CN110996537A - Dry film hole masking method for PTH long slotted hole - Google Patents
Dry film hole masking method for PTH long slotted hole Download PDFInfo
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- CN110996537A CN110996537A CN201911310590.7A CN201911310590A CN110996537A CN 110996537 A CN110996537 A CN 110996537A CN 201911310590 A CN201911310590 A CN 201911310590A CN 110996537 A CN110996537 A CN 110996537A
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- dry film
- pth
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- grinding
- milling
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 230000000873 masking effect Effects 0.000 title claims abstract description 22
- 238000000227 grinding Methods 0.000 claims abstract description 51
- 238000003801 milling Methods 0.000 claims abstract description 38
- 238000005530 etching Methods 0.000 claims abstract description 35
- 238000009713 electroplating Methods 0.000 claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 claims abstract description 17
- 239000010949 copper Substances 0.000 claims abstract description 17
- 239000002253 acid Substances 0.000 claims abstract description 16
- 238000007689 inspection Methods 0.000 claims abstract description 14
- 238000007747 plating Methods 0.000 claims abstract description 9
- 230000008021 deposition Effects 0.000 claims abstract description 7
- 238000005553 drilling Methods 0.000 claims abstract description 7
- 238000004080 punching Methods 0.000 claims abstract description 7
- 238000001816 cooling Methods 0.000 claims abstract 2
- 239000004745 nonwoven fabric Substances 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000003475 lamination Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 6
- 238000005507 spraying Methods 0.000 description 6
- 239000003814 drug Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 230000007704 transition Effects 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention belongs to the technical field of manufacturing of printed circuit boards, and provides a dry film hole masking method for a PTH slotted hole, which comprises the following steps: the conventional multilayer board is pressed → outer layer drilling → CNC groove milling → electroplating grinding board → copper deposition → VCP copper plating → circuit grinding board → dry film pasting → LDI exposure → development → circuit inspection → acid etching → inspection; and in the CNC milling groove, cooling punching plates are added on the upper surface and the lower surface of the PCB to control the height of the flash. The invention can stably and efficiently ensure the dry film hole masking quality of the PTH elongated slot with 4.0 x 50.0mm, thereby meeting the processing requirement of acid etching.
Description
Technical Field
The invention belongs to the technical field of manufacturing of printed circuit boards, and particularly relates to a dry film hole masking method for a PTH long groove.
Background
The PCB circuit forming usually needs to be processed by an etching process, the current etching process mainly adopts alkaline etching and acidic etching, and compared with the two processes, the following quality differences mainly exist:
1. alkaline etching, wherein an anti-etching layer needs to be patterned before etching, and the electroplating is uneven due to the influence of pattern distribution, and the patterned electrical interlayer appears at a fine interval, so that the quality is unstable; in addition, the side etching amount of the alkaline etching process is large, which is not beneficial to the manufacture of fine circuits, so the method is generally used for simpler PCB processing.
2. Acid etching, copper plating and dry film hole masking are carried out on the whole plate before etching for protection, and the whole plate is good in electroplating uniformity and high in product consistency because the whole plate is not influenced by pattern distribution; meanwhile, the amount of side etching by acid etching is small, the etching precision of the circuit is higher, and most of high-precision plates and high-precision impedance plates adopt the acid etching process, which is the mainstream in the industry at present.
The processing according to the traditional process method mainly faces the following technical defects:
the acid etching process has simple flow, high etching precision and high product yield, but the acid etching process is greatly influenced by the dry film hole masking capability and can only meet the hole masking etching of a round hole of 5.0mm PTH, and for a PTH round hole with the diameter of more than or equal to 5.0mm or a slotted hole with the diameter of more than or equal to 3.0X10.0mm, the hole masking capability is relatively weak, the defect of film breaking is easy to occur, the etching is scrapped, and therefore, the dry film hole masking capability of the slotted hole needs to be further improved.
