CN108401385A - A kind of production method and PCB of the stepped groove that side wall is non-metallic - Google Patents
A kind of production method and PCB of the stepped groove that side wall is non-metallic Download PDFInfo
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- CN108401385A CN108401385A CN201810218711.4A CN201810218711A CN108401385A CN 108401385 A CN108401385 A CN 108401385A CN 201810218711 A CN201810218711 A CN 201810218711A CN 108401385 A CN108401385 A CN 108401385A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to PCB technical fields, disclose a kind of production method and PCB of the stepped groove that side wall is non-metallic.The production method includes：The multi-layer board with initial step slot is made in pressing；Multi-layer board includes the first superficies and the second superficies, and the notch of initial step slot is formed in the first superficies；Integral tin after whole heavy copper is electroplated is carried out to multi-layer board；Remove the tin layers of the first boundary position and the second boundary surface of position so that the layers of copper of the first boundary position and the second boundary position is exposed；First boundary position is located at the boundary position of side wall and the first superficies, and the second boundary position is located at the boundary position of side wall and bottom surface；The layers of copper of two boundary positions is removed, removes remaining tin layers later；Predetermined pattern is made in the slot bottom of initial step slot, and removes the layers of copper of side wall.The present invention can greatly simplify manufacture craft compared with the existing technology by the way of first making stepped groove and making slot bottom figure again, reduce operation difficulty, improve working efficiency.
Description
Technical field
The present invention relates to PCB (Printed Circuit Board, printed wiring board) technical fields, more particularly to one kind
The production method and PCB of the non-metallic stepped groove of side wall.
Background technology
With the development of science and technology electronic product indispensable articles for daily use in having become for people's lives, and PCB is electronics
The important component of product, people are more and more to the functional requirement of electronic product in recent years, thus also proposed more to PCB
High requirement.In general, for the ease of the device for installing the device of specific function on PCB or needs sink, it is often necessary to
Stepped groove is set on PCB, and stepped groove is also the pith for realizing product high-power heat-dissipation, is in industry widely used.
The side wall of stepped groove can metallize, can also be non-metallic；And for the non-metallic PCB of ladder groove sidewall,
There are mainly two types of production methods general at present：
One kind is controlled depth milling production method.It is bigger that this production method not only controls deep difficulty, it is difficult to which controlled depth milling is to specified line
Road floor leads to not meet design requirement；And figure can not be made in slot bottom.
Another kind is the via and figure of pre-production slot bottom, after filling or embedment gasket, carries out pressing plate successively, uncaps
And take out gasket.On the one hand this production method must make ladder since pre-production slot bottom figure makes stepped groove again
Protection processing, complex process and operating difficulties are carried out to slot bottom figure during slot；On the other hand, it is needing to make different graphic
Production requirement under do not have versatility, constrain the popularization and application of stepped groove PCB.
Invention content
The purpose of the present invention is to provide a kind of production methods and PCB of the stepped groove that side wall is non-metallic, overcome existing
The defect of complex manufacturing technology, operating difficulties and poor universality existing for technology.
For this purpose, the present invention uses following technical scheme：
A kind of production method for the stepped groove that side wall is non-metallic, including：
The multi-layer board with initial step slot is made in pressing；The multi-layer board includes the first outer layer being distributed in the stacking direction
The notch of surface and the second superficies, the initial step slot is formed in first superficies；
Whole heavy copper plating is carried out to the multi-layer board；
Integral tin is carried out to the multi-layer board；
Remove the tin layers of the first boundary position and the second boundary surface of position so that hand over first boundary position and second
The layers of copper of boundary position is exposed；First boundary position is located at the boundary position of the side wall and first superficies, institute
State the boundary position that the second boundary position is located at the side wall and the bottom surface；
The layers of copper of first boundary position and second boundary position is removed, removes remaining tin layers later；
Predetermined pattern is made in the slot bottom of the initial step slot, and removes the layers of copper of the side wall.
