CN103203955A - A hybrid production process for a step stencil - Google Patents
A hybrid production process for a step stencil Download PDFInfo
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- CN103203955A CN103203955A CN2012100107298A CN201210010729A CN103203955A CN 103203955 A CN103203955 A CN 103203955A CN 2012100107298 A CN2012100107298 A CN 2012100107298A CN 201210010729 A CN201210010729 A CN 201210010729A CN 103203955 A CN103203955 A CN 103203955A
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Abstract
A hybrid production process for a step stencil. Specifically, The process flow is as follows: electroforming a first electroformed layer: core mold treatment->pre-treatment (degreasing, pickling and sandblasting)->film mounting 1->exposure 1->single sided development 1-> electroforming 1->stripping; electroforming up steps on a printing surface: pre-treatment (pickling and sandblasting)->double sided film mounting->double sided exposure->double sided development->electroforming 2->stripping; and etching down steps on a PCB surface: PCB surface etching->film stripping->follow-up treatment (degreasing and pickling). By employing the process, a metal stencil having the PCB surface with down steps and the printing surface with up steps can be produced. The pattern areas of the metal stencil have openings with good quality, smooth hole walls, and no undesirable phenomena of blurs, jags, etc.; the position precision of the opening pattern area is high; and the thickness uniformity of the stencil is good, uniformity COV being less than 10%.
Description
Technical field
The present invention relates to a kind of mixing manufacture technology of step template, belong to material manufacturing and manufacture field, be specifically related to that a kind of printing surface has raised step in the PCB manufacturing field, the PCB mask has the manufacture craft of the mask used for printing plate of recess step.
Background technology
Along with electronic product is pursued miniaturization, previously used perforation plug-in unit element can't dwindle; The electronic product function is more complete, the integrated circuit that adopts (IC) can't punctured element, and particularly extensive, high integrated IC has to adopt the surface patch element, therefore mould printing technology has obtained development rapidly at electronics manufacturing, and the SMT printing is exactly the typical case.The first step of SMT assembly technology is not only in the buying of template, also is a most important step.The major function of template is the deposition that helps tin cream, and purpose is with the material transfer of accurate quantity position accurately to the tabula rasa.Tin cream is blocked on the template more few, is deposited on the circuit board just more many.Therefore more smooth more good to the opening quality requirement of template.But, for some special P CB plates, need the amount of tin cream to Duo than other positions or few as some privileged sites are arranged on the pcb board, therefore must carry out up or down processing to the position of corresponding templates, in general, the up zone needs to make figure, and the down zone does not need to make figure.
Electrotyping forming, a kind of technology that increases progressively rather than successively decrease is produced a metal form, has unique sealing characteristics, reduces the needs to Xi Qiao and template bottom surface cleaning.This technology provides and is close to perfectly location, does not have the restriction of geometry, has inherent trapezoidal smooth hole wall and low surface tension, improves tin cream and discharges.Go up the development photoresist by the substrate (or core) that will form perforate at, then one by one atom, electroforming goes out template around photoresist layer by layer.
Making for the step step; cycle is the fastest surely belongs to etch process, the making of the stainless steel template of chemical etching be by be coated with the anticorrosion protection agent in metal forming, with pin location sensitization instrument with graph exposure on the metal forming two sides, use double-side technology simultaneously from two sides corroding metal paper tinsel then.
For the technology of part thickening, its aperture position precision that is opened on the substrate graphics field that focuses on up step graphics field wants high, and adhesion wants big simultaneously, otherwise the life-span will reduce greatly.
Printing stencil is the mould of print solder paste, at present the general steel mesh that adopts.And the punching block opening size quality that traditional handicraft is made by laser cutting technique can not reach requirement, and plate face quality is also good inadequately.
Therefore, produce how better, quickly that printing surface has the up step, the PCB mask has the metal form of down step significant.
Summary of the invention
The present invention is intended to solve above technical problem, invents a kind of mixing manufacture technology of step template.The metal form that utilizes this manufacture craft to be made, printing surface have raised step (up step), and the PCB mask has recess step (down step), and the figure opening in up step zone and base openings have higher aligning accuracy.
