CN112312662A - Manufacturing method of fine circuit printed circuit board - Google Patents
Manufacturing method of fine circuit printed circuit board Download PDFInfo
- Publication number
- CN112312662A CN112312662A CN202011036638.2A CN202011036638A CN112312662A CN 112312662 A CN112312662 A CN 112312662A CN 202011036638 A CN202011036638 A CN 202011036638A CN 112312662 A CN112312662 A CN 112312662A
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- China
- Prior art keywords
- laser
- printed circuit
- copper foil
- circuit board
- micropores
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 22
- 239000011889 copper foil Substances 0.000 claims abstract description 21
- 238000005530 etching Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000000126 substance Substances 0.000 claims abstract description 14
- 238000005553 drilling Methods 0.000 claims abstract description 11
- 238000000151 deposition Methods 0.000 claims abstract description 9
- 238000011161 development Methods 0.000 claims abstract description 9
- 238000009713 electroplating Methods 0.000 claims abstract description 7
- 238000003384 imaging method Methods 0.000 claims abstract description 7
- 238000012546 transfer Methods 0.000 claims abstract description 7
- 238000005516 engineering process Methods 0.000 claims abstract description 6
- 238000007747 plating Methods 0.000 claims abstract description 6
- 230000008021 deposition Effects 0.000 claims abstract description 5
- 238000005137 deposition process Methods 0.000 claims abstract description 5
- 229910000679 solder Inorganic materials 0.000 claims abstract description 5
- 238000004381 surface treatment Methods 0.000 claims abstract description 5
- 239000003292 glue Substances 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 238000012545 processing Methods 0.000 abstract description 10
- 238000013461 design Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 230000010354 integration Effects 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a manufacturing method of a fine circuit printed circuit board, which comprises the following steps: preparing a core plate with an ultrathin copper foil, and drilling a positioning hole drilled by laser on the edge of the plate; carrying out windowing treatment on the ultrathin copper foil by using pattern transfer and etching; drilling a micropore and a positioning hole for transferring the circuit pattern by using laser; depositing a layer of chemical copper on the surface and in the micropores of the core plate by chemical glue removal and copper deposition processes; pressing dry films on two surfaces of the core plate after copper deposition; exposing the surface of the dry film by using a laser direct imaging technology; developing away the dry film without exposure by development; filling up the micropores by using hole filling electroplating, and plating surface circuits; making a circuit by using rapid etching; and finishing the solder resist and surface treatment to obtain the fine circuit printed circuit board. The method can realize the processing of fine lines of 25um and below and micropores smaller than 75um, and provides an important solution for the refinement and miniaturization of the printed circuit board.
Description
Technical Field
The invention relates to the technical field of PCB production, in particular to a manufacturing method of a fine circuit printed circuit board.
Background
With the rapid development of the electronic industry, electronic products enter into the development stage of functionalization and intellectualization, and in order to meet the requirements of high integration and miniaturization of electronic products, printed circuit boards and semiconductor integrated circuit package substrates are also developed towards light, thin, short and small design directions on the premise of meeting good electrical and thermal properties of electronic products. In the design of PCB, in order to realize more functions, fine circuits, dense micro-holes, and ultra-thin board thickness have become the development trend of printed circuit boards.
In the field of PCB manufacturing and processing, the current industry level general line width/line distance can be 75um/75um, the pore diameter of the micropore is more than 75um, and the traditional method can not meet the requirement for processing fine lines, particularly lines with high-density interconnection design below 25um/25um and micropores smaller than 75 um. Based on the processing requirement of high-density interconnection fine lines, a production method which can solve the design of the micro-holes with the thickness less than 25um and the thickness less than 75um is urgently needed.
Disclosure of Invention
The invention provides a novel line processing and production operation method in order to solve the problems of fine lines and micropore processing. The specific technical scheme of the invention is as follows:
a manufacturing method of a fine circuit printed circuit board is characterized by comprising the following steps:
(1) preparing a core plate with an ultrathin copper foil, and drilling a positioning hole drilled by laser on the edge of the plate;
(2) carrying out windowing treatment on the ultrathin copper foil by using pattern transfer and etching;
(3) drilling a micropore and a positioning hole for transferring the circuit pattern by using laser;
(4) depositing a layer of chemical copper on the surface and in the micropores of the core plate by chemical glue removal and copper deposition processes;
(5) pressing dry films on two surfaces of the core plate after copper deposition;
(6) exposing the surface of the dry film by using a laser direct imaging technology;
(7) developing away the dry film without exposure by development;
(8) filling up the micropores by using hole filling electroplating, and plating surface circuits;
(9) making a circuit by using rapid etching;
(10) and finishing the solder resist and surface treatment to obtain the fine circuit printed circuit board.
Preferably, the thickness of the ultra-thin copper foil is 1-5 um, the ultra-thin copper foil is protected by a carrier copper foil with the thickness of 12-35 um, and the carrier copper foil is torn off before windowing.
Preferably, adopt the operation mode of the two-sided beat of laser to process X type micropore on the core board, X type micropore's central aperture is more than or equal to 25um and less than or equal to 45um, and both ends aperture is greater than 45um and is less than 75 um.