Optionally, the slot bottom in initial step slot makes predetermined pattern, and the method for removing the layers of copper of the side wall
Including：
Integral tin is carried out to the multi-layer board；
Remove the tin layers of the non-predetermined graphics field of the bottom surface so that the layers of copper of non-predetermined graphics field is exposed；
Remove the layers of copper of the non-predetermined graphics field of the bottom surface and the layers of copper of the side wall；
Remove the tin layers in the predetermined pattern region of the bottom surface so that the layers of copper in predetermined pattern region is exposed to be formed as predetermined
Figure.
Optionally, the production method further includes：
Whole heavy copper plating is carried out after the multi-layer board with initial step slot is made in pressing, and to the multi-layer board
Before, via is opened up in the slot bottom of the initial step slot.
Optionally, the production method further includes：Predetermined pattern is made in the slot bottom of the initial step slot, and removes institute
While stating the layers of copper of side wall, orifice ring is made.
Optionally, while making predetermined pattern in the slot bottom of the initial step slot, and remove the layers of copper of the side wall,
Make orifice ring method include：
Integral tin is carried out to the multi-layer board；
Remove the non-predetermined figure of the bottom surface and the tin layers of non-hole ring region so that non-predetermined figure and non-hole ring region
Layers of copper it is exposed；
Remove the non-predetermined figure and the layers of copper of non-hole ring region and the layers of copper of the side wall of the bottom surface；
Remove the predetermined pattern of the bottom surface and the tin layers of hole ring region so that the layers of copper of predetermined pattern and hole ring region is naked
Dew is formed as predetermined pattern and predetermined orifice ring.
Optionally, the production method further includes：Predetermined pattern is made in the slot bottom of the initial step slot and removes institute
While stating the layers of copper of side wall, outer graphics are made.
Optionally, the width of first boundary position and second boundary position is 2mil~3mil.
Optionally, it is made in multiple-plate step of initial step slot in the pressing, using filling or is embedded to
The mode of gasket makes the initial step slot.
Optionally, the predetermined pattern includes circuit and/or pad.
A kind of PCB, including stepped groove that side wall is non-metallic, the stepped groove is according to as above any production method
It is made.
Compared with prior art, beneficial effects of the present invention are：
Using the embodiment of the present invention, a PCB with stepped groove is can be made into, and its ladder groove sidewall is non-metallic, slot bottom
It is formed with predetermined pattern；In the production process, by the way of first making stepped groove and making slot bottom figure again, relative to existing skill
Art can greatly simplify manufacture craft, reduce operation difficulty, improve working efficiency.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without having to pay creative labor, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is the production method flow chart for the non-metallic stepped groove of side wall that the embodiment of the present invention one provides；
Fig. 2 is the multiple-plate topology view for forming initial step slot that the embodiment of the present invention one provides；
Fig. 3 is topology view of the multi-layer board shown in Fig. 2 after integrally heavy copper plating；
Fig. 4 is topology view of the multi-layer board after integral tin shown in Fig. 3；
Fig. 5 is multi-layer board shown in Fig. 4 in the tin of removal ladder groove sidewall and superficies and ladder groove bottom boundary position
Topology view after layer；
Fig. 6 is topology view of the multi-layer board after the layers of copper for removing two boundary positions shown in Fig. 5；
Fig. 7 is topology view of the multi-layer board after moving back tin shown in Fig. 6；
Fig. 8 is topology view of the multi-layer board after integral tin shown in Fig. 7；
Fig. 9 is topology view of the multi-layer board after removing the non-predetermined graphics field tin layers of slot bottom shown in Fig. 8；
Figure 10 is topology view of the multi-layer board shown in Fig. 9 after the non-predetermined graphics field of removal slot bottom and side wall layers of copper；
Figure 11 is topology view of the multi-layer board shown in Figure 10 after the remaining tin layers of removal；
Figure 12 is the production method flow chart of the non-metallic stepped groove of side wall provided by Embodiment 2 of the present invention；
Figure 13 is the multilayer provided by Embodiment 2 of the present invention formed after initial step slot, slot internal drilling and whole plating
The topology view of plate；
Figure 14 is topology view of the multi-layer board after integral tin shown in Figure 13；
Figure 15 is multi-layer board shown in Figure 14 in removal ladder groove sidewall and superficies and ladder groove bottom boundary position
Topology view after tin layers；
Figure 16 is topology view of the multi-layer board after removing two boundary position layers of copper shown in Figure 15；
Figure 17 is topology view of the multi-layer board after moving back tin shown in Figure 16；
Figure 18 is topology view of the multi-layer board after integral tin shown in Figure 17；
Figure 19 is that structure of the multi-layer board after the removal non-predetermined figure of slot bottom and non-hole ring region tin layers shown in Figure 18 regards
Figure；
Figure 20 is that structure of the multi-layer board after the removal non-predetermined figure of slot bottom and non-hole ring region layers of copper shown in Figure 19 regards
Figure；
Figure 21 is topology view of the multi-layer board after removal slot bottom predetermined pattern and hole ring region tin layers shown in Figure 20.
