CN105163503A - Method for fabricating hollowed-out board of flexible printed circuit (FPC) by laser windowing - Google Patents
Method for fabricating hollowed-out board of flexible printed circuit (FPC) by laser windowing Download PDFInfo
- Publication number
- CN105163503A CN105163503A CN201510541875.7A CN201510541875A CN105163503A CN 105163503 A CN105163503 A CN 105163503A CN 201510541875 A CN201510541875 A CN 201510541875A CN 105163503 A CN105163503 A CN 105163503A
- Authority
- CN
- China
- Prior art keywords
- hollowed
- copper plate
- fpc
- out board
- dry film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The invention discloses a method for fabricating a hollowed-out board of a flexible printed circuit (FPC) by laser windowing. The method comprises the following steps: (a) pure copper plate cutting; (b) first chemical treatment, namely carrying out surface chemical treatment on the pure copper plate; (c) dry film laminating, namely pressing the dry film on the front surface of the pure copper plate; (d) compounding of a reverse cover film, namely compounding the front surface of the reverse cover film and the reverse surface of the pure copper plate; (e) ultraviolet exposure; (f) developing; (g) etching; (h) film removal; (i) second chemical treatment, namely carrying out surface chemical treatment on a line part; (j) compounding of the front cover film, namely compounding the reverse surface of the front cover film and the front surface of the line part; and (k) laser windowing, namely carrying out windowing treatment on the reverse cover film with laser to form the hollowed-out board. According to the method disclosed by the invention, the steps of developing, etching and film removing are firstly carried out; and then windowing treatment is carried out on the reverse cover film, so that an etching solution can be prevented from entering inside the hollowed-out board while etching and poor etching is avoided. Therefore, the stability and the quality of the product are improved; and the raw materials are reduced.
Description
Technical field
The present invention relates to one to utilize laser to window to make the method for FPC (flexible PCB) hollowed-out board.
Background technology
Flexible PCB is that the one made for base material with polyimides or polyester film has height reliability, excellent flexual printed circuit board (PCB), it has the features such as distribution density is high, lightweight, thickness is thin, bending property is good, is thus widely used in various field.In part special dimension, need FPC for hollowed-out board as in the photoelectric conversion module that military signal base station uses, FPC hollowed-out board is the flexible print circuit board for hollow out between fingerboard left-hand seat refers to.
The main Making programme of existing hollowed-out board is as follows: window first to reverse side coverlay, again by reverse side coverlay and fine copper plate compound, circuit pack is drawn after development, etching, striping step, last composite positive coverlay, this Making programme easily causes press mold bad, cause the liquid medicine when etching to enter hollowed-out board inside, cause etching bad, vacancy section easily produces fold.Therefore, be necessary to provide a kind of new manufacture method to solve the problems referred to above.
Summary of the invention
The object of the present invention is to provide a kind of conservation, product stability high utilize laser to window to make the method for FPC hollowed-out board.
To achieve these goals, the technical solution adopted in the present invention is as follows:
Utilize laser to window and make a method for FPC hollowed-out board, comprise the following steps:
A) fine copper plate cuts: shape fine copper plate being cut into needs;
B) first time chemical treatment: chemical surface treatment is carried out to described fine copper plate;
C) pressing dry film: dry film is pressed in described pure upside of a tossed coin;
D) compound reverse side coverlay: by the reverse side compound of the front of reverse side coverlay and described fine copper plate;
E) ultraviolet exposure: exposure-processed is carried out to the dry film on the circuit pack that described fine copper plate will be utilized to make with ultraviolet;
F) develop: chemically remove unexposed dry film, expose the copper of described fine copper plate part to be etched;
G) etch: chemically etch away the copper exposed in development step, form the described circuit pack needed;
H) striping: remove exposed dry film with highly basic, expose circuit pack;
I) second time chemical treatment: chemical surface treatment is carried out to described circuit pack;
J) composite positive coverlay: by the front compound of the reverse side of front cover and described circuit pack;
K) laser is windowed: utilize laser to window process to described reverse side coverlay, form hollowed-out board.
Preferably, in step b) and step I) in, described first time chemical treatment and described second time chemical treatment all adopt phosphate solution process.
Preferably, in steps d) and step j) in, increase hot-pressing processing while compound.
Preferably, in step f) in, adopt developer solution to remove unexposed dry film, described developer solution adopts Na2CO3 solution, and the temperature of developer solution is 33 DEG C, and concentration is 1.9%, sprays as 2.1kg/cm2.
