CN104191855A - SMT printing template - Google Patents
SMT printing template Download PDFInfo
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- CN104191855A CN104191855A CN201410417880.2A CN201410417880A CN104191855A CN 104191855 A CN104191855 A CN 104191855A CN 201410417880 A CN201410417880 A CN 201410417880A CN 104191855 A CN104191855 A CN 104191855A
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- smt printing
- composite layer
- printing stencil
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Abstract
The invention discloses an SMT printing template. The SMT printing template comprises an anti-scraping layer. The anti-scraping layer is made of rolled steel and is arranged on the surface of the SMT printing template. A composite material layer is arranged below the anti-scraping layer. The composite material layer is made of high polymer materials and photosensitive materials in a mixing mode and has certain viscidity. Reinforcing ribs are arranged in the composite material layer. The reinforcing ribs are made of alloy steel. A carrier plate is arranged below the composite material layer and is made of rolled steel. A template hole is formed in the SMT printing template. The cross section of the template hole has a certain gradient. The hole diameter becomes larger and larger from the periphery to the center. The SMT printing template is reasonable in design, and easy and convenient to manufacture, template cracking is well prevented, and working stability is improved.
Description
Technical field
The present invention relates to print field, particularly a kind of SMT printing stencil.
Background technology
Hyundai electronics industry develop rapidly, electronic product towards less, gentlier, thinner future development, more and more application of thin space, mould printing technique is more and more in electronics manufacturing application.In producing, electronic product electronic component kit PCB to be welded, first need tin silk to soften on PCB, and on PCB, have a lot of pads need to go up tin, the corresponding electronic component in position of each pad, adopt mould printing technology exactly the best approach of disposable pad that need to go up tin accurately upper tin.
The most simplicity of design of existing printing stencil, single with material, usually there will be the defects such as template cracking, print solder paste off normal, affect product quality.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of SMT printing stencil, and pattern hole cross section becomes certain gradient, and Yue Wang center, aperture is wider, has avoided the problems such as generation tin sweat(ing), to solve the above-mentioned multinomial defect causing in prior art.
For achieving the above object, the invention provides following technical scheme: a kind of SMT printing stencil, comprise anti-scratch layer, composite layer, support plate, reinforcement, pattern hole, described SMT printing stencil comprises that anti-scratch layer is made up of steel, be located at SMT printing stencil top layer, anti-scratch layer below is composite layer, composite layer is mixed by macromolecular material and photosensitive material, there is certain viscosity, in composite layer, be provided with reinforcement, reinforcement is made up of steel alloy, composite layer below is support plate, support plate is made up of steel, SMT printing stencil has pattern hole, pattern hole cross section becomes certain gradient, and Yue Wang center, aperture is wider, anti-scratch layer, composite layer, support plate, between layers by adhesive bond.
Preferably, described pattern hole upper surface and lower surface are all provided with rounding, and in pattern hole, center is provided with protruding convex arc.
Preferably, described reinforcement is manufactured by steel alloy, and reinforcement is that cross section is circular steel wire, is evenly applied in composite layer inside.
Adopt the beneficial effect of above technical scheme to be: this SMT printing stencil adopts multiple material Integrated using, anti-scratch layer is made up of steel, composite layer is mixed by macromolecular material and photosensitive material, reinforcement is made up of steel alloy, support plate is made up of steel, the combination of multiple material, improve the mechanical property of SMT printing stencil, anti-scratch layer is made up of high-carbon steel, hardness is large, and anti-wear performance is good, has prevented well the defects such as template cracking, the use of reinforcement, has improved the tensile strength of composite layer.SMT printing stencil has pattern hole, pattern hole cross section becomes certain gradient, and Yue Wang center, aperture is wider, in pattern hole, center is provided with protruding convex arc, use the pattern hole of this kind of structure to prevent the print solder paste off normal that plain bore easily occurs and easily produced the problems such as tin sweat(ing), simple in structure, easy to manufacture, serviceability and the life-span of having improved printing stencil.
Brief description of the drawings
Fig. 1 is the cutaway view of a kind of SMT printing stencil of the present invention;
Fig. 2 is the top view of a kind of SMT printing stencil of the present invention.
Wherein, 1-anti-scratch layer, 2-composite layer, 3-support plate, 4-reinforcement, 5-pattern hole, 6-convex arc.
Detailed description of the invention
Describe the preferred embodiment of a kind of SMT printing stencil of the present invention in detail below in conjunction with accompanying drawing.
Fig. 1 and Fig. 2 show the detailed description of the invention of a kind of SMT printing stencil of the present invention: a kind of SMT printing stencil, comprise anti-scratch layer 1, composite layer 2, support plate 3, reinforcement 4, pattern hole 5, described SMT printing stencil comprises that anti-scratch layer 1 is made up of steel, be located at printing stencil top layer, anti-scratch layer 1 below is composite layer 2, composite layer 2 is mixed by macromolecular material and photosensitive material, there is certain viscosity, in composite layer 2, be provided with reinforcement 4, reinforcement 4 is made up of steel alloy, composite layer 2 belows are support plate 3, support plate 3 is made up of steel, hardness is large, wearability is good, SMT printing stencil has pattern hole 5, pattern hole 5 cross sections become certain gradient, and Yue Wang center, aperture is wider, anti-scratch layer 1, composite layer 2, support plate 3, between layers by adhesive bond.