Specific implementation mode
In order to make the invention's purpose, features and advantages of the invention more obvious and easy to understand, below in conjunction with the present invention
Attached drawing in embodiment, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that disclosed below
Embodiment be only a part of the embodiment of the present invention, and not all embodiment.Based on the embodiments of the present invention, this field
All other embodiment that those of ordinary skill is obtained without making creative work, belongs to protection of the present invention
Range.
Embodiment one
Referring to Fig. 1, the present embodiment one provides a kind of production method for the stepped groove that side wall is non-metallic, including step
Suddenly：
Step 101, complete inner figure make after, pressing the multi-layer board with initial step slot is made, such as Fig. 2 institutes
Show.
Wherein, multi-layer board includes the first superficies and the second superficies being distributed in the stacking direction, initial step slot
Bottom surface and side wall do not metallize；Conventional filling can be used in initial step slot or embedment gasket mode is molded to make,
The notch of initial step slot is formed in the first superficies.
Use embedment gasket mode make the method for initial step slot for：It is respectively completed the inner figure system of each core plate
Make；Predeterminated position on specified core material and specified prepreg opens a window；By each core plate and prepreg according to
Predetermined order is stacked, and is formed by joint sheet in slot in specified core material and specified prepreg；Lamination, later
It uncaps (i.e. will be positioned at the core plate part mill off of gasket upper area) and takes out gasket, to form initial step slot.
Use joint sheet mode make the method for initial step slot for：It is respectively completed the inner figure system of each core plate
Make；Predeterminated position on specified outer layer core plate, specified core material and specified prepreg opens a window；By each core plate and
Prepreg is stacked according to predetermined order, and in specified outer layer core plate, specified core material and specified prepreg institute shape
At slot in be embedded to gasket；It is laminated after the outer layer of outer layer core plate places buffer board；Buffer board is removed after lamination and is taken out
Gasket, to form initial step slot.
Step 102 carries out whole heavy copper plating to multi-layer board so that multiple-plate superficies (including in the stacking direction
The first superficies and the second superficies of distribution) and initial step slot inner surface (including the side wall of stepped groove and bottom
Face) layers of copper is plated, as shown in Figure 3.
Step 103 carries out integral tin to multi-layer board so that multiple-plate outer surface (including be distributed in the stacking direction
First superficies and the second superficies) and initial step slot inner surface (including the side wall of initial step slot and bottom surface)
Tin layers are plated, as shown in Figure 4.
Step 104, in the first boundary position of multiple-plate first superficies and initial step groove sidewall, and it is initial
Second boundary position of ladder groove sidewall and initial step groove bottom uses laser cutting machine to carry out laser ablation, to go respectively
Except the tin layers of the first boundary position and the second boundary position, expose the layers of copper of its bottom, as shown in Figure 5.
The size of first boundary position and the second boundary position can flexibly be set according to design requirement, its usual width can
Think 2mil~3mil.
Step 105, using chemical etching mode, remove the exposed layers of copper in the first boundary position and the second boundary position, such as
Shown in Fig. 6.
