JP4597631B2 - Component built-in wiring board, method of manufacturing component built-in wiring board - Google Patents

Description

  The present invention relates to a component built-in wiring board having electric / electronic components embedded in an insulating layer and a manufacturing method thereof, and more particularly to a component built-in wiring board suitable for improving productivity and a manufacturing method thereof.

As a component built-in wiring board having an electrical component embedded in an insulating layer, for example, there is one disclosed in Patent Document 1 below. According to the structure shown in FIG. 1 of the same literature, solder (or a conductive composition) is used for electrical connection to the wiring layer of the electrical component, and an interlayer connection body (through the insulating layer embedded with the electrical component) ( For the conductor between the wiring layers, a conductive composition filled in the through holes is used. In the manufacturing method, electrical components are electrically and mechanically connected to a wiring board serving as a core in advance using solder (or a conductive composition). In addition, a hole is formed in another insulating resin layer, and the hole is filled with a conductive composition, aligned and arranged with the core plate on which the component has been previously mounted, and laminated and integrated.
JP 2003-197849 A

  In the wiring board as described above, it is considered appropriate to prepare a member (solder or conductive composition) required for component mounting and a member for forming an interlayer connector as materials or different compositions. For this reason, it takes time and effort for management such as procurement of a plurality of materials and inventory management. Also, the production equipment necessary for the component mounting process is completely different from the production equipment necessary for stacking and integrating as a wiring board, and the burden on equipment investment is large.

  The present invention has been made in consideration of the above circumstances, and in a component built-in wiring board having an electric / electronic component embedded in an insulating layer and a method for manufacturing the same, a component built-in wiring board having a small manufacturing burden and its manufacturing It aims to provide a method.

In order to solve the above-described problems, a component built-in wiring board according to the present invention is embedded in at least a part of the electrical / electronic component in close contact with at least a part of the surface of the electrical / electronic component and the electrical / electronic component. A plate-like insulating layer; a first conductor provided so as to penetrate the insulating layer while avoiding a position of the electric / electronic component; and the insulation so as to be electrically connected to the first conductor. A first wiring layer provided on the upper surface of the layer, and a lower surface facing the upper surface of the insulating layer so as to be electrically connected to the first conductor, without falling in the thickness direction of the insulating layer It provided the electrical and the second wiring layer of the outermost no multilayer structure on the surface facing the surface in contact with the insulating layer, the electric / electronic component terminal and a second wiring layer , Mechanically connected and made of the same composition material as the first conductor Characterized by comprising a conductor.

  In this component built-in wiring board, the terminal of the electric / electronic component is electrically and mechanically connected to the first or second wiring layer by the second conductor. The first wiring layer and the second wiring layer have an insulating layer between them, and the first wiring layer and the second wiring layer are formed by the first conductor passing through the insulating layer. It is the structure which can be electrically conducted. The electric / electronic component is at least partially embedded in the insulating layer. In such a component built-in wiring board, the first conductor (interlayer connection body) and the second conductor (members required for component mounting) are made of the same composition material. Therefore, the first and second conductors can be easily formed at the same time, and the manufacturing burden can be reduced in terms of material procurement and production facilities.

In addition, the method of manufacturing a component built-in wiring board according to the present invention includes a first conductive bump on the first metal foil, a height lower than the first conductive bump, and the first conductive bump. A first step of forming a second conductive bump made of the same material as the bump, and an electric / electronic component on the first metal foil so as to pass through the formed second conductive bump A second step of mounting, and laminating the prepreg on the first metal foil so that the formed first conductive bump penetrates, and the prepreg is fluidized by heating to provide the prepreg. A third step of embedding the electrical / electronic component; and a step of deforming a head portion of the first conductive bump penetrating the prepreg so as to obtain electrical continuity with the first conductive bump on the laminated prepreg. Two metal foils are laminated and the prepreg is A fourth step of integrating the whole by reduction, patterned by photolithography said first metal foil and the second metal foil on both surfaces of the prepreg obtained by being cured insulating layer And a fifth step . In addition, another method of manufacturing a component built-in wiring board according to the present invention includes a first conductive bump on the first metal foil, a height lower than the first conductive bump, and the first conductive bump. A first step of forming a second conductive bump made of the same material as that of the conductive bump, and an electric / electron on the first metal foil so as to pass through the formed second conductive bump. A second step of mounting the component, and a prepreg having an opening corresponding to the position of the electrical / electronic component on the first metal foil so that the formed first conductive bump penetrates. A third step of laminating and an insulating layer having a metal wiring pattern on the laminated prepreg so as to deform the head of the first conductive bump penetrating the prepreg and obtain electrical conduction therewith. A fourth step of arranging the layers, and the prepreg by heating By subsequently cured give fluidity, the prepreg is adhered to the electric / electronic component, a fifth step of fixing in the state of filling the electrical / electronic components, the insulating layer in which the prepreg is obtained by being cured And a sixth step of patterning the first metal foil on the surface using photolithography .