A kind of mixing manufacture method of step template.Its technological process is as follows:
Electroforming first electroformed layer: core processing → pre-treatment (oil removing, pickling, sandblast) → pad pasting 1 → exposure 1 → surface development 1 → electroforming 1 → peel off;
Electroforming printing surface raised step (up step): pre-treatment (pickling, sandblast) → two-sided pad pasting → double-sided exposure → two-sided development → electroforming 2 → peel off;
Etching PCB face recess step (down step): PCB facet etch → take off film → subsequent treatment (oil removing, pickling).
Specifically, the concrete technological process of each step is:
Electroforming first electroformed layer:
(1) core is handled: select the 0.3mm stainless steel as core, and substrate is cut into needed size.
(2) pre-treatment: after the sheet metal that cuts carried out oil removing, pickling, the two sides blasting treatment improved surface roughness, thus the adhesion of dry film and sheet metal when improving pad pasting.
(3) pad pasting 1: select the high dry film of adhesive force, prevent from falling in the electroforming process film phenomenon.After choosing dry film, carry out pad pasting at mandrel surface.
(4) exposure 1: the subsides dry film is exposed, and the exposure area is the opening figure zone, and the exposure dry film stops the material deposition as the protective layer in the electroforming process.
(5) surface development 1: unexposed dry film is removed by two-sided developing process, and inspections of developing after the development requires not have the film of falling, rubs film, the phenomenon such as most of developing.
(6) electroforming 1: electroforming material is deposited on no dry film zone, clones the opening figure consistent with exposure figure.
(7) peel off: after an electroforming is finished, electroformed layer is stripped down from core.
Electroforming printing surface raised step (up step):
(1) pre-treatment: template is carried out pickling, and the two sides blasting treatment improves surface roughness, thus the adhesion of dry film and sheet metal when improving pad pasting.
(1) two-sided pad pasting: two-sided pad pasting, because the up step region area of the electroforming of wanting is less, so repeat press mold during pad pasting in printing, guarantee that dry film is close to first electroformed layer, guarantee that namely up step zone is difficult for breaking away from.
(2) double-sided exposure: by the lateral opening contraposition of CCD, the opening figure zone of accurate contraposition up step regional location and up step; Then printing surface is wanted electroforming up step zone in addition and the opening figure exposure in up step zone, with the regional exposure beyond the want etching PCB face down step.
(3) two-sided development: develop and remove unexposed dry film, needs are deposited the zone (up step zone) of electroforming material and need etched zone (down step zone) to come out.
(4) electroforming 2: the good electroformed layer that will develop is fixed on the core substrate with adhesive tape, and printing surface outwardly, carries out the secondary electroforming, at unexposed area (namely not having the dry film zone) deposition electroforming material, forms the up step of printing surface.。
Because up step region area is less, the current density line is concentrated during electroforming, can cause the edge effect in electroforming up step zone serious, so the careful contraposition of ready shunting auxiliary template to first electroformed layer, note not abrading figure and electroformed layer, first electroformed layer, one of flow distribution plate be fixed to fly to immerse electrotyping bath on the bar control electroforming up step thickness.
Described flow distribution plate, namely with the measure-alike corrosion resistant plate of core on method by laser cutting cut out identical with up step regional location, that size is an identical through hole, play the effect of sharing electric current, alleviating edge effect.
(5) peel off: after the secondary electroforming is finished, electroformed layer is stripped down from core.
Etching PCB face recess step (down step):
(1) PCB facet etch: after sealing with will be the ready-made printing surface up step of adhesive tape zone, cast layer is sent in the horizontal etching machine, mode by spray sprays the PCB face with etching solution, produce chemical reaction at the substrate surface that does not have the exposure dry film, etch away one deck steel disc, so just formed the recess step zone at the PCB face, shown in 4 among Fig. 3.
(2) take off film: after etching is finished, take off film and clean.
(3) subsequent treatment: with template oil removing, pickling.
Specifically, the concrete process parameters range of each step is as follows:
The pre-treating technology parameter is as follows:
| The |
1～2min |
| The |
1～2min |
| The |
2～3min |
| The |
5～10min |
| Pressure (pis) | 1～5 |
The exposure imaging technological parameter is as follows:
The technological parameter of electroforming is as follows:
Etch process parameters is as follows:
| Etching solution proportion | 1.30～1.50 |
| Fe 3+Concentration (g/L) | 100～300 |
| pH | 1.4～1.8 |
| Temperature (℃) | 50～60 |
| Pressure (pis) | 10～20 |
| |
8～20Hz |
The mixing manufacture technology of the step template of this patent invention is compared with laser cutting parameter in the past, and following obvious improvement is arranged:
(1) can make printing surface and have raised step (up step) and have opening figure, the PCB mask has the metal form of recess step (down step);
(2) the template opening quality is good, and hole wall is smooth, no burr;
(3) the positional precision height of the opening of raised step (up step) figure open area and first electroformed layer;
(4) template thickness good uniformity, uniformity COV in 10%,
(5) raised step (up step) zone is big with the adhesion of first electroformed layer, difficult drop-off;
(6) plate face one-level light.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage are from obviously and easily understanding becoming the description of embodiment in conjunction with following accompanying drawing.
