CN109548270A - Wiring board and preparation method thereof - Google Patents
Wiring board and preparation method thereof Download PDFInfo
- Publication number
- CN109548270A CN109548270A CN201811329530.5A CN201811329530A CN109548270A CN 109548270 A CN109548270 A CN 109548270A CN 201811329530 A CN201811329530 A CN 201811329530A CN 109548270 A CN109548270 A CN 109548270A
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- China
- Prior art keywords
- flexible body
- substrate
- line layer
- wiring board
- layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to wiring board and preparation method thereof, include the following steps: to provide flexible body；Electric conductor is set on the flexible body, so that forming line layer on the flexible body；The flexible body is fitted on substrate, wiring board is formed.Pass through above-mentioned method for manufacturing circuit board, the flexible physical efficiency for being provided with line layer is matched with substrate surface fitting, so that the wiring board of planar structure can not only be manufactured by the method for manufacturing circuit board, when changing substrate shape, the wiring board with more multiplicity is made in the shape that substrate can also be matched, and enriches the structure of wiring board.
Description
Technical field
The present invention relates to wiring board technology fields, more particularly to wiring board and preparation method thereof.
Background technique
Current wiring board type includes PCB (Printed Circuit Board, printed wiring board), FPC
(Flexible Printed Circuit board, flexible circuit board) and FPCB (Flexible Printed Circuit
Board, Rigid Flex), although the wiring board type as made from traditional handicraft is more, circuit board structure type obtained
It is less.
Summary of the invention
Based on this, it is necessary to provide a kind of wiring board and preparation method thereof.
A kind of method for manufacturing circuit board, includes the following steps:
Flexible body is provided；
Electric conductor is set on the flexible body, so that forming line layer on the flexible body；
The flexible body is fitted on substrate, wiring board is formed.
By above-mentioned method for manufacturing circuit board, the flexible physical efficiency for being provided with line layer is matched with substrate surface fitting, makes
The wiring board that planar structure can not only be manufactured by the method for manufacturing circuit board is obtained, when changing substrate shape, moreover it is possible to make soft
Property body matching substrate shape be made with more multiplicity wiring board, enrich the structure type of wiring board.
Described in one of the embodiments, that electric conductor is arranged on flexible body, the electric conductor is on the flexible body
The step of forming line layer are as follows:
The electric conductor is printed on the flexible body, so that forming line layer on the flexible body.
The material of the electric conductor includes in graphene, metal powder and conducting liquid glue in one of the embodiments,
It is at least one.
The flexible body is flexible sheets in one of the embodiments,.
The flexible body is film or the scraps of paper in one of the embodiments,.
In one of the embodiments, further include following steps:
Adhesive layer is set on the substrate and/or the flexible body, passes through the substrate and the flexible body described
Adhesive layer bonding.
It is described in one of the embodiments, to fit in the flexible body on substrate, formed wiring board the step of after also
Include the following steps:
Setting layer is set on the substrate and the line layer.
Described in one of the embodiments, that electric conductor is arranged on flexible body, the electric conductor is on the flexible body
Further include following steps after the step of forming line layer:
Insulating layer is set on the substrate and/or line layer, in the insulating layer uplifting window, the position of the windowing with
At least part of line layer alignment.
Described in one of the embodiments, that electric conductor is arranged on flexible body, the electric conductor is on the flexible body
Further include following steps after the step of forming line layer:
The line layer is surface-treated.
A kind of wiring board, including substrate, flexible body and line layer, the line layer is set on the flexible body, described
Flexible body is connect with the substrate.
Detailed description of the invention
Fig. 1 is the flow diagram of the method for manufacturing circuit board of one embodiment；
Fig. 2 is the flow diagram of the method for manufacturing circuit board of another embodiment.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give better embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose of providing these embodiments is that making to understand more the disclosure
Add thorough and comprehensive.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more
Any and all combinations of relevant listed item.
