KR101979078B1 - Anisotropic conductive film using solder coated metal conducting particles - Google Patents

Abstract

An anisotropic conductive film using solder coated metal conductive particles is presented. According to an embodiment, an anisotropic conductive film (ACF) compressed between an upper substrate and a lower substrate includes an adhesive layer disposed between the upper substrate and the lower substrate; And conductive particles made of metal coated with a solder that is formed in the adhesive layer and electrically connects the electrodes of the upper substrate and the electrodes of the lower substrate.

Description

TECHNICAL FIELD [0001] The present invention relates to an anisotropic conductive film using solder-coated metal conductive particles.

The following examples relate to anisotropic conductive films using solder coated metal conductive particles.

With the rapid progress of the digital network information society, functions such as high performance, multifunctionalization (convergence and compounding), miniaturization, light weight and acceleration of information processing speed are required in mobile information terminals. In particular, the choice of miniaturization technology in response to changes in the manufacturing technology due to the miniaturization of electronic devices has become a very important factor and has attracted attention as an important variable in business.

Since the miniaturization of the electronic device is emphasized, the number of input / output (I / O) terminals of the circuit connecting the components in the electronic device is increased, thereby making the interval between the electrodes finer. In the packaging process, which is a post-semiconductor process, the electrical connection caused by the narrowing gap between the electrodes and the reliability is the biggest problem.

Anisotropic Conductive Film (ACF or ACFs), which is an electrical connecting material used in semiconductor packaging, makes fine conductive particles into a film state by mixing with an adhesive resin (generally a thermosetting resin) So as to be electrically connected to the upper and lower sides, and to be insulated laterally. As the conductive particles (conductive balls), a metal ball such as nickel (Ni), solder or the like may be used, or a polymer ball in which nickel (Ni) or gold (Gold) And mechanical and electrical bonding is achieved in such a manner that the conductive particles are sandwiched between the electrodes in the anisotropic conductive film (ACF), and then the film is cured.

However, in the case of such an anisotropic conductive film, a small ball is used in order to prevent an electrical short between the left and right electrodes in accordance with progress of fine pitching. Accordingly, in the case of the solder ball, the gap between the upper and lower electrodes becomes very small due to the melting and pressure of the solder, thereby causing a problem that the electrodes are in direct contact with each other. In this case, tin (Sn), which is a main alloy component of the solder, is rapidly consumed in the form of an intermetallic compound through a diffusion reaction with the electrode, and the solder joint becomes very brittle, Occurs.

In order to solve such a connection problem and to ensure a stable connection, a solder capable of forming a solder joint, while ensuring a sufficient gap size between the metal electrodes, contains metal conductive particles such as nickel coated with nickel A new solder anisotropic conductive film (ACF) is required.

Korean Patent Publication No. 10-2011-0027378 discloses a resin composition for such an adhesive film and a technique relating to an adhesive film using the same.

Embodiments describe an anisotropic conductive film using solder coated metal conductive particles and more specifically to an anisotropic conductive film containing metal conductive particles coated with a solder capable of forming a solder joint ACF). ≪ / RTI >

Embodiments are characterized in that solder is coated on the metal particles used for spacers, such as nickel, to ensure sufficient electrode spacing between the upper and lower electrodes to obtain a constant electrode spacing, To provide a stable solder joint by using the solder-coated metal conductive particles.

Embodiments are based on coating solder on metal particles for spacers, such as nickel (Ni), to improve electrical performance, increase mechanical reliability, and to be applicable to fine or very fine pitch, there is no need to add nickel spacer particles to ensure a gap size when using a solder ball, so that solder-coated metal conductive particles capable of reducing material cost by reducing the total conductive particle content And to provide an anisotropic conductive film.

An anisotropic conductive film (ACF) compressed between an upper substrate and a lower substrate along one side includes an adhesive layer disposed between the upper substrate and the lower substrate; And conductive particles made of metal coated with a solder that is formed in the adhesive layer and electrically connects electrodes of the upper substrate and electrodes of the lower substrate.

