CN103204013B - A kind of printing Three-dimensional mask plate with figure opening - Google Patents
A kind of printing Three-dimensional mask plate with figure opening Download PDFInfo
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- CN103204013B CN103204013B CN201210010760.1A CN201210010760A CN103204013B CN 103204013 B CN103204013 B CN 103204013B CN 201210010760 A CN201210010760 A CN 201210010760A CN 103204013 B CN103204013 B CN 103204013B
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Abstract
The invention discloses a kind of printing Three-dimensional mask plate with figure opening, the printing surface including substrate and being positioned at substrate both sides and PCB surface, described mask plate has multiple figure opening and 3-D solid structure, and described 3-D solid structure includes elevated regions and the sunk area of described PCB surface being positioned at described printing surface；With the figure opening meeting print request on described 3-D solid structure.This kind of mask plate has projection and the depressed area of three-dimensional, and its height of projection is 0.1 ~ 10mm, and the degree of depth of depression is 0.1 ~ 10mm, and the outer angle in projection and depressed area and plate face is at 80 ° ~ 90 °；This mask plate is 40% ~ 55% ferrum and 45% ~ 60% nickel, and its precision is the highest；Uniformity is high, and board surface quality is good, bright, without rough point, cut, pin hole；Port quality is good, and hole wall is smooth, impulse-free robustness；This kind of mask plate production cost is low, and technique is simple, and energy consumption is low.
Description
Technical field
The present invention relates to a kind of Three-dimensional mask plate, particularly relate to the printing Three-dimensional mask plate with figure opening.
Background technology
Along with China's electron trade develops rapidly, stencil print process is also applied at electronics manufacturing, and SMT printing is exactly typical case.During Electronic products manufacturing, electronic component and PCB are welded needs first stannum is placed on PCB, and on PCB, have hundreds of pad to need stannum, the position of each pad correspond to electronic component, the most first-class disposable for the pad needing upper stannum stannum the best way be printed exactly.Method usual in electronics manufacturing is to make one piece of stainless steel substrates having numerous small holes, and each hole correspond to a pad needing stannum, then stainless steel substrates is attached on the grenadine that stretches tight, and grenadine is attached on the bottom surface of print stencil net frame.
Printing stencil is used to the mould of print solder paste, the most typically uses steel mesh.And traditional handicraft can not reach requirement by the punching block Aperture precision that laser cutting technique makes, board surface quality is the most not high enough.Electroformed nickel mask plate is then easily formed pin hole, rough point because of plate face, and solution is unstable, and cost is high, the defects such as energy consumption is big.
Tin cream on pad is the most smooth, uniform, consumption the most suitably will directly affect the effect of electronic component SMT, when particularly having precision electronic element pad and hot pressing finger, requires higher to printing stencil.
The development of PCB industry is not limited solely to plane template, and existing PCB industry development is rapid, and some have the position of particular requirement to need spill position, such as B2it printed board.Prepared 3-dimensional metal mask plate has 3-D in male structure identical with substrate; with corresponding concavo-convex position, protective substrate surface; and when the 3-dimensional metal mask plate transfer prepared by using in substrate surface relief region edge, mask open can contact with substrates into intimate thus exactitude position.Make simultaneously and there is the development trend following after the metal mask plate corresponding with concaveconvex shape on pcb board is.
How to develop a kind of printing stencil made than common steel mesh even metallic nickel printing stencil, the new product that performance is more excellent, and there is accurate depth-to-width ratio and the good concavo-convex position of port quality is most important.
Summary of the invention
(1) to solve the technical problem that
The technical problem to be solved in the present invention is to provide a kind of prints with its printing stencil made than common steel mesh of Three-dimensional mask plate, excellent performance and have accurate depth-to-width ratio and the good concavo-convex position of port quality.
(2) technical scheme
In order to solve above-mentioned technical problem, the invention provides a kind of printing Three-dimensional mask plate with figure opening, the printing surface including substrate and being positioned at substrate both sides and PCB surface, described mask plate has multiple figure opening and 3-D solid structure, and described 3-D solid structure includes elevated regions and the sunk area of described PCB surface being positioned at described printing surface；With the figure opening meeting print request on described 3-D solid structure.
Wherein, the figure opening on described 3-D solid structure is up-small and down-big opening, and its tapering is 3 ~ 8 °.
Wherein, the sunk area of described mask plate and the angle in plate face are at 80 ° ~ 90 °.
Wherein, described elevated regions and sunk area center are on the same line, and this line is vertical with the plate face of described mask plate；Described sunk area is less than the area of elevated regions, and described 3-D solid structure is hollow-core construction.