Shown in Fig. 1 and Fig. 2, anti-scratch layer 1 hardness is higher, mar proof is good, pattern hole 5 upper surfaces and lower surface are all provided with rounding, and the interior center of pattern hole 5 is provided with protruding convex arc 6, have prevented print solder paste off normal and have easily produced the problems such as tin sweat(ing), reinforcement 4 is manufactured by steel alloy, reinforcement 4 is that cross section is circular steel wire, is evenly applied in composite layer 2 inside, has improved the tensile strength of composite layer 2.
Above is only the preferred embodiment of the present invention, it should be pointed out that for the person of ordinary skill of the art, and without departing from the concept of the premise of the invention, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (3)
1. a SMT printing stencil, comprise anti-scratch layer, composite layer, support plate, reinforcement, pattern hole, it is characterized in that: the anti-scratch layer that described SMT printing stencil comprises is made up of high-carbon steel, be located at SMT printing stencil top layer, anti-scratch layer below is composite layer, composite layer is mixed by macromolecular material and photosensitive material, there is certain viscosity, in composite layer, be provided with reinforcement, reinforcement is made up of steel alloy, composite layer below is support plate, support plate is made up of steel, SMT printing stencil has pattern hole, pattern hole cross section becomes certain gradient, and Yue Wang center, aperture is wider, anti-scratch layer, composite layer, support plate, between layers by adhesive bond.
2. printing stencil according to claim 1, is characterized in that: described pattern hole upper surface and lower surface are all provided with rounding, and in pattern hole, center is provided with protruding convex arc.
3. printing stencil according to claim 1, is characterized in that: described reinforcement is manufactured by steel alloy, and reinforcement is that cross section is circular steel wire, is evenly applied in composite layer inside.
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410417880.2A CN104191855B (en) | 2014-08-22 | 2014-08-22 | A kind of SMT printing stencil |
Applications Claiming Priority (1)
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CN201410417880.2A CN104191855B (en) | 2014-08-22 | 2014-08-22 | A kind of SMT printing stencil |
Publications (2)
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CN104191855A true CN104191855A (en) | 2014-12-10 |
CN104191855B CN104191855B (en) | 2016-07-13 |
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CN201410417880.2A Active CN104191855B (en) | 2014-08-22 | 2014-08-22 | A kind of SMT printing stencil |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104219895A (en) * | 2014-10-04 | 2014-12-17 | 艾金富 | Printing template |
CN105415912A (en) * | 2015-11-18 | 2016-03-23 | 桐城运城制版有限公司 | Printing template |
CN115302205A (en) * | 2022-08-23 | 2022-11-08 | 上海福讯电子有限公司 | SMT (surface Mount technology) stepped template preparation method |
Citations (7)
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US20050161490A1 (en) * | 1999-09-02 | 2005-07-28 | Salman Akram | Method and apparatus for forming metal contacts on a substrate |
CN201226078Y (en) * | 2008-05-26 | 2009-04-22 | 新日光能源科技股份有限公司 | Combined printing formwork |
CN201703004U (en) * | 2010-05-19 | 2011-01-12 | 彰绅精密工业股份有限公司 | Metal printed formwork |
CN202353948U (en) * | 2011-10-11 | 2012-07-25 | 潘宇强 | Mask plate applied in B2it+FCA (fixed channel allocation) |
CN103203955A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A hybrid production process for a step stencil |
CN103862744A (en) * | 2012-12-10 | 2014-06-18 | 昆山允升吉光电科技有限公司 | Compound mask plate |
CN103974548A (en) * | 2014-04-26 | 2014-08-06 | 昆山允升吉光电科技有限公司 | Method for manufacturing mask plate |
-
2014
- 2014-08-22 CN CN201410417880.2A patent/CN104191855B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050161490A1 (en) * | 1999-09-02 | 2005-07-28 | Salman Akram | Method and apparatus for forming metal contacts on a substrate |
CN201226078Y (en) * | 2008-05-26 | 2009-04-22 | 新日光能源科技股份有限公司 | Combined printing formwork |
CN201703004U (en) * | 2010-05-19 | 2011-01-12 | 彰绅精密工业股份有限公司 | Metal printed formwork |
CN202353948U (en) * | 2011-10-11 | 2012-07-25 | 潘宇强 | Mask plate applied in B2it+FCA (fixed channel allocation) |
CN103203955A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A hybrid production process for a step stencil |
CN103862744A (en) * | 2012-12-10 | 2014-06-18 | 昆山允升吉光电科技有限公司 | Compound mask plate |
CN103974548A (en) * | 2014-04-26 | 2014-08-06 | 昆山允升吉光电科技有限公司 | Method for manufacturing mask plate |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104219895A (en) * | 2014-10-04 | 2014-12-17 | 艾金富 | Printing template |
CN105415912A (en) * | 2015-11-18 | 2016-03-23 | 桐城运城制版有限公司 | Printing template |
CN115302205A (en) * | 2022-08-23 | 2022-11-08 | 上海福讯电子有限公司 | SMT (surface Mount technology) stepped template preparation method |
CN115302205B (en) * | 2022-08-23 | 2024-05-14 | 上海福讯电子有限公司 | SMT ladder template preparation method |
Also Published As
Publication number | Publication date |
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CN104191855B (en) | 2016-07-13 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Yuan Shaojie Inventor before: Zhang Liming |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180315 Address after: 061600 Hebei province Dongguang Huiyuan Economic Development Zone on the west side of the road Patentee after: Dongguang Yuncheng plate making Co. Ltd. Address before: 231400 Tongcheng City, Anqing Province, private Economic Development Zone Xingyuan West Road Patentee before: Tongcheng Yuncheng Platemaking Co., Ltd. |