Step 106, the process of tin that moves back using routine, remove the interior table to multiple-plate superficies and initial step slot
The remaining tin layers in face, as shown in Figure 7.
So far, the layers of copper of the layers of copper of initial step groove sidewall and the layers of copper and initial step groove bottom of the first superficies,
Isolation is realized, the non-metallic processing of initial step groove sidewall is greatly facilitated.
Step 107, initial step slot slot bottom make predetermined pattern, while remove the layers of copper of initial step groove sidewall with
Keep initial step groove sidewall non-metallic.
Specifically, this step 107 further comprises：
(1) integral tin is carried out to multi-layer board.
Since initial step groove sidewall has been disconnected with the layers of copper of the first superficies and initial step groove bottom, because
And after the operation of the integral tin of this step, the first superficies and initial step groove bottom will plate tin layers, and initial rank
Terraced groove sidewall will not plate tin layers, as shown in Figure 8.
(2) laser ablation mode is used, the tin layers of the non-predetermined graphics field of initial step groove bottom is removed, exposes the area
The layers of copper in domain, as shown in Figure 9.
Wherein, initial step groove bottom is divided into predetermined pattern region and non-predetermined graphics field.
(3) chemical etching mode is used, the layers of copper of the non-predetermined graphics field of initial step groove bottom is removed；It is same with this
When, using chemical etching mode, remove the layers of copper of initial step groove sidewall so that initial step groove sidewall is non-metallic, meets
Design requirement, as shown in Figure 10.
(4) laser ablation mode is used, the tin layers in the predetermined pattern region of initial step groove bottom is removed, exposes the region
Layers of copper, this part layers of copper is formed as predetermined pattern, as shown in figure 11.
In step 107, also normal manufacture craft can be used to make outer graphics simultaneously, to improve working efficiency.
So far, that is, a PCB with stepped groove is made, and its ladder groove sidewall is non-metallic, slot bottom is formed with predetermined figure
Shape.In the production process, it by the way of first making stepped groove and making slot bottom figure again, can greatly simplify compared with the existing technology
Manufacture craft reduces operation difficulty, improves working efficiency.
Embodiment two
The production method that the present embodiment two provides the non-metallic stepped groove of another side wall, the slot bottom of the stepped groove is not only
It is formed with predetermined pattern and offers via.
It please refers to Fig.1 shown in 2, the production method of the stepped groove of the present embodiment includes step：
Step 201, molding initial step slot, the bottom surface of the initial step slot and side wall do not metallize.
Step 202 opens up via inside and outside initial step slot, carries out whole heavy copper plating to multi-layer board so that multi-layer board
Outer surface (including first superficies and the second superficies being distributed in the stacking direction), initial step slot inner surface
(including the side wall of initial step slot and bottom surface), via inner wall plate layers of copper, as shown in figure 13.
Step 203, to multi-layer board carry out integral tin so that multiple-plate outer surface, initial step slot inner surface with
And via inner wall plates tin layers, as shown in figure 14.
Step 204, in the first boundary position of multiple-plate first superficies and initial step groove sidewall, and it is initial
Second boundary position of ladder groove sidewall and initial step groove bottom uses laser cutting machine to carry out laser ablation, to go respectively
Except the tin layers of the first boundary position and the second boundary position, expose the layers of copper of its bottom, as shown in figure 15.
Step 205, using chemical etching mode, remove the exposed layers of copper in the first boundary position and the second boundary position, such as
Shown in Figure 16.
Step 206, the process of tin that moves back using routine, remove the inner surface to multiple-plate superficies, initial step slot
And the remaining tin layers of via inner wall, as shown in figure 17.
Step 207 makes predetermined pattern and predetermined orifice ring in the slot bottom of initial step slot, while removing initial step slot side
The layers of copper of wall is so that initial step groove sidewall is non-metallic.
Specifically, this step 207 further comprises：
(1) integral tin is carried out to multi-layer board, as shown in figure 18.