Wherein, described elevated regions is high with the aligning accuracy of described substrate, and the hole wall of 3-D solid structure is smooth, impulse-free robustness.
Wherein, the height of described elevated regions is 0.1 ~ 10mm.
Wherein, the degree of depth of described sunk area is 0.1 ~ 10mm.
Wherein, the substrate thickness of described metal mask plate is 20 ~ 100um.
Wherein, the material of described mask plate is dilval, and two kinds of component sums are 100%, and described iron content is 40% ~ 55%, and nickel content is 45% ~ 60%.
Wherein, uniformity COV of described ferro-nickel alloy plating is less than 5%；Described ferro-nickel alloy plating surface brightness is one-level light, without rough point, pin hole.
(3) beneficial effect
A kind of printing Three-dimensional mask plate with figure opening that technique scheme is provided, the printing surface including substrate and being positioned at substrate both sides and PCB surface, described mask plate has multiple figure opening and 3-D solid structure, and described 3-D solid structure includes elevated regions and the sunk area of described PCB surface being positioned at described printing surface；With the figure opening meeting print request on described 3-D solid structure.This kind of mask plate has projection and the depressed area of three-dimensional, and its height of projection is 0.1 ~ 10mm, and the degree of depth of depression is 0.1 ~ 10mm, and the outer angle in projection and depressed area and plate face is at 80 ° ~ 90 °；This mask plate be 40% ~ 55% ferrum and this kind of mask plate precision of 45% ~ 60% nickel the highest；This kind of mask plate uniformity is high, and board surface quality is good, bright, without rough point, cut, pin hole；Port quality is good, and hole wall is smooth, impulse-free robustness；This kind of mask plate production cost is low, and technique is simple, and energy consumption is low.
Accompanying drawing explanation
Figure 1A is embodiment of the present invention metal mask plate 3 D stereo area schematic；
Figure 1B is A ~ A schematic cross-section of Figure 1A；
Fig. 2 is the figure opening schematic diagram on embodiment of the present invention cut 3-D solid structure；
Fig. 3 is that the embodiment of the present invention prints schematic diagram；
Wherein: 1: elevated regions；2: sunk area；3: printing surface；4:PCB face；5: opening；11: mask plate；22: figure opening；111:PCB plate；222:PCB plate elevated regions；444: scraper；555: material for transfer.
Detailed description of the invention
Below in conjunction with the accompanying drawings and embodiment, the detailed description of the invention of the present invention is described in further detail.Following example are used for illustrating the present invention, but are not limited to the scope of the present invention.
Shown in Figure 1A, 1B, Fig. 2 and 3, embodiments provide a kind of printing Three-dimensional mask plate 11 with figure opening, the printing surface 3 including substrate and being positioned at substrate both sides and PCB surface 4, mask plate 11 has multiple figure opening 22 and 3-D solid structure, and 3-D solid structure includes the sunk area 2 of the elevated regions 1 and PCB surface 4 being positioned at printing surface 3；With the figure opening 5 meeting print request on 3-D solid structure.Can obtain high accuracy printing 3 D stereo dilval mask plate 11, plate face brightness is good, and coating surface quality is good, without pit, pin hole etc.；The outer angle in up and the down district of differing heights or the degree of depth, up and down district and plate face can be obtained very close to 90 ° of required precisions being beneficial to print tin cream at present；The Aperture precision of relatively laser steel mesh is high, and port quality is good, and hole wall is smooth；This kind of mask plate 11 uniformity is high；The relatively low cost of metallic nickel mask plate 11, energy consumption is low, and technique is simple.
This template is the first step print solder paste being applied in SMT surface mounting technology flow process, and in printing process, the uniformity in plate face and the quality of port quality directly affect the quality of lower stannum quality.Uniformity is good, the lower stannum bad phenomenon of the thinnest position, plate face would not occurs.Typically improve coating uniformity by one anode baffle of addition in electrotyping bath；Port quality is good, the stannum that would not occur collapsing, even stannum, draws the bad phenomenon such as point.Compared with the great advantage of laser steel mesh, electroforming is that electroforming is the deposition of atomic level, as long as development point control obtains very well, and the bad phenomenon such as smooth, the impulse-free robustness of hole wall of electroforming mask plate 11 out.Referring in particular to shown in Fig. 3, pcb board 111 coordinates with the PCB surface 4 of mask plate 11, and pcb board elevated regions 222 coordinates with the 3-D solid structure of mask plate 11, and in printing process, scraper 444 mobilization material 555 moves on the printing surface 3 of mask plate 11.With meeting the figure opening 5 of print request on the 3-D solid structure of mask plate 11, and the pcb board region corresponding with opening 5 arranges welding copper platform 333.Figure opening 5 on 3-D solid structure is up-small and down-big opening, and its tapering is 3 ~ 8 °.