Here, the conductive particles may be formed by electrolytically or electrolessly plating a solder on metal conductive particles made of nickel (Ni) or copper (Cu), or may be formed by vapor phase coating.

The conductive particles may be composed of conductive particles coated with solder on spacer Ni particles or spacer Cu particles.

The conductive particles may be formed of spacer Ni particles to secure a distance between the electrodes of the upper substrate and the lower substrate and delay consumption of tin by the diffusion of tin, which is a main component of the solder. Or spacer copper particles, it is possible to secure a predetermined gap size.

The conductive particles are made of the metal coated with the solder so as to have high reliability, high current carrying characteristics, and low connection resistance, and are electrically connected to the electrodes of the solder, The metal chemical connection by the metal bonding can be made between the electrodes.

The conductive particles can be simultaneously brought into contact with the physical connection of the metal and the metal chemical of the solder so as to have a high electrical and mechanical performance.

The conductive particles may be characterized in that they are not sensitive to the flatness of the substrate as the solder is melted.

The anisotropic conduction film is applicable to the upper substrate and the lower substrate which are fine pitch or very fine pitch due to the conductive particles made of the metal coated with the solder.

A structure including an anisotropic conductive film according to another aspect includes: an upper substrate on which electrodes are formed; A lower substrate on which electrodes are formed; And an anisotropic conductive film (ACF) pressed between the upper substrate and the lower substrate, wherein the anisotropic conductive film comprises: an adhesive layer disposed between the upper substrate and the lower substrate; And conductive particles made of metal coated with a solder that is formed in the adhesive layer and electrically connects electrodes of the upper substrate and electrodes of the lower substrate.

The conductive particles may be composed of conductive particles coated with solder on spacer Ni particles or spacer Cu particles.

The conductive particles may be formed of spacer Ni particles to secure a distance between the electrodes of the upper substrate and the lower substrate and delay consumption of tin by the diffusion of tin, which is a main component of the solder. Or spacer copper particles, it is possible to secure a predetermined gap size.

The conductive particles are made of the metal coated with the solder so as to have high reliability, high current carrying characteristics, and low connection resistance, and are electrically connected to the electrodes of the solder, A metal chemical connection is made between the electrodes by metal bonding, and the metal in the inside can make a physical connection with the electrodes of the upper substrate and the electrodes of the lower substrate.

Wherein the substrate and the lower substrate are made of fine pitch or extremely fine pitch substrates, and the anisotropic conduction film is a fine pitch or extremely fine pitch-changed film due to the conductive particles made of the metal coated with the solder The upper substrate and the lower substrate.

According to embodiments, solder is coated on the metal particles used for spacers, such as nickel, to ensure sufficient electrode spacing between the upper and lower electrodes to obtain a constant electrode spacing, It is possible to provide an anisotropic conduction film using solder-coated metal conductive particles which realize a stable solder joint by implementing interconnection.

In addition, according to embodiments, the solder can be coated on the metal particles for a spacer such as nickel (Ni) to improve the electrical performance, increase the mechanical reliability, and improve the solder coating Anisotropic conduction films using the metal conductive particles can be provided.

In addition, according to the embodiments, there is no need to add Ni spacer particles for securing the gap size when using the existing solder balls, so that by reducing the content of the entire conductive particles, It is possible to provide an anisotropic conductive film using solder-coated metal conductive particles which can be reduced.

1 is a view showing a state before connection of an anisotropic conductive film using solder-coated metal conductive particles according to one embodiment.
2 is a view showing a connection state of an anisotropic conductive film using solder-coated metal conductive particles according to one embodiment.
3 is a view for explaining conductive particles obtained by plating tin (Sn) on nickel (Ni) particles according to an embodiment.
4 is a view showing a solder joint shape of an anisotropic conductive film using solder-coated metal conductive particles according to an embodiment.
5 is a view showing a state before connection of a conventional anisotropic conductive film.
6 is a view showing a connection state of a conventional anisotropic conductive film.
7 is a view for explaining a case where a conventional anisotropic conductive film is used for a fine pitch electrode.
8 is a view for explaining a case where spacer nickel particles and solder particles are mixed and used in a conventional anisotropic conductive film.