To expand out more diversified circuit board structure, as shown in Figure 1, a kind of wiring board in one of the embodiments,
Production method, comprising:
Step 110, flexible body is provided.
Specifically, the flexible body has flexibility, and the material of the flexible body is flexible material, and the flexible body is by flexible material
It is made.One embodiment is that the flexible body is made of insulating materials,
Step 130, electric conductor is set on the flexible body, so that forming line layer on the flexible body.
Specifically, electric conductor is formed on the flexible body, to make line layer on flexible body.The conduction physical efficiency
For conduction, which is made of conductive material.It should be understood that line layer is either use in the present embodiment
Traditional manufacture craft that is, by the way that copper foil to be pressed on flexible body, then is obtained through overlay film, exposure, development and etching indirectly.?
It can be, electric conductor is printed directly on flexible body by way of printing or silk-screen.
Step 150, the flexible body is fitted on substrate, forms wiring board.
Flexible body has flexibility, can be matched with the adhered shape of substrate.I.e. when substrate is plane, flexible body is entirely pasted
Together in substrate surface, when the substrate has curved-surface structure, flexible body also adapts to the curved-surface structure in substrate, so that flexible
Body is fitted in substrate surface, so that the wiring board with curved-surface structure be made.When the substrate has folding surface structure, flexible body
Also the folding surface structure in substrate is adapted to, so that flexible body is fitted in substrate surface, so that the route with folding surface structure be made
Plate.
By above-mentioned method for manufacturing circuit board, the flexible physical efficiency for being provided with line layer is matched with substrate surface fitting, makes
The wiring board that planar structure can not only be manufactured by the method for manufacturing circuit board is obtained, when changing substrate shape, moreover it is possible to make soft
Property body matching substrate shape the wiring board with more multiplicity is made, it can be made different with unconventional shape
Shape wiring board enriches the structure type of wiring board.
One embodiment is that the wiring board with curved-surface structure, this reality can be made by above-mentioned method for manufacturing circuit board
It applies in example, the wiring board has curved surface, and the flexible body fits on the curved surface of the wiring board, and the flexible body matches
In the curved surface of the wiring board, the wiring board with curved-surface structure is formed.One embodiment is made by above-mentioned wiring board
It is in S font wiring board that cross-sectional shape, which is made, in method, and in the present embodiment, the cross-sectional shape S font of the wiring board is described soft
Property show consideration for together in the one side of the wiring board.One embodiment is that cylinder is made by above-mentioned method for manufacturing circuit board
The wiring board of shape structure, in the present embodiment, described matrix is cylindrical in shape, and the flexible body fits in the outer surface of described matrix.
One embodiment is that the wiring board with folding surface structure, this reality can be made by above-mentioned method for manufacturing circuit board
It applies in example, the wiring board has the first binding face and the second binding face, first binding face and the second binding face phase
It even and inclines towards each other, the flexible body fits on first binding face and second binding face, and the flexible body
Shape assigned in the first binding face and the second binding face forms the wiring board with folding surface structure.
Many wiring board production plants all select to be produced and processed in relatively remote place at present, this is because line
Road plate is mostly or using traditional manufacture craft, and traditional manufacture craft can generate a large amount of harmful sewage and pernicious gas, such as
Fruit is not stringent to the processing procedure control in manufacture craft, also results in the heavy metals exceeding standard in harmful sewage and pernicious gas, causes
Heavy metal pollution is easy to cause serious destruction to surrounding enviroment.It is described in one of the embodiments, to be arranged on flexible body
Electric conductor, the electric conductor is the step of forming line layer on the flexible body are as follows: the conduction is printed on the flexible body
Body, so that forming line layer on the flexible body.In the present embodiment, by printing or printing technology, electric conductor is arranged
On flexible body, one embodiment is the electric conductor to be printed on the flexible body by numerical control printer, so that described
Line layer is formed on flexible body.Specifically, electric conductor will be formed on conductive material printing paper flexible body by numerical control printer, it should
Electric conductor is line layer on flexible body.
