CN202353948U - Mask plate applied in B2it+FCA (fixed channel allocation) - Google Patents
Mask plate applied in B2it+FCA (fixed channel allocation) Download PDFInfo
- Publication number
- CN202353948U CN202353948U CN2011203871805U CN201120387180U CN202353948U CN 202353948 U CN202353948 U CN 202353948U CN 2011203871805 U CN2011203871805 U CN 2011203871805U CN 201120387180 U CN201120387180 U CN 201120387180U CN 202353948 U CN202353948 U CN 202353948U
- Authority
- CN
- China
- Prior art keywords
- mask plate
- plate substrate
- conducting bumps
- b2it
- fca
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 22
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052709 silver Inorganic materials 0.000 claims abstract description 5
- 239000004332 silver Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000007639 printing Methods 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 229910000990 Ni alloy Inorganic materials 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 239000011889 copper foil Substances 0.000 abstract description 3
- 239000010935 stainless steel Substances 0.000 abstract description 3
- 229910001256 stainless steel alloy Inorganic materials 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 2
- 230000003044 adaptive effect Effects 0.000 abstract 1
- 238000005553 drilling Methods 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 4
- 238000003475 lamination Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000005323 electroforming Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Abstract
The utility model discloses a mask plate applied in B2it+FCA (fixed channel allocation). The mask plate comprises a mask plate substrate and conducting bumps, wherein the mask plate substrate is made of metal stainless steel or nickel alloy; and the mask plate substrate is provided with through printing holes adaptive to the conducting bumps. The conducting bumps are preferably conducting bumps made of conical silver conductor pulp. For the through printing holes, the size deviation reaches +/-5mu m, the position deviation can reach +/-5mu m, and the minimum interval between the through printing holes can reach 0.10MM. The conducting bumps are printed on the mask plate substrate, and penetrate through the insulating layer; and the conducting bumps penetrating through the insulating layer are connected with a core plate and a copper foil. The mask plate has the advantages that since the method for printing silver conductor pulp and pressurizing accumulated layers on the mask plate substrate is adopted, the production process realized by the steps of drilling, chemically copper plating or copper electroplating and the like of the traditional PCB (printed circuit board) is omitted, so that the process flow of the PCB is greatly simplified and the production period is shortened.
Description
Technical field
The utility model relates to a kind of mask plate, especially a kind of mask plate of in the B2IT+FCA technology, using.
Background technology
Along with improving constantly of living standard, people, can't dwindle small product size but the perforation that tradition is used inserts the method for electronic component so that carry and put the pursuit miniaturization day by day of various electric equipment productss again; For the electronic product function more complete; The chip type of components and parts and integrated; The increased popularity of BGA (ball bar display), CSP (wafer-level package) and MCM (multi-chip module) requires the miniaturization of PCB package terminal; Be both and also require substrate to bear new function, embedded components occurs and be responsible for making sheet, to adapt to highdensity assembling requirement.
For satisfying the development need of CSP and flip-chip packaged FC; Need to use the high density PCB with internal through-hole (IVH) structure, the screen printing/thick-film technique that is applied in the lamination method multilayer technology to a kind of high-precision metal mask plate is exactly to realize the PCB of the IBH structure of low-cost mass production.There is following drawback in traditional manufacture method: 1, the manufacture method of traditional printed circuit PCB, and the cycle is long, and substrate is thick, can't satisfy accurate CSP and reach the fine pitch requirement that encapsulates the meticulous terminal of FC; 2, silk screen printing/thick-film technique of using of traditional lamination method multilayer technology, because its silk screen is made through etching method, precision is low, can't guarantee accurate CSP and encapsulate the quality that the fine pitch of the meticulous terminal of FC requires; 3, traditional silk screen printing and PCB manufacture method will experience technologies such as etching and plating, and be very big to environmental impact, causes environmental pollution.
B2it+FCA is the upside-down mounting crimp technology that forms salient point on the multilager base plate.
The utility model content
In order to overcome the deficiency of above technology, the utility model provides a kind of mask plate, can be good at the fine pitch requirement of satisfying accurate CSP and encapsulating the meticulous terminal of FC.