Hereinafter, embodiments will be described with reference to the accompanying drawings. However, the embodiments described may be modified in various other forms, and the scope of the present invention is not limited by the embodiments described below. In addition, various embodiments are provided to more fully describe the present invention to those skilled in the art. The shape and size of elements in the drawings may be exaggerated for clarity.

The following embodiments relate to an anisotropic conductive film (ACF) containing metal conductive particles coated with a solder capable of forming a solder joint, in order to ensure a sufficient electrode gap between the upper and lower electrodes By coating solder on metal particles used for spacers such as nickel, stable electrode spacing can be obtained and a stable solder joint can be obtained by realizing the intermetallic bonding of the solder .

In addition, embodiments can improve electrical performance, increase mechanical reliability, and be applicable to fine pitch or fine pitch by coating solder on metal particles for a spacer such as nickel (Ni).

5 is a view showing a state before connection of a conventional anisotropic conductive film. 6 is a view showing a connection state of a conventional anisotropic conductive film.

As shown in FIGS. 5 and 6, in the case of a bonding method using a conventional anisotropic conductive film, a conductive ball is contained between a printed circuit board (PCB) and a flexible printed circuit board (FPCB) The anisotropic conductive film was subjected to heat and pressure at 150 to 250 DEG C to form conductive connection by sandwiching the conductive ball-like conductive particles between the electrodes having a thickness of several tens of micrometers. At this time, as the conductive particles, a metal ball such as nickel (Ni), solder, or the like, or a polymer ball in which nickel (Ni) or gold is plated, And the diameter is in the range of several mu m to several tens mu m. Here, the thickness of the anisotropic conductive film is usually determined by the sum of the heights of the upper and lower electrodes.

In the case of a conventional anisotropic conductive film, a metal ball such as nickel (Ni), solder, or the like may be used, or a polymer ball in which nickel (Ni) or gold It is used dispersed in resin film. In the case of the polymer resin film used for the anisotropic conductive film, for example, an acrylic type or an epoxy type can be commonly used. Metal particles and gold-plated polymer particles form a physical bond between the electrodes.

The use of anisotropic conductive films (ACF) has been increasing and replacing metal particles with solder particles as required for highly reliable anisotropic conductive film (ACF) bonding, Thereby enabling connection by metal bonding. This connection not only shows high reliability, high current carrying characteristics, low contact resistance, but is also insensitive to substrate flatness by melting the solder, replacing existing physical connections with metal chemical connections There are advantages.

However, since the solder balls having a small size are used in order to prevent electric short between the right and left electrodes due to the fine pitch of the substrate, the following problems arise.

7 is a view for explaining a case where a conventional anisotropic conductive film is used for a fine pitch electrode.

As shown in Fig. 9B, which is a partially enlarged view of Figs. 7A and 7A, when a conventional anisotropic conductive film is used for a fine pitch electrode, the gap is reduced in size, (Sn) is easily consumed.

In other words, a solder ball having a small size is used in order to prevent an electrical short between the left and right electrodes in accordance with the fine pitch of the substrate, so that the gap between the upper and lower electrodes becomes very small, A problem of direct contact occurs. Also, tin (Sn), which is a main component of the solder, is metallurgically bonded to the metal electrode and is consumed at the same time as the diffusion, resulting in a very brittle solder joint, which causes a problem of connection reliability.

8 is a view for explaining a case where spacer nickel particles and solder particles are mixed and used in a conventional anisotropic conductive film.