It is described that the electric conductor is printed on the flexible body in above-described embodiment, so that being formed on the flexible body
The step of line layer, hereinafter referred to as prints processing procedure, and printing processing procedure has following technology compared to traditional method for manufacturing circuit board
Effect, printing processing procedure will not generate pernicious gas and trade effluent.The case where printing processing procedure will not generate heavy metal pollution.Printing
The simple production process of processing procedure, production material and step are all conveniently adjusted, and have very strong flexibility.Used by printing processing procedure
Equipment is less.It is high to the utilization rate of material to print processing procedure.Printing processing procedure is with short production cycle, and production efficiency is higher.It is made by printing
The wiring board of journey production has higher precision, can accurately process the route with 0.05mm or more line width, and can accurately process
Route with 0.1mm or more line-spacing.
The present invention has higher production efficiency compared to traditional circuit board manufacturing method, can effectively shorten the production cycle
Drop reduces production equipment cost and cost of labor, and production procedure is short in production technology, facilitates suitable in each procedure for producing of adjustment
Sequence and material, flexibility are high；Equipment applicability is high, so the maintenance of equipment is simple, it is final to realize green production and environmental protection production
Purpose, reduce pollution, wiring board plasticity is strong, have very high applicability.
The electric conductor is printed on the flexible body by numerical control printer to realize, so that shape on the flexible body
The step of at line layer, is realized in one of the embodiments, using including such as under type: firstly, being gone out by computer drawing
The line map of line layer.Typesetting is carried out to the line map by computer, obtains domain.Numerical control is sent by the domain to beat
On print machine.Electric conductor is printed upon on flexible body by numerical control printer according to domain.It is noted that the size of flexible body according to
Line layer size actually required or the size of domain are determined and select.The numerical control in one of the embodiments,
Printer is metallic print machine.
To realize, electric conductor is set on flexible body, the electric conductor the step of forming line layer on the flexible body,
Described in one of the embodiments, that electric conductor is arranged on flexible body, the electric conductor forms route on the flexible body
The step of layer are as follows: the electric conductor described in silk-screen on the flexible body, so that forming line layer on the flexible body.It should be understood that
, electric conductor printed to flexible body by silk-screen printing, is able to achieve and sets on the flexible body by silk-screen, that is, silk-screen printing
Electric conductor is set, so that forming line layer on the flexible body.The electric conductor described in silk-screen on the flexible body, so that
The step of line layer is formed on the flexible body hereinafter referred to as silk-screen processing procedure, silk-screen processing procedure is compared to traditional wiring board production side
Method has the following technical effect that printing processing procedure will not generate pernicious gas and trade effluent.Printing processing procedure will not generate heavy metal
The case where pollution.The simple production process of processing procedure is printed, production material and step are all conveniently adjusted, and have very strong flexibility.
It is less to print equipment used by processing procedure.It is high to the utilization rate of material to print processing procedure.It is with short production cycle to print processing procedure, production efficiency
It is higher.
The substrate is played a supporting role, and the material of the substrate includes metal, this implementation in one of the embodiments,
In example, the metal includes solid-state at normal temperature.The material of the substrate includes alloy in one of the embodiments,.At it
In middle one embodiment, the material of the substrate includes paper.The material of the substrate includes carbon fiber in one of the embodiments,
Dimension.The material of the substrate includes glass dimension in one of the embodiments,.
The substrate is played a supporting role, and the material of the substrate is metal, the present embodiment in one of the embodiments,
In, the metal is solid-state at normal temperature.The material of the substrate is alloy in one of the embodiments,.One wherein
In embodiment, the material of the substrate is paper.The material of the substrate is carbon fiber in one of the embodiments,.Wherein
In one embodiment, the material of the substrate is glass dimension.