The method of manufacturing these is respectively one method for producing the component built-in wiring board. The first conductive bump and the second conductive bump are formed as one process, and in the subsequent process, the first conductive bump becomes an interlayer connection, and the second conductive bump is an electric / electronic component. It becomes a member for terminal connection. Therefore, the manufacturing burden is small.

  According to the present invention, in a component built-in wiring board having an electric / electronic component embedded in an insulating layer and a method for manufacturing the same, the manufacturing burden can be reduced.

  As an embodiment of the present invention, the first conductor is made of a conductive composition and has a shape that has an axis that coincides with the layer direction and has a diameter that changes in the direction of the axis. be able to. For example, the first conductor is formed by screen printing of a conductive composition paste.

Here, the second area in contact with the front Stories second wiring layer of the conductor, the area is smaller than in contact with the first conductor wiring layer of the second, can be. The first conductor and the second conductor have a bottom area corresponding to the required height.

  Further, as an embodiment as a manufacturing method, the first step may be to simultaneously form the first conductive bump and the second conductive bump. Productivity is still improved by simultaneous formation. Since the materials of the first and second conductive bumps are the same, simultaneous formation is easy.

  Here, the first step may be that the first conductive bump and the second conductive bump are simultaneously formed by screen printing of a conductive composition. Such simultaneous formation can be easily performed by screen printing.

  Further, here, the first step may be performed using a screen plate having two types of pits having different diameters for the screen printing. According to the screen plate having pits having different diameters, conductive bumps having different heights can be easily formed at the same time due to the difference in pit internal volume.

  Here, the second step may be performed before the second conductive bump formed by screen printing the conductive composition is cured. By mounting the electrical / electronic component before curing, component mounting utilizing the adhesive property of the conductive composition can be performed.

  Alternatively, the second step may be performed after the second conductive bump formed by screen printing the conductive composition is cured. By mounting the electrical / electronic component after curing, it is easy to break the connection hindering layer such as an oxide layer formed on the terminal of the component to obtain electrical conduction, and stable connection is possible.

Further, as an embodiment, the second step, the pre-Symbol first metal foil made fixed on the stage by vacuum suction, can be. This is for reliably mounting the component on the surface of the metal foil that is easily deformed.

  Based on the above, embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing a configuration of a component built-in wiring board according to an embodiment of the present invention. As shown in FIG. 1, this component built-in wiring board includes an insulating layer 11, wiring layers (metal wiring patterns) 12, 13, conductive bumps (first conductor) 14, conductive bumps (second conductor). ) 15 and a resistor chip (electric / electronic component) 16.

  The insulating layer 11 is a layer made of a rigid insulating resin such as glass epoxy resin, and has a thickness of 200 μm, for example. The wiring layers 12 and 13 are metal (copper) wiring patterns provided on the upper and lower surfaces of the insulating layer 11 and have a thickness of 18 μm, for example. The conductive bumps 14 are made of a conductive composition (in which fine metal particles such as silver, gold, and copper and fine particles of carbon are dispersed and cured in a resin), and penetrate the insulating layer 11 to form the wiring layer 12. , 13 are electrically connected to the wiring layers 12 and 13. Further, the diameter changes in the axial direction (upper and lower lamination directions in the drawing) depending on the manufacturing process, and the diameter is 300 μm on the thick side (wiring layer 12 side), for example.

The conductive bump 15 is made of the same composition material as that of the conductive bump 14 and is embedded in the insulating layer 11 to electrically connect the wiring layer 12 and the terminal of the built-in resistor chip 16. The diameter is, for example, 100 μm on the side in contact with the wiring layer 12. Resistor chip 16, has been embedded provided in the insulating layer 11, and is electrically connected to the wiring layer 12 that terminal via the conductive bump 15. For example, a resistor chip 16 having a size of 0402 (0.4 mm × 0.2 mm) can be used. Its thickness is a little over 0.1 mm.

  In the component built-in wiring board having such a configuration, the conductive bumps 14 that are interlayer connections and the conductive bumps 15 that are members for electrically connecting the component (resistor chip 16) to the wiring layer 12 are manufactured. Can be easily formed simultaneously. This is because they are the same composition material and are formed on the same metal foil that is the basis of the wiring layer 12. Hereinafter, a series of manufacturing steps including this step will be described.