As shown in FIG. 8, when spacer Ni particles and solder particles are used in combination to increase the size of the gap, the spacer Ni particles and the solder particles it is difficult to simultaneously capture the solder particles on the electrode.

In other words, when Ni particles serving as spacers are used together with solder particles to increase the gap between the metal electrodes, the flow of the thermosetting polymer resin during the bonding process A large amount of conductive particles are caught later and a lot of electrodes are gathered between the electrodes, so that a short circuit phenomenon that is an electrical error in which the electrodes are energized in the horizontal direction can easily occur. In addition, it is difficult to capture nickel particles and solder particles which are spacers at the same time because the width of the electrode is small, and it is difficult to maintain a constant gap size between the electrodes. And, if the two kinds of balls are mixed, the material cost of the anisotropic conductive film (ACF) is also increased.

1 is a view showing a state before connection of an anisotropic conductive film using solder-coated metal conductive particles according to one embodiment.

Referring to FIG. 1, an anisotropic conductive film (ACF) 100 using solder-coated metal conductive particles according to an embodiment is disposed between an upper substrate 210 and a lower substrate 200, The upper substrate 210 and the lower substrate 200 can be pressed and connected to each other by heat and pressure applied from above.

1, an anisotropic conductive film (ACF) 100 pressed between the upper substrate 210 and the lower substrate 200 will be described in more detail.

The anisotropic conductive film (ACF) 100 pressed between the upper substrate 210 and the lower substrate 200 according to an embodiment may include the adhesive layer 120 and the conductive particles 110.

The adhesive layer 120 may be disposed between the upper substrate 210 and the lower substrate 200.

As the adhesive layer 120, a polymer film may be used. For example, an acrylic type or an epoxy type may be used. The adhesive layer 120 may be a non-conducting film (NCF) polymer adhesive layer, or may be formed of a thermosetting resin and laminated or double coated. On the other hand, the adhesive layer may be formed by lamination or double coating of a polymer adhesive layer of a non-conductive film (NCF) on the polymer layer and on the upper and lower sides of the polymer layer. In this case, the conductive particles 110 may be formed in the polymer layer.

The conductive particles 110 are formed in the adhesive layer 120 and are electrically connected to the electrodes 201 of the upper substrate 210 and the electrodes 201 of the lower substrate 200 by solder- ≪ / RTI > For example, when the content of tin is less than 100%, tin (Sn) may be used as the solder, and the remainder may be used as an alloy for soldering such as silver (Ag), copper (Cu), lead (Pb) ≪ / RTI >

Here, the conductive particles 110 may be spherical, but may be non-spherical such as elliptical, cylindrical, or polygonal. For example, the shape of spherical conductive particles can be changed to an elliptical shape by a simple method of controlling pressure and temperature.

The conductive particles 110 may be made of metal particles coated with a solder. The metal particles used at this time may be metal particles (metal balls) having a high hardness to increase the size of the gap, the reliability of the solder joint can be enhanced. For example, the metal particles having high hardness may be metal particles made of nickel (Ni), or metal particles containing nickel (Ni). On the other hand, the metal particles may be not only nickel (Ni) but also metal particles having high hardness such as copper (Cu) and serving as a spacer.

In other words, the conductive particles 110 may be formed by electrolytically or electrolessly plating or vapor-coating a solder on metal conductive particles made of nickel (Ni) or copper (Cu) or the like.

For example, the conductive particles 110 may be formed by plating a solder on metal conductive particles made of nickel (Ni). More specifically, the conductive particles 110 may be composed of conductive particles 110 coated with solder on spacer Ni particles. At this time, as a concept of a solder coated on a nickel spacer (not a separate Ni spacer and solder ball), a ball spacer and a joint ) Can be obtained. The conductive particles 110 may be composed of spacer Ni particles as well as conductive particles 110 coated with solder on spacer Cu particles.

