4, copper deposition and flash plating:
and (3) carrying out copper deposition within 8h after plasma activation, wherein copper deposition 1 (namely, the first copper deposition) starts to enter from the high-position neutralization tank, and copper deposition 2 (namely, the second copper deposition) starts to enter from the pre-soaking tank, so that the copper deposition quality is ensured, and no black hole and no hole are formed in the copper deposition.
The copper deposition and flash plating process comprises the following steps:
1) before copper deposition, a thin plate frame needs to be installed preferentially, and the plate is deformed due to swing in the copper deposition process, so that the size deformation is uncontrollable finally.
2) Copper deposition 1: after activation, copper 1 is deposited and cleaned in a multi-layer board mode, but potassium permanganate is not used. And conventional first copper deposition ensures flash plating processing after copper deposition on the hole wall.
3) Flash plating: the main function is to thicken the hole wall copper, and the flash plating parameter is set to be 1.0asd/30 min.
4) And (3) copper deposition 2: because the PTFE material has poor copper deposition effect, in order to avoid star point holes after the copper deposition of the hole wall for one time, the copper deposition is carried out for 1 time after the flash plating, and the integrity of the hole wall is ensured.
S5, clamping a thin plate frame for electroplating, clamping a long edge to enable the thickness of copper in an electroplating hole to be larger than 13 mu m and the thickness of surface copper to be larger than 18 mu m, and then checking the thickness of the electroplating copper and the drilling quality;
s6, pretreating the outer layer by adopting a conventional method, wherein the pretreatment cannot be finished by grinding and brushing;
s7, clamping a thin plate frame for pattern plating, clamping a long edge to enable the thickness of copper in a pattern plating hole to be larger than 28 micrometers, and then checking the thickness of the copper plated on the pattern to enable the thickness of surface copper to be larger than 43 micrometers;
s8, adding a strip plate on the outer layer, then carrying out alkaline etching, and then carrying out a via hole thermal stress test to enable the hole wall copper and the hole wall to meet the quality inspection requirement;
s9, solder resist: the method comprises the following steps of (1) processing the dirt and the roughness of a board surface by using an inner layer mode through a line pre-processing line, performing solder mask after the board surface enters a purification room, printing solder mask ink in a spray printing mode, completing pre-curing within 4 hours after the spray printing and standing are completed, performing solder mask detection, and performing post-curing;
s10, controlling characters by a conventional method, performing conventional surface treatment, and performing conventional quality inspection, final inspection and packaging.
Further, in step S2, before drilling, an auxiliary plate needs to be added to the core plate (i.e. the substrate or the core plate material), and the composition of the auxiliary plate and the substrate from the upper layer to the lower layer is as follows: aluminum sheet, copper-bearing base material, substrate, copper-bearing base material and phenolic aldehyde bottom plate; and when the aperture of the drilled hole is larger than 0.6mm, a phenolic aldehyde cover plate with the thickness of 0.4mm is additionally arranged on the aluminum sheet.
The base plate is a PTFE high-frequency plate needing to be processed, the copper-bearing base material is an auxiliary plate used for protecting and reducing drilling burrs and the like, the aluminum sheet is used for drilling buffering positioning and heat dissipation, and the comprehensive concept description of the PTFE material is as follows: the cover plate is an aluminum sheet and is provided with a copper base material, and the base plate is a phenolic aldehyde base plate and is provided with a copper base material. The phenolic aldehyde bottom plate (i.e. the backing plate) also plays a role in protecting and reducing burrs, has higher hardness, and can effectively remove PTFE drill cuttings on the cutting edge. When the hole diameter of the drilled hole is larger, namely the hole diameter is larger than 0.6mm, more drilling cuttings are generated, and a phenolic aldehyde cover plate with the diameter of 0.4mm needs to be added on an aluminum sheet.
Further, the substrate is composed of PTFE and glass fiber.
Further, the drilling parameters in the step S2 are set as: the needle diameter is 0.15-3.2 mm, the rotating speed is 110-40 Krpm, the feeding speed is 1.0-3.3 m/min, and the withdrawal speed is 12-25 m/min.