Disclosure of Invention
In view of this, the invention provides a dry film hole masking method for a PTH long groove, which can stably and efficiently ensure the quality of a dry film hole masking of a PTH long groove of 4.0 × 50.0mm, thereby meeting the processing requirements of acid etching.
The technical scheme of the invention is as follows:
a dry film hole masking method of a PTH slotted hole is characterized by comprising the following steps: the conventional multilayer board is pressed → outer layer drilling → CNC groove milling → electroplating grinding board → copper deposition → VCP copper plating → circuit grinding board → dry film pasting → LDI exposure → development → circuit inspection → acid etching → inspection;
in the CNC milling groove, cold punching plates are added on the upper surface and the lower surface of the PCB, and the height of the flash is controlled;
further, in the CNC milling groove, the number of stacked plates is controlled, and the plates are machined according to 1 piece per stack.
Furthermore, in the CNC milling flutes, a brand-new milling cutter is used, and the burrs of the milling flutes are reduced.
Furthermore, in the electroplating grinding plate, the electroplating grinding plate adopts a plate grinding mode twice, and the surface is changed in the 2 nd reversing mode, so that the grinding of the slotted holes in all directions is uniform, the edges of the slotted holes form smooth transition, and the risk of dry film damage is reduced.
Furthermore, the electroplating grinding plate adopts a non-woven fabric grinding brush, the current is set to be 3.2A, and the plate grinding speed is set to be 2.0 m/min. The brush-polishing is twice, and the 2 nd switching-over is traded the face, can get rid of totally with the drill way flash of a knife or a sword, and the edge forms the circular arc effect, reduces its sharpness to effectively reduce the broken hole risk of dry film.
Furthermore, in the dry film pasting, a special chemical-resistant dry film is used as the dry film, so that the developing resistance of the dry film is improved.
Furthermore, in the dry film pasting, proper pasting pressure is set, and the thickness of the dry film is prevented from being thinned due to overlarge pressure of an orifice.
Further, the film sticking pressure is 3-5 kg.
Furthermore, in the developing process, the developing spraying pressure is controlled according to the lower limit, and the impact force of the developing on the dry film is reduced. The developing spraying pressure is 1.0-2.0 kg.
Furthermore, in the development, the development speed is controlled according to the upper limit, and the attack time of the liquid medicine to the dry film is reduced. The developing speed is 2.5-4 m/min.
Further, in the development, the weld ring width design is maximized. The width of the welding ring is 0.3-1.0 mm.
The invention has the beneficial effects that:
1. the dry film hole masking capability is improved, and the dry film hole masking requirement of the PTH slotted hole with 4.0 x 50.0mm is met;
2. the yield of the product is improved, and potential quality problems of uneven copper thickness, electric film clamping and the like caused by the electric and alkali etching process of the pattern are avoided according to the acid etching and copper plating process;
3. the etching quality of the product is improved, the etching factor is more than or equal to 4 according to the acid etching process, the etching quality of a precise circuit can be improved, and the high-precision processing requirement of line width tolerance +/-0.8 mil is met.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
A dry film hole masking method of a PTH slotted hole is characterized by comprising the following steps: the conventional multilayer board is pressed → outer layer drilling → CNC groove milling → electroplating grinding board → copper deposition → VCP copper plating → circuit grinding board → dry film pasting → LDI exposure → development → circuit inspection → acid etching → inspection;
in the CNC milling groove, cold punching plates are added on the upper surface and the lower surface of the PCB, and the height of the flash is controlled;
further, in the CNC milling groove, the number of stacked plates is controlled, and the plates are machined according to 1 piece per stack.
Furthermore, in the CNC milling flutes, a brand-new milling cutter is used, and the burrs of the milling flutes are reduced.
Furthermore, in the electroplating grinding plate, the electroplating grinding plate adopts a plate grinding mode twice, and the surface is changed in the 2 nd reversing mode, so that the grinding of the slotted holes in all directions is uniform, the edges of the slotted holes form smooth transition, and the risk of dry film damage is reduced.
