JPH0563340A - Manufacture of wiring board provided with functional element - Google Patents

Abstract

PURPOSE:To obtain the manufacturing method of a wiring board provided with a functional element wherein a functional element of high density and high precision can be easily and simply formed. CONSTITUTION:A tantalum nitride layer 12 formed on a stainless plate 11 is etched, a specified pattern is formed, a copper layer 13 is formed, plating resist is formed, and a conductor pattern 14 is formed. Until the cooper layer 13 except the conductor pattern part is completely eliminated, copper is etched. The above plate is stacked on a glass polyimide board 15, interposing polyimide prepreg, in the manner in which the the surface on which the conductor pattern 14 is formed faces the inner side. From the laminate obtained by pressing, the stainless plate 11 is peeled and removed, thereby obtaining a wiring board having a resistance element.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a wiring board having a functional element such as a resistance element or a magnetic element.

[0002]

2. Description of the Related Art A functional element such as a resistance element or a magnetic element comprises a resistance element or a magnetic element and a pair of electrodes, and is an essential component for a wiring board. Conventionally, a wiring board having a functional element typified by a resistance element is one in which the functional element is directly mounted, one in which various pastes are printed by a screen printing method on a substrate having good heat resistance, and then subjected to heat treatment, etc. There is. As electronic devices become smaller and higher in density, there is a strong demand for higher density and higher precision in functional elements. Various functional layers are formed on alumina substrates and heat resistant polyimide films by thin film technology such as vacuum deposition and sputtering. There is one in which a functional element is formed by patterning a conductor layer and a functional layer in this order by using a photolithography technique after forming the conductor layer.

Regarding the resistance element, after forming a resistance layer on a copper foil by plating or vacuum deposition, the resistance layer is placed inside and laminated on an insulating substrate, and patterning is performed in the order of a copper foil pattern and a resistance pattern. A resistance element is proposed (Japanese Patent Laid-Open No. 62-257702).

Further, Japanese Patent Application No. 1-343352 describes
"A. After forming a copper layer forming a pattern to be a wiring portion on a temporary substrate by a vacuum film forming method, one or more thin metal layers forming a pattern having a function different from that of the copper layer on the copper layer B. Forming a thin metal layer inside and laminating and integrating with the insulating substrate material, peeling the temporary substrate and transferring the copper layer and the metal thin layer to the insulating substrate, and c. Forming a first resist pattern on the surface of the layer, performing copper plating, and then peeling off the first resist pattern, and d. Etching a desired amount of the copper layer exposed on the surface. Then, a second resist pattern is formed, and a step of etching one or more thin metal layers into a predetermined pattern by etching is performed.
Is listed.

[0005]

When a general-purpose wiring board organic material such as a glass epoxy material or a glass polyimide material is used as the insulating substrate, the heat resistance of the organic material is low and the screen printing method and It is difficult to apply the thin film method,
Since the component mounting method is common, high density wiring boards cannot be expected.

On the other hand, a method of forming a resistance layer on a copper foil and then laminating it with an organic base material is a method suitable for higher density than the component mounting method. (1) Thickness of copper foil to be used Is 18-35μ
Since it is thick as m, side etching becomes a problem during wiring formation and there is a limit to miniaturization. (2) When laminating with a prepreg or the like mainly to form a resistance layer on a roughened surface of a copper foil,
In particular, cracks occur in the resistance layer at the intersections of the glass cloth. (3) "Burn" on the outermost copper foil surface during lamination.
Therefore, there is a problem that the surface treatment of the copper foil is required for resist formation, and it is difficult to stably form a truly high-density resistance element.

Further, according to the method described in Japanese Patent Application No. 1-343352, after forming a conductor pattern (including an electrode of a resistance element), the conductor pattern has a thickness of 5 to 35 μm in order to form the resistance pattern. If it is thick, it is difficult to accurately form an etching resist for forming a resistance pattern, and it is difficult to increase the density of resistance elements. The present invention is
It is intended to provide a method of manufacturing a wiring board having a functional element that enables easy and simple manufacture of a functional element with high density and high accuracy.