Further, after the hole is drilled in the step S2, the copper surface is processed through an inner layer circuit pretreatment line, and then baked at 120 ℃ for 1 hour.
Further, in step S10, the inkjet printing is performed by inkjet printing on a thin plate, and the inkjet printing on the thin plate is performed by two times of single-sided inkjet printing and single-sided prebaking.
Further, in step S10, the post-curing is performed by a sectional baking plate, and the parameters are set as: the first stage temperature is 70 ℃, and the baking time is 60 min; the second stage temperature is 90 ℃, and the baking time is 60 min; the temperature of the third section is 110 ℃, and the baking time is 30 min; the fourth stage temperature is 130 ℃, and the baking time is 30 min; the fifth stage temperature is 150 deg.C, and the baking time is 60 min.
The invention achieves the following beneficial effects:
1. the PTFE high-frequency plate has the advantages of simple production process, single parameter and convenience in production and operation, and the effect of the verified PTFE high-frequency plate can pass various tests and meets the existing standard.
2. The invention uses the debugging drilling parameters (such as rotating speed, feed speed, withdrawal speed and the like) and the drilling mode (the arrangement of adding auxiliary plates, thickness and the like), thereby reducing the problem of more drilling and milling burrs; the plasma activation is adopted to remove the glue, the flash plating process after hole activation is added, the problem of difficult hole wall metallization is solved, the subsequent hole treatment is convenient, and the production efficiency and the quality of the PTFE high-frequency board are improved.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The production process of the PTFE high frequency plate of the present invention will be described with reference to specific examples.
The present invention provides an example of a specific production flow of a PTFE high-frequency plate in combination with the actual production, as follows.
Firstly, test board preparation
According to the processing requirements, a production plate with a thickness of 0.254mm, a copper thickness of 18/18 and a size of 9 x 12inch was prepared.
Secondly, the processing flow of the PTFE high-frequency plate specifically comprises the following steps:
s1, cutting:
1. after cutting, the core plate (namely the core plate material) is flat;
2. and lettering marks are marked on the board corners to avoid mixing with other core boards.
S2, drilling:
1. drilling according to the drilling parameters, wherein the drilling parameters are set as follows: the needle diameter is 0.15-3.2 mm, the rotating speed is 110-40 Krpm, the feed speed is 1.0-3.3 m/min, the withdrawal speed is 12-25 m/min, and the specific numerical values are shown in the following table;
2. before drilling, the upper bottom surface and the lower bottom surface of a core plate material need to be additionally provided with auxiliary plates, and the stacking mode of the core plate material and the auxiliary plates is from the bottom to the top: 1.5mm phenolic aldehyde bottom plate +0.15mm copper-bearing base material + base plate (namely core plate material) +0.15mm copper-bearing base material + aluminum sheet, when the aperture is greater than 0.6mm, a 0.4mm phenolic aldehyde cover plate is added on the aluminum sheet, and the thickness of the total thickness of the core plate material plus the cover plate (namely 0.15mm copper-bearing base material + aluminum sheet) and the backing plate (namely 1.5mm phenolic aldehyde bottom plate +0.15mm copper-bearing base material) is not more than the length of the drill bit groove;
3. after drilling, blowing by using an air gun without grinding a plate, and treating a copper surface by using an inner-layer circuit pretreatment line;
4. after drilling, baking for 1h at 120 ℃.
S3, plasma activation:
1. activation parameters: n is a radical of2：H2600: 1400, power: 7000W, activation time: 70 min;
2. after activation, the dyne value is greater than 40 when tested by a dyne pen;
3. copper is deposited within 8h after the activation is finished.
S4, copper deposition 1:
before copper deposition, a thin plate frame needs to be installed preferentially, and the plate is deformed due to swing in the copper deposition process, so that the size deformation is uncontrollable finally. Copper deposition 1 after activation (first copper deposition) was cleaned in a multi-layer panel fashion, but with potassium permanganate. The conventional first copper deposition is carried out from a high-position neutralization tank, and flash plating processing after copper deposition on the hole wall is ensured. After the plasma activation, copper deposition needs to be carried out within 8 hours.