Preferably, in step g) in, adopt etching solution etch copper, described etching solution adopts acidic cupric chloride solutions, and the temperature of described etching solution is 53 DEG C, sprays as 3.1kg/cm2.
Preferably, in step h) in, adopt temperature be 56 DEG C, concentration be 2.1% NaOH remove exposed dry film.
Compared with prior art, the present invention utilizes the window beneficial effect of the method making FPC hollowed-out board of laser to be: the present invention first carries out developing, etching and striping step, again reverse side coverlay is windowed process, can prevent the etching solution when etching from entering hollowed-out board inside, avoid causing etching bad, thus improve stability and the quality of product, conservation.
Accompanying drawing explanation
Fig. 1 is the structural representation of reverse side coverlay of the present invention;
Fig. 2 is the product structure schematic diagram of the present invention after compound reverse side coverlay step;
Fig. 3 is the product structure schematic diagram of the present invention after overexposure, development, etching step;
Fig. 4 is the product structure schematic diagram of the present invention after composite positive coverlay step;
Fig. 5 is the product structure schematic diagram of the present invention after laser casing milling steps.
In figure, each mark is as follows: 1, reverse side coverlay; 2, fine copper plate; 3, front cover.
Embodiment
Below in conjunction with specific embodiment, the present invention is described further.
Refer to shown in Fig. 1 to Fig. 5, the present invention utilizes laser to window to make the method for hollowed-out board and comprises the following steps:
A) fine copper plate cuts: shape fine copper plate being cut into needs;
B) first time chemical treatment: adopt phosphate solution to carry out chemical surface treatment to described fine copper plate, make fine copper plate Surface Creation layer protecting film;
C) pressing dry film: dry film is pressed in described pure upside of a tossed coin;
D) compound reverse side coverlay: the reverse side of the front of reverse side coverlay and described fine copper plate is carried out hot pressing compound;
E) ultraviolet exposure: exposure-processed is carried out to the dry film on the circuit pack that described fine copper plate will be utilized to make with ultraviolet;
F) develop: chemically remove unexposed dry film, expose the copper of described fine copper plate part to be etched;
G) etch: chemically etch away the copper exposed in development step, form the described circuit pack needed;
H) striping: remove exposed dry film with highly basic, expose circuit pack;
I) second time chemical treatment: adopt phosphate solution to carry out chemical surface treatment to described circuit pack;
J) composite positive coverlay: hot pressing compound is carried out in the front of the reverse side of front cover and described circuit pack;
K) laser is windowed: utilize laser to window process to described reverse side coverlay, form hollowed-out board.
In the present invention, step f) in adopt developer solution to remove unexposed dry film, described developer solution adopts Na2CO3 solution, and the temperature of developer solution is 33 DEG C, and concentration is 1.9%, sprays as 2.1kg/cm2; Step g) middle employing etching solution etch copper, described etching solution adopts acidic cupric chloride solutions, and the temperature of described etching solution is 53 DEG C, sprays as 3.1kg/cm2, and wherein, the main component of acidic cupric chloride solutions is: CuCl
2and HCL, reaction principle is Cu+CuCl
2→ Cu
2cl
2, Cu
2cl
2+ 4Cl
-→ 2 (CuCl
3)
2-; Step h) in adopt temperature be 56 DEG C, concentration be 2.1% NaOH remove exposed dry film.
In sum, job step of the present invention is simple, save time and human cost, the present invention first carries out developing, etching and striping step, again reverse side coverlay being windowed process, can preventing the etching solution when etching from entering hollowed-out board inside, avoid causing etching bad, thus improve stability and the quality of product, conservation.
Schematically above be described the present invention and execution mode thereof, this description does not have restricted, and also just one of the embodiments of the present invention shown in accompanying drawing, actual structure is not limited thereto.So, if those of ordinary skill in the art enlightens by it, when not departing from the invention aim, designing the frame mode similar to this technical scheme and embodiment without creationary, all should protection scope of the present invention be belonged to.