[0008]

The first invention of the present application is
(A1) A thin layer having a predetermined pattern having a function different from conduction is formed on the temporary substrate, (B1) a plating resist is formed, a predetermined conductor pattern is formed by plating, and the plating resist is removed. C1) A method of manufacturing a wiring board having a functional element, which comprises removing a temporary substrate after superimposing and integrating the temporary substrate with an insulating base material so that a surface on which a conductor pattern is formed faces inward. ..

A second invention of the present application has (A2) a plating resist is formed on a temporary substrate, a predetermined conductor pattern is formed by plating, the plating resist is removed, and (B2) has a function different from conduction. A thin layer is formed, and (C2) the temporary substrate is laminated and integrated with an insulating base material so that the surface on which the thin layer having a function different from conduction is formed is inward, and then the temporary substrate is removed. , (D2) forming an etching resist on the exposed conductive pattern and a thin layer having a function different from the conduction, and removing the thin layer other than the portion constituting the functional element by etching to remove the etching resist. It is a method of manufacturing a wiring board having a functional element including the same.

According to a third aspect of the present invention, (A3) a thin layer having a function different from conduction is formed on the temporary substrate, and (B3).
A plating resist is formed, a predetermined conductor pattern is formed by plating, the plating resist is removed, and the (C3) temporary substrate is integrated with the insulating substrate so that the surface on which the conductor pattern is formed faces inside. After that, the temporary substrate is removed, (D3) an etching resist is formed on the exposed thin layer having a function different from that of the conduction, and the thin layer other than the portion constituting the functional element is removed by etching to obtain an etching resist. Is a method for manufacturing a wiring board having a functional element including removing.

According to a fourth aspect of the present invention, (A4) a thin conductor layer is formed on a temporary substrate, (B4) a thin layer having a predetermined pattern having a function different from conduction is formed, and (C4) a temporary substrate is formed. , The surface on which the thin layer having a predetermined pattern having a function different from the conduction is formed is inward, the insulating substrate is superposed and integrated, and then the temporary substrate is removed to form a (D4) plating resist, This is a method for producing a wiring board having a functional element, which comprises forming a predetermined conductor pattern by plating, removing the plating resist, and (E4) removing the conductor thin layer other than the portion where the conductor pattern is formed.

FIG. 1 shows an embodiment of the first invention. After washing the stainless steel plate 11 with acetone,
Tantalum is sputtered on one surface of the stainless steel plate 11 using a sputtering device (MLH-6315D manufactured by Nippon Vacuum Co., Ltd.) while flowing a nitrogen gas, and the tantalum nitride layer 1 is formed.
2 (thickness: 500Å) was formed. This tantalum nitride layer 1
A resist (Photech PHT-887, manufactured by Hitachi Chemical Co., Ltd.) was laminated on 2 with a hot roll laminator, a photomask was applied, and an exposure device was used for exposure. Next, an aqueous sodium carbonate solution was sprayed with a spray developing machine to develop the resist. Then, the stainless steel plate 11 was dipped in hydrofluoric acid, and the tantalum nitride layer 12 in the portion not covered with the resist pattern was etched to form a predetermined pattern. After etching, the stainless steel plate 11 was dipped in an aqueous solution of sodium hydroxide to remove the resist pattern, and further washed with dilute sulfuric acid. This stainless steel plate 1
On the surface on which the pattern of the tantalum nitride layer 12 of No. 1 is formed,
A copper layer 13 (thickness: 1000Å) was formed using a vacuum vapor deposition apparatus (EBV-6DA type manufactured by Nippon Vacuum). This copper layer 13
A resist (Photech PHT-887, manufactured by Hitachi Chemical Co., Ltd.) was laminated on the top with a hot roll laminator, a photomask was aligned and applied, and an exposure machine was used for exposure. Then, an aqueous solution of sodium carbonate was sprayed with a spray developing machine to develop the resist. Using the resist pattern obtained by development as a plating resist, copper is plated in a copper sulfate bath to form a conductor pattern 14 (thickness: 40 μm
m) was formed. The conductor pattern includes a pair of electrodes of the resistance element as shown in FIG. After plating, the stainless steel plate 11 was dipped in an aqueous sodium hydroxide solution to remove the resist (FIG. 1 (a)). Further, the stainless steel plate 11 was immersed in an aqueous solution of ammonium persulfate, and copper was etched until the copper layer 13 other than the conductor pattern portion was completely removed (FIG. 1 (b)). After cleaning the stainless steel plate 11 with dilute sulfuric acid, the conductor pattern 14 is formed.
The polyimide prepreg was sandwiched so that the surface on which was formed was inward, and the glass polyimide substrate 15 was stacked and pressed (FIG. 1 (c)). The stainless steel plate 11 was peeled off from the obtained laminate (FIG. 1 (d)) to obtain a wiring board having a resistance element.