Preferably, the thickness of the chemical copper deposited on the surface of the core plate and in the micropores is 0.5-1.5 um.
Preferably, the thickness of the dry film pressed on the two sides of the core plate is 15-25 um.
Preferably, the line compensation is 3-8 um when the laser is directly imaged.
Preferably, the development is performed using a vertical line development operation.
Preferably, the amount of the rapid etching bite is 5-10 um.
Has the advantages that:
the invention uses 1-5 um ultra-thin copper foil (the traditional printed circuit board generally adopts copper foil more than 12 um), adopts laser micropore technology (the aperture of the micropore is more than or equal to 25um and less than 75um, the micropore of the traditional printed circuit board is generally more than 75 um), combines the technologies of pattern transfer, electroplating hole filling, rapid etching (the invention rapid etching amount is 5-10 um, the traditional printed circuit board etching amount is generally 40-100 um, the precision of fine lines can not be accurately controlled) and the like, can realize the processing of 25um and below lines on the printed circuit board, the manufacture of micropores less than 75um breaks through the processing of traditional 75um and above line width in the printed circuit board industry, simultaneously reduces the aperture of the micropore to less than 75um, and can reduce the plate thickness from the existing 250um to 80um, and realizes the manufacture of fine lines. The printed circuit board manufactured by the invention has good assistance effect on the integration and miniaturization of electronic products.
Drawings
FIGS. 1-10 are schematic views of the manufacturing process of the present invention using a double-sided board as an example:
FIG. 1 is a core with ultra-thin copper foil and laser drilled pilot holes in the edges of the sheet;
FIG. 2 is a schematic view of a semi-finished printed circuit board undergoing a windowing process;
FIG. 3 is a schematic diagram of a semi-finished product for making holes and positioning holes for transferring circuit patterns by laser drilling;
FIG. 4 is a schematic diagram of a core plate surface and micro-holes with a layer of chemical copper deposited thereon by a chemical degumming and copper deposition process;
FIG. 5 is a schematic view showing dry films pressed on both sides of a core plate after copper deposition;
FIG. 6 is a schematic diagram of a dry film after exposure using a laser direct imaging technique;
FIG. 7 is a schematic view after dry film development;
FIG. 8 is a schematic illustration of a plated surface circuit with micro-via plating filled in using via fill plating;
FIG. 9 is a schematic diagram of a circuit after it has been formed using a rapid etch;
fig. 10 is a schematic view of a fine wiring printed circuit board obtained by completing solder resist and surface treatment.
Detailed Description
The present invention will be further described with reference to the following specific examples.
Referring to fig. 1 to 10, the method for manufacturing a fine line printed circuit board of the present invention includes the steps of:
(1) firstly, preparing a core plate 100 with an ultrathin copper foil 101 with the thickness of 1-5 um and a carrier copper foil 102 with the thickness of 12-35 um, and drilling a positioning hole 1001 for laser drilling on the edge of the plate, as shown in fig. 1;
(2) tearing off the carrier copper foil 102, and carrying out windowing 103 treatment on the ultrathin copper foil 101 by using pattern transfer and etching;
(3) processing an X-shaped micropore 104 and a positioning hole 1002 for transferring the circuit pattern on the core plate by adopting a laser double-faced printing operation mode, wherein the central aperture of the X-shaped micropore is more than or equal to 25um and less than or equal to 45um, and the apertures of two ends are more than 45um and less than 75 um;
(4) depositing a layer of chemical copper 105 and 105' on the surface of the core plate and in the micropores through chemical glue removal and copper deposition processes, wherein the thickness of the chemical copper is 0.5-1.5 um;
(5) pressing dry films 1003 on two surfaces of the core plate subjected to copper deposition, wherein the thickness of the dry films is 15-25 um;
(6) exposing the surface of the dry film by using a laser direct imaging technology, wherein the exposed dry film is 1004; the line compensation of laser direct imaging is 3-8 um;
(7) developing the unexposed dry film 1003 by adopting a vertical line developing operation mode;
(8) filling up the micropores 104 by electroplating to obtain filled-up micropores 104', and simultaneously plating the upper copper 106;
(9) making a circuit 107 by utilizing rapid etching, wherein the etching amount is 5-10 um, and the circuit consists of ultra-thin copper 101, chemical copper 105 and electroplated surface copper 106;
(10) the solder resist 108 and the surface treatment 109 are completed to obtain a printed circuit board with fine wiring 107 and micro via 104'.
The invention uses the ultra-thin copper foil, and combines with the processes of pattern transfer, laser drilling, hole filling electroplating, rapid etching and the like, thereby realizing the processing of fine circuits and micropores, greatly improving the wiring density of the printed circuit board and realizing the miniaturized and refined production of the printed circuit board. In this embodiment, only a double-sided board is taken as an example for illustration, if a multi-layer board with three or more layers is processed, the layer-adding operation is directly performed on the double-sided board, and the other operations such as laser drilling, pattern transfer, hole-filling electroplating, rapid etching, and the like are the same as those in the embodiment, and only repeated operations are needed. The invention is not limited to the embodiment, and other similar production methods and parameters are within the protection scope of the invention.