(2) tin layers of the non-predetermined figure of removal initial step groove bottom and non-hole ring region, expose the layers of copper in the region,
As shown in figure 19, initial step groove bottom therein is divided into predetermined pattern and hole ring region, non-predetermined figure and non-hole ring region
Domain；
(3) layers of copper of the non-predetermined figure of removal initial step groove bottom and non-hole ring region, while removing initial step
The layers of copper of groove sidewall so that initial step groove sidewall is non-metallic, as shown in figure 20；
(4) tin layers of the predetermined pattern of removal initial step groove bottom and hole ring region, expose the layers of copper in the region, this portion
Point layers of copper is formed as predetermined pattern and predetermined orifice ring, as shown in figure 21.
So far, stepped groove made of the present embodiment, slot bottom can not only form various types of predetermined patterns, predetermined pattern
It may include circuit and/or pad, may also be formed with via and orifice ring.
It is first made during slot bottom figure and slot bottom via make the production method of stepped groove again existing, needs pre- first pass through
Filling holes with resin mode carries out protection processing using special material to slot bottom via, in case via is in subsequent plating and erosion
It is adversely affected in the processes such as quarter, causes complex process, of high cost and operating difficulties in this way.Compared with prior art, this reality
It applies in the production method of example without carrying out protection processing to via, enormously simplifies manufacture craft, reduce operation difficulty, improve
Production efficiency, also reduces cost of manufacture.
Embodiment three
The present embodiment three provides a kind of PCB comprising the non-metallic stepped groove of side wall, the stepped groove is according to embodiment
One or embodiment two provide production method be made.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to before
Stating embodiment, invention is explained in detail, it will be understood by those of ordinary skill in the art that：It still can be to preceding
The technical solution recorded in each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
Modification or replacement, the spirit and scope for various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution.
Claims (10)
1. a kind of production method for the stepped groove that side wall is non-metallic, which is characterized in that the production method includes：
The multi-layer board with initial step slot is made in pressing；The multi-layer board includes the first superficies being distributed in the stacking direction
It is formed in first superficies with the notch of the second superficies, the initial step slot；
Whole heavy copper plating is carried out to the multi-layer board；
Integral tin is carried out to the multi-layer board；
Remove the tin layers of the first boundary position and the second boundary surface of position so that first boundary position and the second boundary position
The layers of copper set is exposed；First boundary position is located at the boundary position of the side wall and first superficies, and described
Two boundaries position are located at the boundary position of the side wall and the bottom surface；
The layers of copper of first boundary position and second boundary position is removed, removes remaining tin layers later；
Predetermined pattern is made in the slot bottom of the initial step slot, and removes the layers of copper of the side wall.
2. the production method of the non-metallic stepped groove of side wall according to claim 1, which is characterized in that described in initial rank
The slot bottom of terraced slot makes predetermined pattern, and the method for removing the layers of copper of the side wall includes：
Integral tin is carried out to the multi-layer board；
Remove the tin layers of the non-predetermined graphics field of the bottom surface so that the layers of copper of non-predetermined graphics field is exposed；
Remove the layers of copper of the non-predetermined graphics field of the bottom surface and the layers of copper of the side wall；
Remove the tin layers in the predetermined pattern region of the bottom surface so that the layers of copper in predetermined pattern region is exposed to be formed as predetermined figure
Shape.
3. the production method of the non-metallic stepped groove of side wall according to claim 1, which is characterized in that the production method
Further include：
After the multi-layer board with initial step slot is made in pressing, and whole heavy copper is carried out to the multi-layer board, it is electroplated
Before, open up via in the slot bottom of the initial step slot.
4. the production method of the non-metallic stepped groove of side wall according to claim 3, which is characterized in that the production method
Further include：While making predetermined pattern in the slot bottom of the initial step slot, and remove the layers of copper of the side wall, hole is made
Ring.