FIG. 2 shows an embodiment of the second invention. After the stainless steel plate 21 was washed with dilute sulfuric acid, a resist (Fottec PHT-887 manufactured by Hitachi Chemical Co., Ltd.) was laminated on one surface of the stainless steel plate 21 with a hot roll laminator, a photomask was applied, and an exposure machine was used for exposure. After the exposure, an aqueous sodium carbonate solution was sprayed with a spray developing machine to develop the resist. Using the obtained resist pattern as a plating resist, copper was plated in a copper sulfate bath to form a conductor pattern 22 (thickness: 40 μm). The conductor pattern includes a pair of electrodes of a resistance element as shown in FIG. After plating, stainless plate 2
1 was immersed in an aqueous solution of sodium hydroxide to remove the resist. After this stainless steel plate 21 was washed with dilute sulfuric acid, nickel-plated on the surface on which the conductor pattern 22 was formed.
The nickel-phosphorus layer 23 (thickness:
500 Å) was formed (Fig. 2 (a)). After plating, the glass plate-polytetrafluoroethylene substrate 24 is sandwiched between the stainless steel plate 21 and the polytetrafluoroethylene prepreg so that the surface on which the conductor pattern 22 is formed faces inward.
Was stacked and pressed (Fig. 2 (b)). The stainless steel plate 21 was peeled off from the obtained laminated body (FIG. 2C), and the exposed conductor pattern 22 and the surface of the nickel-phosphorus layer 23 were washed with dilute sulfuric acid. A resist (Fottec PHT-887, manufactured by Hitachi Chemical Co., Ltd.) was laminated on the conductor pattern 22 and the nickel-phosphorus layer 23 with a hot roll laminator, a photomask was aligned and applied, and exposed by an exposure device. After the exposure, an aqueous sodium carbonate solution was sprayed with a spray developing machine to develop the resist. The obtained resist pattern as an etching resist,
The conductive pattern 22 and the nickel-phosphorus layer 23, which are not covered with the etching resist, were etched by an etching machine using an ammonium persulfate aqueous solution. After that, the laminated body was immersed in an aqueous sodium hydroxide solution to remove the resist, and further washed with dilute sulfuric acid (FIG. 2 (d)). In this way, a wiring board having a resistance element was obtained.

