CN102595795A - Method for making double-sided flexible printed circuit board by using pure copper plate as base material - Google Patents
Method for making double-sided flexible printed circuit board by using pure copper plate as base material Download PDFInfo
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- CN102595795A CN102595795A CN2012100541874A CN201210054187A CN102595795A CN 102595795 A CN102595795 A CN 102595795A CN 2012100541874 A CN2012100541874 A CN 2012100541874A CN 201210054187 A CN201210054187 A CN 201210054187A CN 102595795 A CN102595795 A CN 102595795A
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- coverlay
- circuit
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- etching
- substrate
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- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a method for making a double-sided flexible printed circuit board by using a pure copper plate as a base material and relates to a production process of the flexible printed circuit board. The method comprises the process steps of cutting, drilling, pressing of a cover film, filling of circuit ink, circuit etching, pressing of a cover film, screen printing, surface processing, reinforcing and the like. According to the invention, the acid-resistance circuit ink or liquid photoimagable resist ink is filled at finger hollow-out positions of an open region of the cover films, the height difference of the hollow-out positions is reduced and the subsequent processing is convenient to carry out, and thus, the method has simple and reasonable process, the qualified rate of the formed product can be effectively improved and the method is also beneficial for reducing the production cost.
Description
Technical field
The present invention relates to a kind of production technology of flexible print circuit board, relate in particular to a kind of fine copper board production technology technical field.
Background technology
Flexible print circuit board is widely used in mobile phone, notebook, consumption electronic products, contact panel etc. because of it has advantages such as pliability, in light weight, thin thickness.The double-sided flexible printed circuit board of no cross link uses two-sided copper foil base material to make, and material cost is higher, and needs through the double-side conduction processing procedure, and technological process is complicated.
Summary of the invention
For overcoming above-mentioned deficiency, the object of the present invention is to provide a kind of production technology of using fine copper plate substrate and the simple two-sided finger flexible print circuit board of technology.
The present invention includes following steps:
1) cuts, holes: substrate after cutting, is got out location hole and mechanical hole;
2) compacting coverlay: the coverlay in that the one side of substrate is fitted and windowed, carry out the high temperature pressing then;
3) circuit printing ink:, press one deck light-sensitive surface in surface of semi-finished then with coverlay and ink lay in above-mentioned windowed regions wire mark acid-resisting circuit printing ink; Or direct semi-finished product dip-coating liquid photosensitive etching resisting ink behind the compacting coverlay;
4) circuit etching: make public being fitted on light-sensitive surface or the photosensitive-ink after the required line pattern film contraposition, film sensitization polymerization position forms anti-etching circuit, and the etching of logicalnot circuit position is removed, and exposes required circuit behind the stripping;
5) compacting coverlay: in the coverlay that the other one side of substrate is fitted and windowed, high temperature pressing then;
6) wire mark: according to required figure or the literal of design wire mark;
7) surface treatment: all the coverlay places of windowing to substrate carry out the nickel gold, tin surfaces is handled;
8) reinforcing:, carry out the high temperature pressing then at plugging position reinforcing plate.
Because filling out in coverlay windowed regions finger hollow out position, the present invention attaches acid-resisting circuit printing ink or liquid photosensitive-ink; Reduced hollow out position difference of height; Make things convenient for following process, so technology of the present invention is simple, reasonable; The product percent of pass that forms can effectively improve, and also is beneficial to reduce production costs.
Embodiment
Production stage:
One, embodiment 1:
1) cuts, holes: substrate after cutting, is got out location hole and mechanical hole;
2) compacting coverlay: the coverlay in that the one side of substrate is fitted and windowed, carry out the high temperature pressing then;
3) circuit printing ink:, press one deck light-sensitive surface in surface of semi-finished then with coverlay and ink lay in above-mentioned windowed regions wire mark acid-resisting circuit printing ink;
4) circuit etching: make public being fitted on light-sensitive surface or the photosensitive-ink after the required line pattern film contraposition, film sensitization polymerization position forms anti-etching circuit, and the etching of logicalnot circuit position is removed, and exposes required circuit behind the stripping;
5) compacting coverlay: in the coverlay that the other one side of substrate is fitted and windowed, high temperature pressing then;
6) wire mark: according to required figure or the literal of design wire mark;
7) surface treatment: all the coverlay places of windowing to substrate carry out the nickel gold, tin surfaces is handled;
8) reinforcing:, carry out the high temperature pressing then at plugging position reinforcing plate.