For realize electric conductor conducting function, in one of the embodiments, the material of the electric conductor include graphene,
At least one of metal powder and conducting liquid glue.The material of the electric conductor is graphene in one of the embodiments,.?
In one embodiment, the material of the electric conductor is metal powder.The material of the electric conductor in one of the embodiments,
For conducting liquid glue.In one embodiment, it is additionally favorable for electric conductor printing on flexible body using the electric conductor of above-described embodiment
On, because the electron opaque material content that the electric conductor in above-described embodiment is included is low, so that the electric conductor of above-described embodiment has
There is better electric conductivity, be susceptible to the absorption of flexible body, and is conducive to be arranged after forming line layer with good electric conductivity.
In one embodiment, by graphene printing or silk-screen on flexible body, so that being formed on the flexible body
Line layer.In one embodiment, by metal powder printing or silk-screen on flexible body, so that forming line on the flexible body
Road floor.In one embodiment, conducting liquid glue is printed or silk-screen is on flexible body, so that being formed on the flexible body
Line layer.
More flexible when for flexible body is arranged, the flexible body is flexible sheets, i.e. institute in one of the embodiments,
Flexible body is stated in the form of sheets, in this way, flexible body fits on substrate, so that the shape for being preferably matched with substrate surface of flexible body
Shape so that the setting of flexible body is more flexible, while being also beneficial to reduce the volume of wiring board.
For realize the flexible body have flexibility, in one of the embodiments, the flexible body be film or the scraps of paper,
There is flexibility in flexible body to realize, and convenient for the electric conductor is arranged, moreover it is possible to convenient for leading described in the printing on the flexible body
Electric body.The flexible body is film in one of the embodiments,；In the present embodiment, the flexible body is printing film.At it
In middle one embodiment, the flexible body is the scraps of paper；In the present embodiment, the flexible body is the high temperature resistant scraps of paper.One wherein
In embodiment, the flexible body is the insulation scraps of paper.The flexible body is mica paper in one of the embodiments,.Wherein one
In a embodiment, the flexible body is highland barley paper.It is noted that the type of flexible body can according to actual needs depending on,
If line layer is only used for circulation light current, common plant fiber paper can also meet demand.If line layer is used for the big electric current that circulates,
Then need flexible body that there is heat resistance and insulating properties.That is, theoretically flexible body only needs to meet with flexible and tool
There is electric conductor adsorptivity, production requirement can be met.
To fit in the flexible body on the substrate, the wiring board production side in one of the embodiments,
Method further includes following steps: adhesive layer is arranged on the substrate and/or the flexible body, makes the substrate and the flexible body
It is bonded by the adhesive layer.As shown in Fig. 2, further including in one of the embodiments, following steps after step 130: step
Rapid 140, adhesive layer is set on the substrate, is bonded the substrate and the flexible body by the adhesive layer.So that institute
It states flexible body to be adhered on the substrate, to realize that the flexible body fits in the substrate surface.In one embodiment,
Adhesive layer is set on the flexible body, is bonded the substrate and the flexible body by the adhesive layer.It is one of real
It applies in example, adhesive layer is set on the substrate and flexible body, keep the substrate and the flexible body viscous by the adhesive layer
It connects, i.e., adhesive layer is respectively set on the substrate and flexible body, the substrate and the flexible body is made to pass through the adhesive layer
It is bonded, the adhesive layer bonding corresponding with the adhesive layer on the flexible body in the present embodiment, on the substrate.
The adhesive layer is easy adhesive-layer or heat-conducting glue layer in one of the embodiments,.In one of the embodiments,
The adhesive layer is easy adhesive-layer, and in the present embodiment, easy viscose glue is arranged on the substrate and/or the flexible body, is formed
The adhesive layer.The adhesive layer is heat-conducting glue layer in one of the embodiments, and in the present embodiment, heat-conducting glue setting is existed
On the substrate and/or the flexible body, the adhesive layer is formed.It should be understood that the easy viscose glue or heat-conducting glue can be with
It is to be sprayed on the substrate and/or flexible body, is also possible to brush on the substrate and/or flexible body.One embodiment
In, easy viscose glue is sprayed on the substrate, in one embodiment, easy viscose glue is sprayed on the flexible body.