The utility model is realized through following technical scheme:
A kind of mask plate that is applied to B2it+FCA comprises: the mask plate substrate, and the property led projection, the material of said mask plate substrate are metal stainless steel or nickel alloy; Have on the described mask plate substrate and the hole of biting that the property led projection adapts.The said property led projection is preferably the property the led projection that conical silver conductive paste is processed.Said its dimensional discrepancy of hole of biting reaches ± 5 μ m, and position deviation can accomplish ± 5 μ m that said interval minimum of biting between the hole can be accomplished 0.10mm.
The printing property led projection on mask plate substrate 1, the property led projection penetrates insulating barrier, connects central layer and Copper Foil on the said property the led projection that insulating barrier is penetrated.
The advantage with respect to conventional art of the utility model is:
1, the method for mask plate substrate laser or electroforming processes, and its machining accuracy is high, the size of its design and positional precision up to 10 microns in, effectively guaranteed the accuracy of electrical connecting position;
2, the gap minimum widith in the middle of the mask plate substrate printing hole that is processed by the method for laser or electroforming can accomplish that 0.1MM can guarantee that CSP chip terminal pitch is little interconnected more than the 120 μ m;
3, through above-mentioned with pressurize the again method of lamination of mask plate substrate printed silver conductor paste; Having saved traditional PCB waits through hole electroless copper or electro-coppering again and realizes having simplified the production process that is electrically connected the PCB work flow greatly and shortened the production cycle.
Description of drawings
Fig. 1 is applied to the structural representation of circuit board for the utility model embodiment.
Among the figure: 1, mask plate substrate; 2, the hole of biting; 3, the property led projection.
Embodiment
With reference to shown in Figure 1, a kind of mask plate that is applied to B2it+FCA comprises: mask plate substrate 1, the material of mask plate substrate 1 are metal stainless steel or nickel alloy; Have on the described mask plate substrate 1 and the hole 2 of biting that the property led projection 3 adapts.
The said hole 2 of biting is conical hole, and its dimensional discrepancy reaches ± 5 μ m, and position deviation can be accomplished ± 5 μ m.
Said interval minimum of biting between the hole 2 can be accomplished 0.10mm,
The printing property led projection 3 on mask plate substrate 1, the property led projection 3 penetrate insulating barrier, connect central layer and Copper Foil on the said property the led projection 3 that insulating barrier is penetrated.
Claims (2)
1. mask plate that is applied to B2it+FCA comprises: the mask plate substrate, and the property led projection, the property led projection are printed on the mask plate substrate; Have on the described mask plate substrate and the hole of biting that the property led projection adapts, the said property led projection is the property the led projection that conical silver conductive paste is processed.
2. mask plate according to claim 1 is characterized in that: said its dimensional discrepancy of hole of biting reaches ± 5 μ m, and position deviation can accomplish ± 5 μ m that said interval minimum of biting between the hole can be accomplished 0.10mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203871805U CN202353948U (en) | 2011-10-11 | 2011-10-11 | Mask plate applied in B2it+FCA (fixed channel allocation) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203871805U CN202353948U (en) | 2011-10-11 | 2011-10-11 | Mask plate applied in B2it+FCA (fixed channel allocation) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202353948U true CN202353948U (en) | 2012-07-25 |
Family
ID=46542901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203871805U Expired - Fee Related CN202353948U (en) | 2011-10-11 | 2011-10-11 | Mask plate applied in B2it+FCA (fixed channel allocation) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202353948U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104191855A (en) * | 2014-08-22 | 2014-12-10 | 桐城运城制版有限公司 | SMT printing template |
-
2011
- 2011-10-11 CN CN2011203871805U patent/CN202353948U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104191855A (en) * | 2014-08-22 | 2014-12-10 | 桐城运城制版有限公司 | SMT printing template |
| CN104191855B (en) * | 2014-08-22 | 2016-07-13 | 桐城运城制版有限公司 | A kind of SMT printing stencil |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Optical electronic technology (Shenzhen) Co., Ltd. Assignor: Pan Yuqiang Contract record no.: 2013440020182 Denomination of utility model: Mask plate applied in B2it+FCA (fixed channel allocation) Granted publication date: 20120725 License type: Exclusive License Record date: 20130613 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160617 Address after: Four, building 518000, building C5, Hengfeng Industrial Zone, Baoan District, Guangdong, Shenzhen, Xixiang Patentee after: Optical electronic technology (Shenzhen) Co., Ltd. Address before: Four C5 building, 518126, Hengfeng Industrial Zone, Baoan District, Guangdong, Shenzhen, Xixiang Patentee before: Pan Yuqiang |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120725 Termination date: 20191011 |