The conductive particles 110 secure the distance between the electrode 211 of the upper substrate 210 and the electrode 201 of the lower substrate 200 after the connection process and the tin (Sn) diffusion which is the main component of the solder It is possible to secure a predetermined gap size between the two electrodes after the connection process due to the spacer Ni particles or the spacer Cu particles in order to reduce the consumption by the spacer.

The conductive particles 110 are made of a solder-coated metal so as to have a high reliability, a high current carrying characteristic, and a low contact resistance, and are electrically connected to the solder (solder) 211 and the electrode 201 of the lower substrate 200 by metal bonding.

The conductive particles 110 may be simultaneously made of the physical connection of the internal metal and the metal chemical connection of the solder so as to have high electrical and mechanical performance.

The conductive particles 110 may be characterized in that they are not sensitive to the flatness of the substrate as the solder is melted.

The conductive particles 110 distributed in the adhesive layer 120 are formed in such a degree that a plurality of conductive particles 110 do not contact each other between the electrodes and are arranged at appropriate intervals even after the pressing to be dispersed without aggregation .

The anisotropic conduction films including the conductive particles 110 may be formed on the upper substrate 210 and the lower substrate 200, which are fine pitch or finely pitch-formed by the conductive particles 110 made of metal coated with solder. ). That is, by coating a solder on metal particles having high hardness such as nickel (Ni), electrical performance is improved, mechanical reliability is increased, and fine pitch / fine pitch can be applied.

2 is a view showing a connection state of an anisotropic conductive film using solder-coated metal conductive particles according to one embodiment.

Referring to FIG. 2, a connection structure of an anisotropic conductive film using solder-coated metal conductive particles is shown, which may be a structure including an anisotropic conductive film (ACF) 100. For example, the structure including the anisotropic conductive film (ACF) 100 may be a structure including an anisotropic conductive film (ACF) 100 using solder-coated nickel (Ni) conductive particles.

The structure including the anisotropic conductive film (ACF) 100 is formed by applying heat and pressure to an anisotropic conductive film (ACF) 100 containing conductive particles between the upper substrate 210 and the lower substrate 200, So that electrical connection can be made between the thick electrodes through the conductive particles 110. In this case, a heat tool 300 may be used to press the anisotropic conductive film (ACF) 100 between the upper substrate 210 and the lower substrate 200, and the heat tool 300 and the upper substrate 210 An interposer may be formed.

The structure including the anisotropic conductive film (ACF) 100 will be described in more detail below with reference to FIG.

The structure including the anisotropic conductive film according to one embodiment may include an upper substrate 210, a lower substrate 200, and an anisotropic conductive film (ACF) 100. The anisotropic conductive film (ACF) 100 may include an adhesive layer 120 and conductive particles 110. Herein, the anisotropic conductive film (ACF) 100 has been described in detail with reference to FIG. 1 and will be briefly described.

The upper substrate 210 may have electrodes formed thereunder. For example, the upper substrate 210 may be formed of a flexible printed circuit board (FPCB). The upper substrate 210 may be a printed circuit board (PCB), a glass chip substrate, or the like.

An electrode may be formed on the upper substrate 200. For example, the lower substrate 200 may be a printed circuit board (PCB). The lower substrate 200 may be a flexible substrate such as a flexible printed circuit board (FPCB), a glass chip substrate, or the like.

Here, the upper substrate 210 and the lower substrate 200 may be formed of fine pitch or extremely fine pitch substrates as the size of electronic equipment is reduced.

The anisotropic conductive film (ACF) 100 is pressed between the upper substrate 210 and the lower substrate 200 and may include the adhesive layer 120 and the conductive particles 110.

The anisotropic conductive film (ACF) 100 includes an adhesive layer 120 disposed between the upper substrate 210 and the lower substrate 200, an electrode 211 formed in the adhesive layer 120, And conductive particles 110 made of a metal coated with solder for electrically connecting between the electrodes 201 of the lower substrate 200 and the electrodes 201 of the lower substrate 200.