It is noted that whether traditional printed wiring board need to consider can be effective between each prepreg (prepreg)
In conjunction with and copper foil and prepreg between whether can effectively combine, so the selection to material is more stringent.Flexible body is led to
The mode that adhesive layer fits in substrate is crossed, the material diversification of circuit board substrate is able to achieve, while circuit board substrate may be implemented
Structure diversification, i.e., can both replace the material of substrate at any time according to actual needs, base can also be replaced according to actual needs
The shape of plate, thus it is few to the limiting factor of wiring board production, and flexibility is high.
To keep associativity between the substrate and the line layer more preferable, it is described in one of the embodiments, will be described
It further include following steps after the step of flexible body fits on substrate, forms wiring board: on the substrate and the line layer
Setting layer is set.As shown in Fig. 2, further including in one of the embodiments, following steps after step 150: step 160,
Setting layer is set on the substrate and the line layer.That is, on the surface of the substrate and the surface of the line layer
Upper setting setting layer.Setting agent is applied on the substrate and the line layer in one of the embodiments, specifically,
Setting agent is applied to the junction of the substrate and the line layer, the setting agent the substrate and the line layer it
Between form the setting layer, play so that the more firm effect of line layer, enables and combining between the substrate and the line layer
Property is more preferable.The setting agent includes at least one of ink, paint and reinforcement glue in one of the embodiments,.Wherein
In one embodiment, the setting agent is ink.The setting agent is paint in one of the embodiments,.One wherein
In embodiment, the setting agent is to reinforce glue.In one embodiment, the material of the setting layer is three-proofing coating.In a reality
It applies in example, the material of the setting layer is epoxy resin coating.It should be understood that the material of setting layer can come according to actual needs
It selects, the principle of selection is that setting layer need to not have corrosivity, that is, avoids setting layer etching lines layer and substrate；And setting layer
Material need to have insulating properties, avoid short-circuit between the route of line layer.
Some wiring boards need to carry out insulation processing, described in one of the embodiments, that conduction is arranged on flexible body
Body, the electric conductor further include following steps after the step of forming line layer on the flexible body: in the substrate and/or line
Insulating layer is set on the floor of road, in the insulating layer uplifting window, the position of the windowing is aligned at least part of line layer.
Insulating layer is set on the substrate in one of the embodiments, in the insulating layer uplifting window, the position of the windowing with
At least part of line layer alignment, the insulating layer is used for protective substrate as a result, avoids destroying substrate, this implementation when welding
In example, by the way that solder resist to be printed in the surface of the substrate, the insulating layer is formed.In one of the embodiments, in institute
It states and insulating layer is set on line layer, in the insulating layer uplifting window, the position of the windowing and at least part of line layer
Alignment, the insulating layer is used for the route of wrapping portion line layer as a result, and protection circuit layer does not need the place welded, this
In embodiment, by the way that solder resist to be printed in the surface of the line layer, the insulating layer is formed.One embodiment wherein
In, insulating layer is set on the substrate and line layer, in the insulating layer uplifting window, the position of the windowing at least partly
Line layer alignment, in the present embodiment, by the way that solder resist to be printed in the surface of the substrate and the table of the line layer
Face forms the insulating layer.As shown in Fig. 2, further including in one of the embodiments, following steps after step 160: step
170, insulating layer is set on the substrate and line layer, in the insulating layer uplifting window, the position of the windowing and at least portion
The line layer alignment divided.The insulating layer is used to wrap up the route of substrate and part line layer as a result, that is, protects substrate,
Avoid the high temperature damaged substrate of welding, the place for also protecting line layer not need to be welded.In above-described embodiment, insulating layer
It can be used for preventing from generating parasitic capacitance between route.