S5, flash plating: and after the copper deposition 1 is finished, completing flash plating within 4h, wherein the flash plating is mainly used for thickening the hole wall copper, and the flash plating parameter is set to be 1.0asd/30 min. The thin plate frame is also clamped during flash plating.
S6, copper deposition 2: because the PTFE material has poor copper deposition effect, in order to avoid star point holes after the copper deposition on the hole wall for the first time, the copper deposition is carried out for the first time after the flash plating, the copper deposition is carried out from the pre-soaking tank, the integrity of the hole wall is ensured, the copper deposition quality is ensured, and no black hole or no hole is formed.
S7, electroplating:
1. the thickness of the copper in the electroplating hole is more than 13 mu m, and the long side is clamped;
2. clamping the thin plate frame during electroplating;
3. and (3) thickness inspection of electroplated copper: the copper of the electroplating hole is more than 13 mu m, and the surface copper is more than 18 mu m;
4. and (3) checking the drilling quality: after electroplating, the slice is taken to observe the parameter test hole, and the problems of wicking and rough hole wall are avoided.
S8, outer layer: the pretreatment is carried out by adopting a conventional method, and the pretreatment can not be carried out by grinding and brushing,
s9, pattern plating:
1. copper plating holes are larger than 28 mu m, and the long sides are clamped;
2. and clamping the sheet frame during drawing.
3. Checking the copper plating thickness: the copper of the plated hole is more than 28 μm, and the copper of the surface is more than 43 μm.
S10, outer layer alkaline etching:
1. adding a strip plate during alkaline etching, and applying solder resist ink within 8 hours after the alkaline etching;
2. testing the thermal stress of the via hole: taking 3 slices with the aperture of 0.5mm and the diameter of 15 x 8mm, testing the slices according to the test condition of 288 ℃/10S and the test of tin bleaching for 3 times/5 times/10 times, and observing glue pouring: whether the hole wall copper is separated from the hole wall.
S11, solder resist:
1. the material is special, the pre-treatment of solder mask can not be carried out by brushing and sand blasting, the surface of the board can be treated by an inner layer mode through a line pre-treatment line to increase the roughness, the solder mask is carried out after the board enters a purification room, and the ink jet printing is finished in 8H after the outer layer pattern is finished;
2. solder resist ink printing adopts a jet printing mode, and sheet jet printing adopts a mode of twice single-side jet printing and single-side pre-drying;
3. completing precuring in 4H after the jet printing and standing are completed;
4. postcuring the plate must be baked in sections, parameters: 70 ℃/60min → 90 ℃/60min → 110 ℃/30min → 130 ℃/30min → 150 ℃/60 min;
5. and performing solder mask inspection deviation and the like before post-curing.
And S12, controlling the characters by adopting a conventional method, performing conventional surface treatment, and then performing conventional quality inspection, final inspection and packaging. And the core plate material is ensured to have no problems of scratch, pits, oxidation, gaps and the like during conventional quality inspection.
After the PTFE high-frequency plate is finished, the test is carried out, and the items are as follows:
1. substrate material characteristic test results
And (3) testing results: the test result of the substrate material characteristic meets the standard
2. Quality test result of hole wall of drill hole
And (3) testing results: the quality test result of the hole wall of the drilled hole meets the standard
3. Quality inspection results of hole formation plating
And (3) testing results: the inspection result of the hole electroplating quality is qualified
4. Apparent and Electrical Performance test results
And (3) testing results: qualified apparent and electrical performance results
As is clear from the above verification results, the expected effects can be satisfied.
The technical features of the embodiments described above can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.