  FIG. 2 is a process diagram schematically showing a manufacturing process of the component built-in wiring board shown in FIG. 1, and the same or equivalent components as those shown in FIG. is there. First, as shown in FIG. 2 (a), a metal foil (electrolytic copper foil) 12A having a thickness of, for example, 18 μm to be used as the wiring layer 12 is prepared, and the conductive bumps 14 and the components are connected to each other at predetermined positions. The conductive bumps 15 are formed by screen printing a conductive composition paste, for example.

  A screen plate (metal mask) used for screen printing is used in which two types of pits (through holes) having different diameters are formed. Thus, two types of conductive bumps 14 and 15 having different sizes (bottom diameter and height as a conical shape) can be easily formed simultaneously due to the difference in volume in the pit. The conductive bumps 14 for interlayer connection have a bottom surface diameter of 300 μm and a height of 300 μm, for example, and the conductive bumps 15 for connecting components have a bottom surface diameter of 100 μm and a height of 100 μm, for example.

  Next, as shown in FIG. 2B, for example, a mounter is used to place the 0402 size chip resistor 16 on the metal foil 12 </ b> A so that both terminals thereof are placed on the conductive bumps 15. At this time, the printed conductive bumps 15 are not cured and are easily deformed to ensure a sufficient contact area with the terminals of the chip resistor 16. In addition, it is preferable to use a flat stage that can fix the position of the metal foil 12A by vacuum suction when mounting the component by the mounter. As a result, deformation such as wrinkles on the metal foil 12A can be avoided, and component placement with high positional accuracy becomes possible. When the mounting of the components by the mounter is completed, the conductive bumps 14 and 15 are dried and cured, and the chip resistor 16 is mechanically fixed on the metal foil 12A via the conductive bumps 15.

  Next, as shown in FIG.2 (c), FR-4 prepreg 11A of nominal thickness which should be used as the insulating layer 11, for example, 200 micrometers is laminated | stacked on the metal foil 12A using a press. At this time, the head of the conductive bump 15 penetrates the prepreg 11A, and the prepreg 11A obtains fluidity by heating to cover the chip resistor 16 and embed it. In addition, the broken line at the head of the conductive bump 14 in FIG. 2C indicates that there may be both cases where the head of the conductive bump 14 is plastically deformed and crushed at this stage and when it is not plastically deformed. .

  Next, a metal foil (electrolytic copper foil) 13A having a thickness of 18 μm, for example, is arranged on the laminated prepreg 11A, and is pressed and heated in the laminating direction by a press. As a result, as shown in FIG. 2D, the prepreg 11A is completely cured (= insulating layer 11), and the whole is laminated and integrated. At this time, the metal foil 13 </ b> A is electrically connected to the conductive bump 14. Finally, the metal foils 12A and 13A that shield both surfaces of the insulating layer 11 are patterned in a predetermined manner using well-known photolithography to obtain a component built-in wiring board having the wiring layers 12 and 13 as shown in FIG. Can do. The patterning of the metal foil 12A is naturally performed so that the pattern of the wiring layer 12 connected to both terminals of the built-in chip resistor 16 is separated.

  As described above, this embodiment can provide a component built-in wiring board and a method for manufacturing the same with a small increase in the process due to the incorporation of the component (chip resistor 16) and a small increase in manufacturing burden. .

  Next, a component built-in wiring board according to another embodiment of the present invention will be described with reference to FIG. FIG. 3 is a schematic cross-sectional view showing a configuration of a component built-in wiring board according to another embodiment of the present invention. In the component built-in wiring board of this embodiment, it is possible to incorporate a larger (thickness) electric / electronic component than the above embodiment.

  As shown in FIG. 3, this component built-in wiring board includes insulating layers 31, 32, 33, wiring layers 34, 35, 36, 37 (= four layers in total), conductive bumps (first conductive layer). Bodies) 38, 39, conductive bumps (second conductor) 40, chip parts (electric / electronic parts) 41, and through-hole conductors 42.

  The portions of the insulating layer 32 and the wiring layers 35 and 36 positioned on the upper and lower surfaces thereof are core plate portions, and the core plate can obtain electrical continuity between the wiring layers 35 and 36 by the through-hole conductor 42. It is configured as follows. Further, a position corresponding to the built-in chip component 41 is an opening, and provides a space for incorporating a thicker chip component 41. The insulating layer 32 has a thickness of 300 μm, for example, and is a rigid material such as a glass epoxy resin. The wiring layers 35 and 36 are metal (copper) wiring patterns having a thickness of, for example, 18 μm.

  The insulating layer 31, the conductive bump 38 passing through the insulating layer 31, the lower wiring layer 34 conducting to the conductive bump 38, the conductive bump 40 embedded in the insulating layer 31, and the wiring layer 34 by the conductive bump 40. The part of the chip part 41 that is electrically connected to the lower part is a lower buildup part laminated on the core plate. The insulating layer 33, the conductive bump 39 passing through the insulating layer 33, and the upper wiring layer 37 connected to the conductive bump 39 are the upper build-up portion laminated on the core plate.