5. the production method of the non-metallic stepped groove of side wall according to claim 4, which is characterized in that in the initial rank
The slot bottom of terraced slot makes predetermined pattern, and while remove the layers of copper of the side wall, and the method for making orifice ring includes：
Integral tin is carried out to the multi-layer board；
Remove the non-predetermined figure of the bottom surface and the tin layers of non-hole ring region so that non-predetermined figure and the copper of non-hole ring region
Layer is exposed；
Remove the non-predetermined figure and the layers of copper of non-hole ring region and the layers of copper of the side wall of the bottom surface；
Remove the predetermined pattern of the bottom surface and the tin layers of hole ring region so that the exposed shape of the layers of copper of predetermined pattern and hole ring region
As predetermined pattern and predetermined orifice ring.
6. the production method of the non-metallic stepped groove of side wall according to claim 1, which is characterized in that the production method
Further include：While the slot bottom of the initial step slot makes predetermined pattern and removes the layers of copper of the side wall, outer layer is made
Figure.
7. the production method of the non-metallic stepped groove of side wall according to claim 1, which is characterized in that described first has a common boundary
The width of position and second boundary position is 2mil~3mil.
8. the production method of the non-metallic stepped groove of side wall according to claim 1, which is characterized in that made in the pressing
At in multiple-plate step with initial step slot, the initial step is made by the way of filling or embedment gasket
Slot.
9. the production method of the non-metallic stepped groove of side wall according to claim 1, which is characterized in that the predetermined pattern
Including circuit and/or pad.
10. a kind of PCB, including stepped groove that side wall is non-metallic, which is characterized in that the stepped groove is according to claim 1 to 9
Any production method is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810218711.4A CN108401385B (en) | 2018-03-16 | 2018-03-16 | Manufacturing method of stepped groove with non-metalized side wall |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810218711.4A CN108401385B (en) | 2018-03-16 | 2018-03-16 | Manufacturing method of stepped groove with non-metalized side wall |
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| Publication Number | Publication Date |
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| CN108401385A true CN108401385A (en) | 2018-08-14 |
| CN108401385B CN108401385B (en) | 2020-01-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810218711.4A Active CN108401385B (en) | 2018-03-16 | 2018-03-16 | Manufacturing method of stepped groove with non-metalized side wall |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109219250A (en) * | 2018-08-17 | 2019-01-15 | 昆山沪利微电有限公司 | A kind of pcb board heat dissipation T-type hole forming method |
| CN112543560A (en) * | 2019-09-20 | 2021-03-23 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
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| JPH03129895A (en) * | 1989-10-16 | 1991-06-03 | Matsushita Electric Ind Co Ltd | High frequency multilayer board |
| CN103079350A (en) * | 2012-12-28 | 2013-05-01 | 广州杰赛科技股份有限公司 | Method for processing patterns in blind slot of printed circuit board |
| CN103687313A (en) * | 2013-11-26 | 2014-03-26 | 广州杰赛科技股份有限公司 | Method for graphically machining bottoms of blind grooves |
| CN106793589A (en) * | 2016-12-29 | 2017-05-31 | 生益电子股份有限公司 | A kind of preparation method of wiring board bottom land figure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03129895A (en) * | 1989-10-16 | 1991-06-03 | Matsushita Electric Ind Co Ltd | High frequency multilayer board |
| CN103079350A (en) * | 2012-12-28 | 2013-05-01 | 广州杰赛科技股份有限公司 | Method for processing patterns in blind slot of printed circuit board |
| CN103687313A (en) * | 2013-11-26 | 2014-03-26 | 广州杰赛科技股份有限公司 | Method for graphically machining bottoms of blind grooves |
| CN106793589A (en) * | 2016-12-29 | 2017-05-31 | 生益电子股份有限公司 | A kind of preparation method of wiring board bottom land figure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109219250A (en) * | 2018-08-17 | 2019-01-15 | 昆山沪利微电有限公司 | A kind of pcb board heat dissipation T-type hole forming method |
| CN109219250B (en) * | 2018-08-17 | 2021-05-07 | 昆山沪利微电有限公司 | PCB heat dissipation T-shaped hole machining method |
| CN112543560A (en) * | 2019-09-20 | 2021-03-23 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108401385B (en) | 2020-01-17 |
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