JPH11354909A - Transfer medium, its manufacture, and manufacture for wiring pattern using the transfer medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer medium having fine wiring patterns for readily forming fine wiring patterns and manufacturing a fine circuit substrate with a high manufacture yield without causing disconnections, a deformation or the like of the fine wiring patterns, its manufacture, and a manufacturing method for the wiring patterns using the transfer medium. SOLUTION: Desired patterns are provided on a base material 101 with a conductive material 102, and the conductive material 102 and the base material 101 form a transfer medium with a material which can be selectively removed, respectively. The conductive material 102 and the base material 101 are selectively removed with a different etchant. Prior to the formation of the desirable patterns, they are adhered to another substrate 105 having appropriate strength, acid-resistance and alkali-resistance with adhesives 106 which loses an adhesive force at a given temperature, thereby to protect reinforcement and etching, and after completing a step of the transfer medium, it is released by heating.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer medium having a fine wiring pattern for manufacturing a wiring board on which various electronic components can be mounted and electrically connected to each other to form an electronic circuit. The present invention relates to a method for manufacturing the same and a method for manufacturing a wiring pattern using the transfer medium.

[0002]

2. Description of the Related Art In recent years, with the miniaturization of electronic equipment, there has been a strong demand that a circuit board on which a semiconductor chip such as an LSI can be mounted at a low cost can be provided not only in the industrial field but also in the field of consumer electronics. I have. In such a circuit board, it is important that a finer wiring pitch can be easily produced with a higher yield in order to achieve the purpose of miniaturization by improving the mounting density. In conventional circuit boards, a method of applying a copper foil to a so-called glass epoxy board impregnated with epoxy resin in glass woven cloth and photo-etching the copper foil to form a pattern has been adopted. The copper foil surface is roughened to maintain the adhesion of
For this reason, the copper foil became thick and it was difficult to form a fine pattern. In order to solve this, for example, a method has been proposed in which a fine pattern is formed on another substrate in advance by electroplating and the like, and then pressed and transferred to an insulating base material, and then only the substrate is peeled off ( JP-A-6-31
No. 8783).

[0003]

However, in the method proposed in the above-mentioned conventional Japanese Patent Application Laid-Open No. 6-318873, a fine pattern is formed on another substrate in advance by electroplating, and then the insulating substrate is pressed. And transcribe,
Thereafter, only the substrate is peeled off. According to such a method, there is a problem that the conductive pattern peels depending on the peel strength between the conductive pattern and the substrate.
That is, the weaker one is peeled off due to the difference in mechanical adhesion strength, and it is quite difficult to control the adhesion strength between the substrate side and the insulating base material side of the conductive pattern. In particular, as the pattern becomes finer, the contact area between the conductive pattern and the insulating base material becomes smaller, the adhesion strength becomes weaker, and it becomes difficult to peel off the conductive pattern. Therefore, the yield is reduced due to deformation or disconnection of the conductive pattern.

SUMMARY OF THE INVENTION In order to solve the above-mentioned conventional problems, the present invention provides a method for manufacturing a fine circuit board with a high yield without easily forming a fine wiring pattern and without causing disconnection or deformation of the fine wiring pattern. To provide a transfer medium having a fine wiring pattern, a method of manufacturing the same, and a method of manufacturing a wiring pattern using the transfer medium.

[0005]

In order to achieve the above object, a first transfer medium of the present invention comprises a base material provided with a desired pattern made of a conductive material, wherein the conductive material and the base material have a desired pattern. Are made of materials that can be selectively removed.

Next, in a second transfer medium of the present invention, at least one or more etching stopper layers are formed on the substrate surface, and a desired pattern of a conductive material is provided on the etching stopper layer surface. The conductive material and at least the etching stopper layer are each made of a material that can be selectively removed.

[0007] In the first transfer medium, it is preferable that the base material and the conductive material are made of a material that can be selectively removed by a different etchant.
In the second transfer medium, the selective removal is etching, and it is preferable that at least the etching stopper layer and the conductive material are made of a material that can be selectively removed by a different etchant. .