  The insulating layers 31 and 33 are deformed so as to fill the space inside the through-hole conductor 42 of the insulating layer 32 and the opening of the insulating layer 32 for the built-in chip component 41, and there are voids inside. There is no space. The insulating layers 31 and 33 are made of, for example, a rigid insulating resin such as glass epoxy resin, and the thickness of each layer is, for example, 100 μm. The wiring layers 34 and 37 are metal (copper) wiring patterns having a thickness of, for example, 18 μm.

  The conductive bumps 38 and 39 are made of a conductive composition as described above, and are interposed between the wiring layers 34 and 35 or between the wiring layers 36 and 37 through the insulating layer 31 or the insulating layer 33. It is electrically connected to the wiring layers 34 and 35 or the wiring layers 36 and 37. Further, the diameter changes in the axial direction (upper and lower lamination directions in the drawing) depending on the manufacturing process, and the diameter is, for example, 200 μm on the thicker side (wiring layer 34 side or 37 side).

  The conductive bump 40 is made of the same composition material as the conductive bumps 38 and 39 and is embedded in the insulating layer 31 to electrically connect the wiring layer 34 and the terminal of the built-in chip component 41. To do. The diameter is, for example, 50 μm on the side in contact with the wiring layer 34. The chip component 41 is embedded in the insulating layers 31 and 33, and its terminals are electrically connected to the wiring layer 34 via the conductive bumps 40. The chip component 41 can be built up to a thickness of about 0.4 mm.

  Even in the component built-in wiring board having such a configuration, the conductive bump 38 which is an interlayer connection and the conductive bump 40 which is a member for electrically connecting the component (chip component 41) to the wiring layer 34 are manufactured. Can be easily formed simultaneously. This is because, as in the previous embodiment, they are exactly the same composition material and the formation destination is on the same metal foil from which the wiring layer 34 is based. Hereinafter, a series of manufacturing steps including this step will be described.

  4, 5, and 6 are process diagrams schematically showing a part of the manufacturing process of the component built-in wiring board shown in FIG. 3, respectively, and the manufacturing process of the component built-in wiring board shown in FIG. FIG. 4 is a process diagram showing a part of a schematic cross section, and a process diagram showing another part of the manufacturing process of the component built-in wiring board shown in FIG. 3 in a schematic cross section. In these drawings, the same or equivalent components as those shown in FIG. 3 are denoted by the same reference numerals.

  In other words, FIG. 4 is a diagram showing a manufacturing process of the lower buildup portion laminated on the core plate. 4 (a), (b), and (c) are the same except for (a), (b), and (c) in the manufacturing process of the previous embodiment shown in FIG. It is.

  First, as shown in FIG. 4A, a metal foil (electrolytic copper foil) 34A having a thickness of, for example, 18 μm to be used as the wiring layer 34 is prepared, and conductive bumps 38 are connected to the parts at predetermined positions. For example, the conductive bump 40 is formed by screen printing a conductive composition paste. A screen plate (metal mask) having two types of pits with different diameters is used. Using such a screen plate, the conductive bumps 38 for interlayer connection are formed with a bottom diameter of 200 μm and a height of 160 μm, for example, and the conductive bumps 40 for connecting components are formed with a bottom diameter of 50 μm and a height of 30 μm, for example.

  Next, as shown in FIG. 4B, the chip component 41 is placed on the metal foil 34 </ b> A so that both terminals thereof are placed on the conductive bumps 40 using, for example, a mounter. When the mounting of the component by the mounter is completed, the conductive bumps 38 and 40 are dried and cured, and the chip component 41 is mechanically fixed on the metal foil 34 </ b> A via the conductive bump 40.

  Next, as shown in FIG.4 (c), FR-4 prepreg 31A of nominal thickness which should be used as the insulating layer 31, for example, 100 micrometers is laminated | stacked on metal foil 34A using a press. At this time, a prepreg 31A having an opening at a portion corresponding to the position of the chip component 41 is used, and a cushion material (not shown) capable of absorbing the thickness of the chip component 41 is interposed above the prepreg 31A. And pressurize and heat. Thereby, the head of the conductive bump 38 penetrates the prepreg 31A more reliably. Note that the broken line at the head of the conductive bump 38 in FIG. 4C indicates that there may be both cases where the head of the conductive bump 38 is plastically deformed and crushed at this stage and when it is not plastically deformed. . As described above, the wiring board material 1 of the lower buildup portion laminated on the core plate as shown in FIG. 4C is obtained.