Claims (6)
1. utilize laser to window and make a method for FPC hollowed-out board, it is characterized in that, comprise the following steps:
A) fine copper plate cuts: shape fine copper plate being cut into needs;
B) first time chemical treatment: chemical surface treatment is carried out to described fine copper plate;
C) pressing dry film: dry film is pressed in described pure upside of a tossed coin;
D) compound reverse side coverlay: by the reverse side compound of the front of reverse side coverlay and described fine copper plate;
E) ultraviolet exposure: exposure-processed is carried out to the dry film on the circuit pack that described fine copper plate will be utilized to make with ultraviolet;
F) develop: chemically remove unexposed dry film, expose the copper of described fine copper plate part to be etched;
G) etch: chemically etch away the copper exposed in development step, form the described circuit pack needed;
H) striping: remove exposed dry film with highly basic, expose circuit pack;
I) second time chemical treatment: chemical surface treatment is carried out to described circuit pack;
J) composite positive coverlay: by the front compound of the reverse side of front cover and described circuit pack;
K) laser is windowed: utilize laser to window process to described reverse side coverlay, form hollowed-out board.
2. utilize laser to window as claimed in claim 1 and make the method for FPC hollowed-out board, it is characterized in that, in step b) and step I) in, described first time chemical treatment and described second time chemical treatment all adopt phosphate solution process.
3. utilize laser to window as claimed in claim 1 and make the method for FPC hollowed-out board, it is characterized in that, in steps d) and step j) in, increase hot-pressing processing while compound.
4. utilize laser to window as claimed in claim 1 and make the method for FPC hollowed-out board, it is characterized in that, in step f) in, adopt developer solution to remove unexposed dry film, described developer solution adopts Na
2cO
3solution, the temperature of developer solution is 33 DEG C, and concentration is 1.9%, sprays as 2.1kg/cm
2.
5. utilize laser to window as claimed in claim 1 and make the method for FPC hollowed-out board, it is characterized in that, in step g) in, adopt etching solution etch copper, described etching solution adopts acidic cupric chloride solutions, and the temperature of described etching solution is 53 DEG C, sprays as 3.1kg/cm
2.
6. utilize laser to window as claimed in claim 1 and make the method for FPC hollowed-out board, it is characterized in that, in step h) in, adopt temperature to be 56 DEG C, concentration be 2.1% NaOH remove exposed dry film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510541875.7A CN105163503A (en) | 2015-08-31 | 2015-08-31 | Method for fabricating hollowed-out board of flexible printed circuit (FPC) by laser windowing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510541875.7A CN105163503A (en) | 2015-08-31 | 2015-08-31 | Method for fabricating hollowed-out board of flexible printed circuit (FPC) by laser windowing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105163503A true CN105163503A (en) | 2015-12-16 |
Family
ID=54804228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510541875.7A Pending CN105163503A (en) | 2015-08-31 | 2015-08-31 | Method for fabricating hollowed-out board of flexible printed circuit (FPC) by laser windowing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105163503A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105916305A (en) * | 2016-05-19 | 2016-08-31 | 湖北龙腾电子科技有限公司 | Method for preventing printing ink in jack of single-side-windowed jack panel of PCB from attaching to welding pad |
| CN106028663A (en) * | 2016-08-01 | 2016-10-12 | 安徽贝莱电子科技有限公司 | Manufacturing process for radar built-in circuit board |
| CN109743846A (en) * | 2018-09-27 | 2019-05-10 | 常州市武进三维电子有限公司 | The manufacture craft of the hollow-out flexible wiring board of new-energy automobile |
| CN111010811A (en) * | 2019-12-05 | 2020-04-14 | 珠海杰赛科技有限公司 | Manufacturing method of single-side hollowed-out board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101626661A (en) * | 2008-07-11 | 2010-01-13 | 比亚迪股份有限公司 | Method for manufacturing double-side hollowed-out plates |
| CN101730389A (en) * | 2008-10-15 | 2010-06-09 | 比亚迪股份有限公司 | Method for manufacturing single-side hollow out flexible circuit board |
| CN102595795A (en) * | 2012-03-05 | 2012-07-18 | 同扬光电（江苏）有限公司 | Method for making double-sided flexible printed circuit board by using pure copper plate as base material |