Furthermore, the electroplating grinding plate adopts a non-woven fabric grinding brush, the current is set to be 3.2A, and the plate grinding speed is set to be 2.0 m/min. The brush-polishing is twice, and the 2 nd switching-over is traded the face, can get rid of totally with the drill way flash of a knife or a sword, and the edge forms the circular arc effect, reduces its sharpness to effectively reduce the broken hole risk of dry film.
Furthermore, in the dry film pasting, a special chemical-resistant dry film is used as the dry film, so that the developing resistance of the dry film is improved.
Furthermore, in the dry film pasting, proper pasting pressure is set, and the thickness of the dry film is prevented from being thinned due to overlarge pressure of an orifice.
Further, the film sticking pressure is 3 kg.
Furthermore, in the developing process, the developing spraying pressure is controlled according to the lower limit, and the impact force of the developing on the dry film is reduced. The developing spray pressure was 1.0 kg.
Furthermore, in the development, the development speed is controlled according to the upper limit, and the attack time of the liquid medicine to the dry film is reduced. The development speed was 2.5 m/min.
Further, in the development, the weld ring width design is maximized. The width of the welding ring is 0.3 mm.
Example 2
A dry film hole masking method of a PTH slotted hole is characterized by comprising the following steps: the conventional multilayer board is pressed → outer layer drilling → CNC groove milling → electroplating grinding board → copper deposition → VCP copper plating → circuit grinding board → dry film pasting → LDI exposure → development → circuit inspection → acid etching → inspection;
in the CNC milling groove, cold punching plates are added on the upper surface and the lower surface of the PCB, and the height of the flash is controlled;
further, in the CNC milling groove, the number of stacked plates is controlled, and the plates are machined according to 1 piece per stack.
Furthermore, in the CNC milling flutes, a brand-new milling cutter is used, and the burrs of the milling flutes are reduced.
Furthermore, in the electroplating grinding plate, the electroplating grinding plate adopts a plate grinding mode twice, and the surface is changed in the 2 nd reversing mode, so that the grinding of the slotted holes in all directions is uniform, the edges of the slotted holes form smooth transition, and the risk of dry film damage is reduced.
Furthermore, the electroplating grinding plate adopts a non-woven fabric grinding brush, the current is set to be 3.2A, and the plate grinding speed is set to be 2.0 m/min. The brush-polishing is twice, and the 2 nd switching-over is traded the face, can get rid of totally with the drill way flash of a knife or a sword, and the edge forms the circular arc effect, reduces its sharpness to effectively reduce the broken hole risk of dry film.
Furthermore, in the dry film pasting, a special chemical-resistant dry film is used as the dry film, so that the developing resistance of the dry film is improved.
Furthermore, in the dry film pasting, proper pasting pressure is set, and the thickness of the dry film is prevented from being thinned due to overlarge pressure of an orifice.
Further, the film sticking pressure is 4 kg.
Furthermore, in the developing process, the developing spraying pressure is controlled according to the lower limit, and the impact force of the developing on the dry film is reduced. The developing spray pressure was 1.5 kg.
Furthermore, in the development, the development speed is controlled according to the upper limit, and the attack time of the liquid medicine to the dry film is reduced. The developing speed was 3 m/min.
Further, in the development, the weld ring width design is maximized. The width of the welding ring is 0.5 mm.
Example 3
A dry film hole masking method of a PTH slotted hole is characterized by comprising the following steps: the conventional multilayer board is pressed → outer layer drilling → CNC groove milling → electroplating grinding board → copper deposition → VCP copper plating → circuit grinding board → dry film pasting → LDI exposure → development → circuit inspection → acid etching → inspection;
in the CNC milling groove, cold punching plates are added on the upper surface and the lower surface of the PCB, and the height of the flash is controlled;
further, in the CNC milling groove, the number of stacked plates is controlled, and the plates are machined according to 1 piece per stack.
Furthermore, in the CNC milling flutes, a brand-new milling cutter is used, and the burrs of the milling flutes are reduced.