Next, a first method for manufacturing a transfer medium according to the present invention comprises a step of forming a conductive material layer on a surface of a substrate or an etching stopper layer on which a desired pattern of a conductive material is provided, Etching the conductive material layer into a desired pattern.

Next, a second method of manufacturing a transfer medium according to the present invention is a step of forming an insulating material pattern in a desired region on a substrate surface or an etching stopper layer surface provided with a desired pattern made of a conductive material. And forming a pattern made of a conductive material in a region where the surface of the base material or the surface of the etching stopper layer is exposed.

In the first method of manufacturing a transfer medium according to the present invention, the insulating material pattern is selectively formed.
It is preferable that a photosensitive resin is applied to the surface of the base material or the surface of the etching stopper layer, and development is performed after selective exposure using a desired mask pattern.

In the first and second methods for producing a transfer medium of the present invention, it is preferable that the pattern formation using the conductive material is plating. In the method, it is preferable that the plating is electroplating.

In the above method, it is preferable that a pattern made of a conductive material is formed after the back surface of the base material is bonded to the substrate. Further, in the above method, it is preferable that the adhesion of the back surface of the base material to the substrate is performed by an adhesive, and that the adhesive loses adhesive strength at a predetermined temperature or higher.

Next, a method for manufacturing a wiring pattern according to the present invention is as follows.
Forming a transfer medium having a pattern made of a conductive material on the surface of the base material or a transfer medium having at least an etching stopper layer formed on the surface of the base material and having a desired pattern made of a conductive material layer formed on the surface of the etching stopper layer And a step of pressing the conductive pattern surface of the transfer medium having the conductive pattern formed thereon to an insulating substrate,
Selectively removing the base material of the transfer medium by etching while leaving the conductive pattern, or sequentially removing the etching stopper layer and the base material by etching.

[0014]

According to the structure of the present invention, a desired pattern made of a conductive material is provided on a base material, and the conductive material and the base material are each made of a material that can be selectively removed. The base material and the conductive material are made of a material that can be selectively removed by a different etchant; and at least one or more etching stopper layers are formed on the surface of the base material; Is provided with a desired pattern made of a conductive material, the conductive material and at least the etching stopper layer are each formed of a material that can be selectively removed, and the etching stopper layer and the conductive material are formed of different etching liquids. It is made of a material that enables selective removal. Further, the process is carried out by bonding the base material to a substrate having appropriate strength and relatively acid resistance and alkali resistance with an adhesive which loses adhesive strength at a predetermined temperature or higher. Thus, a transfer medium for easily forming a fine conductive pattern having a weak adhesion strength by transfer without obtaining a weaker one due to a difference in mechanical adhesion strength is obtained.

Further, a desired pattern made of a conductive material is provided on a base material, and the conductive material and the base material are each formed of a material which can be selectively removed. This makes it possible to leave only a desired pattern made of a conductive material.

At least one etching stopper layer is formed on the surface of the base material, a desired pattern made of a conductive material is provided on the surface of the etching stopper layer, and the conductive material and at least the etching stopper layer are separated from each other. These transfer media are made of materials that can be selectively removed, and enhance the selectivity of etching between a base material and a desired pattern made of a conductive material by an etching stopper layer.

Further, the base material and the conductive material are made of a material which can be selectively removed with a different etching solution, so that only the base material is etched and then fine etching of the conductive material is performed by overetching or the like. This makes it possible to leave the pattern without etching.

Further, the selective removal is etching, and at least the etching stopper layer and the conductive material are made of a material that can be selectively removed by a different etchant, so that the base material and the conductive material are finely divided. This makes it possible to selectively leave only a fine desired pattern made of a conductive material even if the desired pattern is completely the same material or a material etched with the same etching solution.

Further, the method of the present invention for transferring a desired structure transfer medium according to the present invention includes a step of forming a conductive material layer on the surface of the base material or the surface of the etching stopper layer, and a step of etching the conductive material layer into a desired pattern. It enables a manufacturing method.

A step of forming an insulating material pattern in a desired region on the surface of the substrate or the surface of the etching stopper layer; and a step of forming a conductive material pattern in a region where the surface of the substrate or the surface of the etching stopper layer is exposed. In this case, it is possible to selectively form a highly accurate conductive material pattern on the substrate or on the etching stopper layer on the surface of the substrate.