The conductive particles 110 may be formed by electroplating, electroless plating or vapor-coating a solder on metal conductive particles made of nickel (Ni) or copper (Cu). More specifically, the conductive particles 110 may be composed of conductive particles 110 coated with solder on spacer Ni particles. At this time, as a concept of a solder coated on a nickel spacer (not a separate Ni spacer and solder ball), a ball spacer and a joint ) Can be obtained. The conductive particles 110 may be composed of spacer Ni particles as well as conductive particles 110 coated with solder on spacer Cu particles.

The conductive particles 110 secure the distance between the electrode 211 of the upper substrate 210 and the electrode 201 of the lower substrate 200 and consume the tin (Sn) diffusion, which is the main component of the solder, It is possible to secure a predetermined gap size due to the spacer Ni particles or the spacer Cu particles in order to slow down.

The conductive particles 110 are made of solder-coated metal so as to have a high reliability, a high current carrying characteristic, and a low contact resistance, and are electrically connected to the electrodes 211 of the solder and the upper substrate 210, And the electrodes 201 of the lower substrate 200 and the electrodes 201 of the lower substrate 200 are connected to each other by metal bonding between the electrodes 201 of the upper substrate 210 and the electrodes 201 of the lower substrate 200, Physical connection can be established.

The anisotropic conductive film is applicable to the upper substrate 210 and the lower substrate 200 which are fine pitch or finely pitch-changed due to the conductive particles 110 made of a metal coated with a solder.

As described above, according to the embodiments, the solder is coated on the metal particles used for the spacer such as nickel (Ni) or copper (Cu) in order to ensure a sufficient electrode interval between the upper and lower electrodes, A stable solder joint can be obtained by realizing the inter-metal bonding of the solder while obtaining the electrode interval.

Further, by coating a solder on metal particles for a spacer such as nickel (Ni) or copper (Cu), electrical performance is improved, mechanical reliability is increased, and it is applicable to fine pitch or fine pitch.

It is not necessary to add nickel spacer particles or copper spacer to secure a gap size when using an existing solder ball, and therefore, by reducing the content of the entire conductive particles, Reduction is possible.

On the other hand, anisotropic conductive films (ACF) containing a polymer ball in which a metal ball such as Ni, a solder, or the like is used, or nickel (Ni) The problems of reliability of the solder joint and trapping of the conductive balls are generated as described above with reference to Figs. 7 and 8. In order to solve the reliability problem of the solder joint and the problem of trapping the conductive balls, solder is coated on the metal conductive particles such as nickel (Ni) used as a conventional spacer by a method such as plating Method can be used.

3 is a view for explaining conductive particles obtained by plating tin (Sn) on nickel (Ni) particles according to an embodiment.

Referring to FIG. 3, there is shown a photograph of an actual nickel (Ni) particle having a tin (Sn) plated layer formed thereon, in which nickel (Ni) particles are plated with tin (Sn). By using the conductive balls coated with the solder on the spacer Ni particles, it is possible to ensure a certain gap size due to the spacer Ni particles and to provide a high gap, The consumption by tin (Sn) diffusion can be delayed. In addition, physical connection of nickel (Ni) and metal chemical connection of solder are performed at the same time, so that higher performance and reliability can be obtained electrically and mechanically. In addition, when using a conventional solder ball, it is not necessary to use a nickel (Ni) ball which functions as a spacer for the size of a gap, so that the content of the conductive particles can be reduced.

4 is a view showing a solder joint shape of an anisotropic conductive film using solder-coated metal conductive particles according to an embodiment.

4A and 4C show an actual solder joint shape using an anisotropic conductive film (ACF) using conductive particles in which nickel (Ni) particles are plated with tin (Sn). Fig. 4B is a partially enlarged view of Fig. 4D shows a partial enlarged view of FIG. 4C.