Two, embodiment 2:
1) cuts, holes: substrate after cutting, is got out location hole and mechanical hole;
2) compacting coverlay: the coverlay in that the one side of substrate is fitted and windowed, carry out the high temperature pressing then;
3) circuit printing ink: direct semi-finished product dip-coating liquid photosensitive etching resisting ink behind the compacting coverlay;
4) circuit etching: make public being fitted on light-sensitive surface or the photosensitive-ink after the required line pattern film contraposition, film sensitization polymerization position forms anti-etching circuit, and the etching of logicalnot circuit position is removed, and exposes required circuit behind the stripping;
5) compacting coverlay: in the coverlay that the other one side of substrate is fitted and windowed, high temperature pressing then;
6) wire mark: according to required figure or the literal of design wire mark;
7) surface treatment: all the coverlay places of windowing to substrate carry out the nickel gold, tin surfaces is handled;
8) reinforcing:, carry out the high temperature pressing then at plugging position reinforcing plate.
Claims (1)
1. one kind is the flexible print circuit board that base material is made with the fine copper plate, comprises that layer of copper is characterized in that may further comprise the steps:
1) cuts, holes: substrate after cutting, is got out location hole and mechanical hole;
2) compacting coverlay: the coverlay in that the one side of substrate is fitted and windowed, carry out the high temperature pressing then;
3) circuit printing ink:, press one deck light-sensitive surface in surface of semi-finished then with coverlay and ink lay in above-mentioned windowed regions wire mark acid-resisting circuit printing ink; Or direct semi-finished product dip-coating liquid photosensitive etching resisting ink behind the compacting coverlay;
4) circuit etching: make public being fitted on light-sensitive surface or the photosensitive-ink after the required line pattern film contraposition, film sensitization polymerization position forms anti-etching circuit, and the etching of logicalnot circuit position is removed, and exposes required circuit behind the stripping;
5) compacting coverlay: in the coverlay that the other one side of substrate is fitted and windowed, high temperature pressing then;
6) wire mark: according to required figure or the literal of design wire mark;
7) surface treatment: all the coverlay places of windowing to substrate carry out the nickel gold, tin surfaces is handled;
8) reinforcing:, carry out the high temperature pressing then at plugging position reinforcing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100541874A CN102595795A (en) | 2012-03-05 | 2012-03-05 | Method for making double-sided flexible printed circuit board by using pure copper plate as base material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100541874A CN102595795A (en) | 2012-03-05 | 2012-03-05 | Method for making double-sided flexible printed circuit board by using pure copper plate as base material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102595795A true CN102595795A (en) | 2012-07-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100541874A Pending CN102595795A (en) | 2012-03-05 | 2012-03-05 | Method for making double-sided flexible printed circuit board by using pure copper plate as base material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102595795A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102984888A (en) * | 2012-12-13 | 2013-03-20 | 无锡江南计算技术研究所 | Method of partially replacing flexible printed circuit board cover film with flexible printed circuit board grease |
| CN103731993A (en) * | 2014-01-17 | 2014-04-16 | 杨秀英 | Machining method for single-side flexible printed circuit board |
| CN104411104A (en) * | 2014-11-07 | 2015-03-11 | 双鸿电子(惠州)有限公司 | Method for manufacturing flexible single-sided hollowed-out printed circuit board of mobile phone module |
