CN108738236A - A kind of production method and products thereof of COF single-sided flexibles substrate fine-line - Google Patents
A kind of production method and products thereof of COF single-sided flexibles substrate fine-line Download PDFInfo
- Publication number
- CN108738236A CN108738236A CN201810744246.8A CN201810744246A CN108738236A CN 108738236 A CN108738236 A CN 108738236A CN 201810744246 A CN201810744246 A CN 201810744246A CN 108738236 A CN108738236 A CN 108738236A
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- Prior art keywords
- dry film
- layers
- copper
- microns
- production method
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides a kind of production method of COF single-sided flexibles substrate fine-line, includes the following steps：(1) dry film presses；(2) dry film ultraviolet exposure；(3) dry film develops；(4) electro-coppering；(5) dry film is removed；(6) base material layers of copper is etched；(7) Ni/Cr layers of metal is etched.The present invention also provides the products that the production method obtains.The present invention uses semi-additive process, can produce 10 microns of copper thickness using the dry film of high-precision glass negative and high adhesion force high-res and line width/line-spacing reaches 7 microns/7 microns of flexible single-sided substrate fine-lines of COF.
Description
Technical field
The present invention relates to a kind of production methods and products thereof of COF single-sided flexibles substrate fine-line.
Background technology
COF (Chip on film, membrane of flip chip technology) is to realize chip by chip attachment on flexible film substrates
The output of I/O is widely used on the panel of the electronic products such as mobile phone, TV, ipad.The life of COF flexible base boards is grasped at present
Production technology and the enterprise for having scale of mass production condition have focused largely on South Korea, Japan and TaiWan, China, domestic individual enterprise's tools
The standby production capacity that single side COF flexible base boards are made using etching method, but minimum feature/line-spacing is not up to 10 microns/10 microns
The rank of left and right.It, can be increasing to the demand of COF flexible base boards with the rise of panel industry OLED.COF flexible base boards
Difficult point be that line width/line-spacing is small, at present Japan and Korea S and TaiWan, China enterprise can volume production single side COF flexible base boards minimum feature/
Line-spacing has reached 10 microns/10 microns, therefore domestic enterprise is badly in need of promoting the technical capability of COF fine-lines.
Invention content
The technical problem to be solved in the present invention is to provide a kind of production methods of COF single-sided flexibles substrate fine-line, adopt
With semi-additive process, it is micro- copper thickness 10 to be produced using the dry film of high-precision glass negative and high adhesion force high-res
Rice or so and line width/line-spacing reach 7 microns/7 microns of the flexible single-sided substrate fine-lines of COF.
In order to solve the above technical problems, the technical scheme is that：
A kind of production method of COF single-sided flexibles substrate fine-line, includes the following steps：
(1) dry film presses：It is arranged W metal/Cr layers in the upper surface of polyimides lower layer, in W metal/Cr layers of upper table
Base material is made in the layers of copper that face setting thickness is 0.5 or 1 micron, presses to form dry film in the upper surface of layers of copper by vacuum pressing-combining；
(2) dry film ultraviolet exposure：Partial illumination is carried out to dry film using ultraviolet light, is irradiated by ultraviolet light on dry film
Part occurs polymerization crosslinking and forms dry film exposed portion, and remaining part is dry film unexposed portion, dry film exposure portion on dry film
Point and dry film unexposed portion have multiple and be spaced one by one in X-direction, the X of each dry film exposed portion to size be 4-7
Micron, the X of each dry film unexposed portion to size be 8-10 microns；
(3) dry film develops：By the removal of dry film unexposed portion and exposed portion layers of copper；
(4) electro-coppering：Plating is carried out to the part layers of copper exposed after step (3) and forms copper electroplated layer, layers of copper and copper
The overall thickness of electroplated layer is 12 microns；
(5) dry film is removed：All dry film exposed portions are removed；
(6) base material layers of copper is etched：The layers of copper being located on step (5) treated base material below dry film exposed portion will be passed through
It is removed by etching；
(7) Ni/Cr layers of metal is etched：It will pass through on step (6) treated base material and be located at below dry film exposed portion
W metal/Cr layers is removed by etching.
Preferably, in the step (1), W metal/Cr layers of thickness is 20-30 nanometers.
Preferably, in the step (1), the thickness of dry film is 15 microns.
Preferably, the step (2) is：Glass negative is covered on dry film, the glass negative include in X-direction one by one
The transparent region and black region at interval, the X of each transparent region are 4-7 microns to size, and the X of each black region is to ruler
Very little is 8-10 microns, and glass negative is removed after being irradiated exposure to the dry film for being covered with glass negative using ultraviolet light, is done
By the part of transparent region covering it is dry film exposed portion on film, by the part of black region overlay is that dry film is unexposed on dry film
Part.
