CN110213898A - A kind of production method for the flexible circuit board that can remove substrate shape burr - Google Patents
A kind of production method for the flexible circuit board that can remove substrate shape burr Download PDFInfo
- Publication number
- CN110213898A CN110213898A CN201910557918.9A CN201910557918A CN110213898A CN 110213898 A CN110213898 A CN 110213898A CN 201910557918 A CN201910557918 A CN 201910557918A CN 110213898 A CN110213898 A CN 110213898A
- Authority
- CN
- China
- Prior art keywords
- substrate
- cover film
- route
- opening
- stiffening plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a kind of production methods of flexible circuit board that can remove substrate shape burr comprising the steps of: substrate blanking；Substrate drilling；The electric plated with copper in through-hole；It does route respectively in the upper and lower surfaces of substrate as required, and is electrically connected the route of upper surface by the copper in through-hole with the route of lower surface；Cover film blanking；Cover film windowing；CVL: ready-made cover film CVL is attached to the upper and lower surfaces of substrate, then parameter is pressed with fast press as required；Temperature and time as required carries out baking-curing with oven again；Temperature 150-160 degree, time 50-60 minute；Location hole is got with puncher；Change gold: being surface-treated as required in the copper face for exposing opening, is got rusty with prevention；Welding resistance: need to form the corresponding region stencil at severing on cover film；Stiffening plate blanking；It is radium-shine；FR4 reinforcement；Flying probe；CNC molding；The edge substrate FPC of the present invention when being avoided that molding generates burr.
Description
Technical field
The present invention relates to a kind of improvement of the production method of flexible circuit board, substrate FPC when one kind is avoided that molding is refered in particular to
The production method that edge generates the flexible circuit board that can remove substrate shape burr of burr.
Background technique
In the prior art, in the production method of flexible circuit board in last molding, hair often is generated at the edge substrate FPC
Thorn, influences the good appearance of flexible circuit board.
For this purpose, we have developed that a kind of edge substrate FPC when being avoided that molding generates burr can remove substrate shape hair
The production method of the flexible circuit board of thorn.
Summary of the invention
For the above technical problems, the purpose of the present invention is: propose the side substrate FPC when one kind is avoided that molding
The production method that edge generates the flexible circuit board that can remove substrate shape burr of burr.
The technical solution of the invention is as follows is achieved: a kind of production for the flexible circuit board that can remove substrate shape burr
Method comprising the steps of:
Substrate blanking: opening correspondingly-sized using cutting machine as required, forms substrate；
Substrate drilling: the holes drilled through on substrate；
Plating: by plated with copper electric in above-mentioned through-hole；
Route production: it does route respectively in the upper and lower surfaces of substrate as required, and makes the route and following table of upper surface
The route in face passes through the copper electrical connection in through-hole；
Cover film blanking: opening correspondingly-sized using cutting machine as required, forms cover film；The size one of the cover film and substrate
Sample；
Cover film windowing: opening is done on cover film, the end of each fine copper route of substrate respectively corresponds a cover film
On opening；
CVL: ready-made cover film CVL is attached to the upper and lower surfaces of substrate, while the end of each route is right respectively
The opening on a cover film is answered, then parameter is pressed with fast press as required；Temperature and time as required is used again
Oven carries out baking-curing；Temperature 150-160 degree, time 50-60 minute；
Punching: location hole is got with puncher；
Change gold: being surface-treated as required in the copper face for exposing opening, is got rusty with prevention；
Welding resistance: need to form the corresponding region stencil at severing on cover film；
Stiffening plate blanking: opening correspondingly-sized using cutting machine as required, forms stiffening plate；The size one of the stiffening plate and substrate
Sample；The stiffening plate FR4 is made of epoxide resin material；
It is radium-shine: opening to be done on stiffening plate, the end of each fine copper route of substrate respectively corresponds opening on a stiffening plate
Fenestra；
FR4 reinforcement: FR4 stiffening plate reinforcement is attached on substrate, while the end of corresponding line respectively corresponds on a stiffening plate
Opening；
Flying needle: flying probe is carried out as required；
CNC molding: CNC molding is carried out as required.
Preferably, the ink selects PSR9000-501OR.