The insulating material pattern can be selectively formed by forming a photosensitive resin on the surface of the base material, performing selective exposure with a desired mask pattern, and then developing the base material or the etching stopper layer surface. It is possible to form an insulating material pattern in a desired region.

Further, by forming the pattern with the conductive material by plating, the pattern with the conductive material can be easily formed. Also,
By performing electroplating as the plating, it is possible to easily and selectively form a pattern made of a conductive material only on the surface of the base material or the surface of the etching stopper layer where the insulating material pattern such as the photosensitive resin is removed and exposed. It is assumed that.

Further, by bonding the back surface of the base material to the substrate and then forming a pattern of a conductive material, even if the base material is a thin film, the base material is reinforced by a substrate having another strength. This makes it possible to facilitate processes such as pattern formation using a conductive material.

Further, the adhesion of the back surface of the base material to the substrate is based on an adhesive, and the adhesive loses adhesive strength at a predetermined temperature or higher, so that the bonded substrate is heated after completing each step. As a result, the adhesive force is lost, and separation can be easily performed without applying a mechanical adapting force.

A transfer medium in which a pattern made of a conductive material is provided on the surface of the base material or a transfer medium in which at least an etching stopper layer is formed on the surface of the base material and a desired pattern made of a conductive material is provided on the surface of the etching stopper layer A step of forming a medium, a step of bonding a pattern surface made of a conductive material of the transfer medium having a conductive pattern formed thereon to an insulating substrate, and leaving the pattern of the conductive material with the base material of the transfer medium. A step of selectively etching away or sequentially removing the etching stopper layer and the base material to produce a wiring pattern using the transfer medium of the present invention.

[0026]

EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples. (Example 1) As shown in FIG. 1, a metal layer 102 for forming a pattern made of a conductive material was formed on a metal surface as a substrate 101. For example, aluminum is used as the metal of the base material 101, and copper is used for the metal layer 102 for forming the conductive pattern. This copper can be formed by electroplating, vapor deposition or bonding to aluminum. Thus, a transfer medium is formed. here,
The substrate 101 is desirably as thin as about 1 mm or less in order to be removed by etching in a later step. However, if it is too thin, it may be difficult to handle, so that the thickness is desirably 5 μm or more, for example, about 50 μm. However, thinning is important for easy removal by etching, and wrinkles and bends can often occur even with a thickness of about 50 μm depending on handling. Here, for example, a polyethylene terephthalate (PET) film having moderate strength and relatively acid resistance and alkali resistance is used as the substrate 104 to facilitate handling.
3 can be reinforced by bonding to a metal layer 102 for forming a pattern of a conductive material of a transfer medium, that is, a back surface on which a desired pattern of copper is not formed (FIG. 2). It should be noted that an adhesive whose adhesive force is substantially weakened or lost when the temperature reaches a predetermined temperature or more is used as the adhesive 103. This is achieved, for example, by including a foaming agent that foams above a predetermined temperature. The substrate 104 to which the adhesive 103 has been attached is commercially available, for example, as “Riba Alpha” (trade name). The copper was photo-etched to form a pattern 102 of a conductive material (FIG. 3). Here, as a photoresist for photoetching, a finer pattern can be formed by using a liquid resist than by using a film resist. The metal as the base material 101 and the metal layer 102 for forming the conductive material pattern were made of different metal materials having different etching solutions. By selecting an appropriate etchant for each metal material, only each metal could be selectively etched. In this case, for the etching of the pattern formation of copper, which is a conductive material, since aluminum is also etched in the case of ordinary copper chloride or copper sulfate, by selecting sodium persulfate or ammonium persulfate which does not etch aluminum. Only copper could be selectively etched. Then, even if over-etching is performed during the formation of the conductive pattern of copper, the metal of the base material 101, that is, aluminum is not etched, so that it can be used as an etching stopper.