Claims (7)
1. The production process of the PTFE high-frequency plate is characterized by comprising the following steps:
s1, cutting and ensuring the core plate to be flat, and marking plate corners;
s2, drilling: drilling the core plate material according to the set drilling parameters, wherein the total thickness of the core plate material plus the thicknesses of the cover plate and the backing plate does not exceed the length of the drill groove;
s3, activating plasma, wherein the activation parameters are as follows: n is a radical of2：H2600: 1400, 7000W of power and 70min of activation time, and testing with a dyne pen to enable the dyne value to be larger than 40 after activation;
s4, copper deposition and flash plating: firstly, mounting a thin plate frame, performing first copper precipitation after plasma activation, and cleaning according to a multilayer plate mode, wherein potassium permanganate and conventional copper precipitation are not required to enter from an elevated neutralizing tank; flash plating, wherein the flash plating parameter is set to be 1.0asd/30 min; carrying out secondary copper deposition, and starting to enter from the pre-soaking tank;
s5, clamping a thin plate frame for electroplating, clamping a long edge to enable the thickness of copper in an electroplating hole to be larger than 13 mu m, and then checking the thickness of the electroplating copper and the drilling quality;
s6, pretreating the outer layer by adopting a conventional method, wherein the outer layer cannot be brushed;
s7, clamping a thin plate frame for pattern plating, clamping a long edge to enable the thickness of copper in a pattern plating hole to be larger than 28 micrometers, and then checking the thickness of the copper plated on the pattern to enable the thickness of surface copper to be larger than 43 micrometers;
s8, adding a strip plate on the outer layer, then carrying out alkaline etching, and then carrying out a via hole thermal stress test to enable the hole wall copper and the hole wall to meet the quality inspection requirement;
s9, solder resist: the method comprises the steps of processing dirt and roughness of a board surface by using an inner layer mode through a line pre-processing line, performing solder mask after the board surface enters a purification room, printing solder mask ink in a spray printing mode, completing pre-curing within 4 hours after the spray printing and standing are completed, performing solder mask detection, and performing post-curing;
s10, performing conventional character management and control, surface treatment, quality inspection and final inspection, and packaging.
2. The process for producing a PTFE high-frequency plate according to claim 1, wherein in step S2, in step S2, before drilling the core plate, an auxiliary plate is added, and the composition of the auxiliary plate and the substrate from the upper layer to the lower layer is: aluminum sheet, copper-bearing base material, substrate, copper-bearing base material and phenolic aldehyde bottom plate; and when the aperture of the drilled hole is larger than 0.6mm, a phenolic aldehyde cover plate with the thickness of 0.4mm is additionally arranged on the aluminum sheet.
3. The production process of a PTFE high-frequency plate according to claim 2, wherein the substrate is composed of PTFE and glass fiber.
4. The production process of a PTFE high frequency plate according to claim 1, wherein the drilling parameters in the step S2 are set to: the needle diameter is 0.15-3.2 mm, the rotating speed is 110-40 Krpm, the feeding speed is 1.0-3.3 m/min, and the withdrawal speed is 12-25 m/min.
5. The production process of a PTFE high-frequency plate according to claim 1, wherein after the drilling in step S2, the copper surface is treated by an inner layer wire pretreatment line and then baked at 120 ℃ for 1 hour.
6. The production process of a PTFE high-frequency plate according to claim 1, wherein in the step S9, the jet printing is sheet jet printing, and the sheet jet printing is performed by two times of single-sided jet printing and single-sided pre-baking.
7. The process for producing a PTFE high-frequency plate according to claim 1, wherein in the step S9, the post-curing is performed by baking plates in sections, and the parameters are set as follows: the first stage temperature is 70 ℃, and the baking time is 60 min; the second stage temperature is 90 ℃, and the baking time is 60 min; the temperature of the third section is 110 ℃, and the baking time is 30 min; the fourth stage temperature is 130 ℃, and the baking time is 30 min; the fifth stage temperature is 150 deg.C, and the baking time is 60 min.
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| CN202111625549.6A CN114245589B (en) | 2021-12-28 | Production process of PTFE high-frequency plate |
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| CN202111625549.6A CN114245589B (en) | 2021-12-28 | Production process of PTFE high-frequency plate |
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