In above-described embodiment, the line layer at the windowing of the insulating layer is pad.The pad is for welding electricity
Subcomponent.
For protection circuit layer, described in one of the embodiments, that electric conductor is arranged on flexible body, the electric conductor exists
Further include following steps after the step of forming line layer on the flexible body: the line layer is surface-treated.Such as Fig. 2 institute
Show, further include in one of the embodiments, following steps after step 170: step 180, surface being carried out to the line layer
Processing.It, can protection circuit layer after being surface-treated to line layer.The line layer is carried out in one of the embodiments,
Spray tin surfaces processing.Wicking surface treatment is carried out to the line layer in one of the embodiments,.One embodiment wherein
In, leaching golden watch surface treatment is carried out to the line layer, in the present embodiment, covers layer gold in route layer surface, layer gold more scratch resistance,
The protection circuit layer before line layer welding avoids short-circuit conditions of breaking, and has between tin cream when layer gold and welding good
Good adhesive force, promotes the stability of welding.Leaching silver surface processing is carried out to the line layer in one of the embodiments,.
Gold-plated surface processing is carried out to the line layer in one of the embodiments,.In one of the embodiments, to the route
Layer carries out leaching golden watch surface treatment, then carries out gold-plated surface processing, and the attainable layer gold thickness of leaching gold is not high, some special circumstances,
Layer gold after leaching gold need to be thickeied, i.e., be handled by gold-plated surface, so that layer gold is thicker, acquirement preferably protection circuit
Effect and the effect for promoting welding stability.In the various embodiments described above, using wicking, spray tin, leaching gold, the surfaces such as silver-colored, gold-plated are soaked
Processing mode is surface-treated line layer, moreover it is possible to so that line layer has better ductility, line layer be avoided to be bonded
It is breaking in the process.Organic guarantor is carried out to the line layer in one of the embodiments, and welds film surface processing.
The method for manufacturing circuit board further includes following steps in one of the embodiments: being printed on the substrate
Character, in the present embodiment, the step of the printed character on the substrate in, either printing word on the substrate
Symbol, is also possible to silk-screen character on the substrate, is also possible to printing and silk-screen combines.Institute in one of the embodiments,
The step of stating printed character on the substrate are as follows: printable character on the substrate.In one of the embodiments, it is described
On the substrate the step of printed character are as follows: silk-screen character on the substrate.
The method for manufacturing circuit board further includes following steps in one of the embodiments: being printed on the flexible body
Character processed, in the present embodiment, it is described the printed character on the flexible body the step of in, either being beaten on the flexible body
Lettering symbol, is also possible to the silk-screen character on the flexible body, is also possible to printing and silk-screen combines.One embodiment wherein
In, it is described the printed character on the flexible body the step of are as follows: the printable character on the flexible body.One embodiment wherein
In, it is described the printed character on the flexible body the step of are as follows: the silk-screen character on the flexible body.
It is described in one of the embodiments, that insulating layer is set on the substrate and/or line layer, in the insulating layer
It further include following steps after the step of uplifting window, the position of the windowing is aligned at least part of line layer: in institute
State printed character on insulating layer.In the present embodiment, it is described the printed character on the insulating layer the step of in, either in institute
Printable character on insulating layer is stated, the silk-screen character on the insulating layer is also possible to, is also possible to printing and silk-screen combines.Such as figure
Shown in 2, further includes in one of the embodiments, following steps after step 180: step 190, being printed on the insulating layer
Character.It is described the printed character on the insulating layer the step of in one of the embodiments, are as follows: to be printed on the insulating layer
Character.It is described the printed character on the insulating layer the step of in one of the embodiments, are as follows: the silk-screen on the insulating layer
Character.