Preferably, in the step (3), the quantity of transparent region is 3, and the quantity of black region is 2.
The present invention also provides the products that the production method obtains.
Compared with prior art, the invention has the advantages that：
The present invention is by semi-additive process, using the thin Copper base material of vacuum splashing and plating, high-accuracy glass egative film and high adhesion force
The COF single-sided flexibles substrate essence of thick 10 microns of copper and 7 microns/7 microns line width/line-spacings can be made in the dry film of high-res
Fine rule road, wherein the adhesive force optimum value of the dry film of high adhesion force is the X of dry film exposed portion to minimum dimension, height parsing
The best parsing angle value of the dry film of degree is the X of dry film unexposed portion to minimum dimension；On base material after step (7)
The width of copper electroplated layer is line width, and the distance between copper electroplated layer is line-spacing, copper electroplated layer when due to etching base material copper
Both sides can be also etched and width becomes smaller, therefore the present invention suitably reduces the X of dry film exposed portion to size, suitably increases
The X of dry film unexposed portion ensures that final line width and line-spacing all reach 7 microns to size.
Description of the drawings
Attached drawing described herein is used to provide further understanding of the present invention, and is constituted part of this application, not
Inappropriate limitation of the present invention is constituted, in the accompanying drawings：
Fig. 1 is the structural schematic diagram of step of the present invention (1)；
Fig. 2 is the structural schematic diagram of step of the present invention (3)；
Fig. 3 is the structural schematic diagram of step of the present invention (4)；
Fig. 4 is the structural schematic diagram of step of the present invention (6)；
Fig. 5 is the structural schematic diagram of step of the present invention (7)；.
Specific implementation mode
Below in conjunction with specific embodiment, the present invention will be described in detail, herein illustrative examples and explanation of the invention
For explaining the present invention, but it is not as a limitation of the invention.
Embodiment 1
COF single-sided flexible substrate fine-lines, are made by following steps：
(1) dry film presses：W metal/Cr layers 2 that setting thickness is 20 nanometers in the upper surface of polyimides lower layer 1,
The upper surface setting thickness of W metal/Cr layers 2 is that base material is made in 1 micron of layers of copper 3, by vacuum pressing-combining layers of copper 3 upper table
Face pressure closes to form the dry film that thickness is 15 microns；
(2) dry film ultraviolet exposure：Glass negative is covered on dry film, the glass negative include in X-direction one by one between
Every transparent region and black region, the X of each transparent region is 5 microns to size, and the X of each black region is equal to size
It is 9 microns, the dry film for being covered with glass negative is irradiated after exposure using ultraviolet light and removes glass negative, it is saturating on dry film
The part of bright region overlay is dry film exposed portion 4, by the part of black region overlay is dry film unexposed portion on dry film, often
The X of a dry film exposed portion 4 to size be 5 microns, the X of each dry film unexposed portion to size be 9 microns；
(3) dry film develops：By the removal of dry film unexposed portion and exposed portion layers of copper 3；
(4) electro-coppering：Plating is carried out to the part layers of copper 3 exposed after step (3) and forms copper electroplated layer 5,3 He of layers of copper
The overall thickness of copper electroplated layer 5 is 12 microns；
(5) dry film is removed：All dry film exposed portions 4 are removed；
(6) base material layers of copper is etched：The layers of copper being located on step (5) treated base material below dry film exposed portion will be passed through
3 are removed by etching；
(7) Ni/Cr layers of metal is etched：It will pass through on step (6) treated base material and be located at below dry film exposed portion
W metal/Cr layers 2 are removed by etching.
In step (3), the quantity of transparent region is 3, and the quantity of black region is 2.
Embodiment 2
As different from Example 1：In step (2), the X of each transparent region and dry film exposed portion 4 to size be 4
Micron, the X of each black region and dry film unexposed portion to size be 10 microns.
Embodiment 3
As different from Example 1：In step (1), the thickness of layers of copper 3 is 0.5 micron；In step (2), each clear area
The X of domain and dry film exposed portion 4 is 6 microns to size, and the X of each black region and dry film unexposed portion is to size
8 microns.
Embodiment 4
As different from Example 1：In step (1), the thickness of W metal/Cr layers 2 is 30 nanometers, and the thickness of layers of copper 3 is
0.5 micron；In step (2), the X of each transparent region and dry film exposed portion 4 to size be 5 microns, each black region
With the X of dry film unexposed portion to size be 9 microns.
The principle of the present invention and effect is only illustrated in above-described embodiment, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology can all carry out modifications and changes to above-described embodiment without violating the spirit and scope of the present invention.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should by the present invention claim be covered.