| CN105163503A (en) * | 2015-08-31 | 2015-12-16 | 昆山龙朋精密电子有限公司 | Method for fabricating hollowed-out board of flexible printed circuit (FPC) by laser windowing |
| CN110177427A (en) * | 2019-05-24 | 2019-08-27 | 上海温良昌平电器科技股份有限公司 | Depressed structure and its production technology are escaped in a kind of pressure-sensing glue reinforcement |
| CN110213898A (en) * | 2019-06-26 | 2019-09-06 | 苏州市华扬电子股份有限公司 | A kind of production method for the flexible circuit board that can remove substrate shape burr |
| CN110248480A (en) * | 2019-06-26 | 2019-09-17 | 苏州市华扬电子股份有限公司 | A kind of production method of flexible circuit board |
| CN111818740A (en) * | 2020-07-08 | 2020-10-23 | 恩达电路(深圳)有限公司 | Method for manufacturing circuit board with circuit height difference rigid-flexible circuit |
| CN112533390A (en) * | 2021-02-03 | 2021-03-19 | 四川英创力电子科技股份有限公司 | Manufacturing method of copper-embedded PCB (printed circuit board) copper plate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4622097A (en) * | 1984-10-11 | 1986-11-11 | Shikoku Chemicals Corporation | Process for producing copper through-hole printed circuit board |
| JPH04365394A (en) * | 1991-06-13 | 1992-12-17 | Matsushita Electric Ind Co Ltd | Manufacture of printed wiring board |
| CN101553089A (en) * | 2009-05-11 | 2009-10-07 | 昆山亿富达电子有限公司 | Production technology of hollow-out double-sided flexible printed circuit board |
| CN201709016U (en) * | 2009-10-19 | 2011-01-12 | 嘉联益科技股份有限公司 | Structure of flexible circuit board |
-
2012
- 2012-03-05 CN CN2012100541874A patent/CN102595795A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4622097A (en) * | 1984-10-11 | 1986-11-11 | Shikoku Chemicals Corporation | Process for producing copper through-hole printed circuit board |
| JPH04365394A (en) * | 1991-06-13 | 1992-12-17 | Matsushita Electric Ind Co Ltd | Manufacture of printed wiring board |
| CN101553089A (en) * | 2009-05-11 | 2009-10-07 | 昆山亿富达电子有限公司 | Production technology of hollow-out double-sided flexible printed circuit board |
| CN201709016U (en) * | 2009-10-19 | 2011-01-12 | 嘉联益科技股份有限公司 | Structure of flexible circuit board |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102984888A (en) * | 2012-12-13 | 2013-03-20 | 无锡江南计算技术研究所 | Method of partially replacing flexible printed circuit board cover film with flexible printed circuit board grease |
| CN102984888B (en) * | 2012-12-13 | 2015-05-06 | 无锡江南计算技术研究所 | Method of partially replacing flexible printed circuit board cover film with flexible printed circuit board grease |
| CN103731993A (en) * | 2014-01-17 | 2014-04-16 | 杨秀英 | Machining method for single-side flexible printed circuit board |
| CN104411104A (en) * | 2014-11-07 | 2015-03-11 | 双鸿电子(惠州)有限公司 | Method for manufacturing flexible single-sided hollowed-out printed circuit board of mobile phone module |
| CN105163503A (en) * | 2015-08-31 | 2015-12-16 | 昆山龙朋精密电子有限公司 | Method for fabricating hollowed-out board of flexible printed circuit (FPC) by laser windowing |
| CN110177427A (en) * | 2019-05-24 | 2019-08-27 | 上海温良昌平电器科技股份有限公司 | Depressed structure and its production technology are escaped in a kind of pressure-sensing glue reinforcement |
| CN110213898A (en) * | 2019-06-26 | 2019-09-06 | 苏州市华扬电子股份有限公司 | A kind of production method for the flexible circuit board that can remove substrate shape burr |
| CN110248480A (en) * | 2019-06-26 | 2019-09-17 | 苏州市华扬电子股份有限公司 | A kind of production method of flexible circuit board |
| CN111818740A (en) * | 2020-07-08 | 2020-10-23 | 恩达电路(深圳)有限公司 | Method for manufacturing circuit board with circuit height difference rigid-flexible circuit |
| CN112533390A (en) * | 2021-02-03 | 2021-03-19 | 四川英创力电子科技股份有限公司 | Manufacturing method of copper-embedded PCB (printed circuit board) copper plate |
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Application publication date: 20120718 |