  FIG. 5 is a diagram showing a manufacturing process of the core plate portion in other words. First, as shown in FIG. 5A, for example, an FR-4 insulating layer 32 having a thickness of, for example, 300 μm in which metal foils (electrolytic copper foils) 35A and 36A having a thickness of 18 μm are laminated on both surfaces is prepared. A through-hole 52 for forming a through-hole conductor is formed at a predetermined position, and an opening 51 is formed at a portion corresponding to the chip component 41 to be incorporated.

  Next, electroless plating and electrolytic plating are performed to form a through-hole conductor 42 on the inner wall of the through hole 52 as shown in FIG. At this time, a conductor is also formed on the inner wall of the opening 51. Further, as shown in FIG. 5C, the metal foils 35A and 36A are patterned in a predetermined manner using known photolithography (wiring layers 35 and 36). The conductor formed on the inner wall of the opening 51 is also removed by patterning the wiring layers 35 and 36. As described above, the wiring board material 2 of the core board portion can be obtained.

  In other words, FIG. 6 shows an arrangement relationship in which the upper buildup portion of the wiring board material 3 and the lower buildup portion of the wiring board material 1 are laminated on the upper and lower surfaces of the core board portion of the wiring board material 2. FIG. Here, the upper wiring board material 3 is obtained by applying the same process as the lower wiring board material 1. However, it is a structure without the site | part (conductive bump 40, opening of prepreg 33A) produced in order to connect components (chip component 41). Other than that, the metal foil (electrolytic copper foil) 37A, the conductive bump 39, and the prepreg 33A are the same as the metal foil 34A, the conductive bump 38, and the prepreg 31A of the wiring board material 1, respectively.

  The respective wiring board materials 1, 2, and 3 are laminated and arranged in the arrangement as shown in FIG. Thereby, the prepregs 31 </ b> A and 33 </ b> A are completely cured, and the whole is laminated and integrated. At this time, due to the fluidity of the prepregs 31 </ b> A and 33 </ b> A obtained by heating, the prepregs 31 </ b> A and 33 </ b> A are deformed and enter the space around the chip component 41, and no gap is generated. The wiring layers 35 and 36 are electrically connected to the conductive bumps 38 and 39, respectively. After this laminating step, the metal foils 34A and 37A on both the upper and lower surfaces are patterned in a predetermined manner using well-known photolithography to obtain a component built-in wiring board as shown in FIG. The patterning of the metal foil 34A is naturally performed so that the patterns of the wiring layer 34 connected to both terminals of the built-in chip component 41 are separated.

  As described above, this embodiment can also provide a component built-in wiring board and a method for manufacturing the component built-in wiring board with a small increase in the process by incorporating the component (chip component 41) and a small increase in manufacturing burden. . In addition, the region provided for the built-in component is thicker in the thickness direction, and more types of components can be built. As for the through-hole conductor 42 in the core plate portion, it is of course possible to manufacture a structure having an interlayer connection similar to the conductive bumps 38 and 39.

Next, a component built-in wiring board according to a reference example will be described with reference to FIG. FIG. 7 is a schematic cross-sectional view showing the configuration of the component built-in wiring board according to the reference example , and the same reference numerals are given to the same or equivalent components as those shown in the already described drawings. The description of the part is omitted unless there is an additional matter.

  This component built-in wiring board is similar in configuration to the component built-in wiring board shown in FIG. 3 except that an insulating layer 71 and upper and lower wiring layers 72 and 73 are provided instead of the wiring layer 34, and Instead of the wiring layer 37, an insulating layer 81 and upper and lower wiring layers 82 and 83 are provided. Thus, there are a total of six wiring layers. Further, conductive bumps 74 exist through the insulating layer 71, and the wiring layers 72 and 73 on the upper and lower surfaces of the insulating layer 71 are configured to be electrically conductive. The same applies to the conductive bumps 84 that penetrate the insulating layer 81.

  As a manufacturing process, in the formation of the conductive bumps 38 and 40 shown in FIG. 4, instead of the metal foil 34A, wiring layers 72 and 73 are provided on the upper and lower surfaces of the insulating layer 71 and sandwiched between them to conduct electricity. A double-sided wiring board having a conductive bump 74 may be used (the wiring layer 72 below the insulating layer 71 may be one before patterning). The same applies to the double-sided wiring board having the insulating layer 81, the conductive bumps 84, and the wiring layers 82 and 83 instead of the metal foil 37A (this also applies to the wiring layer 82 above the insulating layer 81 before patterning). Good.) These double-sided wiring boards used instead can be obtained by referring to the steps of the embodiment described in FIGS. Thereafter, by applying the steps of FIGS. 4 to 6, a component built-in wiring board as shown in FIG. 7 can be obtained.