Elevated regions 1 and sunk area 2 center are on the same line, and this line is vertical with the plate face of mask plate 11.The sunk area 2 of mask plate 11 and the angle in plate face are at 80 ° ~ 90 °.Sunk area 2 is less than the area of elevated regions 1, and 3-D solid structure is hollow-core construction.Elevated regions 1 is high with the aligning accuracy of substrate, and the hole wall of 3-D solid structure is smooth, impulse-free robustness.
For Three-dimensional mask plate 11, the problem overcome is needed to have protruding and sunk area 2 making the most excellent, especially positional precision.In order to coordinate the required precision of specific position, and the depth-to-width ratio in up or down district is required strict, also include the angle in raised or sunken district and direction, perpendicular plate face.Therefore, selection and making for core are particularly important, and the adhesion between down district and plane coating is also the emphasis considered besides.The making of elevated regions 1 and sunk area 2 mainly by first etching core, is produced a convex on core, then is carried out electroforming on this core, peel off the 3-D solid structure that i.e. can get differing heights and the degree of depth after electroforming.
Printing is high with 3 D stereo dilval mask plate 11 Aperture precision, and product component can meet print request simultaneously, and product thickness also can control in claimed range；Use 304 rustless steel cores as cathode base, coating is easily peeled off, and the depression of available angle composite demand and elevated regions 1, this is owing to 304 stainless steel surfaces define one layer of fine and close oxidized surface film with amorphous structure, the biggest crystalline phase difference is had with sedimentary, thus " not bonding " characteristic of the electroformed layer formed, the beneficially stripping of sunk area 2.
The height of elevated regions 1 is 0.1 ~ 10mm, and the height of preferred elevated regions 1 is 0.5 ~ 1mm.The degree of depth of sunk area 2 is 0.1 ~ 10mm.Preferably the degree of depth of sunk area 2 is for for 0.5 ~ 1mm.The substrate thickness of metal mask plate 11 is 20 ~ 100um.
The material of mask plate 11 is dilval, and two kinds of component sums are 100%, and iron content is 40% ~ 55%, and nickel content is 45% ~ 60%.Uniformity COV of ferro-nickel alloy plating is less than 5%；Ferro-nickel alloy plating surface brightness is one-level light, without rough point, pin hole.
As can be seen from the above embodiments, embodiments provide a kind of printing Three-dimensional mask plate 11 with figure opening, the printing surface 3 including substrate and being positioned at substrate both sides and PCB surface 4, mask plate 11 has multiple figure opening 22 and 3-D solid structure, and 3-D solid structure includes the sunk area 2 of the elevated regions 1 and PCB surface 4 being positioned at printing surface 3；With the figure opening 5 meeting print request on institute's 3-D solid structure.This kind of mask plate 11 has projection and the depressed area of three-dimensional, and its height of projection is 0.1 ~ 10mm, and the degree of depth of depression is 0.1 ~ 10mm, and the outer angle in projection and depressed area and plate face is at 80 ° ~ 90 °；This mask plate 11 component be 40% ~ 55% ferrum and 45% ~ 60% nickel this kind of mask plate 11 precision the highest；This kind of mask plate 11 uniformity is high, and board surface quality is good, bright, without rough point, cut, pin hole；Port quality is good, and hole wall is smooth, impulse-free robustness；This kind of mask plate 11 production cost is low, and technique is simple, and energy consumption is low.
Below it is only the preferred embodiment of the present invention; it should be pointed out that, for those skilled in the art, on the premise of without departing from the technology of the present invention principle; can also make some improvement and replacement, these improve and replace and also should be regarded as protection scope of the present invention.
Claims (9)
1. the printing Three-dimensional mask plate with figure opening, it is characterized in that, the printing surface including substrate and being positioned at substrate both sides and PCB surface, described mask plate has multiple figure opening and 3-D solid structure, and described 3-D solid structure includes elevated regions and the sunk area of described PCB surface being positioned at described printing surface；With the figure opening meeting print request on described 3-D solid structure, it is characterised in that: described mask used for printing plate uses the 304 rustless steel cores being etched with depression to carry out electrotyping process as cathode base；Wherein, before carrying out electrotyping process, this core need to first pass through etching and produce a depression, and defines one layer of dense oxide skin covering of the surface with amorphous structure on surface；The material of described mask plate is dilval, and two kinds of component sums are 100%, and described iron content is 40% ~ 55%, and nickel content is 45% ~ 60%.