Fig. 1. PCB face down zone cutaway view
The 1-PCB substrate
The 2-template
3-welds base station
4-plane opening
Elevated regions on the 5-PCB plate
6-PCB face down zone
The 7-printing surface
The 8-PCB face
Fig. 2. the opening cutaway view in printing surface up zone
The 1-PCB substrate
The 2-template
3a-welds base station
3b-welds base station
4-plane opening
5-printing surface up zone
The opening in 6-printing surface up zone
The 7-printing surface
The 8-PCB face
Fig. 3. template PCB face down schematic diagram
The 1-template
2-stencil plane opening
3-template PCB face down zone
4-template PCB face
Fig. 4. mould printing face up schematic diagram
The 1-template
2-stencil plane opening
3-mould printing face up zone
4-mould printing face up zone opening
5-mould printing face
The specific embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein identical or similar label is represented identical or similar elements or the element with identical or similar functions from start to finish.Be exemplary below by the embodiment that is described with reference to the drawings, only be used for explaining the present invention, and can not be interpreted as limitation of the present invention.
Attention problem among the concrete technological process of this religious name and the present invention in the technological process will be more detailed in the following description.
A kind of mixing manufacture method of step template.Its technological process is as follows:
Electroforming first electroformed layer: core processing → pre-treatment (oil removing, pickling, sandblast) → pad pasting 1 → exposure 1 → surface development 1 → electroforming 1 → peel off;
Electroforming printing surface raised step (up step): pre-treatment (pickling, sandblast) → two-sided pad pasting → double-sided exposure → two-sided development → electroforming 2 → peel off;
Etching PCB face recess step (down step): PCB facet etch → take off film → subsequent treatment (oil removing, pickling).
Specifically, the concrete technological process of each step is:
Electroforming first electroformed layer:
(1) core is handled: select the 0.3mm stainless steel as core, and substrate is cut into needed size.
(2) pre-treatment: after the sheet metal that cuts carried out oil removing, pickling, the two sides blasting treatment improved surface roughness, thus the adhesion of dry film and sheet metal when improving pad pasting.
(3) pad pasting 1: select the high dry film of adhesive force, prevent from falling in the electroforming process film phenomenon.After choosing dry film, carry out pad pasting at mandrel surface.
(4) exposure 1: the subsides dry film is exposed, and the exposure area is the opening figure zone, and the exposure dry film stops the material deposition as the protective layer in the electroforming process.
(5) surface development 1: unexposed dry film is removed by two-sided developing process, and inspections of developing after the development requires not have the film of falling, rubs film, the phenomenon such as most of developing.
(6) electroforming 1: electroforming material is deposited on no dry film zone, clones the opening figure consistent with exposure figure.
(7) peel off: after an electroforming is finished, electroformed layer is stripped down from core.
Electroforming printing surface raised step (up step):
(1) pre-treatment: template is carried out pickling, and the two sides blasting treatment improves surface roughness, thus the adhesion of dry film and sheet metal when improving pad pasting.
(1) two-sided pad pasting: two-sided pad pasting, because the up step region area of the electroforming of wanting is less, so repeat press mold during pad pasting in printing, guarantee that dry film is close to first electroformed layer, guarantee that namely up step zone is difficult for breaking away from.
(2) double-sided exposure: by the lateral opening contraposition of CCD, the opening figure zone of accurate contraposition up step regional location and up step; Then printing surface is wanted electroforming up step zone in addition and the opening figure exposure in up step zone, with the regional exposure beyond the want etching PCB face down step.
(3) two-sided development: develop and remove unexposed dry film, needs are deposited the zone (up step zone) of electroforming material and need etched zone (down step zone) to come out.