Claims (6)
1. a kind of production method of COF single-sided flexibles substrate fine-line, it is characterised in that：Include the following steps：
(1) dry film presses：It is arranged W metal/Cr layers in the upper surface of polyimides lower layer, is set W metal/Cr layers of upper surface
It sets the layers of copper that thickness is 0.5 or 1 micron and base material is made, press to form dry film in the upper surface of layers of copper by vacuum pressing-combining；
(2) dry film ultraviolet exposure：Partial illumination, the part being irradiated by ultraviolet light on dry film are carried out to dry film using ultraviolet light
Polymerization crosslinking occurs and forms dry film exposed portion, remaining part is dry film unexposed portion on dry film, dry film exposed portion and
Dry film unexposed portion has multiple and is spaced one by one in X-direction, the X of each dry film exposed portion to size be 4-7 microns,
The X of each dry film unexposed portion to size be 8-10 microns；
(3) dry film develops：By the removal of dry film unexposed portion and exposed portion layers of copper；
(4) electro-coppering：Plating is carried out to the part layers of copper exposed after step (3) and forms copper electroplated layer, layers of copper and copper plating
The overall thickness of layer is 12 microns；
(5) dry film is removed：All dry film exposed portions are removed；
(6) base material layers of copper is etched：It will pass through by the layers of copper being located at below dry film exposed portion on step (5) treated base material
Etching removal；
(7) Ni/Cr layers of metal is etched：The metal being located on step (6) treated base material below dry film exposed portion will be passed through
Ni/Cr layers are removed by etching.
2. the production method of COF single-sided flexibles substrate fine-line according to claim 1, it is characterised in that：The step
Suddenly in (1), W metal/Cr layers of thickness is 20 or 30 nanometers.
3. the production method of COF single-sided flexibles substrate fine-line according to claim 2, it is characterised in that：The step
Suddenly in (1), the thickness of dry film is 15 microns.
4. the production method of COF single-sided flexibles substrate fine-line according to claim 3, it is characterised in that：The step
Suddenly (2) are：Glass negative is covered on dry film, which includes the transparent region and black being spaced one by one in X-direction
Region, the X of each transparent region are 4-7 microns to size, and the X of each black region is 8-10 microns to size, is used
Ultraviolet light is irradiated after exposure the dry film for being covered with glass negative and removes glass negative, by transparent region covering on dry film
Part is dry film exposed portion, by the part of black region overlay is dry film unexposed portion on dry film.
5. the production method of COF single-sided flexibles substrate fine-line according to claim 4, it is characterised in that：The step
Suddenly in (3), the quantity of transparent region is 3, and the quantity of black region is 2.
6. according to the product that production method obtains described in claim 1-5 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810744246.8A CN108738236B (en) | 2018-07-06 | 2018-07-06 | Method for manufacturing COF single-side flexible substrate fine circuit and product thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810744246.8A CN108738236B (en) | 2018-07-06 | 2018-07-06 | Method for manufacturing COF single-side flexible substrate fine circuit and product thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108738236A true CN108738236A (en) | 2018-11-02 |
| CN108738236B CN108738236B (en) | 2020-02-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810744246.8A Active CN108738236B (en) | 2018-07-06 | 2018-07-06 | Method for manufacturing COF single-side flexible substrate fine circuit and product thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116170957A (en) * | 2022-10-24 | 2023-05-26 | 东莞市湃泊科技有限公司 | PCB processing method and system for reducing patterning times |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101360385A (en) * | 2007-07-30 | 2009-02-04 | 三星电机株式会社 | Printed circuit board and its manufacturing method |
| CN104411106A (en) * | 2014-11-14 | 2015-03-11 | 电子科技大学 | Manufacturing method of fine circuit of printed-circuit board |
| CN106783554A (en) * | 2016-12-13 | 2017-05-31 | 深圳顺络电子股份有限公司 | The preparation method and electronic component of a kind of electronic component electrode |
| CN206564726U (en) * | 2017-02-14 | 2017-10-17 | 苏州维信电子有限公司 | The FPC with ultra fine-line that Novel dry film makes |
-
2018
- 2018-07-06 CN CN201810744246.8A patent/CN108738236B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101360385A (en) * | 2007-07-30 | 2009-02-04 | 三星电机株式会社 | Printed circuit board and its manufacturing method |
| CN104411106A (en) * | 2014-11-14 | 2015-03-11 | 电子科技大学 | Manufacturing method of fine circuit of printed-circuit board |
| CN106783554A (en) * | 2016-12-13 | 2017-05-31 | 深圳顺络电子股份有限公司 | The preparation method and electronic component of a kind of electronic component electrode |
| CN206564726U (en) * | 2017-02-14 | 2017-10-17 | 苏州维信电子有限公司 | The FPC with ultra fine-line that Novel dry film makes |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116170957A (en) * | 2022-10-24 | 2023-05-26 | 东莞市湃泊科技有限公司 | PCB processing method and system for reducing patterning times |
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| Publication number | Publication date |
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| CN108738236B (en) | 2020-02-07 |
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