On the other hand, aluminum is a hydrochloric acid solution such as hydrochloric acid:
Although it can be easily etched by water = 1: 1, the copper of the base material 101 is not etched by this solution. After pattern formation, the copper surface may be subjected to a surface treatment such as a roughening treatment. The metal layer 102 of the pattern made of a conductive material
When removing the resist after etching the unnecessary area of
Sodium carbonate is used for the film resist, and an alkali solution such as sodium hydroxide is used for the liquid resist. These solutions slightly etch the aluminum which is the base material 101. Substrate 104 having adhesive
Since it is bonded to aluminum of No. 01, it is protected and also protected from etching and the like. By such a process, the metal layer 102 having a desired conductive pattern made of aluminum as a base material and copper as a conductive material is formed.
Is provided, and the transfer medium of the present invention can be formed in which aluminum as the base material 101 and copper as the conductive material can be removed by different etchants.

After the transfer medium was formed, the transfer medium was heated to a temperature higher than the temperature at which the foaming agent of the adhesive 103 foamed, whereby the foaming agent of the adhesive 103 foamed and the adhesive force was lost. As a result, the substrate 101 made of aluminum on which the metal layer 102 having a desired pattern of copper as the conductive material is formed can be easily separated from the substrate 104, and the transfer medium of the present invention is obtained (FIG. 4). ). The heating temperature in this case can be 90 ° C. to 180 ° C. depending on the foaming agent. However, the heating temperature can sufficiently withstand the baking of the photoresist. Desired pattern metal layer 1
In order to prevent 02 from being deteriorated by thermal oxidation or the like, about 150 ° C. is appropriate. Here, the substrate 1
Although PET was used for 04, other organic materials, glass, and stainless steel may be used as long as they have moderate strength and relatively acid resistance and alkali resistance.

Thereafter, as shown in FIG. 5, an adhesive 106 was applied to the surface of the insulating substrate 105 to approach the surface of the metal layer 102 of the transfer medium shown in FIG. Next, the surface on the adhesive 106 side of the insulating substrate 105 made of glass epoxy or the like to which the adhesive 106 is attached, and the surface on which the metal layer 102 of the desired pattern of the conductive material of the foamed and peeled base 101 is formed. Were bonded together (FIG. 6). At this time, this bonding can be easily performed by pressing, and the bonding force can be increased by performing the bonding while heating. Here, as the insulating substrate 105, a substrate in which an oxide film or a nitride film is formed on the surface of a glass substrate or a silicon substrate, a resin material, or a semi-cured prepreg resin can be used. In the case of a prepreg resin, adhesiveness is generated by the heating temperature at the time of pressure bonding, so that the adhesive 106 is not particularly necessary. Alternatively, a transfer medium may be adhered to the base material 101 on which the metal layer 102 having a desired pattern formed of a conductive material is formed on both sides of the insulating substrate 105. Further, a through-hole is provided in the insulating substrate 105, and the metal layer 102 having a desired pattern made of a conductive material adhered to both surfaces of the insulating substrate 105 by plating the inside of the through-hole, filling the hole with a conductive paste, or the like. It is possible to connect them together.

Thereafter, the aluminum of the base material 101 is etched and removed by the above-mentioned hydrochloric acid solution, for example, a solution of hydrochloric acid: water = 1: 1, thereby forming a wiring with a desired pattern of metal 102 of a conductive material using a transfer medium. A pattern was formed (FIG. 7). At this time, as described above, the metal layer 102 having a desired pattern made of a conductive material can be easily left because it is not etched,
Unnecessary mechanical stress was not applied to the metal layer 102 having a desired pattern made of a conductive material, and a high yield was obtained without disconnection or peeling of the pattern. Also,
On one surface of the insulating substrate 105, a pattern is formed by a glass epoxy substrate on which ordinary copper is bonded, a through hole is formed as described above, and the substrate is formed as a substrate provided with electrical connection means. By doing so, only non-defective products are selected, and the transfer medium on which the fine pattern of the present invention has been formed can be formed by inspection using only non-defective products, resulting in a high yield. Here, the base material 101 and the metal layer 10 having a desired pattern made of a conductive material are used.
In the selective etching with No. 2, the material and the etching solution may have a sufficient difference between the respective etching rates, for example, a difference of several times.

