CN206564726U

CN206564726U - The FPC with ultra fine-line that Novel dry film makes

Info

Publication number: CN206564726U
Application number: CN201720134331.3U
Authority: CN
Inventors: 刘清
Original assignee: Suzhou Weixin Electronic Co Ltd
Current assignee: Suzhou Weixin Electronic Co Ltd
Priority date: 2017-02-14
Filing date: 2017-02-14
Publication date: 2017-10-17
Anticipated expiration: 2027-02-14

Abstract

The utility model discloses the FPC with ultra fine-line that a kind of Novel dry film makes, including base material, the base material includes double-faced flexible copper-clad plate, the double-faced flexible copper-clad plate includes non-conductive layer and the non-conductive layer is located in into upper copper foil therein and lower copper foil, copper wire is formed on the upper copper foil and lower copper foil, the minimum feature and/or line-spacing of the copper wire are 25 μm.The utility model forms copper wire on upper copper foil and lower copper foil, the minimum feature and/or line-spacing of the copper wire are 25 μm, relative to original minimum feature and/or line-spacing be 35 μm, the utility model complete more fine rule the wide line away from making, improve the wiring density of flexible PCB.

Description

The FPC with ultra fine-line that Novel dry film makes

Technical field

The utility model is related to flexible PCB, and what more particularly to a kind of Novel dry film made has the soft of ultra fine-line Property wiring board.

Background technology

With the miniaturization of electronic product, more and more higher is required to the high-density wiring of FPC, so thinner Line width line-spacing turns into the development trend in market.Country's FPC industry makes circuit, etching using etching method mostly at present Common dry film resolution used in method (after development minimum dry intermembranous away from) is minimum according to single edge of circuit during etching at 25 μm or so 5 μm of calculating of compensation, so etch the minimum feature/line-spacing come 35 μm or 35 μm or so (as shown in Figure 1).

However, common dry film can not complete more fine rule the wide line away from making, it is impossible to meet high-density wiring demand.

Utility model content

In order to solve the above technical problems, the utility model purpose is to provide, a kind of Novel dry film makes has superfine wire The FPC on road, to overcome the deficiencies in the prior art.

To reach above-mentioned purpose, the technical solution of the utility model is as follows：

The FPC with ultra fine-line that a kind of Novel dry film makes, including base material, the base material include two-sided Flexible copper-clad plate, the double-faced flexible copper-clad plate includes non-conductive layer and the non-conductive layer is located in into upper copper foil therein With lower copper foil, copper wire is formed on the upper copper foil and lower copper foil, the minimum feature and/or line-spacing of the copper wire are 25 μm.

It is preferred that, the FPC also include be respectively arranged on the upper copper electroplating layer of the front and back of the base material, under Copper electroplating layer and the upper protective film and lower diaphragm fitted respectively with the upper copper electroplating layer and lower copper electroplating layer.

It is preferred that, the copper wire is formed on copper foil and lower copper foil on described by copper etching method.

Further, the copper etchant solution that the copper etching method is used at least includes copper chloride, hydrochloric acid and hydrogen peroxide.

It is preferred that, the non-conductive layer is polyimides or polyester film.

It is preferred that, the thickness of the non-conductive layer is 25 μm, and/or, the thickness of the upper copper foil and lower copper foil is 12 μm.

Compared with prior art, advantage of the present utility model at least that：

The utility model forms copper wire, the minimum feature and/or line-spacing of the copper wire on upper copper foil and lower copper foil For 25 μm, relative to original minimum feature and/or line-spacing be 35 μm, the utility model complete more fine rule the wide line away from making, Improve the wiring density of flexible PCB.

Brief description of the drawings

, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art The required accompanying drawing used is briefly described in description or in the prior art.

Fig. 1 is the structural representation of the base material of FPC of the prior art；

Fig. 2 is the structural representation of the base material of the FPC disclosed in the utility model embodiment；

Fig. 3 makes the flow chart of circuit for the base material of FPC of the prior art by etching method；

Fig. 4 is the FPC with ultra fine-line that the Novel dry film disclosed in the utility model embodiment makes Base material makes the flow chart of circuit by etching method；

Fig. 5 is the ultraviolet photoetching cross-sectional view of the base material of FPC of the prior art；

Fig. 6 is the FPC with ultra fine-line that the Novel dry film disclosed in the utility model embodiment makes The ultraviolet photoetching cross-sectional view of base material；

Fig. 7 is the structural representation in prior art with the glass negative disclosed in the utility model embodiment.

Embodiment

Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out Clearly and completely describe.