In the form status of this, the insulating layer 71 (81), the conductive bumps 74 (83), and a wiring layer 72 (82), the portion of the double-sided wiring board made of 73 (83), components such as shown in FIG. 1 A built-in wiring board can also be used. Thereby, it is possible to obtain a component built-in wiring board in which components are further embedded at high density.

Next, a component built-in wiring board according to another reference example will be described with reference to FIG. FIG. 8 is a schematic cross-sectional view showing the configuration of a component built-in wiring board according to another reference example . Components that are the same as or equivalent to those shown in the already described drawings are denoted by the same reference numerals. is there. The description of the part is omitted unless there is an additional matter.

This component built-in wiring board has a bare chip semiconductor 91 as a built-in component. An underfill resin 92 is filled on the connection surface side of the bare chip semiconductor 91 with the conductive bumps 40A. The manufacturing process is similar on purpose form shown in FIG. 7 is also slightly different. This will be described below.

That is, following the formation of the conductive bumps 38 and 40A by screen printing, the conductive bumps 38 and 40A are first dried and cured. And underfill resin 92 is apply | coated to the area | region of 40 A of hardened conductive bumps. Further, the bare chip semiconductor 91 is flip-chip connected in accordance with the position of the conductive bump 40A. In this flip-chip connection, the cured conductive bump 40A easily breaks through a connection-inhibiting layer such as an oxide film on the connection pad of the bare chip semiconductor 91, thereby realizing stable electrical connection. The following steps are in the form on purpose similar that shown in FIG. In such form state Nico, reliability of the connection increases, it is possible to built a bare chip semiconductor 91 as a component.

Next, a component built-in wiring board according to still another reference example will be described with reference to FIG. FIG. 9 is a schematic cross-sectional view showing a configuration of a component built-in wiring board according to still another reference example . Components identical or equivalent to those shown in the already described drawings are denoted by the same reference numerals. It is. The description of the part is omitted unless there is an additional matter.

In the form status of this, the conductive bumps 38,40A, instead 39 has metal bumps 108,100,109 formed by a metal plate etching. As shown in the figure, an etching stopper layer remains on the wiring layer 73 side or the wiring layer 83 side of these metal bumps 108, 100, and 109. The boundary between the insulating layer 31 (33) of the insulating layer 71 (81) is moving toward the deep by the thickness of the wiring layer 73 as compared shaped on purpose shown in FIG. 8 (83). Hereinafter, the manufacturing process will be described including the reason for such a configuration.

  FIG. 10 is a process diagram schematically showing a part of a manufacturing process of the component built-in wiring board shown in FIG. 9 in an insulating layer 71, wiring layers 72 and 73, conductive bumps 74, metal bumps in FIG. The manufacturing process of the part of 108 and 100 is shown. The manufacturing process of the insulating layer 81, the wiring layers 82 and 83, the conductive bump 84, and the metal bump 109 in FIG. 9 is substantially the same. In addition, the same code | symbol is attached | subjected to the same or equivalent thing as the component shown in FIG.

  First, for example, a laminated film in which a layer (etching stopper layer ES) made of, for example, a nickel alloy having a very thin thickness, for example, 2 μm, is prepared on a metal foil (electrolytic copper foil) 73A having a thickness of 18 μm is prepared. A metal plate (copper plate) 108A having a thickness of, for example, 120 μm is laminated and integrated on the side to obtain a clad material having a three-layer structure as shown in FIG.

Next, as shown in FIG. 10B, the metal foil 73A is patterned in a predetermined pattern with an etchant that can etch only copper using well-known photolithography. Thereby, the wiring layer 73 is formed. Further, as shown in FIG. 3C, conductive bumps 74 are formed at predetermined positions on the wiring layer 73 by screen printing of a conductive composition paste. Subsequently, as shown in FIG. 10D, a prepreg 71A to be the insulating layer 71 is laminated on the wiring layer 73 side using a press machine. At this time, the head of the conductive bump 74 is made to penetrate the prepreg 71A. By this lamination process, the wiring layer 73 is sunk and positioned on the prepreg 71A side. In addition, the broken line at the head of the conductive bump 74 in FIG. 10D indicates that there are both cases where the head of the conductive bump 74 is plastically deformed and crushed at this stage and when it is not plastically deformed. .

  Next, on the laminated prepreg 71A, a metal foil (electrolytic copper foil) 72A having a thickness of, for example, 18 μm to be used as the wiring layer 72 is disposed and pressed and heated in the laminating direction by a press. As a result, as shown in FIG. 10E, the prepreg 71A is completely cured to become the insulating layer 71 and laminated and integrated. At this time, the metal foil 72A is electrically connected to the conductive bump 74.