Furthermore, in the electroplating grinding plate, the electroplating grinding plate adopts a plate grinding mode twice, and the surface is changed in the 2 nd reversing mode, so that the grinding of the slotted holes in all directions is uniform, the edges of the slotted holes form smooth transition, and the risk of dry film damage is reduced.
Furthermore, the electroplating grinding plate adopts a non-woven fabric grinding brush, the current is set to be 3.2A, and the plate grinding speed is set to be 2.0 m/min. The brush-polishing is twice, and the 2 nd switching-over is traded the face, can get rid of totally with the drill way flash of a knife or a sword, and the edge forms the circular arc effect, reduces its sharpness to effectively reduce the broken hole risk of dry film.
Furthermore, in the dry film pasting, a special chemical-resistant dry film is used as the dry film, so that the developing resistance of the dry film is improved.
Furthermore, in the dry film pasting, proper pasting pressure is set, and the thickness of the dry film is prevented from being thinned due to overlarge pressure of an orifice.
Further, the film sticking pressure is 3.5 kg.
Furthermore, in the developing process, the developing spraying pressure is controlled according to the lower limit, and the impact force of the developing on the dry film is reduced. The developing spray pressure was 1.8 kg.
Furthermore, in the development, the development speed is controlled according to the upper limit, and the attack time of the liquid medicine to the dry film is reduced. The developing speed was 3.5 m/min.
Further, in the development, the weld ring width design is maximized. The width of the welding ring is 0.7 mm.
Example 4
A dry film hole masking method of a PTH slotted hole is characterized by comprising the following steps: the conventional multilayer board is pressed → outer layer drilling → CNC groove milling → electroplating grinding board → copper deposition → VCP copper plating → circuit grinding board → dry film pasting → LDI exposure → development → circuit inspection → acid etching → inspection;
in the CNC milling groove, cold punching plates are added on the upper surface and the lower surface of the PCB, and the height of the flash is controlled;
further, in the CNC milling groove, the number of stacked plates is controlled, and the plates are machined according to 1 piece per stack.
Furthermore, in the CNC milling flutes, a brand-new milling cutter is used, and the burrs of the milling flutes are reduced.
Furthermore, in the electroplating grinding plate, the electroplating grinding plate adopts a plate grinding mode twice, and the surface is changed in the 2 nd reversing mode, so that the grinding of the slotted holes in all directions is uniform, the edges of the slotted holes form smooth transition, and the risk of dry film damage is reduced.
Furthermore, the electroplating grinding plate adopts a non-woven fabric grinding brush, the current is set to be 3.2A, and the plate grinding speed is set to be 2.0 m/min. The brush-polishing is twice, and the 2 nd switching-over is traded the face, can get rid of totally with the drill way flash of a knife or a sword, and the edge forms the circular arc effect, reduces its sharpness to effectively reduce the broken hole risk of dry film.
Furthermore, in the dry film pasting, a special chemical-resistant dry film is used as the dry film, so that the developing resistance of the dry film is improved.
Furthermore, in the dry film pasting, proper pasting pressure is set, and the thickness of the dry film is prevented from being thinned due to overlarge pressure of an orifice.
Further, the film sticking pressure is 5 kg.
Furthermore, in the developing process, the developing spraying pressure is controlled according to the lower limit, and the impact force of the developing on the dry film is reduced. The developing spray pressure was 2.0 kg.
Furthermore, in the development, the development speed is controlled according to the upper limit, and the attack time of the liquid medicine to the dry film is reduced. The developing speed was 4 m/min.
Further, in the development, the weld ring width design is maximized. The width of the welding ring is 1.0 mm.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art in the field.
Claims (10)
1. A dry film hole masking method of a PTH slotted hole is characterized by comprising the following steps: the conventional multilayer board is pressed → outer layer drilling → CNC groove milling → electroplating grinding board → copper deposition → VCP copper plating → circuit grinding board → dry film pasting → LDI exposure → development → circuit inspection → acid etching → inspection;
and in the CNC milling groove, cooling punching plates are added on the upper surface and the lower surface of the PCB to control the height of the flash.