The utility model embodiment discloses the FPC with ultra fine-line that a kind of Novel dry film makes, including Base material, the upper copper electroplating layer of front and back located at base material, lower copper electroplating layer and respectively with upper copper electroplating layer and lower plating The upper protective film and lower diaphragm of layers of copper laminating；

Shown in Figure 2, base material includes double-faced flexible copper-clad plate, and double-faced flexible copper-clad plate includes the polyamides that thickness is 25 μm Imines A and polyimides is located in into therein and thickness is to form copper cash on 12 μm of upper and lower copper foil B, upper and lower copper foil B Road, the minimum feature and/or line-spacing of copper wire are 25 μm.

Shown in Figure 4, the process that the base material of above-mentioned flexible PCB makes circuit by etching method includes：Dry film pressure Conjunction, ultraviolet photoetching, dry film development, copper etching and dry film stripping process.

Wherein, dry film, which is pressed, is：A dry film C is respectively pressed on upper and lower copper foil B surface；

Ultraviolet photoetching is：Place glass negative D respectively on upper and lower dry film C and carry out the local ultraviolet photoetching of dry film, glass D points of glass egative film is light transmission part and lightproof part, and ultraviolet light can act on dry film C1 through glass negative D light transmission part On be allowed to occur cross-polymerization chemical reaction, and the dry film C2 under glass negative D lightproof part does not change, common dry Film and Novel dry film ultraviolet photoetching cross-sectional view are shown in Fig. 5 and 6 respectively, and the utility model is in order to obtain thinner line width line Away from when making glass negative used in Novel dry film, by the width in lightproof part region by 25 μm of original reductions to 15 μm (as shown in Figure 7)；

Dry film develops：By unexposed portion dry film in 1% sodium hydroxide developer solution tydrophilization in copper foil surface, and Dry film exposed portion remains in copper foil surface after development, and dry film spacing is 25 μm after common dry film development, and novel dry Dry film spacing was reduced to 15 μm (as shown in Figures 3 and 4) after film development；

Copper is etched：The copper foil of exposure outside is dissolved with corrosive liquid, i.e., the copper foil for not having dry film C to surface loses Carve, the copper etchant solution that copper etching method is used at least includes copper chloride, hydrochloric acid and hydrogen peroxide.

Dry film is peeled off：It is swelled using alkaline medicinal liquid and peels off all dry films of copper foil surface, finally obtains copper wire Semi-finished product, it is 35/35 μm of circuit (as shown in Figure 3) to obtain line width/line-spacing using common dry film, and use Novel dry film can be with Obtain the circuit (as shown in Figure 4) that line width line-spacing is 25/25 μm.

In summary, the utility model forms copper wire, the minimum feature of the copper wire on upper copper foil and lower copper foil It it is 35 μm relative to original minimum feature and/or line-spacing, the utility model completes more fine rule the wide line and/or line-spacing is 25 μm Away from making, improve the wiring density of flexible PCB.

The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or new using this practicality Type.A variety of modifications to these embodiments will be apparent for those skilled in the art, determine herein The General Principle of justice can in other embodiments be realized in the case where not departing from spirit or scope of the present utility model.Cause This, the utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein The most wide scope consistent with features of novelty.

Claims

1. the FPC with ultra fine-line that a kind of Novel dry film makes, it is characterised in that：Including base material, the base material Including double-faced flexible copper-clad plate, the double-faced flexible copper-clad plate includes non-conductive layer and is located in the non-conductive layer wherein Upper copper foil and lower copper foil, form copper wire, the minimum feature and/or line-spacing of the copper wire on the upper copper foil and lower copper foil For 25 μm.

2. the FPC with ultra fine-line that Novel dry film according to claim 1 makes, it is characterised in that should FPC also include being respectively arranged on the upper copper electroplating layer of front and back of the base material, lower copper electroplating layer and respectively with The upper copper electroplating layer and the upper protective film and lower diaphragm of the laminating of lower copper electroplating layer.

3. the FPC with ultra fine-line that Novel dry film according to claim 1 makes, it is characterised in that：It is logical Cross copper etching method and form the copper wire on copper foil and lower copper foil on described.

4. the FPC with ultra fine-line that Novel dry film according to claim 1 makes, it is characterised in that：Institute Non-conductive layer is stated for polyimides or polyester film.

5. the FPC with ultra fine-line that Novel dry film according to claim 1 makes, it is characterised in that：Institute The thickness for stating non-conductive layer is 25 μm, and/or, the thickness of the upper copper foil and lower copper foil is 12 μm.