| CN104320915A (en) * | 2014-11-07 | 2015-01-28 | 双鸿电子(惠州)有限公司 | Manufacturing method of mobile phone module flexible double-faced hollow printed circuit board |
| CN104320916A (en) * | 2014-11-14 | 2015-01-28 | 镇江华印电路板有限公司 | Hollow-type double-sided flexible printed circuit board |
| CN104411104A (en) * | 2014-11-07 | 2015-03-11 | 双鸿电子(惠州)有限公司 | Method for manufacturing flexible single-sided hollowed-out printed circuit board of mobile phone module |
-
2015
- 2015-08-31 CN CN201510541875.7A patent/CN105163503A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101626661A (en) * | 2008-07-11 | 2010-01-13 | 比亚迪股份有限公司 | Method for manufacturing double-side hollowed-out plates |
| CN101730389A (en) * | 2008-10-15 | 2010-06-09 | 比亚迪股份有限公司 | Method for manufacturing single-side hollow out flexible circuit board |
| CN102595795A (en) * | 2012-03-05 | 2012-07-18 | 同扬光电（江苏）有限公司 | Method for making double-sided flexible printed circuit board by using pure copper plate as base material |
| CN104320915A (en) * | 2014-11-07 | 2015-01-28 | 双鸿电子(惠州)有限公司 | Manufacturing method of mobile phone module flexible double-faced hollow printed circuit board |
| CN104411104A (en) * | 2014-11-07 | 2015-03-11 | 双鸿电子(惠州)有限公司 | Method for manufacturing flexible single-sided hollowed-out printed circuit board of mobile phone module |
| CN104320916A (en) * | 2014-11-14 | 2015-01-28 | 镇江华印电路板有限公司 | Hollow-type double-sided flexible printed circuit board |
Non-Patent Citations (2)
| Title |
|---|
| 孙贵斌，唐友名: "《客车制造工艺》", 31 January 2015 * |
| 杨丁: "《金属蚀刻技术》", 31 January 2008 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105916305A (en) * | 2016-05-19 | 2016-08-31 | 湖北龙腾电子科技有限公司 | Method for preventing printing ink in jack of single-side-windowed jack panel of PCB from attaching to welding pad |
| CN106028663A (en) * | 2016-08-01 | 2016-10-12 | 安徽贝莱电子科技有限公司 | Manufacturing process for radar built-in circuit board |
| CN109743846A (en) * | 2018-09-27 | 2019-05-10 | 常州市武进三维电子有限公司 | The manufacture craft of the hollow-out flexible wiring board of new-energy automobile |
| CN109743846B (en) * | 2018-09-27 | 2021-08-20 | 常州市武进三维电子有限公司 | Manufacturing process of hollow flexible circuit board of new energy automobile |
| CN111010811A (en) * | 2019-12-05 | 2020-04-14 | 珠海杰赛科技有限公司 | Manufacturing method of single-side hollowed-out board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103582304B (en) | Transparent printed circuit board (PCB) and preparation method thereof | |
| CN102458055B (en) | Manufacturing method for rigid-flexible circuit board | |
| CN105163503A (en) | Method for fabricating hollowed-out board of flexible printed circuit (FPC) by laser windowing | |
| CN102137551B (en) | Production method of high-frequency four-layer circuit board | |
| CN206564726U (en) | The FPC with ultra fine-line that Novel dry film makes | |
| CN106455345A (en) | Method of machining burr-free hole of PCB copper-based core board | |
| CN106535510A (en) | Method for producing rigid-flex PCB lid | |
| CN102361538A (en) | Method for processing printed circuit two-level blind hole | |
| CN108495486A (en) | A kind of production method and High speed rear panel of High speed rear panel | |
| CN101426342B (en) | Manufacturing method of hollowed-out flexible circuit board | |
| CN105830542B (en) | The production method of ladder copper post in a kind of PCB | |
| JP2009164557A (en) | Printed circuit board and method of manufacturing the same | |
| CN103260361A (en) | Method with simple process for processing HDI outer layer line negative film being | |
| CN105188267A (en) | Method for mirroring production of FPC (Flexible Printed Circuit) single panel | |
| CN103677409B (en) | A kind of processing technology of the touch module of the two-sided conducting membrane structure of GF2 | |
| CN102917544A (en) | Manufacturing method of high-frequency three-layer circuit board with impermeable slot | |
| CN101626661B (en) | Method for manufacturing double-side hollowed-out plates | |
| CN103898498A (en) | Blackening liquid medicine and manufacturing method of transparent printed circuit board | |
| CN103391686B (en) | Wiring board processing method | |
| CN108650800A (en) | A kind of PCB production procedures reducing dry film holes | |
| KR100754061B1 (en) | Method of fabricating printed circuit board | |
| CN210670814U (en) | Laser engraving circuit board | |
| CN102223764A (en) | Manufacturing method of flexible circuit boards | |
| KR20110110664A (en) | Manufacturing method of double-sided printed circuit board | |
| CN105282989A (en) | Manufacturing method of windowed rigid-flex PCB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151216 |
|
| RJ01 | Rejection of invention patent application after publication |