2. The method of claim 1, wherein the CNC milling process is performed on a number of stacks of 1 piece per stack.
3. The method of claim 1, wherein a new milling cutter is used to reduce the milling burr in the CNC milling groove.
4. The method as claimed in claim 1, wherein the electroplated grinding plate is twice ground, and the surface is changed by reversing for 2 nd time, so that the grinding of the slot holes in all directions is uniform, the edges of the slot holes are smoothly transited, and the risk of dry film damage is reduced.
5. The dry film via masking method of PTH slotted holes of claim 4, wherein said electroplating blade is brushed with a non-woven fabric at a current of 3.2A and a blade speed of 2.0 m/min.
6. The method as claimed in claim 1, wherein a dry film for PTH slot is used as the dry film for dry film lamination, which is a special dry film with chemical resistance to improve the development resistance.
7. The method as claimed in claim 1, wherein a proper film pressure is applied to the dry film, and the film pressure is 3-5 kg.
8. The dry film via-masking method for PTH slots of claim 1, wherein said developing spray pressure is controlled according to a lower limit, said developing spray pressure being 1.0-2.0 kg.
9. The dry film via-masking method of PTH slots of claim 1, wherein in said developing, the developing speed is controlled at the upper limit, and said developing speed is 2.5-4 m/min.
10. The dry film via masking method for PTH slotted holes of claim 1, wherein during said developing, a solder ring width is designed to be maximized, said solder ring width being 0.3-1.0 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911310590.7A CN110996537A (en) | 2019-12-18 | 2019-12-18 | Dry film hole masking method for PTH long slotted hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911310590.7A CN110996537A (en) | 2019-12-18 | 2019-12-18 | Dry film hole masking method for PTH long slotted hole |
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| Publication Number | Publication Date |
|---|---|
| CN110996537A true CN110996537A (en) | 2020-04-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911310590.7A Pending CN110996537A (en) | 2019-12-18 | 2019-12-18 | Dry film hole masking method for PTH long slotted hole |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113613415A (en) * | 2021-10-11 | 2021-11-05 | 四川英创力电子科技股份有限公司 | Printed circuit board and non-metallized step groove processing technology thereof |
| CN114126244A (en) * | 2021-12-01 | 2022-03-01 | 广德东风电子有限公司 | PCB production process based on laser direct writing exposure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106739374A (en) * | 2016-12-29 | 2017-05-31 | 深圳市天龙兴业科技有限公司 | Novel soft jumping through rings cold insulation punching and the cold punching plate technique |
| CN107072046A (en) * | 2017-02-15 | 2017-08-18 | 深圳市景旺电子股份有限公司 | A kind of pcb board and its outer-layer circuit preparation method |
| CN109703154A (en) * | 2019-01-14 | 2019-05-03 | 广东中晨电子科技有限公司 | A kind of cold punching plate aluminium foil cover board |
-
2019
- 2019-12-18 CN CN201911310590.7A patent/CN110996537A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106739374A (en) * | 2016-12-29 | 2017-05-31 | 深圳市天龙兴业科技有限公司 | Novel soft jumping through rings cold insulation punching and the cold punching plate technique |
| CN107072046A (en) * | 2017-02-15 | 2017-08-18 | 深圳市景旺电子股份有限公司 | A kind of pcb board and its outer-layer circuit preparation method |
| CN109703154A (en) * | 2019-01-14 | 2019-05-03 | 广东中晨电子科技有限公司 | A kind of cold punching plate aluminium foil cover board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113613415A (en) * | 2021-10-11 | 2021-11-05 | 四川英创力电子科技股份有限公司 | Printed circuit board and non-metallized step groove processing technology thereof |
| CN114126244A (en) * | 2021-12-01 | 2022-03-01 | 广德东风电子有限公司 | PCB production process based on laser direct writing exposure |
| CN114126244B (en) * | 2021-12-01 | 2023-07-14 | 广德东风电子有限公司 | PCB production method based on laser direct writing exposure |
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Application publication date: 20200410 |
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