Due to the application of the above technical scheme, compared with the prior art, the invention has the following advantages:
The production method of the flexible circuit board that can remove substrate shape burr of the present invention on cover film by needing
Form the corresponding region stencil at severing, to enhance the intensity of corresponding region on cover film, base when being avoided that molding
The edge material FPC generates burr.
Detailed description of the invention
Technical scheme of the present invention is further explained with reference to the accompanying drawing:
Attached drawing 1 is the process flow chart of the production method of flexible circuit board of the present invention；
Attached drawing 2 is the schematic diagram for the flexible circuit board that the production method of flexible circuit board of the present invention produces；
Wherein: 1, substrate；2, cover film；3, stiffening plate.
Specific embodiment
The preferred embodiments of the present invention will be described in detail with reference to the accompanying drawing, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, so as to make a clearer definition of the protection scope of the present invention.
Attached drawing 1-2 be the flexible circuit board of the present invention that can remove substrate shape burr production method, comprising with
Lower step:
Substrate blanking: opening correspondingly-sized using cutting machine as required, forms substrate 1；
Substrate drilling: the holes drilled through (not shown) on substrate 1；
Plating: by plated with copper electric in above-mentioned through-hole；
Route production: doing route respectively in the upper and lower surfaces of substrate 1 as required, and makes the route of upper surface under
The route on surface passes through the copper electrical connection in through-hole；
Cover film blanking: opening correspondingly-sized using cutting machine as required, forms cover film 2；The ruler of the cover film 2 and substrate 1
It is very little the same；
Cover film windowing: opening (not shown) is done on cover film 2, the end of each fine copper route of substrate 1 respectively corresponds
Opening on one cover film 2；
CVL: ready-made cover film CVL is attached to the upper and lower surfaces of substrate 1, while the end of each route is right respectively
The opening on a cover film is answered, then parameter is pressed with fast press as required；Temperature and time as required is used again
Oven carries out baking-curing；160 degree of temperature, the time 60 minutes；
Punching: location hole is got with puncher；
Change gold: being surface-treated as required in the copper face for exposing opening, is got rusty with prevention；
Welding resistance: needing to form on cover film 2 the corresponding region stencil at severing, and ink selects PSR9000-501OR;
Stiffening plate blanking: opening correspondingly-sized using cutting machine as required, forms stiffening plate 3；The ruler of the stiffening plate 3 and substrate 1
It is very little the same；The stiffening plate FR4 is made of epoxide resin material；
It is radium-shine: opening (not shown) to be done on stiffening plate 3, the end of each fine copper route of substrate 1 respectively corresponds a benefit
Opening on strong plate 3；
FR4 reinforcement: FR4 stiffening plate reinforcement is attached on substrate 1, while the end of corresponding line respectively corresponds on a stiffening plate
Opening；
Flying needle: flying probe is carried out as required；
CNC molding: CNC molding is carried out as required.
Due to the application of the above technical scheme, compared with the prior art, the invention has the following advantages:
The production method of the flexible circuit board that can remove substrate shape burr of the present invention on cover film by needing
Form the corresponding region stencil at severing, to enhance the intensity of corresponding region on cover film, base when being avoided that molding
The edge material FPC generates burr.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar can understand the contents of the present invention and be implemented, and it is not intended to limit the scope of the present invention, it is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the scope of protection of the present invention.
Claims (2)
1. a kind of production method for the flexible circuit board that can remove substrate shape burr comprising the steps of:
Substrate blanking: opening correspondingly-sized using cutting machine as required, forms substrate；
Substrate drilling: the holes drilled through on substrate；
Plating: by plated with copper electric in above-mentioned through-hole；
Route production: it does route respectively in the upper and lower surfaces of substrate as required, and makes the route and following table of upper surface
The route in face passes through the copper electrical connection in through-hole；
Cover film blanking: opening correspondingly-sized using cutting machine as required, forms cover film；The size one of the cover film and substrate
Sample；
Cover film windowing: opening is done on cover film, the end of each fine copper route of substrate respectively corresponds a cover film
On opening；
CVL: ready-made cover film CVL is attached to the upper and lower surfaces of substrate, while the end of each route is right respectively
The opening on a cover film is answered, then parameter is pressed with fast press as required；Temperature and time as required is used again
Oven carries out baking-curing；Temperature 150-160 degree, time 50-60 minute；
Punching: location hole is got with puncher；
Change gold: being surface-treated as required in the copper face for exposing opening, is got rusty with prevention；
Welding resistance: need to form the corresponding region stencil at severing on cover film；
Stiffening plate blanking: opening correspondingly-sized using cutting machine as required, forms stiffening plate；The size one of the stiffening plate and substrate
Sample；The stiffening plate FR4 is made of epoxide resin material；
It is radium-shine: opening to be done on stiffening plate, the end of each fine copper route of substrate respectively corresponds opening on a stiffening plate
Fenestra；
FR4 reinforcement: FR4 stiffening plate reinforcement is attached on substrate, while the end of corresponding line respectively corresponds on a stiffening plate
Opening；
Flying needle: flying probe is carried out as required；
CNC molding: CNC molding is carried out as required.