Therefore, these materials are not limited to a combination of aluminum and copper and the etching solution is limited to hydrochloric acid solution and ammonium persulfate. (Embodiment 2) As shown in FIG. 8, a copper foil having a thickness of about 18 μm, which can be easily removed by etching in a later step, is used as a substrate 201, and plating or vapor deposition is performed on the surface of the etching stopper layer 207 on the surface of the copper foil. Nickel is used as an etching stopper layer 207 by adhesion or the like, and is 3 μm without pinholes.
Degree formed. Further, a metal layer 202 of a conductive material was sequentially formed on the nickel surface by plating, vapor deposition, adhesion, or the like. Here, the metal layer 202 has a thickness that satisfies the electrical characteristics as a wiring material and has a thickness capable of forming a fine pattern without being affected by side etching or the like at the time of subsequent etching, for example, 10 μm. Formed to the extent. Next, as in the first embodiment, the adhesive 20 containing a foaming agent is used.
3 on a PET film as a substrate 204 on which
No. 01 was adhered to the opposite surface on which nickel and copper were applied (FIG. 9). Thereafter, copper, which is a metal layer 202 of a conductive material on the surface, was photo-etched to form a metal layer 202 of a conductive material having a desired pattern (FIG. 10). Here, nickel of the etching stopper layer 207 is not etched by an ammonium persulfate solution as an etching solution of copper which is the metal layer 202 of the conductive material, so that only copper which is the metal layer 202 of the conductive material is etched. . Further, since the copper of the base material 201 was protected from the back side by the substrate 204, there was no attack.

Thereafter, the adhesive containing the foaming agent was foamed by heating, so that the adhesive force was lost and the substrate 204 and the etching stopper layer 207 were formed from the substrate 204 and a desired pattern was formed on the surface thereof. A transfer medium composed of the metal layer 202 of a conductive material was obtained (FIG. 11).

Next, the surface of the insulating substrate 205 on the side of the adhesive 206 made of glass epoxy or the like to which the adhesive 206 has been adhered, and the metal layer 202 of a conductive material formed in a desired pattern on the foamed and peeled substrate 201 Were bonded together (FIG. 12) by a hot press (FIG. 13). Here, the insulating substrate 205 is heated and pressed at a temperature not lower than the temperature at which the foaming agent of the adhesive 203 foams as described above without heat-peeling the substrate 204, so that the transfer medium and the insulating substrate 213 are bonded together. 204 was simultaneously peeled off.

Thereafter, copper on the substrate 201 was etched with an ammonium persulfate solution, and nickel was individually etched away with a hydrochloric acid solution to form a wiring pattern using a transfer medium (FIG. 1).
4).

In the embodiment of the present invention, copper is used for the substrate 201, but any material may be used as long as the etching stopper layer 207 and the etching solution are different, and aluminum may be used. The etching stopper layer 207 includes iron, chromium, and the like in addition to nickel.