It is described in one of the embodiments, to fit in the flexible body on substrate for the quality to guarantee wiring board,
Further include following steps after the step of forming wiring board: finished product detection is carried out to wiring board.As shown in Fig. 2, one wherein
Further include following steps after step 190 in embodiment: step 200, finished product detection being carried out to wiring board.
It is described in one of the embodiments, that wiring board progress finished product detection is included the following steps: to carry out wiring board
Size detection.In the present embodiment, size detection include the size of the outer edge of wiring board, the size of line width, the size of line-spacing and
The size etc. of pad, and the wiring board of existing defects is rejected, guarantee the quality of wiring board.
It is described in one of the embodiments, that wiring board progress finished product detection is included the following steps: to carry out wiring board
Electrical detection.Whether electrical functionality of the electrical testing for measurement circuit plate be normal, if there are short open defects etc., and reject
The wiring board of existing defects guarantees the quality of wiring board.
It is described in one of the embodiments, that wiring board progress finished product detection is included the following steps: to carry out wiring board
Visual detection.Visual detection is used to detect the appearance of wiring board with the presence or absence of defect, and rejects the wiring board of existing defects, guarantees
The quality of wiring board.
In the present embodiment, a kind of wiring board, including substrate, flexible body and line layer are provided, the line layer is set to institute
It states on flexible body, the flexible body is connect with the substrate.In the present embodiment, the flexible body fits in the table of the substrate
Face.
The substrate has curved surface in one of the embodiments, and the flexible body fits on the curved surface of the substrate.
To obtain the wiring board with curved-surface structure.
The substrate has folding face in one of the embodiments, and the flexible body fits in the folding face of the substrate.
To obtain the wiring board with folding surface structure.
Above-mentioned wiring board, is fitted in by flexible body and forms wiring board on substrate, described compared to traditional wiring board
Wiring board can be produced as the structure that wiring board is enriched with curved surface or folding face.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of method for manufacturing circuit board, which comprises the steps of:
Flexible body is provided；
Electric conductor is set on the flexible body, so that forming line layer on the flexible body；
The flexible body is fitted on substrate, wiring board is formed.
2. method for manufacturing circuit board according to claim 1, which is characterized in that it is described that electric conductor is set on flexible body,
The electric conductor is the step of forming line layer on the flexible body are as follows:
The electric conductor is printed on the flexible body, so that forming line layer on the flexible body.
3. method for manufacturing circuit board according to claim 1, which is characterized in that the material of the electric conductor includes graphite
At least one of alkene, metal powder and conducting liquid glue.
4. method for manufacturing circuit board according to claim 1, which is characterized in that the flexible body is flexible sheets.
5. method for manufacturing circuit board according to claim 4, which is characterized in that the flexible body is film or the scraps of paper.
6. method for manufacturing circuit board described in -5 according to claim 1, which is characterized in that further include following steps:
Adhesive layer is set on the substrate and/or the flexible body, the substrate and the flexible body is made to pass through the bonding
Layer bonding.
7. method for manufacturing circuit board described in -5 any one according to claim 1, which is characterized in that described by the flexible body
Further include following steps after the step of fitting on substrate, forming wiring board:
Setting layer is set on the substrate and the line layer.
8. method for manufacturing circuit board described in -5 any one according to claim 1, which is characterized in that described to be set on flexible body
Electric conductor is set, the electric conductor further includes following steps after the step of forming line layer on the flexible body:
Insulating layer is set on the substrate and/or line layer, in the insulating layer uplifting window, the position of the windowing at least
Partial line layer alignment.
9. method for manufacturing circuit board described in -5 any one according to claim 1, which is characterized in that described to be set on flexible body
Electric conductor is set, the electric conductor further includes following steps after the step of forming line layer on the flexible body:
The line layer is surface-treated.
10. a kind of wiring board, which is characterized in that including substrate, flexible body and line layer, the line layer is set to the flexibility
On body, the flexible body is connect with the substrate.
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Application publication date: 20190329 |