(4) electroforming 2: the good electroformed layer that will develop is fixed on the core substrate with adhesive tape, and printing surface outwardly, carries out the secondary electroforming, at unexposed area (namely not having the dry film zone) deposition electroforming material, forms the up step of printing surface.。
Because up step region area is less, the current density line is concentrated during electroforming, can cause the edge effect in electroforming up step zone serious, so the careful contraposition of ready shunting auxiliary template to first electroformed layer, note not abrading figure and electroformed layer, first electroformed layer, one of flow distribution plate be fixed to fly to immerse electrotyping bath on the bar control electroforming up step thickness.
Described flow distribution plate, namely with the measure-alike corrosion resistant plate of core on method by laser cutting cut out identical with up step regional location, that size is an identical through hole, play the effect of sharing electric current, alleviating edge effect.
(5) peel off: after the secondary electroforming is finished, electroformed layer is stripped down from core.
During electroforming, increase modes such as increasing soak time before sandblast time, the electroforming by pre-treatment and improve adhesion between two coating, prevent that coating from coming off, ready-made anode baffle is controlled the current density line by experiment, makes it in the scope of graphics field the first electroformed layer deposit thickness uniformity COV in 10%; Guarantee quality of coating by the amount of adjusting the electroforming additive, as coating light, free of pinholes, pit; It is good to reach coating opening hole wall quality by control development point during development, no burr, plating.
Etching PCB face recess step (down step):
(1) PCB facet etch: after sealing with will be the ready-made printing surface up step of adhesive tape zone, cast layer is sent in the horizontal etching machine, mode by spray sprays the PCB face with etching solution, produce chemical reaction at the substrate surface that does not have the exposure dry film, etch away one deck steel disc, so just formed the recess step zone at the PCB face, shown in 4 among Fig. 3.
(2) take off film: after etching is finished, take off film and clean.
(3) subsequent treatment: with template oil removing, pickling.
So just produce the step template shown in Fig. 3,4, and the printing process of this kind printing stencil as shown in Figure 1, 2, the recess step of PCB face, it mainly act as avoids the pcb board elevated regions, avoids the printing process template deformation, shown in 6 in 1, and the raised step of printing surface, its soldering copper platform that mainly act as on pcb board increases the following tin amount of printing, and is used for the welding of big element, shown in 6 in 2.
One group of preferred technological parameter is as follows:
The pre-treating technology parameter:
| The oil removing time | 2min |
| The pickling time | 2min |
| The |
3min |
| The |
6min |
| Pressure (pis) | 3 |
The exposure imaging technological parameter is as follows:
The technological parameter of electroforming is as follows:
Etch process parameters is as follows:
| Etching solution proportion | 1.4 |
| Fe 3+Concentration (g/L) | 150 |
| pH | 1.6 |
| Temperature (℃) | 55 |
| Pressure (pis) | 15 |
| Etching speed | 14Hz |
Although illustrated and described embodiments of the invention, those having ordinary skill in the art will appreciate that: can carry out multiple variation, modification, replacement and modification to these embodiment under the situation that does not break away from principle of the present invention and aim, scope of the present invention is limited by claim and equivalent thereof.
Claims (10)
1. the mixing manufacture technology of a step template, its technological process is as follows:
Electroforming first electroformed layer: core processing → pre-treatment (oil removing, pickling, sandblast) → pad pasting 1 → exposure 1 → surface development 1 → electroforming 1 → peel off;
Electroforming printing surface raised step (up step): pre-treatment (pickling, sandblast) → two-sided pad pasting → double-sided exposure → two-sided development → electroforming 2 → peel off;
Etching PCB face recess step (down step): PCB facet etch → take off film → subsequent treatment (oil removing, pickling).
2. the mixing manufacture technology of step template according to claim 1 is characterized in that, the printing surface of the metal form for preparing has raised step (up step) zone, and the PCB mask has recess step (down step) zone.
3. the mixing manufacture technology of step template according to claim 1 is characterized in that, the metal form for preparing has opening figure, and opening figure is distributed in up step regional peace face zone, down step zone imperforation figure.
4. the mixing manufacture technology of step template according to claim 1 is characterized in that, when the PCB face is printing, and the one side of step template and PCB substrate contacts.
5. the mixing manufacture technology of step template according to claim 1 is characterized in that, when printing surface is printing, and the one side that the step template contacts with scraper.