  Next, an etching resist at a predetermined position is formed on the metal plate 108A. This etching resist is left where the metal bumps 108 and 100 are to be formed by etching. Then, etching is performed using an etchant that can etch only copper, and as shown in FIG. 10F, metal bumps 108 and 100 are formed by etching the metal plate. The shape varies depending on the shape and size of the etching resist and the etching processing time. Generally, the shape has an axis that coincides with the stacking direction, and the diameter changes in the direction of this axis by side etching. The difference in height between the metal bumps 108 and 100 is due to the difference in the size of the etching resist.

Finally, by using the formed metal bumps 108 and 100 as a mask, the etching stopper layer ES is removed by etching to obtain a wiring board material having a form as shown in FIG. In the following, the component built-in wiring board shown in FIG. 9 can be obtained by applying the same manufacturing process as the reference example shown in FIG. As described above, the conductor for connecting the interlayer and the conductor for connecting the components can be simultaneously formed by etching the metal plate.

Next, a component built-in wiring board according to still another reference example will be described with reference to FIG. FIG. 11 is a schematic cross-sectional view showing a configuration of a component built-in wiring board according to still another reference example . Components identical or equivalent to those shown in the already described drawings are denoted by the same reference numerals. It is. The description of the part is omitted unless there is an additional matter.

Shape status of this, the conductive bumps 38,40A, instead 39 (see FIG. 8), and a metal bump 118,110,119 formed by plating. The component built-in wiring board having such metal bumps 118, 110, and 119 can be manufactured, for example, as follows. That is, instead of forming the conductive bumps 38 and 40 (see FIG. 4), a patterned resist for plating is formed on the wiring layer 73 (83), and plating growth is performed on the portion where the resist is removed. Form bumps with The other steps are the same as those of the component built-in wiring board shown in FIG.

  For efficient plating growth, it is preferable to form a power feeding pattern as a part of the wiring layers 73 and 83 when forming them. As a result, it is possible to efficiently form the metal bumps 118, 110, and 119 by applying an electrolytic plating process. The shape of the metal bumps 118, 100, and 119 is a columnar or frustum shape whose axis direction coincides with the stacking direction following the resist pattern shape for plating (that is, the diameter changes in the axis direction or (The shape has not changed). The difference in height between the metal bump 118 and the metal bump 118 is that, for example, the plating process is divided into two stages, and after the first stage, a new mask is formed only on the metal bump 110 and the second stage plating process is performed. It will be realized.

The typical sectional view showing the composition of the component built-in wiring board concerning one embodiment of the present invention. Process drawing which shows the manufacturing process of the component built-in wiring board shown in FIG. The typical sectional view showing the composition of the component built-in wiring board concerning another embodiment of the present invention. Process drawing which shows a part of manufacturing process of the component built-in wiring board shown in FIG. 3 with a typical cross section. FIG. 4 is a process view schematically showing another part of the manufacturing process of the component built-in wiring board shown in FIG. FIG. 5 is a process diagram schematically showing still another part of the manufacturing process of the component built-in wiring board shown in FIG. 3. The typical sectional view showing the composition of the component built-in wiring board concerning a reference example . The typical sectional view showing the composition of the component built-in wiring board concerning another reference example . Furthermore, the typical sectional view showing the composition of the component built-in wiring board concerning another reference example . Process drawing which shows a part of manufacturing process of the component built-in wiring board shown in FIG. 9 with a typical cross section. Furthermore, the typical sectional view showing the composition of the component built-in wiring board concerning another reference example .

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Wiring board material, 2 ... Wiring board material (core board), 3 ... Wiring board material, 11 ... Insulating layer, 11A ... Prepreg, 12 ... Wiring layer (metal wiring pattern), 12A ... Metal foil (copper foil), 13 ... Wiring layer (metal wiring pattern), 13A ... Metal foil (copper foil), 14 ... Conductive bump (first conductor), 15 ... Conductive bump (second conductor), 16 ... Resistor chip ( Electrical / electronic parts), 31 ... insulating layer, 31A ... prepreg, 32 ... insulating layer, 33 ... insulating layer, 33A ... prepreg, 34 ... wiring layer (metal wiring pattern), 34A ... metal foil (copper foil), 35 ... Wiring layer (metal wiring pattern), 35A ... metal foil (copper foil), 36 ... wiring layer (metal wiring pattern), 36A ... metal foil (copper foil), 37 ... wiring layer (metal wiring pattern), 37A ... metal foil (Copper foil), 38 ... conductive bump (first conductor), DESCRIPTION OF SYMBOLS 9 ... Conductive bump, 40, 40A ... Conductive bump (2nd conductor), 41 ... Chip component (electric / electronic component), 42 ... Through-hole conductor, 51 ... Opening part, 52 ... Through-hole, 71 ... Insulating layer, 71A ... Prepreg, 72 ... Wiring layer (metal wiring pattern), 72A ... Metal foil (copper foil), 73 ... Wiring layer (metal wiring pattern), 73A ... Metal foil (copper foil), 74 ... Conductivity Bump, 81 ... insulating layer, 82 ... wiring layer (metal wiring pattern), 83 ... wiring layer (metal wiring pattern), 84 ... conductive bump, 91 ... bare chip semiconductor, 92 ... underfill resin, 100 ... by metal plate etching Formed metal bump (second conductor), 108... Metal bump formed by metal plate etching (first conductor), 108 A... Metal plate (copper plate), 109. Metal bumps formed, 110 ... Metal bumps formed by plating (second conductor), 118 ... Metal bumps formed by plating (first conductor), 119 ... Metal bumps formed by plating, ES: Etching stopper layer.