(Example 3) As shown in FIG.
Adhesive containing a foaming agent on the back surface of aluminum
3, the substrate 304 was bonded. Next, in order to form an insulating pattern on the aluminum surface of the base material 301,
As an insulating material, a photosensitive resin having a desired thickness of, for example, 10 μm was applied by a spinner, a roll coat, or the like.
Then, exposure and development were performed using a mask having a desired pattern to form a photosensitive resin pattern 308 on the aluminum surface of the substrate 301 (FIG. 16). Next, by performing copper plating on the exposed surface of the base material 301,
A desired pattern of the metal layer 302 was formed using copper as a conductive material (FIG. 17). Here, when the plating is electroless plating, copper also grows on the photosensitive resin pattern 308. Then, when the photosensitive resin is removed, the copper grown on the photosensitive resin pattern 308 is removed together with the photosensitive resin, that is, lift-off is performed. If the photosensitive resin is not sufficiently thicker than the copper to be plated, the photosensitive resin is removed. In some cases, a desired pattern of the metal layer 302 made of copper, which is a conductive material, cannot be obtained because the conductive resin is covered with copper and is not removed properly. However, in the case of electroplating, copper is not deposited on the pattern 308 region of the photosensitive resin, which is an electrically insulating material, so that copper can be selectively formed only in a desired region easily. In this case, if the above-described etching stopper layer is used, it must be a conductive material. Thereafter, the photosensitive resin layer was removed with a sodium hydroxide solution of about 3% by weight (FIG. 18). Next, a foaming agent of the adhesive 303 was foamed by heating to peel off the substrate 304, thereby obtaining a transfer medium (FIG. 19). Here, in plating, there is no side etching like etching, and a plating pattern can be formed faithfully to a resist pattern, which is advantageous for forming a fine pattern. In addition, as the insulating material, an inorganic material such as glass, a polyimide resin, or the like can also be used. In particular, when a conductive pattern such as a copper foil is transferred using the transfer medium of the present invention using a grease sheet made of alumina or a composite material as an electrically insulating material, the fine pattern is obtained by firing in a low oxygen atmosphere or a reducing atmosphere. A patterned alumina or composite material substrate can be obtained. In this case, a copper foil or the like obtained by photoetching can be used as the conductor, so that a finer and lower-resistance wiring pattern than that obtained by conventional printing and firing can be obtained. Thereafter, as in the first and second embodiments, the base material is selectively etched and removed after bonding to the insulating substrate.

[0037]

As described above, according to the present invention,
By forming the transfer medium by using a combination of different materials for the conductive material pattern and the base material, the fine wiring pattern can be easily formed, and only non-defective products can be formed separately from the insulating substrate such as glass epoxy. Can be used, and the yield can be improved. In addition, by enabling removal by etching without mechanically peeling the substrate after bonding with the insulating substrate, a fine circuit board can be obtained without applying a mechanical stress to a fine wiring pattern. . As a result, a fine circuit board can be manufactured with a high yield without causing a break or deformation of the fine wiring pattern. Furthermore, by bonding the substrate to another substrate such as a substrate with an adhesive containing a foaming agent, the substrate can be reinforced and protected from an etching solution, and the adhesive force can be easily lost by heating after the process. Thus, a transfer medium can be manufactured with high yield without requiring any mechanical treatment.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of a manufacturing process of a transfer medium and a circuit board in Embodiment 1 of the present invention, and is a cross-sectional view in which a metal layer is formed on a surface of a base material.

FIG. 2 is a schematic cross-sectional view of the manufacturing process, in which the substrate is integrated as a reinforcement via an adhesive layer.

FIG. 3 is a schematic cross-sectional view of the manufacturing process, in which a pattern made of a conductive material is formed by photo-etching a metal layer.

FIG. 4 is a schematic cross-sectional view of the same manufacturing process in which a transfer medium of the present invention is formed by peeling a substrate on which a metal layer having a desired pattern is formed.

5 is a schematic cross-sectional view of the same manufacturing process, in which an adhesive is attached to the surface of the insulating substrate, and the surface of the transfer medium of FIG.

FIG. 6 is a schematic cross-sectional view of the same manufacturing process in which an insulating substrate is bonded to a metal layer surface of a transfer medium via an adhesive.

FIG. 7 is a schematic cross-sectional view of the manufacturing process, in which a metal wiring pattern having a desired pattern is exposed by removing a base material by etching;

FIG. 8 is a schematic diagram of a process for manufacturing a transfer medium and a circuit board using an etching stopper layer in Embodiment 2 of the present invention, in which a base material that is easily removed by etching, an etching stopper layer, and a metal layer of a conductive material are sequentially formed. FIG.

FIG. 9 is a schematic cross-sectional view of the same manufacturing process, in which a PET film substrate is integrated via an adhesive containing a foaming agent.

FIG. 10 is a schematic cross-sectional view of the same manufacturing process in which a metal layer of a conductive material having a desired pattern is formed by photoetching the metal layer.

FIG. 11 is a schematic diagram of the same manufacturing process, and is a cross-sectional view of a transfer medium formed of a base material, an etching stopper layer, and a metal layer of a conductive material formed in a desired pattern on the surface thereof.

12 is a schematic cross-sectional view of the same manufacturing process, in which an adhesive is attached to the surface of the insulating substrate, and the surface of the transfer medium of FIG. 11 is brought closer to the surface of the metal layer.