FIG. 3 shows an embodiment of the third invention. After washing the stainless steel plate 31 with acetone,
A vacuum deposition device (made by Nippon Vacuum Co., Ltd.
Using EBV-6DA type, nichrome layer 32 (thickness: 50
0Å, Ni: Cr = 4: 1), and further nichrome layer 3
A copper layer 33 (thickness: 1000Å) was formed on 2. A resist (Photech PHT-887, manufactured by Hitachi Chemical Co., Ltd.) is laminated on the copper layer 33 with a hot roll laminator,
A photomask was applied and exposure was performed by an exposure device. afterwards,
The resist was developed by spraying an aqueous sodium carbonate solution with a spray developing machine. Using the resist pattern obtained by development as a plating resist, copper pattern plating (thickness: 40 μm) is performed in a copper sulfate bath to form a conductor pattern 3
4 was formed. The conductor pattern includes a pair of electrodes of a resistance element as shown in FIG. After plating, the stainless steel plate 31 was dipped in an aqueous solution of sodium hydroxide to remove the resist pattern (FIG. 3 (a)). Next, the stainless steel plate 31 is dipped in an alkaline etching solution (Meltex, A process building bath solution) to remove copper until the copper layer 33 on the nichrome layer 32 other than the conductor pattern 34 is completely removed. Etching was performed (FIG. 3 (b)).
After this stainless steel plate 31 was washed with dilute sulfuric acid, it was stacked and pressed with a glass epoxy substrate 35 with an epoxy prepreg sandwiched so that the surface on which the conductor pattern 34 was formed faces inward (FIG. 3 (c)). The stainless steel plate 31 was peeled off from the obtained laminate (FIG. 3D), and the exposed surface of the nichrome layer 32 was washed with dilute sulfuric acid. A resist (Photech PHT-887, manufactured by Hitachi Chemical Co., Ltd.) was laminated on the nichrome layer 32 with a hot roll laminator, a photomask was aligned and applied, and an exposure device was used for exposure. After the exposure, an aqueous solution of sodium carbonate was sprayed with a spray developing machine to develop the solution, thereby forming an etching resist. Next, an aqueous solution of ammonium persulfate was used to etch away the portion of the nichrome layer 32 not covered with the resist pattern by an etching machine. Then, the laminate was immersed in an aqueous sodium hydroxide solution to remove the etching resist, and further washed with dilute sulfuric acid (FIG. 3 (e)). In this way, a wiring board having a resistance element was obtained.

FIG. 4 shows an embodiment of the present invention. After cleaning the glass plate 41 with acetone, a vacuum vapor deposition device (manufactured by Nippon Vacuum Co., Ltd., EBV-6
A copper layer 2 (thickness: 3000Å) was formed using DA type).
A resist (made by Shipley, TF-20) having a thickness of 10 μm was coated on the copper layer 42 with a spin coater, prebaked, and then exposed with a photomask by applying a photomask.
After the exposure, the resist was developed with a spray developing machine using a developer exclusively for TF-20, and then post-baked. On the surface of the glass plate on which the resist pattern was formed, a chromium-silicon dioxide layer 43 (thickness: 2000Å, Cr: SiO2 =) was formed by using a vacuum vapor deposition device (manufactured by Nippon Vacuum Co., Ltd., EBV-6DA type).
1: 1) was formed, and then the glass plate 41 was immersed in acetone to dissolve and remove the resist pattern. At this time, the chromium-silicon dioxide layer 43 deposited on the resist pattern is removed at the same time, and a pattern of the chromium-silicon dioxide layer is formed (FIG. 4 (a)). This glass plate 41
Was laminated and pressed with a glass epoxy substrate 44 with an epoxy prepreg so that the surface on which the pattern of the chrome-silicon dioxide layer 43 was formed was inward (FIG. 4).
(B)). The glass plate 41 was peeled off from the obtained laminate (FIG. 4C), and the exposed surface of the copper layer 42 was washed with dilute sulfuric acid. On this copper layer 42, a resist (Fottec PHT-88, manufactured by Hitachi Chemical Co., Ltd.) was used with a hot roll laminator.
7) was laminated, a photomask was aligned and applied, and exposed by an exposure device. After the exposure, an aqueous sodium carbonate solution was sprayed with a spray developing machine to develop the resist. Using the obtained resist pattern as a plating resist, copper is plated in a copper sulfate bath to form a conductor pattern 45.
(Thickness: 40 μm) was formed. The conductor pattern includes a pair of electrodes of a resistance element as shown in FIG. After plating, soak the laminate in an aqueous sodium hydroxide solution,
The resist was peeled off (FIG. 4 (d)). Next, the laminate was immersed in an aqueous solution of ammonium persulfate, and copper was etched until the copper layer 42 other than the conductor pattern portion was completely removed (FIG. 4 (e)). In this way, a wiring board having a resistance element was obtained.

As the temporary substrate, a copper plate, a copper foil, a glass plate, a ceramic plate, a resin plate, a resin film or the like is used in addition to the stainless plate. As a thin layer having a function different from conduction, if a resistance element is desired, a resistance layer such as nichrome, tantalum nitride, chromium-silicon dioxide, or nickel-phosphorus is used.If a magnetic element is desired, iron or nickel is used. A magnetic layer of cobalt, cobalt, or an alloy thereof such as permalloy. The thickness of this thin layer is preferably 0.01 to 10 μm.
Further, the thin layer is formed by a vacuum film forming method such as vapor deposition, sputtering, plasma CVD, or electroplating, electroless plating, etc. In order to obtain a predetermined pattern, etching,
A suitable technique such as lift-off can be used.