As described above, the embodiments are novel anisotropic conductive films using solder-coated metal particles which can not be used as electrical connection materials for next generation electronic devices requiring excellent electrical connection performance, excellent reliability, and fine pitch / fine pitch have.

In addition, the embodiments improve the electrical performance and increase the mechanical reliability by coating the solder on metal particles such as nickel (Ni) used in conventional anisotropic conductive films, and can be applied to fine pitch / fine pitch have.

In addition, the embodiments do not require the use of spacer Ni particles at the same time in order to secure a gap size when using a conventional solder ball, thereby reducing the content of the entire conductive particles, It is possible to reduce the cost of anisotropic conductive film (ACF) material compared to conductive film.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. For example, it is to be understood that the techniques described may be performed in a different order than the described methods, and / or that components of the described systems, structures, devices, circuits, Lt; / RTI > or equivalents, even if it is replaced or replaced.

Therefore, other implementations, other embodiments, and equivalents to the claims are also within the scope of the following claims.

Claims (13)

An anisotropic conductive film (ACF), which is pressed between an upper substrate and a lower substrate,
An adhesive layer disposed between the upper substrate and the lower substrate; And
Conductive particles made of a metal coated on the adhesive layer and electrically connected between the electrodes of the upper substrate and the electrodes of the lower substrate,
/ RTI >
The conductive particles,
The present invention relates to a method of manufacturing an electrode of an upper substrate and a lower electrode of a lower substrate using spacer nickel particles each having a predetermined hardness and formed of conductive particles coated with solder on spacer Ni particles, As the distance between the electrodes is ensured, a predetermined gap between the upper and lower electrodes is ensured, consumption of tin (Sn), which is a main component of the solder, is slowed and solder The solder is formed of a metal coated with a solder so as to have reliability, current carrying property, and low contact resistance, and is formed by electrolytic or electroless plating or vapor coating, A metal chemical connection is made between the electrode of the lower substrate and the electrode of the lower substrate by metal bonding, and the physical and / The connection and the metal chemical connection of the solder are simultaneously performed and the solder is not susceptible to the flatness of the substrate as the solder is melted,
The anisotropic conductive film may have a thickness
Applicable to the upper substrate and the lower substrate which are fine pitch or very fine pitch due to the conductive particles made of the metal coated with the solder
And an anisotropic conductive film. delete delete delete delete delete delete delete An upper substrate on which electrodes are formed;
A lower substrate on which electrodes are formed; And
An anisotropic conductive film (ACF) pressed between the upper substrate and the lower substrate,
/ RTI >
The anisotropic conductive film may have a thickness
An adhesive layer disposed between the upper substrate and the lower substrate; And
Conductive particles made of a metal coated on the adhesive layer and electrically connected between the electrodes of the upper substrate and the electrodes of the lower substrate,
/ RTI >
The conductive particles,
The present invention relates to a method of manufacturing an electrode of an upper substrate and a lower electrode of a lower substrate using spacer nickel particles each having a predetermined hardness and formed of conductive particles coated with solder on spacer Ni particles, As the distance between the electrodes is ensured, a predetermined gap between the upper and lower electrodes is ensured, consumption of tin (Sn), which is a main component of the solder, is slowed and solder The solder is formed of a metal coated with a solder so as to have reliability, current carrying property, and low contact resistance, and is formed by electrolytic or electroless plating or vapor coating, A metal chemical connection is made between the electrode of the lower substrate and the electrode of the lower substrate by metal bonding, and the physical and / The connection and the metal chemical connection of the solder are simultaneously performed and the solder is not susceptible to the flatness of the substrate as the solder is melted,
Wherein the substrate and the lower substrate are made of fine pitch or extremely fine pitch substrates,
The anisotropic conductive film may have a thickness
Applicable to the upper substrate and the lower substrate which are fine pitch or very fine pitch due to the conductive particles made of the metal coated with the solder
≪ / RTI > wherein the anisotropic conductive film comprises an anisotropic conductive film. delete delete delete delete

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