FIG. 13 is a schematic cross-sectional view of the manufacturing process, in which an insulating substrate is bonded to a surface of a metal layer of a transfer medium via an adhesive.

FIG. 14 is a schematic cross-sectional view of the manufacturing process, in which a metal wiring pattern having a desired pattern is exposed by removing a base material by etching;

FIG. 15 is a schematic view of a manufacturing process according to a third embodiment of the present invention, and is a cross-sectional view in which a substrate is bonded to the back surface of a base material via an adhesive containing a foaming agent.

FIG. 16 is a schematic cross-sectional view of the same manufacturing process, in which a photosensitive resin pattern is formed on the surface of a base material.

FIG. 17 is a cross-sectional view of the same manufacturing process diagram in which a desired pattern of a metal layer made of copper is formed by performing copper plating on an exposed surface of a base material.

FIG. 18 is a schematic cross-sectional view of the same manufacturing process, with the photosensitive resin layer removed.

FIG. 19 is a schematic cross-sectional view of the manufacturing process, in which a transfer medium is formed by foaming an adhesive foaming agent by heating and peeling a substrate.

[Explanation of symbols]

 101, 201, 301 Base material 102, 202, 303 Metal layer made of conductive material 103, 203, 303 Adhesive containing foaming agent 104, 204, 304 Substrate 105, 205, 305 Insulating substrate 106, 206, 306 Adhesion Agent 207 etching stopper layer 308 photosensitive resin

 ──────────────────────────────────────────────────続 き Continued from the front page (72) Inventor Hideki Azumaya 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (12)

[Claims] 1. A transfer medium in which a desired pattern of a conductive material is provided on a base material, and the conductive material and the base material are each made of a material that can be selectively removed. 2. A method according to claim 1, wherein at least one etching stopper layer is formed on the surface of the base material, a desired pattern of a conductive material is provided on the surface of the etching stopper layer, and the conductive material and at least the etching stopper layer are respectively provided. A transfer medium made of a material that can be selectively removed. 3. The transfer medium according to claim 1, wherein the base material and the conductive material are made of a material that can be selectively removed by a different etchant. 4. The transfer medium according to claim 2, wherein the selective removal is etching, and at least the etching stopper layer and the conductive material are made of a material that can be selectively removed by a different etchant. 5. A step of forming a conductive material layer on a surface of a substrate or an etching stopper layer on which a desired pattern of a conductive material is provided, and a step of etching the conductive material layer into a desired pattern. A method for manufacturing a transfer medium. 6. A step of forming an insulating material pattern in a desired area on a substrate surface or an etching stopper layer provided with a desired pattern of a conductive material, and exposing the substrate surface or the etching stopper layer surface. Forming a pattern of a conductive material in a region. 7. The method according to claim 7, wherein the insulating material pattern is selectively formed.
7. The method for manufacturing a transfer medium according to claim 6, wherein a photosensitive resin is applied to the surface of the base material or the surface of the etching stopper layer, and is developed after selective exposure using a desired mask pattern. 8. The pattern formation using the conductive material,
The method for producing a transfer medium according to claim 6, wherein the method is plating. 9. The method according to claim 8, wherein the plating is electroplating. 10. The method for manufacturing a transfer medium according to claim 5, wherein a pattern made of a conductive material is formed after bonding the back surface of the base material to the substrate. 11. The method for manufacturing a transfer medium according to claim 10, wherein the bonding of the back surface of the base material to the substrate is performed by an adhesive, and the adhesive loses an adhesive force at a predetermined temperature or higher. 12. A transfer medium in which a pattern made of a conductive material is provided on the surface of the base material, or at least an etching stopper layer is formed on the surface of the base material, and a desired pattern made of a conductive material layer is provided on the surface of the etching stopper layer. Forming the transfer medium, and pressing the conductive pattern surface of the transfer medium having the conductive pattern formed thereon against an insulating substrate; and selectively removing the base material of the transfer medium while keeping the conductive pattern. And a step of sequentially removing the etching stopper layer and the base material by etching.