Printing Three-dimensional mask plate with figure opening the most according to claim 1, it is characterised in that the figure opening on described 3-D solid structure is up-small and down-big opening, its tapering is 3 ~ 8 °.
Printing Three-dimensional mask plate with figure opening the most according to claim 2, it is characterised in that the angle in the sunk area of described mask plate and plate face is at 80 ° ~ 90 °.
Printing Three-dimensional mask plate with figure opening the most according to claim 3, it is characterised in that described elevated regions and sunk area center are on the same line, and this line is vertical with the plate face of described mask plate；Described sunk area is less than the area of elevated regions, and described 3-D solid structure is hollow-core construction.
Printing Three-dimensional mask plate with figure opening the most according to claim 4, it is characterised in that described elevated regions is high with the aligning accuracy of described substrate, and the hole wall of 3-D solid structure is smooth, impulse-free robustness.
Printing Three-dimensional mask plate with figure opening the most according to claim 5, it is characterised in that the height of described elevated regions is 0.1 ~ 10mm.
Printing Three-dimensional mask plate with figure opening the most according to claim 6, it is characterised in that the degree of depth of described sunk area is 0.1 ~ 10mm.
Printing Three-dimensional mask plate with figure opening the most according to claim 3, it is characterised in that the substrate thickness of described metal mask plate is 20 ~ 100um.
Printing Three-dimensional mask plate with figure opening the most according to claim 1, it is characterised in that uniformity COV of described ferro-nickel alloy plating is less than 5%；Described ferro-nickel alloy plating surface brightness is one-level light, without rough point, pin hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010760.1A CN103204013B (en) | 2012-01-16 | 2012-01-16 | A kind of printing Three-dimensional mask plate with figure opening |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010760.1A CN103204013B (en) | 2012-01-16 | 2012-01-16 | A kind of printing Three-dimensional mask plate with figure opening |
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| CN103204013A CN103204013A (en) | 2013-07-17 |
| CN103204013B true CN103204013B (en) | 2016-12-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210010760.1A Expired - Fee Related CN103204013B (en) | 2012-01-16 | 2012-01-16 | A kind of printing Three-dimensional mask plate with figure opening |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103203984B (en) * | 2012-01-16 | 2016-06-15 | 昆山允升吉光电科技有限公司 | A kind of printing Three-dimensional mask plate |
| CN103203983B (en) * | 2012-01-16 | 2016-01-27 | 昆山允升吉光电科技有限公司 | A kind of printing Three-dimensional mask plate with figure opening |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006062457A1 (en) * | 2004-12-10 | 2006-06-15 | Hp Etch Ab | Solder paste stencil and method for producing the same |
| CN101540288A (en) * | 2008-03-18 | 2009-09-23 | 恩益禧电子股份有限公司 | Method for printing a metal paste, metal mask, and bump forming method |
| CN202528605U (en) * | 2012-01-16 | 2012-11-14 | 昆山允升吉光电科技有限公司 | Printing three-dimensional mask plate with graphic openings |
| CN103203983A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Three-dimensional mask plate with graphic openings and for printing |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3120130B2 (en) * | 1992-02-24 | 2000-12-25 | 九州日立マクセル株式会社 | Manufacturing method of metal mask plate for printing |
| JPH0761158A (en) * | 1993-08-31 | 1995-03-07 | Matsushita Electron Corp | Metal mask for printing and printing method using the same |
| JP2000071637A (en) * | 1998-09-03 | 2000-03-07 | Taiyo Kagaku Kogyo Kk | Metal mask and its manufacture |
| JP2000168256A (en) * | 1998-12-02 | 2000-06-20 | Ricoh Microelectronics Co Ltd | Printing mask and manufacture of printing mask |
| JP2003080859A (en) * | 2001-09-13 | 2003-03-19 | Rohm Co Ltd | Method for screen-printing paste on lead frame, and its apparatus |
| JP2006213000A (en) * | 2005-02-07 | 2006-08-17 | Bonmaaku:Kk | Screen printing plate and its manufacturing method |
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2012
- 2012-01-16 CN CN201210010760.1A patent/CN103204013B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006062457A1 (en) * | 2004-12-10 | 2006-06-15 | Hp Etch Ab | Solder paste stencil and method for producing the same |
| CN101540288A (en) * | 2008-03-18 | 2009-09-23 | 恩益禧电子股份有限公司 | Method for printing a metal paste, metal mask, and bump forming method |
| CN202528605U (en) * | 2012-01-16 | 2012-11-14 | 昆山允升吉光电科技有限公司 | Printing three-dimensional mask plate with graphic openings |
| CN103203983A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Three-dimensional mask plate with graphic openings and for printing |
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| CN103204013A (en) | 2013-07-17 |
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