Claims (11)

Electrical / electronic components,
A plate-like insulating layer in close contact with at least a part of the surface of the electrical / electronic component and embedding at least a part of the electrical / electronic component;
A first conductor provided so as to penetrate the insulating layer while avoiding the position of the electric / electronic component;
A first wiring layer provided on an upper surface of the insulating layer so as to be electrically connected to the first conductor;
The first conductor is provided without sagging in the thickness direction of the insulating layer on the lower surface facing the upper surface of the insulating layer so as to be electrically conductive, the surface opposite the on the surface in contact with said insulating layer Includes an outermost second wiring layer having no multilayer structure,
Electrically and mechanically connecting the terminal of the electrical / electronic component and the second wiring layer, and comprising a second conductor made of the same composition material as the first conductor. A component built-in wiring board.   2. The first conductor according to claim 1, wherein the first conductor is made of a conductive composition and has a shape that has an axis that coincides with a layer direction and a diameter that changes in the direction of the axis. Component built-in wiring board.   3. The component built-in wiring board according to claim 2, wherein an area of the second conductor in contact with the second wiring layer is smaller than an area of the first conductor in contact with the second wiring layer. . On the first metal foil, a first conductive bump and a second conductive bump having a height lower than that of the first conductive bump and made of the same material as the first conductive bump are formed. A first step of:
A second step of mounting an electrical / electronic component on the first metal foil so as to pass through the formed second conductive bump;
While the prepreg is laminated on the first metal foil so that the formed first conductive bump penetrates, the prepreg is fluidized by heating and the electric / electronic component is covered with the prepreg. A third step;
The head of the first conductive bump penetrating the prepreg is deformed, and a second metal foil is laminated on the laminated prepreg so as to obtain electrical continuity therewith, and at the same time, the prepreg is cured. a fourth step of integrating the whole Te,
And a fifth step of patterning the first metal foil and the second metal foil on both surfaces of the insulating layer obtained by curing the prepreg using photolithography. Manufacturing method of built-in wiring board. On the first metal foil, a first conductive bump and a second conductive bump having a height lower than that of the first conductive bump and made of the same material as the first conductive bump are formed. A first step of:
A second step of mounting an electrical / electronic component on the first metal foil so as to pass through the formed second conductive bump;
A third step of laminating a prepreg having an opening corresponding to the position of the electric / electronic component on the first metal foil so that the formed first conductive bump penetrates;
A fourth step of disposing a head portion of the first conductive bump penetrating the prepreg and disposing an insulating layer having a metal wiring pattern on the laminated prepreg so as to obtain electrical conduction therewith. When,
A fifth step of fixing the prepreg in a state where the prepreg is brought into close contact with the electric / electronic component by embedding the prepreg by heating and then cured ,
And a sixth step of patterning the first metal foil on the surface of the insulating layer obtained by curing the prepreg by using photolithography. .   6. The method of manufacturing a component built-in wiring board according to claim 4, wherein the first step forms the first conductive bump and the second conductive bump simultaneously.   7. The component built-in wiring board according to claim 6, wherein in the first step, the first conductive bump and the second conductive bump are simultaneously formed by screen printing of a conductive composition. Production method.   8. The method of manufacturing a component built-in wiring board according to claim 7, wherein the first step is performed using a screen board having two types of pits having different diameters for the screen printing.   8. The component built-in wiring board according to claim 7, wherein the second step is performed before the second conductive bump formed by screen printing the conductive composition is cured. Production method.   8. The component built-in wiring board according to claim 7, wherein the second step is performed after the second conductive bump formed by screen printing the conductive composition is cured. Method.   6. The method of manufacturing a component built-in wiring board according to claim 4, wherein the second step is performed by fixing the first metal foil on a stage by vacuum suction.

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