Copper is preferred as the conductor, but gold, silver,
Nickel, chrome, etc. can also be used, and the conductor pattern is formed by electroplating, electroless plating or the like. The thickness of the conductor pattern is preferably 1 to 100 μm. The conductor pattern includes a pair of electrodes of the resistance element. As the insulating base material, a film of polyethylene terephthalate, polyimide, polytetrafluoroethylene, or the like, a ceramic plate with an adhesive, or the like can be used in addition to the laminated plate of phenol, epoxy, polyimide, polytetrafluoroethylene, or the like. The plating resist or etching resist is preferably a positive or negative type liquid or film type photosensitive resist.

[0018]

According to the present invention, the high density and high precision of the functional elements such as the resistance element and the magnetic element are transferred to the insulating substrate using the temporary substrate. Can be achieved.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing the manufacturing process of the first invention.

FIG. 2 is a cross-sectional view showing the manufacturing process of the second invention.

FIG. 3 is a cross-sectional view showing the manufacturing process of the third invention.

FIG. 4 is a cross-sectional view showing the manufacturing process of the fourth invention.

[Explanation of symbols]

 11 Stainless Steel Plate 12 Tantalum Nitride Layer 13 Copper Layer 14 Conductor Pattern 15 Glass Polyimide Substrate 21 Stainless Steel Plate 22 Conductor Pattern 23 Nickel-Phosphorus Layer 23 Copper Layer 24 Glass-Polytetrafluoroethylene Substrate 31 Stainless Steel Plate 32 Nichrome Layer 33 Copper Layer 34 Conductor Pattern 35 Glass epoxy substrate 41 Glass plate 42 Copper layer 43 Chrome-silicon dioxide layer 44 Glass epoxy substrate 45 Conductor pattern

Claims (4)

[Claims] (A1) A thin layer having a predetermined pattern having a function different from conduction is formed on a temporary substrate, (B1) a plating resist is formed, and a predetermined conductor pattern is formed by plating, and the plating resist is formed. (C1) A wiring board having a functional element including removing the temporary substrate after superimposing and integrating the temporary substrate with the insulating base material so that the surface on which the conductor pattern is formed faces the inside. Manufacturing method. 2. (A2) A plating resist is formed on a temporary substrate, a predetermined conductor pattern is formed by plating, the plating resist is removed, and (B2) a thin layer having a function different from conduction is formed. (C2) The temporary substrate was laminated and integrated with the insulating base material so that the surface on which the thin layer having a function different from conduction was formed was inward, and then the temporary substrate was removed to expose (D2). Wiring having a functional element including forming an etching resist on a thin layer having a function different from that of the conductor pattern and conduction, removing the thin layer other than the portion constituting the functional element by etching, and removing the etching resist Board manufacturing method. (A3) A thin layer having a function different from conduction is formed on a temporary substrate, (B3) a plating resist is formed, a predetermined conductor pattern is formed by plating, and the plating resist is removed. Then, (C3) the temporary substrate is superposed and integrated with the insulating substrate so that the surface on which the conductor pattern is formed faces inward, and then the temporary substrate is removed, and (D3) a function different from the exposed conduction. A method for manufacturing a wiring board having a functional element, comprising: forming an etching resist on the thin layer having the functional element; removing the thin layer other than a portion constituting the functional element by etching; and removing the etching resist. 4. (A4) forming a thin conductor layer on a temporary substrate, (B4) forming a thin layer having a predetermined pattern having a function different from conduction, and (C4) forming a temporary substrate having a function different from conduction. After the superposed and integrated with the insulating substrate so that the surface on which the thin layer having the predetermined pattern is formed is on the inside, the temporary substrate is removed, (D4) a plating resist is formed, and the predetermined conductive pattern is formed by plating. And removing the plating resist, and (E4) removing a thin conductor layer other than the portion where the conductor pattern is formed.