2. the production method of the preferred flexible circuit board that can remove substrate shape burr according to claim 1, special
Sign is: the ink selects PSR9000-501OR.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910557918.9A CN110213898A (en) | 2019-06-26 | 2019-06-26 | A kind of production method for the flexible circuit board that can remove substrate shape burr |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910557918.9A CN110213898A (en) | 2019-06-26 | 2019-06-26 | A kind of production method for the flexible circuit board that can remove substrate shape burr |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110213898A true CN110213898A (en) | 2019-09-06 |
Family
ID=67794468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910557918.9A Pending CN110213898A (en) | 2019-06-26 | 2019-06-26 | A kind of production method for the flexible circuit board that can remove substrate shape burr |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110213898A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110572952A (en) * | 2019-09-09 | 2019-12-13 | 萍乡市丰达兴线路板制造有限公司 | Film covering method of ultrathin 5G copper-clad plate and preparation method of copper-clad plate |
| CN111885827A (en) * | 2020-06-05 | 2020-11-03 | 江西一诺新材料有限公司 | Filling method of FPC board conductor circuit |
| CN112469203A (en) * | 2020-11-27 | 2021-03-09 | 东莞市科佳电路有限公司 | Method for improving burrs of gong CVL product |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595795A (en) * | 2012-03-05 | 2012-07-18 | 同扬光电（江苏）有限公司 | Method for making double-sided flexible printed circuit board by using pure copper plate as base material |
| CN103582317A (en) * | 2013-10-16 | 2014-02-12 | 镇江华印电路板有限公司 | Method for manufacturing tin leaking semicircular holes in flexible printed wiring board |
| CN105323339A (en) * | 2015-09-22 | 2016-02-10 | 广东欧珀移动通信有限公司 | Flexible printed circuit board and mobile terminal |
| CN108135094A (en) * | 2018-01-30 | 2018-06-08 | 深圳冠锋航天科技有限公司 | A kind of method for making the not imperial high-frequency circuit board of solder mask iron and removing edges of boards burr |
-
2019
- 2019-06-26 CN CN201910557918.9A patent/CN110213898A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595795A (en) * | 2012-03-05 | 2012-07-18 | 同扬光电（江苏）有限公司 | Method for making double-sided flexible printed circuit board by using pure copper plate as base material |
| CN103582317A (en) * | 2013-10-16 | 2014-02-12 | 镇江华印电路板有限公司 | Method for manufacturing tin leaking semicircular holes in flexible printed wiring board |
| CN105323339A (en) * | 2015-09-22 | 2016-02-10 | 广东欧珀移动通信有限公司 | Flexible printed circuit board and mobile terminal |
| CN108135094A (en) * | 2018-01-30 | 2018-06-08 | 深圳冠锋航天科技有限公司 | A kind of method for making the not imperial high-frequency circuit board of solder mask iron and removing edges of boards burr |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110572952A (en) * | 2019-09-09 | 2019-12-13 | 萍乡市丰达兴线路板制造有限公司 | Film covering method of ultrathin 5G copper-clad plate and preparation method of copper-clad plate |
| CN111885827A (en) * | 2020-06-05 | 2020-11-03 | 江西一诺新材料有限公司 | Filling method of FPC board conductor circuit |
| CN111885827B (en) * | 2020-06-05 | 2022-03-22 | 江西一诺新材料有限公司 | Filling method of FPC board conductor circuit |
| CN112469203A (en) * | 2020-11-27 | 2021-03-09 | 东莞市科佳电路有限公司 | Method for improving burrs of gong CVL product |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190906 |
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| RJ01 | Rejection of invention patent application after publication |