6. the mixing manufacture technology of step template according to claim 1 is characterized in that, the pre-treating technology parameter is as follows:
。
7. the mixing manufacture technology of step template according to claim 1 is characterized in that, the exposure imaging technological parameter is as follows:
。
8. the mixing manufacture technology of step template according to claim 1 is characterized in that, the technological parameter of electroforming is as follows:
。
9. the mixing manufacture technology of step template according to claim 1 is characterized in that etch process parameters is as follows:
。
10. the mixing manufacture technology of step template according to claim 1 is characterized in that, it is characterized in that, the process of electroforming for the second time adopts flow distribution plate to reduce current density, alleviates the edge effect in up step zone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010729.8A CN103203955B (en) | 2012-01-16 | 2012-01-16 | A hybrid production process for a step stencil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010729.8A CN103203955B (en) | 2012-01-16 | 2012-01-16 | A hybrid production process for a step stencil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103203955A true CN103203955A (en) | 2013-07-17 |
| CN103203955B CN103203955B (en) | 2017-02-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210010729.8A Expired - Fee Related CN103203955B (en) | 2012-01-16 | 2012-01-16 | A hybrid production process for a step stencil |
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| Country | Link |
|---|---|
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103572206A (en) * | 2013-11-08 | 2014-02-12 | 昆山允升吉光电科技有限公司 | Manufacture method of composite mask plate assembly |
| CN104191855A (en) * | 2014-08-22 | 2014-12-10 | 桐城运城制版有限公司 | SMT printing template |
| CN112606544A (en) * | 2020-11-19 | 2021-04-06 | 浙江硕克科技有限公司 | Metal plate and processing technology thereof |
| CN113276536A (en) * | 2021-05-14 | 2021-08-20 | 常州天禄显示科技有限公司 | Metal printing template with huge micro-structure holes and manufacturing method thereof |
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| JP2001105563A (en) * | 1999-10-07 | 2001-04-17 | Hitachi Ltd | Screen printing plate and method for munufacturing wiring substrate using screen printing plate |
| JP2002307857A (en) * | 2001-04-12 | 2002-10-23 | Murata Mfg Co Ltd | Screen printing plate and manufacturing method therefor |
| JP2004223842A (en) * | 2003-01-22 | 2004-08-12 | Murata Mfg Co Ltd | Screen process printing form plate and its manufacturing method |
| JP2006159579A (en) * | 2004-12-06 | 2006-06-22 | Kyushu Hitachi Maxell Ltd | Method for manufacturing metal mask plate for printing and metal mask plate for printing |
| CN102094221A (en) * | 2010-12-20 | 2011-06-15 | 昆山美微电子科技有限公司 | Method for preparing SMT (surface mount technology) nickel-phosphorus alloy plate by dry-film wet process |
| KR20120000717A (en) * | 2010-06-28 | 2012-01-04 | 삼성전기주식회사 | Mask for screen printing and method of manufacturing the same |
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2012
- 2012-01-16 CN CN201210010729.8A patent/CN103203955B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001105563A (en) * | 1999-10-07 | 2001-04-17 | Hitachi Ltd | Screen printing plate and method for munufacturing wiring substrate using screen printing plate |
| JP2002307857A (en) * | 2001-04-12 | 2002-10-23 | Murata Mfg Co Ltd | Screen printing plate and manufacturing method therefor |
| JP2004223842A (en) * | 2003-01-22 | 2004-08-12 | Murata Mfg Co Ltd | Screen process printing form plate and its manufacturing method |
| JP2006159579A (en) * | 2004-12-06 | 2006-06-22 | Kyushu Hitachi Maxell Ltd | Method for manufacturing metal mask plate for printing and metal mask plate for printing |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103572206A (en) * | 2013-11-08 | 2014-02-12 | 昆山允升吉光电科技有限公司 | Manufacture method of composite mask plate assembly |
| CN104191855A (en) * | 2014-08-22 | 2014-12-10 | 桐城运城制版有限公司 | SMT printing template |
| CN104191855B (en) * | 2014-08-22 | 2016-07-13 | 桐城运城制版有限公司 | A kind of SMT printing stencil |
| CN112606544A (en) * | 2020-11-19 | 2021-04-06 | 浙江硕克科技有限公司 | Metal plate and processing technology thereof |
| CN113276536A (en) * | 2021-05-14 | 2021-08-20 | 常州天禄显示科技有限公司 | Metal printing template with huge micro-structure holes and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN103203955B (en) | 2017-02-08 |
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