Claims (8)
1. A manufacturing method of a fine circuit printed circuit board is characterized by comprising the following steps:
(1) preparing a core plate with an ultrathin copper foil, and drilling a positioning hole drilled by laser on the edge of the plate;
(2) carrying out windowing treatment on the ultrathin copper foil by using pattern transfer and etching;
(3) drilling a micropore and a positioning hole for transferring the circuit pattern by using laser;
(4) depositing a layer of chemical copper on the surface and in the micropores of the core plate by chemical glue removal and copper deposition processes;
(5) pressing dry films on two surfaces of the core plate after copper deposition;
(6) exposing the surface of the dry film by using a laser direct imaging technology;
(7) developing away the dry film without exposure by development;
(8) filling up the micropores by using hole filling electroplating, and plating surface circuits;
(9) making a circuit by using rapid etching;
(10) and finishing the solder resist and surface treatment to obtain the fine circuit printed circuit board.
2. The method of claim 1, wherein the ultra-thin copper foil is 1-5 um thick and protected by a carrier copper foil 12-35 um thick, and the carrier copper foil is torn off before the window is opened.
3. The method of claim 1, wherein the X-shaped micro-holes are processed on the core board by laser double-faced printing, the central aperture of the X-shaped micro-holes is greater than or equal to 25um and less than or equal to 45um, and the apertures of both ends are greater than 45um and less than 75 um.
4. The method of claim 1, wherein the chemical copper deposited on the surface of the core and in the micro-holes has a thickness of 0.5-1.5 um.
5. The method of claim 1, wherein the thickness of the dry film pressed on the two sides of the core board is 15-25 μm.
6. The method of claim 1, wherein the line compensation is 3-8 um during laser direct imaging.
7. The method of claim 1 wherein the developing is performed by a vertical line developing operation.
8. The method of claim 1, wherein the etching amount is 5-10 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011036638.2A CN112312662A (en) | 2020-09-28 | 2020-09-28 | Manufacturing method of fine circuit printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011036638.2A CN112312662A (en) | 2020-09-28 | 2020-09-28 | Manufacturing method of fine circuit printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112312662A true CN112312662A (en) | 2021-02-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011036638.2A Pending CN112312662A (en) | 2020-09-28 | 2020-09-28 | Manufacturing method of fine circuit printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112312662A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114745859A (en) * | 2022-06-10 | 2022-07-12 | 四川英创力电子科技股份有限公司 | Copper-based printed circuit board drilling device and processing method |
| CN114980569A (en) * | 2021-02-20 | 2022-08-30 | 嘉联益电子(昆山)有限公司 | Method for manufacturing circuit board circuit structure with through hole and manufactured circuit board circuit structure with through hole |
| CN115551232A (en) * | 2022-11-30 | 2022-12-30 | 惠州市金百泽电路科技有限公司 | Circuit board processing method for improving electroplating hole filling cavity and circuit board |
| CN116614939A (en) * | 2023-07-21 | 2023-08-18 | 淄博芯材集成电路有限责任公司 | Anti-seepage liquid medicine structure for outer frame of core plate of printed circuit board and design method thereof |
| WO2023236484A1 (en) * | 2022-06-09 | 2023-12-14 | 惠州市金百泽电路科技有限公司 | Method for manufacturing printed integrated circuit |
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| CN102711385A (en) * | 2012-06-26 | 2012-10-03 | 北京凯迪思电路板有限公司 | Method for manufacturing circuit board by addition method |
| CN103687337A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Laser machining method for package substrate through hole |
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2020
- 2020-09-28 CN CN202011036638.2A patent/CN112312662A/en active Pending
Patent Citations (7)
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114980569A (en) * | 2021-02-20 | 2022-08-30 | 嘉联益电子(昆山)有限公司 | Method for manufacturing circuit board circuit structure with through hole and manufactured circuit board circuit structure with through hole |
| WO2023236484A1 (en) * | 2022-06-09 | 2023-12-14 | 惠州市金百泽电路科技有限公司 | Method for manufacturing printed integrated circuit |
| CN114745859A (en) * | 2022-06-10 | 2022-07-12 | 四川英创力电子科技股份有限公司 | Copper-based printed circuit board drilling device and processing method |
| CN115551232A (en) * | 2022-11-30 | 2022-12-30 | 惠州市金百泽电路科技有限公司 | Circuit board processing method for improving electroplating hole filling cavity and circuit board |
| CN116614939A (en) * | 2023-07-21 | 2023-08-18 | 淄博芯材集成电路有限责任公司 | Anti-seepage liquid medicine structure for outer frame of core plate of printed circuit board and design method thereof |
| CN116614939B (en) * | 2023-07-21 | 2023-10-20 | 淄博芯材集成电路有限责任公司 | Anti-seepage liquid medicine structure for outer frame of core plate of printed circuit board and design method thereof |
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